JP2014120544A - Light emitting device - Google Patents

Abstract

When a general-purpose large luminous flux LED-COB (chip on board) light source is incorporated in a light emitting device, including a light source using a metal substrate such as aluminum, the charged part is protected, and insulation and heat dissipation are provided. A light emitting device having an LED light source mounting structure excellent in the above.
A light emitting device of the present invention includes an insulating lower support 11 and an upper support 20 that are fixed so as to sandwich an LED light source 1, and the lower support 11 includes a light source arrangement recess 15. An upper support arrangement recess 14, a conductive terminal that can be electrically connected to the electrode 5 of the LED light source 1 inside the upper support 20, and the LED of the light source arrangement depression 15 of the lower support 11. A burr avoiding groove 12 for dropping the burr 7 on the back surface of the LED light source 1 is provided at a position opposite to the edge on the back surface of the light source 1, and a region surrounded by the burr avoiding groove 12 in the light source arrangement recess 15 It is a flat surface that can contact the back surface of the light source 1.
[Selection] Figure 2

Description

  The present invention relates to a light emitting device using an LED (Light Emitting Diode) as a light source, and more particularly to a light source fixing structure of a light emitting device using a COB (Chip On Board) type LED as a light source.

  With the increase in the luminous flux of the LED light source, it is indispensable to improve the heat dissipation of the heat generated by the LED itself in order to bring out the light emitting performance inherent to the LED element. Therefore, in recent years, many commercially available high luminous flux LED light sources (several W to several tens of W electrical input) have a structure in which a plurality of LED chips are integrated on a heat-radiating substrate made of aluminum or ceramics, and the size is also conventional. It tends to be larger than LED light sources. In addition, as a light emitting device and a lighting fixture using the same, a heat sink is applied to the light source installation portion, and the device is designed to improve heat dissipation.

  On the other hand, the general-purpose large luminous flux LED light source substrate as described above is often a flat plate having an electrode for electrical connection in the vicinity of the end of the surface. Accordingly, manufacturers of light-emitting devices or lighting fixtures are often fixed in the apparatus using general-purpose resin fixtures (sockets) or the like corresponding to individual LED light sources in consideration of insulation and assemblability.

  The invention of Patent Document 1 is an invention related to a fixing structure of a star-shaped LED light source (an LED package mounted in advance on a star-shaped substrate with electrodes) having a configuration similar to that although the input power is relatively low. The star-shaped LED light source is covered with a resin housing shell with a bonding electrode inside, and it is screwed to an aluminum lamp holder (rear mounting base), and it is assembled by connecting an electric cable without brazing. Is intended to simplify.

  At that time, the screw is positioned from the resin housing so as to be in contact with the side surface of the screw-fixing arc-shaped recess on the side surface of the LED mounting substrate, and is stopped by the lamp holder. As described in the background art of the same literature, the star-shaped LED mounting substrate is, for example, an aluminum substrate type in consideration of heat dissipation, and the back surface and side surface of the substrate are usually not subjected to insulation treatment (as a commercial product). For example, LXHL-MWGC manufactured by Lumileds).

  The invention of Patent Document 2 is an invention of an LED module related to another light source fixing structure using the large luminous flux LED-COB light source. The LED member on which the LED element is mounted on the substrate is placed on a metal base plate, and is further pressed by a resin housing provided with a protruding urging portion for fixing and storing the LED member. According to the configuration, the fixing reliability is not lowered, good heat dissipation is maintained, and higher insulation resistance is obtained.

  In addition, in order to incorporate and fix a general-purpose large luminous flux LED-COB light source in a light-emitting device, there is a case in which a general-purpose resin socket as described above is used to fix the light source. Examples of such commercially available resin socket products include an LED array holder manufactured by Molex, an LED connector / LED socket manufactured by BJB, and the like.

JP 2009-176733 A JP 2012-94566 A

  In the conventional device of Patent Document 1, the LED aluminum substrate is directly screw-fixed on the aluminum back surface mounting table, but there is a problem that a sufficient insulation distance from the electrode part of the aluminum substrate to the aluminum back surface mounting table cannot be secured. Further, since the screw contacts the side surface of the arc-shaped concave portion provided on the LED substrate when the screw is fixed, there is a problem that the electrical insulation is deteriorated through the screw and the arc-shaped concave portion. In consideration of insulation, an insulating sheet may be sandwiched between the LED board and the aluminum back mounting base. In that case, a sufficient heat dissipation effect can be obtained due to the low thermal conductivity of the sheet. There is a disadvantage of not. Furthermore, the resin housing shell is not good in light resistance or heat dissipation (or heat resistance) depending on the material selection, and as a result, there is a problem that the light emission characteristics of the apparatus are deteriorated.

