JP2017076187A - Method for producing metal pattern substrate, metal pattern substrate, and display device with touch position detection function - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a metal pattern thinner while securing reliability.SOLUTION: A method for producing a metal pattern substrate comprises a groove forming step for forming a plurality of grooves G1 of a predetermined pattern on the surface of a substrate 32, a metal film formation step for forming a metal film 40 inside the groove and on the substrate between adjacent grooves, a resist layer forming step for forming a resist layer 50 on the metal film formed inside the groove, an etching step for etching the metal film with the resist layer as a mask, and a peeling step for peeling the resist layer.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a metal pattern substrate manufacturing method, a metal pattern substrate, and a display device with a touch position detection function obtained by combining a metal pattern substrate and a display device.

  Today, touch panel devices are widely used as input means. The touch panel device includes a touch panel sensor, a control circuit that detects a contact position on the touch panel sensor, wiring, and an FPC (flexible printed circuit board). In many cases, the touch panel device is used together with the display device as an input means for various devices including a display device such as a liquid crystal display or an organic EL display (for example, a ticket vending machine, an ATM device, a mobile phone, a game machine). It has been. In such a device, the touch panel sensor is disposed on the display surface of the display device, thereby enabling extremely direct input to the display device. The area | region which faces the display area of a display apparatus among touch panel sensors is transparent, and this area | region of a touch panel sensor comprises the active area which can detect a contact position (approach position).

  As a touch panel sensor, a projection capacitive coupling type touch panel sensor is known. In the capacitive coupling type touch panel sensor, when an external conductor (typically, a finger) whose position is to be detected contacts (approaches) the touch panel sensor via a dielectric, a strange capacitance is newly generated. The position of the external conductor on the touch panel sensor is detected on the basis of the change in capacitance caused by this strange capacitance. Such a projected capacitively coupled touch panel sensor includes, for example, a base material made of PET or the like, a plurality of first detection patterns provided on the surface of the base material on the viewer side, and a base material on the display device side. A plurality of second detection patterns provided on the surface. The first detection pattern and the second detection pattern are made of a transparent conductive material having translucency and conductivity, for example. The first detection pattern and the second detection pattern are arranged in the active area.

  A plurality of lead wires (frame wires) made of metal are provided in an inactive area (frame region) around the active area of the touch panel sensor. Each of the plurality of lead-out wirings is electrically connected between the corresponding first or second detection pattern and the corresponding terminal arranged in the vicinity of the outer edge of the base material (for example, see Patent Document 1). .

  Such a lead-out wiring is formed as follows. 9A to 9E are diagrams for explaining a conventional method for manufacturing a lead wiring. FIGS. 9A to 9E schematically show a cross section of a part of the inactive area of the touch panel sensor.

  First, as shown in FIG. 9A, the overcoat layer 34 </ b> X is formed on the base material 33.

  Next, as shown in FIG. 9B, a metal film 40X is formed on the overcoat layer 34X. The overcoat layer 34X improves the adhesion between the metal film 40X and the base material 33.

  Next, as shown in FIG. 9C, a resist layer 50X is formed on the metal film 40X, and the resist layer 50X is patterned. The pattern of the resist layer 50X corresponds to the pattern of the lead wiring.

  Next, as shown in FIG. 9D, the metal film 40X is etched using the patterned resist layer 50X as a mask.

  Finally, as shown in FIG. 9E, the resist layer 50X is peeled off to form the wiring 41X on the overcoat layer 34X. The wiring 41X functions as a lead wiring.

  In recent years, there has been a demand for a narrower inactive area. For this purpose, it is necessary to narrow the width and interval of the lead-out wiring.

JP 2010-277392 A

  However, in the manufacturing method described above, when the metal film 40X is etched, as the etching proceeds, the etching solution also flows below the resist layer 50X, and a part of the metal film 40X below the resist layer 50X is also etched. End up. That is, side etching occurs. As a result, as shown in FIG. 9E, the formed wiring 41X has a trapezoidal cross-sectional shape, and in particular, the upper width of the wiring 41X is larger than the target wiring width (ie, the width of the patterned resist layer 50X). It becomes narrower. Therefore, since the resistance value of the wiring 41X increases or a part of the wiring 41X is lost, there is a limit to thinning the wiring 41X.

