JP2014119675A - Manufacturing method of liquid crystal display device, and mother substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a liquid crystal cell from being broken by polishing liquid used for polishing and thinning a mother substrate.SOLUTION: A mother counter substrate 70 and a mother TFT substrate 60 are bonded with one another with: a mother substrate seal material 61 formed in an island shape with a prescribed pitch and containing a first glass fiber; a temporary fixing material 64 containing a second glass fiber; and a mother substrate encapsulating material 62 filling gaps between the mother substrate seal materials 61, and between the mother substrate seal material 61 and the temporary fixing material 64. The second glass fiber has a diameter larger than that of the first glass fiber. This structure allows uniform application of the mother substrate encapsulating material 62 between the mother counter substrate 70 and the mother TFT substrate 60.

Description

  The present invention relates to a liquid crystal display device, and more particularly to a configuration in which a substrate is thinned by polishing and a yield is improved when a plurality of liquid crystal cells are taken out from a mother substrate.

  In a liquid crystal display device, there are a TFT substrate in which pixel electrodes and thin film transistors (TFTs) are formed in a matrix, and a counter substrate in which color filters are formed at locations corresponding to the pixel electrodes of the TFT substrate, facing the TFT substrate. The liquid crystal is sandwiched between the TFT substrate and the counter substrate. An image is formed by controlling the light transmittance of the liquid crystal molecules for each pixel.

  In the liquid crystal display device, there is a strong demand for reducing the external size of the set while keeping the screen constant, and at the same time reducing the thickness of the liquid crystal display device. In order to make the liquid crystal display device thin, after the liquid crystal display device is manufactured, the outside of the liquid crystal display device is polished and thinned.

  It is not advantageous in cost to manufacture small liquid crystal display devices one by one. Therefore, a process of forming a plurality of liquid crystal display devices on a large substrate and separating the individual liquid crystal display devices after completion is taken. Hereinafter, each liquid crystal display device formed on the mother substrate is referred to as a liquid crystal cell.

  That is, a plurality of TFT substrates are formed on a large mother TFT substrate. A plurality of counter substrates are formed on a large mother counter substrate. Then, the mother TFT substrate and the mother counter substrate are bonded together to form a mother substrate. Individual liquid crystal cells are separated from the mother substrate by scribing or dicing. A liquid crystal display device is completed by injecting liquid crystal into individual liquid crystal cells.

  On the other hand, there is a demand for thinning the liquid crystal cell. Recently, the TFT substrate and the counter substrate constituting the liquid crystal cell are required to be as thin as about 0.18 mm. The thickness of the liquid crystal cell is substantially determined by a glass substrate such as a TFT substrate or a counter substrate. However, the glass substrate used in the liquid crystal cell is standardized to 0.5 mm or 0.4 mm, and using a glass substrate other than the standardized thickness greatly increases the material cost. become. In addition, when a glass substrate that is thinner than a standardized glass substrate is used, problems such as mechanical strength of the glass substrate occur, and it becomes difficult to handle the glass substrate in the manufacturing process.

  In order to solve such a problem and enable a thin liquid crystal cell, there is a technique of polishing the outside of the glass substrate, that is, the TFT substrate and the counter substrate after the liquid crystal cell is completed. As this polishing, mechanical polishing or chemical polishing with hydrofluoric acid or the like is often used.

  Since this polishing is also inefficient for each liquid crystal cell, polishing is performed in the state of the mother substrate. That is, when forming the mother substrate, a mother substrate sealing material is formed around the mother counter substrate. The mother substrate sealing material is formed so as to surround the counter substrate of each liquid crystal cell formed on the mother counter substrate. Thereafter, when the mother counter substrate and the mother TFT substrate are bonded together, a mother substrate in which a plurality of liquid crystal cells are surrounded by a mother substrate sealing material is formed.

  Therefore, the plurality of liquid crystal cells formed on the mother substrate are protected by the mother substrate sealing material. For example, when the mother substrate in this state is chemically polished, it is immersed in a chemical polishing solution. Then, the outer sides of the mother TFT substrate and the mother counter substrate are polished, and the mother TFT substrate and the mother counter substrate can be thinned. On the other hand, since the plurality of liquid crystal cells formed on the mother substrate are protected by the mother substrate sealing material, they are not affected by the polishing liquid.