  In the conventional device of Patent Document 2, aluminum is used for the base plate, and an insulating layer is provided on the surface thereof by painting or the like. In many cases, the insulating layer is about several tens to several hundreds of μm. Depending on the electrode position (charging part position) of the light source, the charging part is located at a short distance from the side surface of the end of the base plate. Is not necessarily sufficient as an insulation distance. For example, if a pinhole or the like occurs in the insulating layer in the region near the light source charging part of the base plate, or if a scratch that happens to reach the aluminum region during processing is formed, it will be formed as a conductive path and the insulation will be reduced. There is a risk. Furthermore, the insulating film has a low thermal conductivity (usually less than 1 W / mK), which is disadvantageous in terms of heat dissipation even with a small thickness, and the problem that the light performance inherent in the light source cannot be fully exhibited. is there. In the present specification, the “charging unit” is a charging unit in the Electrical Appliance and Material Safety Law.

  In the case of using the above-mentioned general-purpose resin socket, a specific structural example is not shown here, but it is difficult to secure an insulation distance depending on the specification, and the live part is not sufficiently protected (the live part is exposed). ), Positioning at the time of fixing the light source is not easy, heat dissipation is insufficient, light reflection loss at the socket itself is large, and there are problems in safety, assemblability (mountability), and characteristics.

  The present invention has been made in order to solve the above-described problems. In particular, a general-purpose large luminous flux LED-COB (including a light source using a metal substrate such as aluminum, which requires consideration of insulation, is required. It is an object of the present invention to provide a light emitting device and a lighting fixture having an LED light source mounting structure that protects a charging part and is excellent in insulation and heat dissipation when a light source is incorporated in a light emitting device.

  A light-emitting device according to the present invention includes an LED light source including a substrate, a light-emitting unit in which an LED bare chip is mounted and resin-sealed on the substrate, and a power supply electrode provided on the substrate surface outside the light-emitting region of the light-emitting unit, An insulating lower support and an upper support fixed to sandwich the LED light source, and the lower support is provided with a light source arrangement recess in which the LED light source is disposed and an upper support. And a conductive terminal that is electrically connectable to the electrode of the LED light source inside the upper support, the conductive terminal being connected to an external lead wire, and the light source of the lower support A burr avoiding groove for dropping a burr on the back side of the LED light source is provided at a position of the arrangement concave portion facing the back edge of the LED light source, and a region surrounded by the burr avoiding groove in the light source arranging concave portion Flat surface that can contact the back of One in which the.

  According to the present invention, the following effects can be obtained. Since the LED light source is fixed by the upper support and the lower support using the insulating material, even if the substrate of the LED light source is made of metal, the insulation distance from the LED light source to the device housing (metal) Even if it compares with JIS standard (C8147-1), it can ensure enough. Further, since it is not necessary to directly fix the LED light source with screws, there is no possibility of leakage of electricity to the housing via the screws. Furthermore, the conductive terminal of the upper support is pressed and fixed from the upper side of the surface electrode of the LED light source so as not to come into contact with the substrate side surface of the LED light source that is not insulated. There is nothing.

  In addition, since the conductive terminal of the upper support and the electrode (power supply terminal) on the substrate of the LED light source to be joined to the upper support and the lower support that are the outer shells are positioned inside the human body directly The live part can be protected from being touched. Moreover, it becomes possible to dissipate the heat | fever which an LED light source emits outside effectively by comprising at least the lower support body among the upper support body and the lower support body with a high thermal conductivity material such as alumina. . Furthermore, when fixing a support body and a fixing tool with a screw, since the fixed site | part is made into the thickness area | region and housing | casing (light source installation stand) of a lower side support body, the risk of a material crack can be suppressed as much as possible.

  As described above, it has the effect of reducing the risk of component damage during assembly and improving the performance in terms of safety such as ensuring insulation and protecting the charged part. Furthermore, a light emitting device having a light source fixing structure with little heat dissipation and light loss can be obtained by selecting materials for the upper support and the lower support.