  Further, when the interval between the wirings 41X becomes narrow, electromigration is likely to occur, and there is a possibility that the adjacent wirings 41X and 41X are short-circuited.

  Such a point is not limited to the lead wiring of the touch panel sensor, and may be a problem with respect to all metal patterns that require thinning.

  The present invention has been made in consideration of such points, and has a metal pattern substrate manufacturing method, a metal pattern substrate, and a touch position detection function capable of making a metal pattern thinner while ensuring reliability. An object is to provide a display device.

A method for producing a metal pattern substrate according to an aspect of the present invention includes:
A groove forming step of forming a plurality of grooves of a predetermined pattern on the surface of the substrate;
A metal film forming step of forming a metal film in the groove and on the substrate between adjacent grooves;
A resist layer forming step of forming a resist layer on the metal film formed in the groove;
An etching step of etching the metal film using the resist layer as a mask;
A peeling step of peeling the resist layer;
Is provided.

Moreover, in the manufacturing method of the metal pattern substrate,
In the metal film forming step, the metal film may be formed so that a thickness of the metal film is smaller than a depth of the groove.

Moreover, in the manufacturing method of the metal pattern substrate,
The groove forming step includes
Forming an overcoat layer on a substrate to obtain the substrate;
Forming the groove in the overcoat layer;
You may have.

Moreover, in the manufacturing method of the metal pattern substrate,
In the groove forming step, the groove that penetrates the overcoat layer and reaches the base material may be formed.

Moreover, in the manufacturing method of the metal pattern substrate,
The substrate has plasticity;
The groove forming step includes
Pressing a mold having a concavo-convex pattern corresponding to the predetermined pattern on the surface of the substrate;
Removing the mold from the substrate;
You may have.

The metal pattern substrate according to one aspect of the present invention is
A substrate having a plurality of grooves of a predetermined pattern on the surface;
A metal layer embedded in the groove;
Is provided.

In the metal pattern substrate,
The thickness of the metal layer may be smaller than the depth of the groove.

In the metal pattern substrate,
The substrate is
A substrate;
An overcoat layer provided on the substrate and having the groove on the surface;
You may have.

In the metal pattern substrate,
The groove may penetrate the overcoat layer and reach the substrate.

A display device with a touch position detection function according to one embodiment of the present invention is provided.
A display device;
A touch panel sensor disposed on the display surface side of the display device,
The touch panel sensor
A substrate having a predetermined pattern of grooves on the surface;
A metal layer embedded in the groove;
Have

In the display device with a touch position detection function,
The touch panel sensor has a detection pattern provided in an active area on the substrate,
The groove and the metal layer are provided in an inactive area located around the active area,
The metal layer may be connected to the detection pattern and function as a lead wiring.

  According to the present invention, the metal pattern can be further thinned while ensuring reliability.

It is an exploded view showing the display device with a touch position detection function according to the first embodiment. It is a top view which shows the touchscreen sensor at the time of seeing from the observer side. It is a longitudinal cross-sectional view along the II line of the touch panel sensor of FIG. (A)-(e) is a figure explaining the manufacturing method of the touch-panel sensor which concerns on 1st Embodiment. (A)-(e) is a figure explaining the manufacturing method of the touch-panel sensor which concerns on 2nd Embodiment. (A)-(e) is a figure explaining the manufacturing method of the touch-panel sensor which concerns on 3rd Embodiment. (A)-(d) is a figure explaining the production method of a mold. (A)-(g) is a figure explaining the preparation methods of a master mold. 9A to 9E are diagrams for explaining a conventional method for manufacturing a lead wiring.

  Embodiments of the present invention will be described below with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual ones.

(First embodiment)
Display Device with Touch Position Detection Function First, a display device 10 with a touch position detection function including a touch panel sensor (metal pattern substrate) 30 will be described with reference to FIG. As shown in FIG. 1, the display device with a touch position detection function 10 is configured by combining a touch panel sensor 30 and a display device 15 such as a liquid crystal display or an organic EL display. The illustrated display device 15 is configured as a flat panel display. The display device 15 includes a display panel 16 having a display surface 16 a and a display control unit (not shown) connected to the display panel 16.