  In “Patent Document 1”, in a liquid crystal display device of an IPS (In Plane Switching) system, when a transparent conductive film is formed on the outside of a mother counter substrate by sputtering, the air present inside the mother substrate expands to become a mother. In order to prevent the substrate from being destroyed, the mother substrate sealing material necessary for polishing the outside of the mother substrate is broken or removed when the sputtering is performed, thereby breaking the sealing of the mother substrate, A manufacturing method for preventing the entire mother substrate from being destroyed is described.

JP 2009-251565 A

  “Patent Document 1” does not describe whether the mother TFT substrate and the mother counter substrate are bonded in a reduced-pressure atmosphere or in the air. If the mother substrate as described in “Patent Document 1” is bonded in the atmosphere, the mother substrate sealing material having the structure as described in “Patent Document 1” is difficult to eliminate the internal air. Thus, the yield of the bonding process of the mother TFT substrate and the mother counter substrate is lowered.

  Therefore, conventionally, vacuum sealing (including reduced pressure sealing) has been generally performed. FIG. 12 is a plan view showing an example of the liquid crystal display device 2 targeted by the present invention. In the liquid crystal display device 2 of FIG. 12, liquid crystal is sealed from the injection hole 40 in a liquid crystal cell in which the TFT substrate 100 and the counter substrate 200 are bonded together by the sealing material 20, and sealed by the sealing material 30. In FIG. 13, the TFT substrate 100 is larger than the counter substrate 200, and a portion where the TFT substrate 100 is one is a terminal portion 150, and an IC driver 50 is mounted on this portion.

  The liquid crystal display device 2 shown in FIG. 12 is used for a mobile phone or the like, and has a longitudinal diameter LY of, for example, 81 mm, a lateral diameter LX of, for example, 54 mm, and a terminal portion length T of 2.7 mm. Since it is inefficient to manufacture such liquid crystal display devices one by one, a large number of liquid crystal cells are formed on a mother substrate and a large number of liquid crystal cells are manufactured at the same time. In this specification, a state in which a TFT substrate and a counter substrate are bonded to each other with a sealing material is referred to as a liquid crystal cell, and a state in which liquid crystal is sealed and an IC driver or the like is mounted is referred to as a liquid crystal display device. To do.

  FIG. 13 shows an example in which a total of 35 liquid crystal cells 1 are formed on the mother substrate 80, 7 in the horizontal direction and 5 in the vertical direction. A mother substrate sealing material 61 is formed around the mother substrate 80 to seal the inside. That is, in order to reduce the thickness of the liquid crystal display device, the outside of the mother TFT substrate 60 and the mother counter substrate 70 is mechanically polished or chemically polished in the state of the mother substrate 80. Whether it is mechanical polishing or chemical polishing, a polishing solution is used. When the polishing liquid enters the mother substrate 80, each liquid crystal cell 1 becomes defective because each liquid crystal cell 1 is not yet sealed.

  A mother substrate sealing material 61 as shown in FIG. 13 is generally formed on a mother counter substrate 70 and bonded to the mother TFT substrate 60. At this time, if bonding is performed in the air, the internal air is difficult to escape to the outside, so that the pressure inside the mother board 80 becomes unstable and often causes a seal failure.

  Therefore, when forming the mother substrate 80 as shown in FIG. 13, it is performed in a vacuum. FIG. 14 is a process flow for producing the mother substrate 80 as shown in FIG. In FIG. 14, a mother TFT substrate 60 and a mother counter substrate 70 are separately formed. The mother substrate sealing material 61 is applied to the mother counter substrate 70 by a dispenser or printing. Thereafter, the entire bonding apparatus is evacuated to a vacuum. Here, exhausting to a vacuum includes the meaning of reducing the pressure.

  In the vacuum state, the X-axis and Y-axis of the mother TFT substrate 60 and the mother counter substrate 70 are confirmed and bonded together. Since the inside is evacuated, the pressure inside the mother substrate sealing material 61 does not become too large to become unstable. Thereafter, the mother substrate is taken out from the vacuum apparatus. Then, the mother substrate sealing material 61 is thermally cured. Thereafter, the mother TFT substrate and the mother counter substrate are thinned by mechanically polishing or chemically polishing the outside of the mother substrate.