It is a figure which shows the structural example of the LED light source integrated in the light-emitting device of Embodiment 1 of this invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view (sectional view) before assembling showing a light emitting device according to a first embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view (cross-sectional view) showing a light emitting device according to a first embodiment of the present invention when assembly is completed. It is a side view (sectional view) of an upper support. It is a top view which shows the light-emitting device of Embodiment 1 of this invention. It is a top view which shows the light-emitting device of Embodiment 1 of this invention. It is a perspective view which shows the other structural example of an upper side support body. It is a three-dimensional external view (disassembled perspective view) showing the light-emitting device of Embodiment 1 of the present invention. It is a three-dimensional external view (disassembled perspective view) showing the light-emitting device of Embodiment 1 of the present invention. It is a side view (sectional drawing) which shows the light-emitting device of Embodiment 2 of this invention. It is a top view which shows the light-emitting device of Embodiment 2 of this invention. It is a side view (sectional drawing) which shows the light-emitting device of Embodiment 3 of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. In addition, the same code | symbol is attached | subjected to the element which is common in each figure, and the overlapping description is abbreviate | omitted.

Embodiment 1 FIG.
FIG. 1 is a diagram illustrating a configuration example of an LED light source 1 incorporated in the light-emitting device according to Embodiment 1 of the present invention. The LED light source 1 shown in FIG. 1 basically has a plurality of (several tens to several hundreds) blue LED bare chips mounted on a heat-dissipating light source substrate 2 on which necessary conductive patterns are formed. It has a light emitting part sealed with the system fluorescent sealing resin 3, and the light emitting part emits white light during driving. The LED light source 1 includes a white resin dam material 4 that secures at least a sealing resin region on the surface and prevents resin flow, and a surface electrode 5. Further, the LED light source 1 is provided with a thin white resist insulating layer 6 in a region other than the surface electrode 5 outside the dam material 4 in order to maintain insulation. Such an LED light source 1 is often often referred to as an LED-COB (Chip On Board) type, and will be referred to as such in this specification.

  Usually, as the heat dissipating substrate 2 of the COB type LED light source 1, a ceramic material such as alumina or a metal material such as aluminum is used. Of these, in the present embodiment, description will be made on a commercially available COB light source using the latter aluminum substrate (for example, CLL0 * 0 series manufactured by Citizen Electronics). There are many aluminum substrates 2 that do not insulate the end surface, that is, the side surface and the back surface of the substrate 2 after the substrate 2 is cut out, and the light source device using the aluminum substrate 2 needs to be configured with sufficient safety considerations such as insulation. become. Further, the edge of the back surface of the LED light source 1 often has a burr 7 having a height of about several tens to several hundreds μm, which is generated when the substrate 2 is divided.

  Further, in the LED light source 1 of FIG. 1, the surface electrode 5 is arranged at a considerably short distance (about 1 mm or less) from the side surface of the substrate 2 at the end of the substrate 2. Therefore, when the LED light source 1 is directly attached to the metal casing of the apparatus, there is a drawback that a sufficient insulation distance (creeping distance, spatial distance) cannot be secured between the LED light source 1 and the metal casing.

  FIG. 2 and FIG. 3 are examples of a light-emitting device configured to safely incorporate such an LED light source 1, and are diagrams showing the light-emitting device according to Embodiment 1 of the present invention. 2 shows a side view (cross-sectional view) before fixing, and FIG. 3 shows a side view (cross-sectional view) after fixing. The light emitting device shown in FIG. 2 and FIG. 3 has a configuration in which the LED light source 1 is mounted so as to be sandwiched between the lower support 11 and the upper support 20. The insulating and heat-dissipating lower support 11 includes a light source arrangement recess 15 having substantially the same size as the LED light source 1 and an upper support arrangement recess 14 that allows the upper support 20 to be fitted and arranged. The LED light source 1 is arranged in the light source arrangement recess 15.

  The upper support 20 is made of an insulating material. For example, a leaf spring-like conductive (metal) joint terminal 26 (conductive terminal) is provided inside the upper support 20 (joint terminal storage portion 22). The junction terminal 26 is connected to an external power supply line (lead wire 27). The surface electrode 5 of the LED light source 1 fixed at a predetermined position of the lower support 11 is electrically connected to the junction terminal tip 23 which is the tip of the junction terminal 26. At this time, as shown in FIG. 4, the connection to the external power supply line has a structure in which an external power supply line insertion portion 25 (lead wire insertion portion) is provided in the junction terminal 26 and is inserted and fixed from the outside. It may have a structure having soldering or a soldering to the joining terminal 26 in advance. When the lead wire 27 is inserted, a stopper and a claw are provided to prevent the lead wire 27 once inserted from being pulled out, so that the lead wire 27 is accidentally disconnected during assembly or use, and the power supply is cut off. Can be avoided. The joining terminal 26 itself may be incorporated so as to be fixed to the joining terminal storage portion 22 of the upper support 20 and embedded in the constituent material of the upper support 20.