  The display panel 16 includes an active area A1 that can display an image, and an inactive area (also referred to as a frame area) A2 that is disposed outside the active area A1 so as to surround the active area A1. . The display control unit processes information regarding the video to be displayed, and drives the display panel 16 based on the video information. The display panel 16 displays a predetermined image on the display surface 16a based on a control signal from the display control unit. That is, the display device 15 plays a role as an output device that outputs information such as characters and drawings as video.

  In the present embodiment, the shape of the active area A1 is substantially rectangular in plan view as shown in FIG. However, the shape of the active area A1 in plan view may be another shape, for example, an elliptical shape.

  As shown in FIG. 1, the touch panel sensor 30 is bonded to the display surface 16 a of the display device 15 via, for example, an adhesive layer (not shown).

The touch panel sensor touch panel sensor 30 may have any configuration, but the configuration illustrated in FIG. 2 will be described as an example.

  FIG. 2 is a plan view showing the touch panel sensor 30 when viewed from the observer side. Here, an example in which the touch panel sensor 30 is configured as a projection capacitive touch panel sensor will be described. The “capacitive coupling” method is also referred to as “capacitance” method or “capacitance coupling” method in the technical field of touch panels. It is treated as a term synonymous with the “capacitive coupling” method. A typical capacitive coupling type touch panel sensor has a light-transmitting conductive pattern, and an external conductor (typically a human finger) approaches the touch panel sensor to externally. A capacitor (capacitance) is formed between this conductor and the conductive pattern of the touch panel sensor. Based on the change in the electrical state accompanying the formation of the capacitor, the position coordinates of the position where the external conductor is approaching on the touch panel sensor are specified. The touch panel sensor 30 according to the present embodiment may be a self-capacitance type or a mutual capacitance type.

  As shown in FIG. 2, the touch panel sensor 30 includes a light-transmitting substrate 32 including a first surface 32 a facing the viewer side and a second surface 32 b facing the display device 15 side, and a first surface 32 a of the substrate 32. A plurality of first detection patterns (detection patterns) 42 provided on the first direction D1 and provided on the second surface 32b of the substrate 32 and intersecting the first direction D1, for example, in the first direction D1 And a plurality of second detection patterns (detection patterns) 46 extending in a second direction D2 orthogonal to each other. As shown in FIG. 2, the first detection pattern 42 and the second detection pattern 46 each extend in a band shape. The plurality of first detection patterns 42 are arranged in the second direction D2 at a constant arrangement pitch, and the plurality of second detection patterns 46 are also arranged in the first direction D1 at a constant arrangement pitch. The arrangement pitch of the first detection pattern 42 and the second detection pattern 46 is determined according to the resolution required for the detection of the touch position, and is, for example, several mm. In FIG. 2, components provided on the first surface 32a side of the substrate 32 are represented by solid lines, and components provided on the second surface 32b side of the substrate 32 are represented by dotted lines.

  As shown in FIG. 2, the substrate 32 of the touch panel sensor 30 includes a rectangular active area Aa1 corresponding to an area where the touch position can be detected, and a rectangular frame-shaped inactive area Aa2 positioned around the active area Aa1. , Including. The active area Aa1 and the inactive area Aa2 are respectively partitioned corresponding to the active area A1 and the inactive area A2 of the display panel 16.

  The first detection pattern 42 and the second detection pattern 46 described above are arranged in the active area Aa1. In addition, on the first surface 32a of the substrate 32 in the inactive area Aa2, a plurality of first lead wirings 44a electrically connected to the corresponding first detection patterns 42 and the vicinity of the outer edge of the substrate 32 are arranged. A plurality of first terminal portions 44b that are electrically connected to the corresponding first lead-out wirings 44a are provided. Further, on the second surface 32b of the substrate 32 in the inactive area Aa2, a plurality of second extraction wirings 49a that are electrically connected to the corresponding second detection patterns 46, and in the vicinity of the outer edge of the substrate 32, respectively. A plurality of second terminal portions 49b that are arranged and electrically connected to the corresponding second lead-out wirings 49a are provided.

