JP2016095243A - Measuring device, measuring method, and article manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique advantageous to accurately measure the shape of a surface to be inspected.SOLUTION: A measuring device for measuring the shape of a surface to be inspected includes: an imaging unit for imaging a measurement place on the surface to be inspected; and a processing unit for obtaining positional information on the measurement place from an image obtained by the imaging unit. The processing unit obtains multiple pieces of positional information from a plurality of images obtained by making the imaging unit image the measurement place from a plurality of angles, obtains the reliability of the positional information for each of the plurality of angles at which the imaging unit is made to image the measurement place on the basis of information indicating the reliability of positional information for an angle at which the imaging unit images the measurement place, and determines the position of the measurement place from relation between each of the multiple pieces of positional information obtained from the plurality of images and the reliability of the positional information for each of the plurality of angles.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a measuring device, a measuring method, and an article manufacturing method for measuring the shape of a test surface.

  As a measuring device that measures the shape of the test surface, the process of irradiating the measurement location on the test surface with light and receiving the light reflected at the measurement location is repeated in a non-contact manner to obtain the three-dimensional shape of the test surface. A measuring device for measuring is known (see Patent Documents 1 and 2). The measurement device includes, for example, an irradiation unit that irradiates light to a measurement location and an imaging unit that images the measurement location irradiated with light, and obtains the position of the measurement location from an image obtained by the imaging unit. it can.

  In such a measurement apparatus, an error may be included in the measurement result of the position of the measurement location obtained from the image obtained by the imaging unit. Patent Documents 1 and 2 propose a method for reducing measurement errors caused by light reflected at a plurality of locations including a measurement location on the surface to be examined, that is, multiple reflected light, is incident on an imaging unit.

JP 2004-257803 A JP 2008-180646 A

  The inventor has found that the error included in the measurement result changes according to the angle at which the measurement part of the surface to be measured is imaged by the imaging unit. In other words, if the angle at which each of the plurality of measurement points on the surface to be measured is imaged by the imaging unit differs depending on the inclination of each measurement point, the error included in the measurement result differs for each measurement point, It can be difficult to accurately measure the shape of the.

  Then, an object of this invention is to provide the technique advantageous in order to measure the shape of a to-be-tested surface accurately.

  In order to achieve the above object, a measurement device according to one aspect of the present invention is a measurement device that measures the shape of a test surface, and includes an imaging unit that images a measurement location of the test surface, and the imaging unit A processing unit that obtains position information of the measurement location from the image obtained in step (a), and the processing unit is configured to obtain a plurality of images from a plurality of images obtained by causing the imaging unit to capture the measurement location from a plurality of angles. For each of the plurality of angles obtained by causing the imaging unit to image the measurement location based on information indicating reliability of the position information with respect to an angle at which the imaging unit images the measurement location. The reliability of the position information is acquired, and the position of the measurement location is determined from the relationship between each of the plurality of position information obtained from the plurality of images and the reliability of the position information for each of the plurality of angles. To do And features.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to provide an advantageous technique for accurately measuring the shape of the test surface.

It is the schematic which shows the measuring device of 1st Embodiment. It is a figure which shows the relationship between an imaging angle and the measurement result of the position of a measurement location. It is a figure which shows the structure of the measurement head of 1st Embodiment. It is a flowchart which shows the process which measures the shape of a to-be-tested surface. It is a figure which shows an example of reliability information. It is a figure which shows a mode that the attitude | position of a measurement head is changed. It is the figure which compared the relationship between the measurement result of the position of an imaging angle and a measurement location in the conventional measurement apparatus and the measurement apparatus of 1st Embodiment. It is a figure which shows the structure of the measurement head of 2nd Embodiment.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member thru | or element, and the overlapping description is abbreviate | omitted.