  The upper support 20 is configured to be pressed and fixed by a fixture 21 extending from the lower support 11 side, and the surface electrode 5 and the joining terminal 26 are electrically joined. FIG. 4 shows a side view (cross-sectional view) of the upper support 20. As shown in FIG. 4, the upper support 20 includes an external power supply line insertion portion (external terminal insertion portion) 25 in the joint terminal storage portion 22 on the lower back side thereof, and an external power supply line insertion portion (external terminal insertion). Part) 25, a lead wire 27 is inserted from the outside.

  The LED light source 1 placed on the light source arrangement recess 15 of the lower support 11 is fixed by placing the upper support 20 on the upper side of the LED light source 1 and then using, for example, a metal fixture 21 to fix the upper support 20. It is done by pressing from the surface. The fixing tool 21 is fixed by a screw 24. The screw 24 passes through the attachment screw hole 13 formed in the lower support 11 and is inserted into the screw hole formed in the installation base 40 (heat dissipating installation part) and fastened. As a result, the fixture 21 and the lower support 11 are both fixed to the installation base 40 by the screws 24. The installation base 40 is, for example, a heat-dissipating part of the device housing, or a device housing made of metal, a heat sink provided for heat dissipation of the LED light source 1, or aluminum connected to the housing or the heat sink. And so on.

  With such a configuration, the upper support 20 is pressed and fixed, whereby the joining terminal tip 23 is pressed and connected to the surface electrode 5 of the LED light source 1. As shown in FIG. 5 (top view), the number of places fixed by the fixture 21 is located at two diagonal positions of the LED light source 1 or on each side of the LED light source 1 as shown in FIG. 6 (top view). 4 locations. 5 and 6 are merely examples of the pressing and fixing method, and the fixing attachment position, the pressing portion of the upper support 20 and the like are not limited to those as long as electrical connection is possible.

  In the LED light source 1 shown in FIG. 1, the surface electrode 5 is disposed at the end of the substrate 2 at a considerably short distance (1 mm or less) from the side surface of the substrate 2. Therefore, when the LED light source 1 is directly attached to the metal casing of the apparatus, it is necessary to ensure a sufficient insulation distance (creeping distance, spatial distance) between the LED light source 1 and the metal casing. In view of securing insulation (securing the insulation distance between the LED light source 1 and the housing), at least the lower support 11 is preferably made of an insulating material such as an insulating resin or ceramics. However, in order to improve the luminous efficiency of the device, it is necessary to improve the heat dissipation of the heat generated by the LED light source 1, and from this point of view, ceramic materials such as aluminum nitride and alumina having high thermal conductivity among insulating materials are used. Good.

  In the present embodiment, the lower support 11 is made of an alumina material that has good workability and is relatively inexpensive. Alumina material has a relatively high thermal conductivity and high emissivity (15-30 W / mK for alumina with a purity of 92% to 98% and a thermal conductivity of 35 to 45 W / mK with a purity of 99.9% or more. (Emissivity is about 0.9). In this respect, unlike conventional resin sockets (for example, 0.27 W / mK for PBT (polybutylene terephthalate), which is a heat-resistant resin), it is effective for promoting heat dissipation from the light source regardless of the shape of the support. It is a member.

  On the other hand, the upper support 20 may be made of a heat-resistant resin material based on the PBT, polycarbonate, polyester, epoxy, nylon, or the like, considering only the support function and the charged part protection function. However, when enhancing the heat dissipation effect and the light reflection effect as described later, it is preferable that the upper support 20 is also made of an alumina material. If it is made of an alumina material, the light reflection performance can be improved (with a reflectivity of about 90%), and it is excellent in heat resistance and light resistance, so that high luminous efficiency can be obtained.

  Further, when the screw is fixed, the lower support 11 has a structure in which the screw 24 is fixed at the thick portion of the lower support 11 as shown in FIGS. 2 and 3. It is possible to eliminate cracks due to impact during Further, it is not necessary to directly fix the LED light source 1 with a screw, and since there is no conductive portion connected from the LED light source 1 to the installation base 40, a desired insulation distance can be provided. Moreover, since the upper side support body 20 covers the upper part of the surface electrode 5 of the LED light source 1, it can prevent that a human body touches a charging part.