  The first and second detection patterns 42 and 46 are made of, for example, a transparent conductive material having translucency and conductivity. Alternatively, the first and second detection patterns 42 and 46 may be made of a metal material such as silver or copper having higher conductivity than the transparent conductive material. Thereby, the electrical resistance value of the 1st and 2nd detection patterns 42 and 46 can be made low. When the first and second detection patterns 42 and 46 are made of a metal material, the first and second detection patterns 42 and 46 have openings for transmitting the image light from the display device 15 at an appropriate ratio. Is formed. For example, the 1st and 2nd detection patterns 42 and 46 may be comprised by the conducting wire which consists of metal materials and is arrange | positioned at mesh shape.

  The first and second lead wires 44a and 49a and the first and second terminal portions 44b and 49b are made of a metal material such as aluminum, molybdenum, silver, copper, or an alloy thereof.

  FIG. 3 is a longitudinal sectional view taken along the line II of the touch panel sensor 30 of FIG. That is, FIG. 3 shows a cross section of a region where the second lead wiring 49a is formed.

  As shown in FIG. 3, the substrate 32 has a plurality of grooves G1 having a predetermined pattern on the surface (second surface) 32b. The pattern of the groove G1 corresponds to the pattern of the second lead wiring 49a.

  The substrate 32 includes a base material 33 and an overcoat layer 34 provided on the base material 33 and having the groove G1. The groove G1 passes through the overcoat layer 34 and reaches the base material 33.

  The base material 33 functions as a dielectric in the touch panel sensor 30. As a material constituting the base material 33, for example, a material having sufficient translucency such as polyethylene terephthalate (PET), cycloolefin polymer (COP) or glass is used. As long as the first detection pattern 42, the second detection pattern 46, the lead-out wirings 44a and 49a, and the terminal portions 44b and 49b can be appropriately held, the specific configuration of the base material 33 is not particularly limited.

  The overcoat layer 34 has translucency. As a material of the overcoat layer 34, for example, an acrylic resin or the like can be used. In the case where the overcoat layer 34 is formed using a photolithography method, the overcoat layer 34 may contain a photocurable photosensitive agent. In the manufacturing method to be described later, the case where the overcoat layer 34 contains a photocurable photosensitive agent will be described.

  The second lead wiring 49a is composed of a metal layer 41 embedded in the groove G1. The thickness of the metal layer 41 is preferably smaller than the depth of the groove G1.

  The metal layer 41 may have a thickness of several hundred nm, for example. The thickness of the overcoat layer 34, that is, the depth of the groove G1, may be several μm, for example.

  Although not shown, the first lead wiring 44a is also composed of the metal layer 41 embedded in the groove G1, like the second lead wiring 49a. In this case, the metal layer 41 is provided on the first surface 32a side.

  1 and 2, the first detection pattern 42, the first lead wiring 44a, and the first terminal portion 44b are provided on the first surface 32a side of the substrate 32, and the second detection pattern 46, the second lead wiring 49a, and Although the example in which the second terminal portion 49b is provided on the second surface 32b side of the substrate 32 has been shown, the present invention is not limited to this. For example, the first detection pattern 42, the first lead wiring 44a, and the first terminal portion 44b are provided on the first surface 32a side of the substrate 32, and the second detection pattern 46, the second lead wiring 49a, and the second terminal portion 49b are provided. It may be provided on one surface side of an additional substrate (not shown), and one surface of the additional base material may be bonded to the second surface 32b of the substrate 32 with a transparent adhesive.

Method for Manufacturing Touch Panel Sensor Next, a method for manufacturing the touch panel sensor 30 having the above configuration will be described with reference to FIGS. Note that the first and second detection patterns 42 and 46 other than the first and second lead wires 44a and 49a can be formed by a known method, and thus the description thereof is omitted below. Further, since the first lead wiring 44a and the second lead wiring 49a can be formed by the same method, only the method for forming the second lead wiring 49a will be described below.

[Groove formation process]
First, as shown in FIG. 4A, a plurality of grooves G1 having a predetermined pattern are formed on the surface of the substrate 32. Specifically, the overcoat layer 34 is formed on the base material 33 to obtain the substrate 32. Then, a groove G <b> 1 that penetrates the overcoat layer 34 and reaches the base material 33 is formed in the overcoat layer 34 of the substrate 32.