<First Embodiment>
A measuring apparatus 100 according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic diagram illustrating a measurement apparatus 100 according to the first embodiment. The measurement apparatus 100 according to the first embodiment can include, for example, a measurement head 1 that measures the shape of the test surface (the surface of the test object), a drive unit 10 that drives the measurement head 1, and a processing unit 12. . The processing unit 12 includes, for example, a CPU and a memory, and performs processing for measuring the shape of the test surface.

  First, the configuration of the drive unit 10 will be described. The drive unit 10 can include, for example, a surface plate 2 on which a test object is arranged, a Y carriage 3, an X slider 4, a Z spindle 5, and a rotary head 11. The Y carriage 3 is formed in a portal shape by a pair of leg portions 3a and an X beam 3b, and is supported by the surface plate 2 through an air guide, for example. One leg 3a of the Y carriage 3 is provided with a Y drive unit 8 that drives the Y carriage 3 along the Y direction. The Y drive unit 8 includes a Y shaft 8a provided on the surface plate 2 and a Y movable unit 8b provided on the Y carriage 3. The Y movable unit 8b moves along the Y shaft 8a, so that the Y carriage 3 can be driven along the Y direction. The X slider 4 is supported by the X beam 3b of the Y carriage 3 through an air guide, for example, and includes an X drive unit that drives the X slider 4 along the X direction. The X drive unit includes an X shaft 14 provided on the Y carriage 3 and an X movable unit provided on the X slider 4. When the X movable unit moves along the X shaft 14, the X slider 4 moves to the X slider 4. It can be driven along the direction.

  The Z spindle 5 is supported by the X slider 4 via an air guide, for example, and includes a Z drive unit that drives the Z spindle 5 along the Z direction. The Z drive unit includes a Z shaft provided on the X slider 4 and a movable unit provided on the Z spindle 5. The Z movable unit moves along the Z shaft so that the Z spindle 5 is moved along the Z direction. Can be driven. A measuring head 1 is provided at the tip of the Z spindle 5 via a rotary head 11. The rotary head 11 can rotate the measurement head 1 around the X axis, the Y axis, and the Z axis, thereby changing the posture of the measurement head 1.

  By configuring the drive unit 10 in this way, the measurement apparatus 100 according to the first embodiment, for example, according to the design data of the shape of the test surface, makes the distance between the measurement head 1 and the test surface constant. The shape of the test surface can be measured while moving the measuring head 1. Here, the drive unit 10 includes, for example, a Y measurement unit 7 for measuring the position of the Y carriage 3 in the Y direction, an X measurement unit for measuring the position of the X slider in the X direction, and the Z spindle Z And a Z measurement unit for measuring a position in the direction. The processing unit 12 is based on the position of the Y carriage 3 measured by the Y measuring unit 7, the position of the X slider 4 measured by the X measuring unit, and the position of the Z spindle 5 measured by the Z measuring unit. The position coordinates of the measuring head 1 can be acquired. The Y measuring unit 7, the X measuring unit, and the Z measuring unit can each include an encoder and a laser interferometer, for example. In the measurement apparatus 100 illustrated in FIG. 1, the Y measurement unit 7 includes an encoder.

  Next, the configuration of the measurement head 1 will be described. In the first embodiment, an example will be described in which the measurement head 1 measures the shape of the test surface using a light cutting method (line light projection type triangulation). The light cutting method is a method for irradiating line light toward a measurement point on the surface to be measured, and for the line light generated according to the shape of the measurement point from an image obtained by imaging the measurement point irradiated with the line light. In this method, the position of the measurement location is obtained by detecting the amount of distortion. In such a light cutting method, the measuring head 1 includes an irradiating unit 17 that irradiates light (line light) to a measurement location on the test surface, and an imaging unit 18 that images the measurement location irradiated with light by the irradiating unit 17. (For example, a CCD camera or a CMOS camera). Here, although 1st Embodiment demonstrates the example which calculates | requires the position of a measurement location using the light cutting method which irradiates a measurement location with line light by the irradiation part 17, it is not restricted to it. For example, the position of the measurement part may be obtained by using a pattern projection method in which the irradiation part 17 irradiates the measurement part with the pattern light in which the bright part and the dark part are two-dimensionally arranged. You may obtain | require the position of a measurement location by irradiating a measurement location.