  When the mother substrate sealing material shown in FIG. 13 is used, the inside of the bonding apparatus needs to be evacuated as shown in FIG. Since the mother substrate is large, the bonding apparatus becomes large and the vacuum apparatus becomes large. Therefore, the cost of manufacturing equipment increases, and the manufacturing cost of the liquid crystal display device is increased. When there is a limit to the increase in size of the vacuum device, a large mother substrate is cut into a medium-sized substrate, and a liquid crystal display device is manufactured by a process as shown in FIG. In this case, the manufacturing efficiency is lower than when manufacturing with a large substrate. Furthermore, a process for cutting a large mother substrate into a medium mother substrate is required.

  The subject of this invention is implement | achieving the structure which does not require a vacuum device in the process of bonding a mother TFT substrate and a mother counter substrate.

  The present invention overcomes the above problems, and the main specific means are as follows.

(1) A method of manufacturing a liquid crystal display device in which a TFT substrate on which a pixel electrode and a pixel having TFTs are formed and a counter substrate on which a color filter is formed are bonded together by a sealing material, and liquid crystal is sealed inside. A plurality of TFT substrates are formed on the mother TFT substrate, a plurality of mother counter substrates are formed on the mother counter substrate, and a mother substrate sealing material including a first glass fiber is provided around the mother counter substrate via a gap between seals. When the width in the linear direction of the mother substrate sealing material is q1 and the gap between the seals is g, q1> g, and g is 5 mm or less, a part of the mother substrate sealing material is replaced by a temporary fixing material including a second glass fiber, and the diameter of the second glass fiber is the first glass The mother TFT substrate is positioned larger than the diameter of the fiber, the mother TFT substrate and the mother counter substrate are aligned in the atmosphere, the temporary fixing material is cured by ultraviolet rays, and then the mother substrate sealing material is thermally cured to form the mother TFT substrate A mother substrate is formed by adhering to the mother counter substrate, and a mother substrate sealing material is applied from a gap between the mother TFT substrate and the mother counter substrate around the mother substrate, and the mother substrate sealing material is cured by ultraviolet rays. And then thinning by polishing the mother TFT substrate or the mother counter substrate of the mother substrate,
Then, it isolate | separates into each liquid crystal cell, The manufacturing method of the liquid crystal display device characterized by the above-mentioned.

(2) A mother substrate having a mother TFT substrate on which a plurality of TFT substrates on which pixels having pixels and TFTs are formed is formed, and a mother counter substrate on which a plurality of counter substrates on which color filters are formed are formed. A mother substrate sealing material having a first glass fiber is formed in a line shape at a predetermined pitch in a shape of islands around a gap between the seals around the mother substrate, and the line of the mother substrate sealing material is formed. When the width in the shape direction is q1, and the gap between the seals is g, q1> g, and g is 5 mm or less,
A part of the island-shaped mother substrate sealing material is replaced by a temporary fixing material having a second glass fiber, and the diameter of the second glass fiber is larger than the diameter of the first glass fiber. The mother substrate sealing material is formed between the mother substrate sealing material and the mother substrate sealing material and between the mother substrate sealing material and the temporary fixing material on the end side of the mother substrate. A featured mother board.

  According to the present invention, the mother counter substrate and the mother TFT substrate are bonded to each other by the mother substrate sealing material formed so as to jump out through the gap between the seals, so that the internal air escapes from the gap between the seals. When bonding the counter substrate, the atmospheric pressure inside the mother substrate does not increase.

  The counter substrate and the TFT substrate are bonded by first temporarily bonding the temporary fixing material by ultraviolet (UV) curing, and then thermally curing the mother substrate sealing material. By making the diameter of the glass fiber included in the temporary fixing material larger than the diameter of the glass fiber included in the mother substrate sealing material, the distance between the TFT substrate and the counter substrate in the seal portion becomes uniform, so When the sealing material is filled, it can be uniformly applied, and at the time of polishing, it is possible to prevent defects caused by the polishing liquid entering the inside of the mother substrate.