  A method for forming the groove in the overcoat layer 34 is not particularly limited, but for example, a photolithography method is preferably used. Thereby, the comparatively fine groove | channel G1 can be formed with sufficient precision.

  When the photolithography method is used, first, a photosensitive overcoat layer coating solution (hereinafter referred to as a coating solution) is applied onto the substrate 33.

  Next, the coating liquid applied on the substrate 33 is heated (prebaked), thereby removing the solvent in the coating liquid. As a result, an overcoat layer material is obtained on the substrate 33. Any of the negative-type and positive-type overcoat layer materials can be used. Here, an example using the negative type will be described.

Next, the overcoat layer material is exposed through an exposure mask.
Next, the exposed overcoat layer material is developed with a developer, whereby the portion of the overcoat layer material that has not been exposed to the exposure light is dissolved in the developer.

  Finally, the overcoat layer material remaining on the substrate 33, that is, the developed overcoat layer material is fired. As a result, as shown in FIG. 4A, a groove G <b> 1 that penetrates the overcoat layer 34 and reaches the base material 33 is formed in the overcoat layer 34.

[Metal film forming process]
Next, as shown in FIG. 4B, a metal film 40 is formed on the surface of the substrate 32 on the side where the groove G1 is formed using a method such as sputtering. That is, the metal film 40 is formed in the groove G1 and on the substrate 32 (that is, on the overcoat layer 34) between the adjacent grooves G1 and G1. Therefore, the metal film 40 includes the metal film 40a embedded in the groove G1 and the metal film 40b disposed on the overcoat layer 34. A groove G2 is formed in the metal film 40 at a position corresponding to the groove G1. Here, the metal film 40 is formed so that the thickness of the metal film 40 is smaller than the depth of the groove G1.

[Resist layer forming step]
Next, as shown in FIG. 4C, a resist layer 50 is selectively formed on the metal film 40a formed in the groove G1, using a photolithography method. That is, the resist layer 50 is selectively formed in the groove G2 of the metal film 40.

  Specifically, first, a photosensitive resist material is applied and cured so as to cover the metal film 40. Although both negative and positive photosensitive resist materials can be used, an example using the positive type will be described here.

  Next, the photosensitive resist material is exposed through an exposure mask having an opening at a position corresponding to the overcoat layer 34, that is, a position corresponding to the metal film 40b.

  Next, the exposed photosensitive resist material is developed with a developer, and thereby the portion of the photosensitive resist material that has been exposed to the exposure light is dissolved in the developer. Therefore, the photosensitive resist material above the overcoat layer 34, that is, on the metal film 40b is removed, and the photosensitive resist material in the groove G2 of the metal film 40 remains. Finally, necessary processing such as baking is performed, and the resist layer 50 is formed in the groove G <b> 2 of the metal film 40.

  Here, as described above, the thickness of the metal film 40 is smaller than the depth of the groove G1. Therefore, the side surface of the metal film 40 a in the groove G 1 is covered with the overcoat layer 34, and the upper surface of the metal film 40 a is covered with the resist layer 50. That is, the metal film 40a is hardly exposed to the outside.

[Etching process]
Next, as shown in FIG. 4D, the metal film 40 is etched using the resist layer 50 as a mask. Of the metal film 40, the metal film 40 b is exposed from the resist layer 50, while the metal film 40 a is covered with the resist layer 50. Therefore, the metal film 40b is etched, but the metal film 40a is hardly etched. Eventually, the metal film 40b is dissolved and removed in the etching solution, and the metal film 40a remains.

[Peeling process]
Finally, the resist layer 50 is peeled off. As a result, as shown in FIG. 4E, the metal layer 41 (second lead wiring 49a) is formed in the plurality of grooves G1 of the substrate 32.

  As described above, according to the present embodiment, the metal film 40a is formed in the groove G1 of the substrate 32, and the resist layer 50 is formed on the metal film 40a in the groove G1. Therefore, the metal film 40a in the groove G1 is covered with the resist layer 50. Therefore, when etching the unnecessary metal film 40b on the overcoat layer 34 between the adjacent grooves G1 and G1, the metal film 40a in the groove G1 is difficult to be etched.