  The measurement result of the position of the measurement location obtained from the image obtained by the imaging unit 18 as described above is based on the angle by which the imaging unit 18 images the measurement location as shown in FIG. It became clear that it changed according to the angle θ). As shown in FIG. 2, it can be seen that the change in the measurement result is particularly large in the vicinity of the imaging angle θ ′ when the light regularly reflected at the measurement location enters the imaging unit 18. The measurement result of the position of the measurement location changes in this way because the error included in the measurement result changes according to the imaging angle θ. Therefore, if the angle at which each of the plurality of measurement points on the surface to be measured is picked up by the imaging unit 18 differs according to the inclination of each measurement point, the error included in the measurement result differs for each measurement point, It can be difficult to accurately measure the shape of the surface. Here, the error included in the measurement result can be caused by, for example, the fact that the light scattered on the surface to be examined interferes with each other and a granular pattern called a speckle pattern is generated in the image obtained by the imaging unit 18. .

  Therefore, the measurement apparatus 100 according to the first embodiment causes the imaging unit 18 to image the measurement location from a plurality of angles without changing the incident angle of light incident on the measurement location on the test surface from the irradiation unit 17, The position information of the measurement location is obtained for each of the plurality of images obtained by the above. In addition, the measuring apparatus 100 obtains the reliability of the position information for each of a plurality of angles obtained by causing the imaging unit 18 to image the measurement location, using information indicating the reliability of the position information with respect to the imaging angle θ. Then, the measuring apparatus 100 determines the position of the measurement location from the relationship between each of the plurality of position information obtained from the plurality of images and the reliability of the position information for each of the plurality of angles. As a result, the measurement apparatus 100 has an error included in the position information for each measurement location even when the angle at which each of the plurality of measurement locations is imaged by the imaging unit 18 is different from each other according to the inclination of each measurement location. Differences can be reduced. The measurement apparatus 100 according to the first embodiment includes a plurality of imaging units 18 that image measurement points on a test surface at different angles, and each of the plurality of imaging units 18 has a measurement point on the test surface. A plurality of images can be obtained by imaging. In such a measurement head 1, the plurality of imaging units 18 are angles between the direction in which the light reflected at the measurement location enters each of the plurality of imaging units 18 and the direction in which the irradiation unit 17 emits light. Are preferably arranged to be the same. Below, the structure of the measurement head 1 and the process which measures the shape of a to-be-tested surface are demonstrated.

  First, the configuration of the measurement head 1 will be described with reference to FIG. FIG. 3 is a diagram illustrating a configuration of the measurement head 1 according to the first embodiment. Here, as shown in FIG. 3, an example in which one irradiation unit 17 and two imaging units 18 a and 18 b are included in the measurement head 1 will be described. The irradiation unit 17 includes a light source 20 such as a semiconductor laser and an optical element 21 such as a cylindrical lens, and the light emitted from the light source 20 can be irradiated to the test surface as line light by passing through the optical element 21. On the other hand, each of the imaging units 18 a and 18 b includes an imaging lens 24 and an image sensor 22, and the line light irradiated on the test surface can be imaged on the image sensor 22 via the imaging lens 24. Here, the imaging units 18a and 18b are preferably arranged to satisfy the conditions of the Scheimpflug optical system in which the sensor surface, the object surface, and the main plane of the imaging lens 24 intersect in the same straight line. In addition, the imaging units 18a and 18b have the same angle between the direction in which the light reflected at the measurement point enters each of the imaging units 18a and 18b and the direction in which the irradiation unit 17 emits the light. It is preferable to arrange | position.