It is a top view of the mother board by the present invention. It is a flow of the manufacturing process of the mother opposing substrate by this invention. It is a top view which shows the state which formed the mother board | substrate sealing material in the mother opposing board | substrate. It is a top view which shows the state which formed the mother board | substrate sealing material and the temporary fixing material in the mother opposing board | substrate. It is a top view which shows the shape of the mother board | substrate sealing material and temporary fix | stop material in the edge part of a mother counter substrate. It is a top view which shows the shape of the mother board | substrate sealing material in the corner part of a mother opposing board | substrate. It is a perspective view which shows the state which apply | coats a mother board | substrate sealing material. It is detail drawing which shows the application | coating state of the mother board | substrate sealing material by this invention. It is detail drawing which shows the application | coating state of the mother board | substrate sealing material by a prior art example. It is an example of the glass fiber contained in the mother board | substrate sealing material. It is an example of the glass fiber contained in a temporary fix | stop material. It is a top view which shows the example of the liquid crystal display device with which this invention is applied. It is an example of a mother substrate sealing material in the case of bonding a mother counter substrate and a mother TFT substrate in a vacuum, which is a conventional example. It is a process chart in the case of bonding a mother counter substrate and a mother TFT substrate in a vacuum, which is a conventional example.

  The contents of the present invention will be described in detail below using examples.

  FIG. 1 is a plan view of a mother board 80 according to the present invention. The mother substrate 80 is obtained by bonding a mother TFT substrate 60 and a mother counter substrate 70 together. In FIG. 1, a total of 35 liquid crystal cells 1 are formed on a mother substrate 80, 7 in the horizontal direction and 5 in the vertical direction. Each liquid crystal cell 1 is formed with a sealing material 20, and a part of the sealing material 20 is an injection hole 40 for injecting liquid crystal.

  That is, after the mother substrate 80 is completed and separated into the respective liquid crystal cells 1, liquid crystal is injected from the injection holes 40, and then sealed with the sealing material 30. Therefore, in the state of FIG. 1, the inside of each liquid crystal cell 1 is open through the injection hole 40, and when the polishing liquid or the like enters the mother substrate 80, it enters the inside of each liquid crystal cell 1. Each liquid crystal cell 1 becomes defective.

  In order to prevent this, in FIG. 1, a mother substrate sealing material 61 and a mother substrate sealing material 63 are formed to prevent the polishing liquid and the like from entering the mother substrate. A feature of the present invention is that both the mother substrate sealing material 61 and the mother substrate sealing material 63 prevent the polishing liquid and the like from entering the inside.

  In FIG. 1, two temporary fixing materials 64 for temporary bonding before bonding by the mother substrate sealing material 61 are formed on the short side of the mother substrate 70 and four on the long side. The number of the temporary fixing materials 64 varies depending on the size of the substrate, bonding conditions, and the like. The mother substrate of FIG. 1 is in a state where the mother TFT substrate 60 and the mother counter substrate 70 are each thinned to about 0.18 mm by chemical polishing.

  FIG. 2 is a process flow for manufacturing the mother substrate shown in FIG. 3 to 11 are views showing the state of the mother substrate in each process corresponding to the process flow of FIG. In FIG. 2, the mother counter substrate 70 and the mother TFT substrate 60 are manufactured separately. In this embodiment, the temporary fixing material 64, the mother substrate sealing material 61, and the like are formed on the mother counter substrate 70 side, but can also be formed on the mother TFT substrate 60 side.

  FIG. 3 is a plan view showing a state where the mother substrate sealing material 61 is printed on the mother counter substrate 70. The mother substrate sealing material 61 is not continuous but formed in a jumping manner. Therefore, when the mother TFT substrate 60 and the mother counter substrate 70 are bonded together, it is possible to avoid the phenomenon that the internal air is trapped and the pressure rises.

  In FIG. 3, the mother substrate sealing material 61 has a portion that is not formed at a predetermined interval. This portion is replaced by a temporary fixing material 64. That is, the mother substrate sealing material 61 and the sealing material 20 of each liquid crystal cell 1 are thermosetting resins, and are bonded by heating after the mother counter substrate 70 and the mother TFT substrate 60 are pasted together. The alignment, position, and interval of the mother TFT substrate 60 and the mother counter substrate 70 may change until the thermosetting is stabilized.