  Even if there is a gap between the lower corner of the resist layer 50 and the upper corner of the overcoat layer 34, the metal film 40a in the groove G1 is more than the unnecessary metal film 40b on the overcoat layer 34. Because of the deep position, the unnecessary metal film 40b can be etched and removed before the etching solution reaches the metal film 40a in the groove G1. Therefore, even in such a case, the metal film 40a in the groove G1 is difficult to be etched.

  From the above, side etching can be suppressed. Accordingly, since the metal layer 41 having a cross-sectional shape close to a rectangle and a width close to the target wiring width can be formed, it is possible to suppress an increase in the resistance value of the metal layer 41 and a loss of a part of the metal layer 41. .

Moreover, since the metal layer 41 is embedded in the groove G1 and the overcoat layer 34 is interposed between the adjacent metal layers 41, 41, electromigration can be suppressed. Therefore, even if the interval between the adjacent metal layers 41 and 41 is narrowed, a short circuit between the adjacent metal layers 41 and 41 can be suppressed.
In this way, the metal pattern can be made finer while ensuring reliability.

  Therefore, in the touch panel sensor 30, the width of the inactive area Aa2 can be made narrower. Thereby, the area of the active area Aa1 can be relatively increased without changing the area of the touch panel sensor 30, and the display performance of the display device 10 with a touch position detection function can be improved.

  Note that at least a part of the first lead-out wiring 44a and the second lead-out wiring 49a may be composed of the metal layer 41 embedded in the groove G1. In this case, in the portion where the first lead wirings 44a are densely packed, the first lead wirings 44a may be composed of the metal layer 41 embedded in the groove G1. The same applies to the second lead wiring 49a.

  Further, an additional functional layer may be provided between the base material 33 and the overcoat layer 34 and the metal film 40a.

  In the above description, an example in which the metal layer 41 embedded in the groove G1 is used as the first and second lead wirings 44a and 49a has been described. However, the present invention is not limited to this. For example, when the first and second detection patterns 42 and 46 are configured by conductive wires arranged in a mesh pattern, the metal layer 41 embedded in the groove G1 configures the first and second detection patterns 42 and 46. It may be used as a conducting wire.

  Furthermore, although the touch panel sensor 30 was demonstrated as an example of a metal pattern board | substrate, it is not restricted to this. The metal pattern substrate can be applied to other than the touch panel sensor 30. For example, the groove G1 and the metal layer 41 may be provided in a mesh shape to form a metal pattern substrate that functions as a translucent film. In this case, according to the present embodiment, the thinned metal layer 41 having a width close to the target wiring width can be formed, and the loss of a part of the metal layer 41 can be suppressed. Therefore, since the metal layer 41 having a uniform width can be formed regardless of the position in the plane of the metal pattern substrate, a uniform transmittance can be obtained regardless of the position in the plane. As described above, the metal layer 41 may not be used as a wiring to which a voltage is applied, but may be used as a simple metal pattern to which no voltage is applied.

(Second Embodiment)
The second embodiment is different from the first embodiment in that the groove G1 does not penetrate the overcoat layer 34. Below, it demonstrates centering around difference with 1st Embodiment.

  5A to 5E are views for explaining a method for manufacturing the touch panel sensor 30 according to the second embodiment. FIGS. 5A to 5E correspond to FIGS. 4A to 4E.

[Groove formation process]
First, as shown in FIG. 5A, a plurality of grooves G1 having a predetermined pattern are formed on the surface of the substrate 32A. Specifically, the groove G1 is formed on the surface of the overcoat layer 34A of the substrate 32A. That is, a thin overcoat layer 34 </ b> A exists between the groove G <b> 1 and the base material 33.

  The method for forming the groove G1 in the overcoat layer 34A is not particularly limited, but for example, it is preferable to use a photolithography method. The present embodiment is different from the first embodiment in that a multi-tone mask such as a halftone mask is used as an exposure mask and the overcoat layer material is exposed. Thereby, the exposure amount can be made different between the region where the groove G1 is formed and the region where the groove G1 is not formed. Therefore, as shown in FIG. 5A, the groove G1 is formed on the surface of the overcoat layer 34A by leaving the thin overcoat layer 34A between the groove G1 and the base material 33 by development.