  Next, processing for measuring the shape of the test surface by the measurement apparatus 100 according to the first embodiment will be described with reference to FIG. FIG. 4 is a flowchart showing a process for measuring the shape of the test surface. Each operation of the flowchart illustrated in FIG. 4 can be performed by the processing unit 12 controlling each unit of the measurement apparatus 100.

  In S101, as illustrated in FIG. 5, the processing unit 12 acquires information indicating the reliability of the position information with respect to the imaging angle θ (hereinafter, reliability information). FIG. 5 is a diagram illustrating an example of the reliability information. When the reliability information about the surface to be measured or the surface having the same surface condition (for example, surface roughness) is obtained in advance, the processing unit 12 obtains the reliability obtained in advance. Use information. On the other hand, when the reliability information is not obtained in advance, the processing unit 12 newly acquires the reliability information. Here, two examples of the method for acquiring the reliability information will be described.

  In the first method, the processing unit 12 specifies a part of the test surface that is substantially flat from the design data of the shape of the test surface, and sets the part as a specific location. Then, as shown in FIGS. 6A to 6C, the processing unit 12 changes the posture of the measurement head 1 with the rotary head 11, thereby changing the angle at which the imaging unit 18 images a specific location. The part 18 is caused to capture an image of the specific part, and position information of the specific part is obtained. Thereby, the process part 12 can obtain the several positional information about a specific location. When changing the angle at which the imaging unit 18 captures a specific location, the position of the line light irradiated to the specific location by the irradiation unit 17 is constant, and the distance between the irradiation unit 17 and the specific location is constant. It is preferable to change the posture of the measuring head 1. Then, the processing unit 12 performs plane fitting on the plurality of pieces of position information about the specific place by the least square method, and obtains a deviation between each of the plurality of pieces of position information about the specific place and the value obtained by the plane fitting. Thereby, the process part 12 can acquire the relationship between the angle which made the imaging part 18 image the specific location, and the said deviation as reliability information. Here, the processing unit 12 uses an average value of a plurality of pieces of position information obtained by causing the image pickup unit 18 to pick up an image of a specific location a plurality of times at one angle as position information about the one angle. Also good. In addition, the reliability information is preferably created for each of the imaging units 18a and 18b. However, when the configurations of the imaging units 18a and 18b are the same, even if the common reliability information is acquired by them. Good. Furthermore, in the above description, an example in which a part of the test surface is a specific location has been described, but a part of the surface having the same surface state as the test surface may be the specific location.

  In the second method, similarly to the first method, the processing unit 12 changes the posture of the measurement head 1 with the rotary head 11, thereby changing the angle at which the imaging unit 18 captures the specific location. The position information is obtained, and a plurality of pieces of position information about a specific location are obtained. And the process part 12 calculates | requires the difference of each of several positional information about a specific location, and the positional information obtained when the imaging part 18 images a specific location with a reference angle. Thereby, the process part 12 can acquire the relationship between the angle which made the imaging part 18 image a specific location, and the said difference as reliability information. Here, the reference angle may be the imaging angle θ ′ when light specularly reflected at a specific location enters the imaging unit 18, or the imaging angle θ that minimizes the error included in the position information is calculated. (Or a simulated result).

  In S <b> 102, the processing unit 12 moves the measurement head 1 to the drive unit 10 so that light from the irradiation unit 17 is irradiated to a measurement location (target measurement location) on a target surface to be measured. In S103, the processing unit 12 causes the imaging unit 18 to image the target measurement location at a plurality of angles without changing the incident angle of the light incident on the measurement location on the test surface from the irradiation unit 17, and is thereby obtained. The position information of the target measurement location is obtained for each of the plurality of images. Thereby, the processing unit 12 can obtain a plurality of pieces of position information about the target measurement location. In the measurement apparatus 100 according to the first embodiment, a plurality of imaging units 18 that capture measurement points at different angles are provided. Therefore, even if the posture of the measurement head 1 is not changed, the plurality of imaging units 18 are configured. A plurality of images can be obtained by causing each of the target measurement locations to be imaged. In this case, the processing unit 12 can obtain the position information of the target measurement location from each of the plurality of images obtained by the plurality of imaging units 18. In S104, the processing unit 12 obtains the imaging angle θ when the imaging unit 18 images the target measurement location. The processing unit 12 can obtain the imaging angle θ based on, for example, the design data of the shape of the test surface and the posture of the measuring head 1 driven by the driving unit 10. In the first embodiment, since the imaging units 18a and 18b are provided in the measurement head 1, the imaging angle θ may be obtained for each of the imaging units 18a and 18b.