  In order to prevent this phenomenon, the temporary fixing material 64 formed of an ultraviolet curable resin is arranged at a predetermined interval. This is application of the temporary fixing material 64 in FIG. Application of the temporary fixing material 64 is performed by a dispenser or the like. FIG. 4 is a plan view showing a state in which the temporary fixing material 64 is formed on the mother counter substrate 70 in this way. Two temporary fixing members 64 are formed on the short side of the mother counter substrate 70 and four on the long side.

  FIG. 5 is a plan view showing a detailed shape in the side portion of the mother substrate sealing material 61. On the mother counter substrate 70, an overcoat film 201 formed in each liquid crystal cell is continuously formed from the end of the mother counter substrate 70 to a distance d1. For example, d1 is 5 mm. The overcoat film 201 is not formed on the portion where the mother substrate sealing material 61 is formed.

  A distance d2 from the end of the mother counter substrate 70 to the center of the mother substrate sealing material 61 is, for example, 3 mm. Each of the island-shaped mother board sealing materials 61 has, for example, a racetrack shape. The width of the mother board 70 in the side direction is q1, and the distance between the centers of the circles at the end of the racetrack is q2. For example, q1 is 2 mm, and q2 is 1 mm, for example. Further, the width w of the island-shaped mother substrate sealing material 61 in the vertical direction in FIG. 3, that is, the direction perpendicular to the side is, for example, 2 mm.

  The island-shaped mother substrate sealing material 61 is formed in a linear shape (in-line shape) with a predetermined pitch p through an inter-seal gap g. Desirably, the predetermined pitch p is constant over the entire circumference excluding the corner portion. The predetermined pitch p is, for example, 3.5 mm. In this case, when q1 is 2 mm, the dimension g of the gap between seals is 1.5 mm. The above numerical values are examples, but the width q1 in the side direction of each mother substrate sealing material 61 is larger than the dimension g of the gap between seals. Further, the dimension g of the gap between seals needs to be set so as not to exceed 5 mm. This is because if the gap g between the seals is too large, it is difficult to stop the mother substrate sealing material 63 described later at a predetermined position.

  In FIG. 5, a temporary fixing material 64 is formed between the mother substrate sealing material 61 and the mother substrate sealing material 61. The temporary fixing material 64 is formed by a dispenser or the like, the plane is substantially circular, and the diameter r is 3 mm. Since the temporary fixing material 64 is different in material and shape from the mother substrate sealing material 61, the portion where the temporary fixing material 64 is formed is between the mother TFT substrate 60 and the mother counter substrate 70 as compared with the other portions. The interval is easy to fluctuate. Then, in this portion, there is a region where the sealing material 63 cannot be applied when the mother substrate sealing material 63 is applied later.

  In the present invention, as will be described later, the diameters of the glass fibers contained in the mother substrate sealing material 61 or the temporary fixing material 64 for controlling the distance between the mother counter substrate 70 and the mother TFT substrate 60 are made different. Thus, the distance between the mother counter substrate 70 and the mother TFT substrate 60 in the mother substrate seal portion is made uniform.

  FIG. 6 shows the shape at the corner of the mother substrate sealing material 61. In FIG. 6, the mother substrate sealing material 61 is formed in a shape that chamfers corners. At the corner, the mother substrate sealing material 61, which will be described later, has a different approach, so the shape of the mother substrate sealing material 61 is different from that of the side portion. In FIG. 4, C1 of a corner part is 4.7 mm, for example. d2 is the same as that of FIG. 3, and is 3 mm, for example.

  The above dimensions are the dimensions of the mother substrate sealing material 61 formed on the mother counter substrate 70. Therefore, after the mother counter substrate 70 and the mother TFT substrate 60 are bonded together, the dimensions of the mother substrate sealing material 61 are different. However, the dimension g of the gap 62 between the seals of the mother board sealing material 61 is smaller than the width q1 in the side direction of the mother board sealing material 61, the dimension g of the gap 62 between the seals is smaller than 5 mm, and the mother board sealing material. It is the same that 61 is preferably formed at a constant pitch.