  When the LED light source 1 is installed on the lower support 11, the lower support 11 is made of an alumina material having high heat radiation characteristics (similarly high heat absorption characteristics), so that the back surface of the LED light source 1 is placed on the lower side. The surface of the support 11 can be placed in contact with a wide surface, and the heat generated by the LED light source 1 can be effectively radiated to the lower support 11. However, there are many cases where there is a burr 7 having a height of about several tens to several hundreds of μm generated when the substrate 2 is divided and processed on the edge of the back surface of the LED light source 1. If placed, the central portion of the back surface of the LED light source 1 is floated (an air layer is formed in the middle), and the heat dissipation effect is often considerably lost.

  Therefore, a burr avoiding groove (burr avoiding recess) 12 into which the burr 7 can be inserted is provided at a position of the light source arrangement recess 15 of the lower support 11 opposite to the edge of the back surface of the LED light source 1, and a burr avoiding groove is provided. The region surrounded by 12 is configured to be a flat surface that can come into contact with the back surface of the LED light source 1. With such a configuration, even when there is a burr 7 on the back edge of the LED light source 1, the burr 7 is avoided, and the back surface of the LED light source 1 and the lower support 11 are brought into contact with each other over a wide area to reduce the thermal resistance. It can be configured. As a result, the heat dissipation of the device can be improved, and a light emitting device with high luminous efficiency can be obtained.

  As shown in FIGS. 5 and 6, the lower support 11 has a power supply line lead groove (power supply line) inserted into a power supply line (lead wire 27) connected to the junction terminal 26 provided on the upper support 20. A drawer recess) 30 is provided. The power line lead-out groove 30 is preferably at a position that does not overlap with the fixture 21 extending from the lower support 11 toward the LED light source 1. For example, the direction in which the fixing tool 21 makes contact with the fixed end where the upper support 20 is in contact with the screw 24 that is the mounting screw of the fixing tool 21 is preferably substantially perpendicular to the direction in which the power line lead-out groove 30 extends. . With such a configuration, when pulling out the power supply line (and the periphery of the contact) to the outside, it is possible to eliminate the inconvenience that the fixing tool 21 becomes an obstacle and the power supply line has to be bent greatly, and the assembling property is improved. Can do.

  Further, as shown in FIGS. 5 and 6, the fixed end where the fixture 21 contacts the upper support 20 is positioned above the surface electrode 5 via the upper support 20 (positioned as close as possible). It is preferable to configure. By setting it as such a structure, the joining terminal front-end | tip 23 of the joining terminal 26 with which the upper side support body 20 was equipped can be strongly pressed against the surface electrode 5 of the LED light source 1, and the connectivity between electrodes is improved. Can do.

  When the lower support 11 is made of an alumina material or the like, if the screw 24 is fixed in a thin region of the lower support 11, the material may be broken when the screw 24 is fixed. . On the other hand, in this embodiment, by fixing the screw 24 at a location where the lower support 11 is thick outside the upper support arrangement recess 14, it is possible to reliably prevent material cracking during assembly. . Although not shown, the screw 24 may be fixed by providing a nut on the back side of the installation base 40 and screwing the nut into the screw 24 for fastening.

  Moreover, in this embodiment, since the fixing tool 21 is fixed simultaneously with the fixing of the lower support 11 and the installation base 40, the risk of material cracking is suppressed as much as possible compared to the case of fixing them separately. Can do. Therefore, there is no material damage during assembly, and a device with good assemblability can be obtained. As is clear from each figure, the LED light source 1 and the fixture 21 are completely insulated, so that no current is passed through the fixing screw 24 and the device is excellent in insulation. Can be obtained.

  Here, when an alumina material is used, the alumina material may be different between the upper support 20 and the lower support 11 depending on characteristics required for the upper support 20 and the lower support 11. For example, considering the direction of light emission from the LED light source 1, it is preferable to use a material having a higher reflectance (visible light reflectance) than the material of the lower support 11 as the material of the upper support 20. When the visible light reflectance of the upper support 20 is equal to or higher than the visible light reflectance of the lower support 11, the light reflection effect is enhanced and a light emitting device with high luminous efficiency can be obtained. Moreover, in order to improve the heat dissipation of the heat generated by the LED light source 1, it is ideal to use a material having a higher thermal conductivity than the material of the upper support 20 as the material of the lower support 11. When the thermal conductivity of the lower support 11 is equal to or higher than the thermal conductivity of the upper support 20, heat dissipation can be improved and a light emitting device with high luminous efficiency can be obtained.