  In S105, the processing unit 12 obtains the reliability of the position information for each of a plurality of imaging angles θ obtained by causing the imaging unit 18 to image the target measurement location, based on the reliability information acquired in S101. In S106, the processing unit 12 determines the target measurement location from the relationship between each of the plurality of position information about the target measurement location obtained in S103 and the reliability of the location information about each of the plurality of imaging angles θ obtained in S105. Determine the position. Here, two examples of the method for determining the position of the target measurement location will be described.

In the first method, the processing unit 12 responds to the reliability σ _i of the position information in the reliability information with respect to a plurality (n pieces) of position information P _i for the target measurement locations obtained from the plurality of images. The weighted averaging process is performed by equation (1) to determine the position P of the target measurement location. For example, the processing unit 12 uses the reliability information, the reliability σ ₁ of the position information at the imaging angle θ ₁ of the target measurement location by the imaging unit 18a, and the position at the imaging angle θ ₂ of the target measurement location by the imaging unit 18b. An information reliability σ ₂ is obtained. The imaging angles θ ₁ and θ ₂ can be obtained in the process of S104. Then, the processing unit 12, to the two position information P ₁ and P ₂ for the target measurement point, performs weighting averaging processing corresponding to the reliability of the position information by the equation (1), the position of the target measurement points P is determined. In this case, “2” is input to “n” in Expression (1). The position information _{P 1} and _{P 2,} in step S103 step, can be respectively determined from an image obtained by each of the imaging unit 18a and 18b. By determining the position of the target measurement point in this way, as shown in FIG. 7A, the measurement result of the position of the measurement point is less changed according to the imaging angle θ as compared with the conventional measurement device. can do.

In the second method, the processing unit 12 selects, based on the reliability information, position information having the highest reliability among a plurality of pieces of position information about the target measurement location obtained from the plurality of images, and selects the selected position. The position of the target measurement location is determined from the information. For example, the processing unit 12 uses the reliability information σ ₁ of position information at the imaging angle θ ₁ of the target measurement location by the imaging unit 18 a and the position at the imaging angle θ ₂ of the target measurement location by the imaging unit 18 b. An information reliability σ ₂ is obtained. Then, the processing unit 12 compares the reliability σ ₁ and σ ₂ of the position information, selects the position information with the highest reliability from the two pieces of position information P ₁ and P ₂ for the target measurement location, and selects The determined position information is determined as the position of the target measurement location. By determining the position of the target measurement location in this way, it is possible to reduce the change in the measurement result of the location of the measurement location according to the imaging angle θ as shown in FIG. 7B.

  In S107, the processing unit 12 determines whether or not the measurement location (next measurement location) where the position is measured next is on the test surface. If there is a next measurement location, the process returns to S102, and steps S102 to S107 are repeated. On the other hand, if there is no next measurement location, the process proceeds to S108. In S108, the processing unit 12 obtains the shape of the test surface based on the position of each of the plurality of measurement locations on the test surface.

  As described above, the measurement apparatus 100 according to the first embodiment obtains a plurality of pieces of position information about the target measurement location by using the plurality of imaging units 18, and each of the plurality of pieces of position information based on the reliability information and the reliability of the position information. The position of the target measurement location is determined from the relationship with the degree. Thereby, the measuring apparatus 100 can reduce that the measurement result of the position of a measurement location changes according to imaging angle (theta).