  The subsequent metal film forming step (FIG. 5B), resist layer forming step (FIG. 5C), etching step (FIG. 5D), and peeling step are the same as those in the first embodiment. Thereby, as shown in FIG. 5E, the metal layer 41 is formed in the plurality of grooves G1 of the substrate 32A. A thin overcoat layer 34 </ b> A is interposed between the metal layer 41 and the base material 33.

  With such a configuration, according to the present embodiment, the adhesion between the metal layer 41 and the base material 33 can be improved as compared with the first embodiment. Moreover, the same effect as 1st Embodiment is also acquired.

  The manufacturing cost of the first embodiment that does not use a halftone mask is lower than that of the second embodiment.

(Third embodiment)
In the third embodiment, the groove G1 is formed by mold transfer. Below, it demonstrates centering around difference with 1st Embodiment.

  6A to 6E are views for explaining a method for manufacturing the touch panel sensor 30 according to the third embodiment. 6A to 6E correspond to FIGS. 4A to 4E.

[Groove formation process]
The substrate 32B is made of, for example, a resin and has plasticity. The substrate 32B may be in the form of a film. First, as shown in FIG. 6A, a mold 60 having a concavo-convex pattern corresponding to the pattern of the groove G1 to be formed is pressed against the surface of the substrate 32B. Thereby, the surface shape of the substrate 32 </ b> B corresponds to the uneven pattern of the mold 60. When the board | substrate 32B is comprised with resin, before pressing the mold 60, the board | substrate 32B is heated and softened.

  Next, the mold 60 is removed from the substrate 32B. As a result, a plurality of grooves G1 having a predetermined pattern are formed on the surface of the substrate 32B.

  Examples of the material of the mold 60 include glass such as quartz glass or metal such as tantalum.

  The subsequent metal film forming step (FIG. 6B), resist layer forming step (FIG. 6C), etching step (FIG. 6D), and peeling step are the same as in the first embodiment. However, prior to the metal film forming step, it is preferable to attach the glass carrier 70 to the surface of the substrate 32B where the groove G1 is not formed. Thereby, even if the board | substrate 32B is a form of a film and it has a softness | flexibility, a metal film formation process, a resist layer formation process, and an etching process can be performed easily. The glass carrier 70 is removed in the peeling process.

  Thereby, as shown in FIG. 6E, the metal layer 41 is formed in the plurality of grooves G1 of the substrate 32B.

  Therefore, also in this embodiment, the effect of the first embodiment can be obtained. However, in this embodiment, after the groove forming process is repeated a plurality of times in order to form a plurality of substrates 32B, the resin of the substrate 32B may adhere to the mold 60, so the mold 60 is replaced with a new one. There is a need to. In the groove forming step, a step of removing the mold 60 from the substrate 32B is also required. Therefore, in this embodiment, there is a possibility that the manufacturing cost is increased as compared with the first embodiment.

[Mold manufacturing method]
Although the manufacturing method of the mold 60 is not particularly limited, an example will be described below.
7A to 7D are views for explaining a method for producing the mold 60. FIG. First, as shown in FIG. 7A, an acrylic resin is applied on a glass substrate 61 to form an acrylic resin layer 62. As the acrylic resin, for example, PMMA resin can be used.

  Next, as shown in FIG. 7B, after the acrylic resin layer 62 is heated and softened, the master mold 80 is pressed against the acrylic resin layer 62. The master mold 80 may be made of glass such as quartz glass, for example.

  Thereby, as shown in FIG. 7C, the concave / convex pattern of the master mold 80 is transferred to the acrylic resin layer 62. Thereafter, the acrylic resin layer 62 is cooled and solidified, and the master mold 80 is removed.

  Next, as shown in FIG. 7D, the glass substrate 61 is etched using the acrylic resin layer 62 as a mask. Thereby, a concavo-convex pattern corresponding to the concavo-convex pattern of the master mold 80 is formed on the glass substrate 61. Finally, the mold 60 can be obtained by removing the acrylic resin layer 62.

[Manufacturing method of master mold]
A method for producing the master mold 80 is not particularly limited, but an example will be described below.

  FIGS. 8A to 8G are views for explaining a method for producing the master mold 80. First, as shown in FIG. 8A, a resin layer 82 is formed on a glass substrate 81, and an electron beam resist layer 83 is formed on the resin layer 82.