  In the alumina material having high thermal conductivity, there is a material mixed with a thermal conductive filler (appearance cream color, gray, black). When this is used as a constituent material of the lower support 11, Since the light emitted from the LED light source 1 is hardly directly irradiated by itself, it can be used very effectively. In addition, in an appliance that uses the light emitting device as a lighting device, particularly in a direction of emitting light toward the floor, most of the heat of the LED light source 1 is radiated to the installation table 40 side via the lower support 11. Thus, the emitted light from the LED light source 1 is directly applied to the inner side surface of the upper support 20 in particular. Therefore, as a constituent material of the upper support 20, it is preferable to select a material having a high reflectance even if the thermal conductivity is low.

  Accordingly, it is possible to increase both the light extraction efficiency and the heat dissipation effect (an effect of suppressing the light source temperature increase) around the fixed portion of the LED light source 1, and the light emission efficiency of the light emitting device can be effectively increased. Furthermore, it is not necessary to configure each of the upper support 20 and the lower support 11 as a member of the same material with good characteristics that achieves both the reflectance and the heat dissipation effect, and the material unit price can be reduced. As a result, the upper support 20 itself, the lower support 11 itself, and the light emitting device can be configured at low cost.

  Further, as shown in FIG. 3, the side surface facing the light emitting part (light emitting surface) side of the LED light source 1 among the surfaces of the upper support 20 is an inclined surface whose opening area widens from the light emitting part toward the light irradiation direction. It is comprised so that it may have. Since the upper support 20 includes the junction terminal 26 inside, the upper support 20 needs to be thick enough to accommodate the junction terminal 26. On the other hand, the higher the rate at which the emitted light from the LED light source 1 is directly incident on the surface of the upper support 20, the smaller the light extraction amount as the device. By providing the inclined surface as described above on the surface of the upper support 20, even if the upper support 20 has a necessary thickness, the ratio at which the emitted light of the LED light source 1 is directly incident on the surface of the upper support 20 is set. Since it can be lowered, the light extraction amount of the apparatus can be kept high.

  As another configuration example of the upper support 20, as shown in FIG. 7, portions of the upper support 20 other than the region (thickness region 50) where the junction terminal 26 must be accommodated and thickened. The upper support 20 itself may be configured to be thinly formed outside the light emitting portion of the LED light source 1 (thin area 51 such as a flat surface). By adopting such a configuration, the amount of light directly irradiated onto the surface of the upper support 20 is also reduced, so that the light emission efficiency of the apparatus can be increased.

  8 and 9 are three-dimensional external views (disassembled perspective views) of the light-emitting device of the first embodiment shown in FIGS. 2, 3, and 5. 8 and 9 are diagrams in which the observation directions are different from each other. As shown in FIGS. 8 and 9, the light emitting device of this embodiment is incorporated in the lower support 11, the LED light source 1, the upper support 20, the fixture 21 disposed on the upper surface thereof, and the upper support 20. A junction terminal 26 is provided, and the LED light source 1 is fixed so as to be sandwiched between the lower support 11 and the upper support 20 as described above. At least the lower support 11 is made of an alumina material having a high thermal conductivity to ensure insulation between the LED light source 1 and the casing (installation table 40), and as described above, the upper support 20 is also highly reflective. Rate alumina material. Such a lower support 11 has sufficiently high thermal conductivity and high emissivity characteristics as compared with, for example, a general-purpose heat-resistant resin (PBT or the like), so that it can withstand severe heat generation when driving a light source. It is possible to enhance heat dissipation to the surroundings and suppress an extreme temperature rise. As described above, the LED light source 1 mounting structure in consideration of insulation and heat dissipation can provide a light-emitting device that has good luminous efficiency and excellent safety. Furthermore, the upper support 20 is also made of a heat conductive and high reflectivity material, so that a device with good luminous efficiency can be obtained.

  Further, as shown in FIGS. 2 and 3, between the back surface of the LED light source 1 and the lower support 11, for example, a heat conductive grease based on silicone or a thin material such as a heat conductive sheet is used. You may comprise so that the soft heat dissipation material 8 may be provided. Thereby, the contact thermal resistance in the contact surface of the back surface of the LED light source 1 and the lower side support body 11 can be suppressed, and heat dissipation can be improved. Moreover, you may comprise so that the same thin soft heat dissipation material (illustration omitted) may be provided between the lower side support body 11 and the installation stand (housing | casing) 40. FIG. Thereby, the contact thermal resistance in the contact surface of the lower side support body 11 and the installation stand (housing | casing) 40 can be suppressed, and heat dissipation can be improved.