Second Embodiment
A measuring device according to a second embodiment of the present invention will be described. The measurement device of the second embodiment is different in the configuration of the measurement head 1 from the measurement device 100 of the first embodiment. FIG. 8 is a diagram illustrating a configuration of the measurement head 1 according to the second embodiment. The measurement head 1 according to the second embodiment includes one irradiating unit 17 and one imaging unit 18, and measuring the light irradiated by the irradiating unit 17 by changing the posture of the measuring head 1 with the rotating head 11. The location can be imaged by the imaging unit 18 from a plurality of angles.

  Next, processing for measuring the shape of the surface to be measured by the measurement apparatus according to the second embodiment will be described. The measuring apparatus according to the second embodiment measures the shape of the surface to be measured according to the flowchart shown in FIG. In the flowchart shown in FIG. 4, the process of S103 is different from that of the first embodiment, and therefore, the process of S103 will be described below.

  In S103, the processing unit 12 causes the imaging unit 18 to image the target measurement location at a plurality of angles without changing the incident angle of the light incident on the measurement location on the test surface from the irradiation unit 17, and is thereby obtained. The position information of the target measurement location is obtained for each of the plurality of images. Thereby, the processing unit 12 can obtain a plurality of pieces of position information about the target measurement location. Since the measurement apparatus according to the second embodiment includes only one image pickup unit 18 in the measurement head 1, the image pickup unit 18 is driven at a plurality of angles by changing the posture of the measurement head 1 by driving the rotary head 11. The target measurement location is imaged. Here, the processing unit 12 is configured so that the angle between the direction in which the light reflected at the target measurement point enters the imaging unit 18 and the direction in which the irradiation unit 17 emits the light is constant. Is preferably changed. In the second embodiment, since the irradiation unit 17 and the imaging unit 18 are integrally formed, the angle between the direction in which light enters the imaging unit 18 and the direction in which the irradiation unit 17 emits light is always set. Can be constant. Further, the processing unit 12 rotates the measuring head 1 (for example, 180 degrees) around the optical axis of the light emitted from the irradiation unit 17 when the imaging unit 18 images the target measurement location at a plurality of angles. Good.

  As described above, the measurement apparatus according to the second embodiment includes one imaging unit 18 in the measurement head 1, and changes the posture of the measurement head 1 so that a single measurement unit 18 can target measurement points from a plurality of angles. Take an image. Then, the measurement device of the second embodiment obtains a plurality of pieces of position information about the target measurement location from the results of imaging at a plurality of angles, and each of the plurality of pieces of position information based on the reliability information and the reliability of the position information The position of the target measurement location is determined from the relationship. Thereby, the measuring apparatus of 2nd Embodiment can reduce that the measurement result of the position of a measurement location changes according to imaging angle (theta) similarly to the measuring apparatus 100 of 1st Embodiment.

<Embodiment of Method for Manufacturing Article>
The method for manufacturing an article according to an embodiment of the present invention is used, for example, when manufacturing an article such as a metal part or an optical element. The method for manufacturing an article according to the present embodiment includes a step of measuring the shape of the test surface (surface of the test object) using the above-described measurement device, and a step of processing the test surface based on the measurement result in the process. Including. For example, the shape of the test surface is measured using a measuring device, and the test object is processed (manufactured) based on the measurement result so that the shape of the test surface becomes a design value. The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared to the conventional method because the shape of the surface to be measured can be measured with high accuracy by the measuring device. It is.