  Next, as shown in FIG. 8B, the electron beam resist layer 83 is irradiated with an electron beam to process the electron beam resist layer 83 into a predetermined pattern. Thereby, a finer pattern can be formed than the photolithography method using light.

  Next, as shown in FIG. 8C, the resin layer 82 is etched using the patterned electron beam resist layer 83 as a mask.

  Next, as shown in FIG. 8D, a metal layer 84 is formed by plating chromium or the like from above the electron beam resist layer 83. The metal layer 84 is formed on the electron beam resist layer 83 and the exposed surface of the glass substrate 81.

  Next, as shown in FIG. 8E, the resin layer 82, the electron beam resist 83, and the metal layer 84 on the electron beam resist layer 83 are removed by dissolving the resin layer 82 (lift-off). . Thereby, the metal layer 84 on the surface of the glass substrate 81 remains.

  Next, as shown in FIG. 8F, the glass substrate 81 is etched using the metal layer 84 as a mask.

  Finally, as shown in FIG. 8G, the metal layer 84 is removed to obtain the master mold 80.

  In place of the mold transfer of this embodiment, for example, the surface of the substrate 32B is irradiated with a laser such as an excimer laser, so that the portion irradiated with the laser is dissolved to form the groove G1. Good.

  As mentioned above, although some embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

10 Display Device with Touch Position Detection Function 15 Display Device A1 Active Area A2 Inactive Area (Frame Area)
30 Touch panel sensor (Metal pattern substrate)
32, 32A, 32B Substrate 33 Base material 34, 34A Overcoat layer G1 Grooves 40, 40a, 40b Metal film 41 Metal layer 42 First detection pattern (detection pattern)
44a First lead wiring (metal layer)
44b 1st terminal part 46 2nd detection pattern (detection pattern)
49a Second lead-out wiring (metal layer)
49b Second terminal portion 50 Resist layer 60 Mold
70 Glass carrier 80 Master mold

Claims (11)

A groove forming step of forming a plurality of grooves of a predetermined pattern on the surface of the substrate;
A metal film forming step of forming a metal film in the groove and on the substrate between adjacent grooves;
A resist layer forming step of forming a resist layer on the metal film formed in the groove;
An etching step of etching the metal film using the resist layer as a mask;
A peeling step of peeling the resist layer;
A method of manufacturing a metal pattern substrate.   2. The method of manufacturing a metal pattern substrate according to claim 1, wherein in the metal film formation step, the metal film is formed such that a thickness of the metal film is smaller than a depth of the groove. The groove forming step includes
Forming an overcoat layer on a substrate to obtain the substrate;
Forming the groove in the overcoat layer;
The manufacturing method of the metal pattern board | substrate of Claim 1 or Claim 2 which has these.   4. The metal pattern substrate according to claim 3, wherein in the groove forming step, the groove reaching the base material through the overcoat layer is formed. 5. The substrate has plasticity;
The groove forming step includes
Pressing a mold having a concavo-convex pattern corresponding to the predetermined pattern on the surface of the substrate;
Removing the mold from the substrate;
The manufacturing method of the metal pattern board | substrate of Claim 1 or Claim 2 which has these. A substrate having a plurality of grooves of a predetermined pattern on the surface;
A metal layer embedded in the groove;
A metal pattern substrate comprising:   The metal pattern substrate according to claim 6, wherein a thickness of the metal layer is smaller than a depth of the groove. The substrate is
A substrate;
An overcoat layer provided on the substrate and having the groove on the surface;
The metal pattern board | substrate of Claim 6 or Claim 7 which has these.   The metal pattern substrate according to claim 8, wherein the groove penetrates the overcoat layer and reaches the base material. A display device;
A touch panel sensor disposed on the display surface side of the display device,
The touch panel sensor
A substrate having a predetermined pattern of grooves on the surface;
A metal layer embedded in the groove;
A display device with a touch position detection function. The touch panel sensor has a detection pattern provided in an active area on the substrate,
The groove and the metal layer are provided in an inactive area located around the active area,
The display device with a touch position detection function according to claim 10, wherein the metal layer is connected to the detection pattern and functions as a lead wiring.

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