Embodiment 2. FIG.
Next, the second embodiment of the present invention will be described with reference to FIG. 10 and FIG. 11. The difference from the above-described first embodiment will be mainly described, and the same parts or corresponding parts will be denoted by the same reference numerals. The description is omitted. FIG. 10 is a side view (sectional view) showing the light-emitting device according to Embodiment 2 of the present invention. FIG. 11 is a top view showing the light emitting device according to the second embodiment of the present invention.

  In the light emitting device according to the second embodiment shown in FIGS. 10 and 11, a fixture attachment portion 41 in which the fixture 21 protrudes from the installation base (housing) 40 to a height higher than the surface of the lower support 11. And the fixture 21 is fixed to the fixture attachment portion 41 with screws 43. The lower support 11 and the installation base 40 are fixed separately by, for example, screws 42. According to the light emitting device of the second embodiment, the fixture 21 can be fixed to a strong installation base 40 (for example, made of aluminum). Further, the lower support 11 made of ceramic is fixed to the installation table 40 with a sufficient thickness portion. Therefore, it can be set as the structure which a ceramic material does not break easily further.

  Further, as shown in FIG. 11, the lower support body 11 made of ceramic is shaped in advance so as to be fitted to the fixture mounting portion 41 of the installation base 40, whereby the installation base 40 and the lower support body 11. When combined with the above, it is possible to obtain a device with good assemblability that can be fixed to each other without misalignment, and components are not damaged during assembly or use.

Embodiment 3 FIG.
Next, a third embodiment of the present invention will be described with reference to FIG. 12. The description will focus on the differences from the first embodiment described above, and the same or corresponding parts will be denoted by the same reference numerals. Is omitted. FIG. 12 is a side view (sectional view) showing a light emitting device according to Embodiment 3 of the present invention.

  According to the embodiment described above, the insulation between the LED light source 1 and the installation base (housing) 40 can be sufficiently ensured. However, in the third embodiment, the insulation with respect to the side surface periphery of the LED light source 1 is further increased. An example is shown. In the light emitting device of the third embodiment shown in FIG. 12, the burr avoiding groove 12 of the lower support 11 is configured to be provided wider than at least the width of the LED light source 1. In other words, a gap is formed between the side surface of the inner wall of the burr avoiding groove 12 or the light source arrangement recess 15 and the side surface, that is, the end surface of the LED light source 1 (substrate 2). And the layer (soft resin layer) of the heat conductive grease 9 is provided in the flat part (light source back surface area | region) of the light source arrangement | positioning recessed part 15 enclosed by the burr | flash avoiding groove | channel 12 by the method of dripping from a dispenser etc., for example.

  At this time, by adjusting the grease viscosity in advance and setting a larger amount of grease, the thermally conductive grease 9 is filled in the burr avoiding groove 12 of the light source arrangement recess 15 and the substrate 2 of the LED light source 1 is formed. The side surface, that is, the end surface is wrapped. Thus, the LED light source 1 can be fixed in a state where the side surface, that is, the end surface of the substrate 2 of the LED light source 1 is covered with the heat conductive grease 9. By adopting such a method, the insulation distance between the LED light source 1 and the installation base (housing) 40 can be sufficiently maintained, and the insulation of the end surface of the substrate 2 of the LED light source 1 can be enhanced. Therefore, in particular, when the LED light source 1 having a configuration in which the aluminum material is exposed on the side surface of the substrate 2 is used, the insulation around the LED light source 1 can be further enhanced. Further, it is possible to reliably prevent the surface electrode 5 of the LED light source 1 and the side surface of the substrate 2 of the LED light source 1 that are located near each other from being energized for some reason. As a result, a failure of the LED light source 1 (for example, (Short-circuit failure) can be reliably prevented.

DESCRIPTION OF SYMBOLS 1 LED light source, 2 board | substrate, 3 yellow type fluorescent sealing resin, 4 dam material, 5 surface electrode, 6 white resist insulation layer, 7 burr | flash, 8 soft heat dissipation material, 9 heat conductive grease, 11 lower side support body, 12 Burr Avoiding Groove, 13 Mounting Screw Hole, 14 Upper Support Placement Recess, 15 Light Source Placement Recess, 20 Upper Support, 21 Fixing Tool, 22 Joining Terminal Storage, 23 Joining Terminal Tip, 24, 42, 43 Screw, 25 External power supply line insertion section, 26 junction terminal, 27 lead wire, 30 power supply line lead groove, 40 installation base (housing), 41 fixture mounting section, 50 thick area, 51 thin area

A light-emitting device according to the present invention includes an LED light source including a substrate, a light-emitting unit in which an LED bare chip is mounted and resin-sealed on the substrate, and a power supply electrode provided on the substrate surface outside the light-emitting region of the light-emitting unit, An insulating lower support that supports the lower side of the LED light source, and the lower support has a burr avoiding groove that can drop a burr generated at the edge of the back surface of the LED light source substrate. And in the area | region enclosed by the burr avoiding groove | channel, it has a flat surface which surface-contacts with the back surface of a LED light source .