  As mentioned above, although preferred embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

Measuring head 1, surface plate 2, driving unit 10, processing unit 12, irradiation unit 17, imaging unit 18, measuring device 100

Claims (15)

A measuring device for measuring the shape of a test surface,
An imaging unit that images the measurement location of the surface to be examined;
A processing unit for obtaining position information of the measurement location from an image obtained by the imaging unit;
Including
The processor is
Obtaining a plurality of the position information from a plurality of images obtained by causing the imaging unit to image the measurement location from a plurality of angles;
Based on the information indicating the reliability of the position information with respect to the angle at which the imaging unit images the measurement location, the reliability of the location information is obtained for each of the plurality of angles at which the measurement location is imaged by the imaging unit. ,
A measurement device that determines the position of the measurement location from the relationship between each of the plurality of position information obtained from the plurality of images and the reliability of the position information for each of the plurality of angles. .   The processing unit determines the position of the measurement location by performing a weighted averaging process according to the reliability of the position information for the plurality of position information obtained from the plurality of images. The measuring device according to claim 1.   The processing unit selects position information having the highest reliability of the position information among the plurality of position information obtained from the plurality of images, and determines the position of the measurement location from the selected position information. The measuring device according to claim 1. The measurement device includes a plurality of the imaging units that image the measurement points at different angles,
The measurement apparatus according to claim 1, wherein the processing unit obtains the plurality of images by causing each of the plurality of imaging units to capture the measurement location. It further includes an irradiation unit that irradiates light to the measurement location,
The plurality of imaging units are configured such that angles between a direction in which light reflected at the measurement location is incident on each of the plurality of imaging units and a direction in which the irradiation unit emits light are the same. The measuring device according to claim 4, wherein the measuring device is arranged.   The processing unit obtains the plurality of images by changing the attitude of the imaging unit and causing the imaging unit to capture the measurement location from the plurality of angles. The measuring apparatus of any one of Claims. It further includes an irradiation unit that irradiates light to the measurement location,
The processing unit changes the posture of the imaging unit so that an angle between a direction in which light reflected by the measurement point enters the imaging unit and a direction in which the irradiation unit emits light is constant. The measuring device according to claim 6, wherein:   The said processing part calculates | requires each of these several angles which made the said imaging part image the said measurement location from the design data of the shape of the said to-be-tested surface, The one of the Claims 1 thru | or 7 characterized by the above-mentioned. The measuring device according to item 1. The processing unit is configured to obtain the position information of the specific location by causing the imaging unit to capture the specific location while changing the angle at which the imaging unit captures the specific location. Obtaining the information from a plurality of the position information;
The specific location is a part of the test surface or a part of the same surface as the test surface, and is a flat surface. The measuring device described in 1.   The processing unit obtains a deviation between each of the plurality of pieces of positional information about the specific part and a value obtained by plane fitting with respect to them by a least square method, and an angle at which the specific part is imaged by the imaging unit. The measurement apparatus according to claim 9, wherein a relationship with the deviation is acquired as the information.   The processing unit obtains a difference between each of the plurality of pieces of position information about the specific part and the position information obtained when the specific part is imaged by the imaging unit at a reference angle. The measurement apparatus according to claim 9, wherein a relationship between an angle at which the specific portion is imaged and the difference is acquired as the information.   The measurement apparatus according to claim 11, wherein the reference angle is an angle that causes the imaging unit to image the specific part so that light regularly reflected at the specific part is incident on the imaging unit.   The image pickup unit picks up an image of the measurement portion irradiated with at least one of pattern light, line light, and point light in which a dark part and a bright part are two-dimensionally arranged. 12. The measuring device according to any one of twelve. A step of measuring the shape of the test surface using the measurement device according to any one of claims 1 to 13,
Processing the test surface based on the measurement result in the step;
A method for producing an article comprising: A measurement method for measuring the shape of the test surface based on an image obtained by imaging a measurement location of the test surface,
Obtaining a plurality of position information from a plurality of images obtained by imaging the measurement location from a plurality of angles;
Obtaining the reliability of the position information for each of the plurality of angles at which the measurement location is imaged based on information indicating the reliability of the position information with respect to the angle at which the measurement location is imaged;
Determining the position of the measurement location from the relationship between each of the plurality of position information obtained from the plurality of images and the reliability of the position information for each of the plurality of angles;
A measurement method comprising:

Images