In this manner, after the mother substrate sealing material 61 and the temporary fixing material 64 are formed on the mother counter substrate 70, the mother TFT substrate 60 and the mother counter substrate 70 are positioned in the atmosphere using alignment marks or the like. And paste them together. According to the configuration of the present invention, the mother counter substrate 70 and the mother TFT 60 substrate can be bonded to each other even when not in a vacuum. The mother TFT substrate 60 and the mother counter substrate 70 are temporarily fixed. This is the UV curing process of the temporary fixing material 64 in FIG. A substrate in which the mother TFT substrate 60 and the mother counter substrate 70 are temporarily fixed is put into a thermosetting furnace, and the mother substrate sealing material 61 is cured, whereby the mother substrate 80 is formed. This is “thermosetting of mother substrate sealing material” in FIG.

  As shown in FIG. 4 and the like, when the mother TFT substrate 60 and the mother counter substrate 70 are bonded together, the internal air escapes from the gap 62 between the seals of the mother substrate sealing material 61 formed in a jumping manner. Therefore, there is no problem that the mother substrate 80 is destroyed when the sealing material 20 or the mother substrate sealing material 61 is thermally cured.

  In FIG. 2, after the mother substrate sealing material 61 is thermally cured, a sealing material 63 is applied to seal the inside. FIG. 7 is a schematic diagram showing a state where the mother substrate sealing material 61 is applied between the mother TFT substrate 60 and the mother counter substrate 70 using the dispenser 300. FIG. 7 shows the mother TFT substrate 60 and the mother counter substrate 70 apart from each other for easy understanding, but in reality, they are bonded via a mother substrate seal material 61. In FIG. 7, the mother substrate sealing material 63 is partially formed by the dispenser 300. When the mother substrate sealing material 63 is applied to the ends of the mother TFT substrate 60 and the mother counter substrate 70, the mother substrate sealing material 63 enters between the substrates, and between the island-shaped mother substrate sealing material 61 and the mother substrate sealing material 61, Stops due to surface tension. Therefore, the mother substrate sealing material 63 is formed from the end of the mother substrate 80 to a predetermined position.

  In FIG. 7, the temporary fixing material 64 is formed between the island-shaped mother substrate sealing material 61 and the mother substrate sealing material 61, but the mother substrate sealing material 63 is similarly formed in the temporary fixing material 64. Is applied. By the way, since the island-shaped mother substrate sealing material 61 and the temporary fixing material 64 are different in material and shape, the portion where the temporary fixing material 64 is formed and the other portion are opposed to the mother TFT substrate 60. The distance between the substrates 70 tends to be different.

  If the distance between the mother TFT substrate 60 and the mother counter substrate 70 can be uniformly formed even in the portion of the temporary fixing material 64, the mother substrate sealing material 63 can be uniformly applied as shown in FIG. However, if the distance between the mother TFT substrate 60 and the mother counter substrate 70 is different in the temporary fixing material 64 portion, as shown in FIG. 9, the portion where the mother substrate sealing material 63 is not applied in the temporary fixing material 64 portion. Will occur.

  Such a phenomenon occurs when the interval between the mother counter substrate 70 and the mother TFT substrate 60 is increased or decreased in the temporary fixing material 64. By the way, both the mother substrate sealing material 61 and the temporary fixing material 64 are made of resin. However, in order to set the distance between the mother counter substrate 70 and the mother TFT substrate 60, glass fibers are included therein, The interval is set according to the diameter.

  Conventionally, in order to make the interval constant, the diameter of the glass fiber 65 included in the mother substrate sealing material 61 is the same as the diameter of the glass fiber 66 included in the temporary fixing material 64. However, in such a conventional example, in particular, in the portion of the temporary fixing material 64, a portion where the mother substrate sealing material 63 cannot be applied occurs, resulting in a decrease in yield.