According to the present invention, the following effects can be obtained. Since the LED light source is fixed by the lower support using an insulating material, even if the substrate of the LED light source is made of metal, the insulation distance from the LED light source to the device housing (metal) is determined according to JIS standards (C Even if compared with 8147-1), it can be ensured sufficiently. Further, since it is not necessary to directly fix the LED light source with screws, there is no possibility of leakage of electricity to the housing via the screws. Furthermore, the conductive terminal of the upper support is pressed and fixed from the upper side of the surface electrode of the LED light source so as not to come into contact with the substrate side surface of the LED light source that is not insulated. There is nothing.

Claims (13)

An LED light source having a substrate, a light emitting part in which an LED bare chip is mounted and resin-sealed on the substrate, and a power supply electrode provided on a substrate surface outside the light emitting region of the light emitting part;
An insulating lower support and an upper support, which are fixed so as to sandwich the LED light source;
With
The lower support has a light source arrangement recess in which the LED light source is arranged, and an upper support arrangement recess in which the upper support is arranged,
Inside the upper support, has a conductive terminal that can be electrically connected to the electrode of the LED light source,
The conductive terminal is connected to an external lead wire,
A burr avoiding groove for dropping a burr on the rear surface of the LED light source is provided at a position of the light source arrangement concave portion of the lower support opposite to the edge of the rear surface of the LED light source, and of the light source arrangement concave portion, The light-emitting device which made the area | region enclosed with the burr avoiding groove | channel the flat surface which can contact the back surface of the said LED light source.   The light emitting device according to claim 1, wherein the upper support is fixed by a fixture extending from the lower support so that the conductive terminal of the upper support and the electrode of the LED light source are joined.   The light-emitting device according to claim 1, wherein the lower support has a power line lead-out groove for drawing out a power line composed of the lead wires. The lower support has a power line lead groove for pulling out a power line composed of the lead wires,
The direction in which the fixing tool makes contact with the fixing end that contacts the upper support and the fixing screw of the fixing tool is substantially perpendicular to the direction in which the power line lead groove extends,
The light emitting device according to claim 2, wherein the fixed end of the fixture is positioned above the electrode of the LED light source via the upper support. A heat dissipating installation part is provided on the back side of the lower support,
The conductive terminal of the upper support is used as the electrode of the LED light source while the fixing tool and the lower support are fixed to the heat dissipating portion by screws passing through the fixing and the lower support. The light emitting device according to claim 2 or 4, wherein the light emitting device is pressed. The heat dissipating installation part has a fixture mounting part that protrudes to a height higher than the surface of the lower support,
Fixing the fixture to the fixture mounting portion;
The light emitting device according to claim 1, wherein the lower support is fixed to the heat dissipating portion.   The light emitting device according to claim 1, wherein a constituent material of the lower support is an alumina material.   The light emitting device according to claim 1, wherein a constituent material of the upper support is an alumina material.   The visible light reflectance of the upper support is equal to or greater than the visible light reflectance of the lower support, and the thermal conductivity of the lower support is compared to the thermal conductivity of the upper support. The light-emitting device according to claim 1, wherein the light-emitting device is equal to or greater than one.   The light emitting device according to claim 1, wherein the substrate of the LED light source is a metal substrate.   The light emission of any one of Claims 1 thru | or 10 with which the surface which faces the said light emission part side of the said LED light source among the surfaces of the said upper side support body has the slope which an opening area spreads toward the irradiation direction from the said light emission part. apparatus.   The light emitting device according to any one of claims 1 to 11, further comprising a gel-like or sheet-like soft heat dissipation material between a back surface of the LED light source and the lower support.   When the burr avoiding groove is provided wider than the LED light source, a soft resin layer is provided between the LED light source and the light source arrangement concave portion, and the LED light source is disposed in the light source arrangement concave portion, the LED light source The light-emitting device according to claim 1, wherein a side surface of the substrate is covered with a soft resin.

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