  The feature of the present invention is that the diameter of the glass fiber 66 included in the temporary fixing material 64 is larger than the diameter of the glass fiber 65 included in the mother substrate sealing material 61, whereby the distance between the mother TFT substrate 60 and the mother counter substrate 70. Is uniform. In other words, it is common knowledge that the same distance between the mother TFT substrate 60 and the mother counter substrate 70 can be obtained by making the diameters of the glass fibers contained in the mother substrate sealing material 61 and the temporary fixing material 64 the same. The feature of the present invention is that the diameter of the glass fiber 66 included in the temporary fixing material 64 is larger than the diameter of the glass fiber 65 included in the mother substrate sealing material 61. With such a special configuration, the distance between the mother TFT substrate 60 and the mother counter substrate 70 can be made uniform, and the mother substrate sealing material 63 can be applied uniformly. I can do it.

  According to the experiment, when the diameter of the glass fiber 66 included in the temporary fixing material 64 is φ2 and the diameter of the glass fiber 65 included in the mother substrate sealing material 61 is φ1, 1.1φ1 ≦ φ2 ≦ 1.4φ1 It should be a range. More preferably, the range is 1.15φ1 ≦ φ2 ≦ 1.3φ1. The diameter φ1 of the glass fiber 65 included in the mother substrate sealing material 61 is, for example, about 6,5 mm.

  The above is “application of the mother substrate sealing material” in FIG. Thereafter, as shown in FIG. 2, the mother substrate sealing material 63 is cured with ultraviolet rays. Thereafter, the mother substrate 80 is immersed in a chemical polishing solution, and the mother TFT substrate 60 and the mother counter substrate 70 are polished to about 0.18 mm. According to the present invention, since the mother substrate sealing material 63 can be uniformly applied over the entire mother substrate 80, the phenomenon that the polishing liquid penetrates into the mother substrate and destroys the individual liquid crystal cells is avoided. I can do it.

  DESCRIPTION OF SYMBOLS 1 ... Liquid crystal cell, 2 ... Liquid crystal display panel, 10 ... Display area, 20 ... Sealing material, 30 ... Sealing material, 40 ... Sealing hole, 50 ... IC driver, 60 ... Mother TFT substrate, g61 ... Mother substrate seal Material: 62 ... Gap between seals, 63 ... Mother substrate sealing material, 64 ... Temporary fixing material, 65 ... Glass fiber for mother substrate sealing material 66 ... Glass fiber for temporary fixing material, 70 ... Mother counter substrate, 80 ... Mother substrate 100 ... TFT substrate 200 ... Counter substrate 201 ... Overcoat film 300 ... Dispenser

Claims (8)

A TFT substrate on which a pixel electrode and a pixel having a TFT are formed and a counter substrate on which a color filter is formed are bonded by a sealing material, and a liquid crystal display device in which liquid crystal is sealed is provided.
A plurality of TFT substrates are formed on the mother TFT substrate, a plurality of mother counter substrates are formed on the mother counter substrate,
A mother substrate sealing material including a first glass fiber around the mother counter substrate is formed in a line shape with a predetermined pitch in an island shape via a gap between seals,
When the width in the linear direction of the mother substrate sealing material is q1, and the gap between the seals is g, q1> g, and g is 5 mm or less,
A part of the mother substrate sealing material is replaced with a temporary fixing material including a second glass fiber,
The diameter of the second glass fiber is larger than the diameter of the first glass fiber,
The mother TFT substrate and the mother counter substrate are aligned in the atmosphere, the temporary fixing material is cured by ultraviolet rays, and then the mother substrate sealing material is thermally cured to bond the mother TFT substrate and the mother counter substrate. By forming a mother substrate,
Apply the mother substrate sealing material from the gap between the mother TFT substrate and the mother counter substrate around the mother substrate,
Curing the mother substrate sealing material with ultraviolet rays;
Then, by thinning the mother TFT substrate or the mother counter substrate of the mother substrate,
Then, it isolate | separates into each liquid crystal cell, The manufacturing method of the liquid crystal display device characterized by the above-mentioned.   A manufacturing method of a liquid crystal display device, wherein 1.1φ1 ≦ φ2 ≦ 1.4φ1 when the diameter of the first glass fiber is φ1 and the diameter of the second glass fiber is φ2.   2. A method of manufacturing a liquid crystal display device, wherein the diameter of the first glass fiber is φ1 and the diameter of the second glass fiber is φ2, 1.2φ1 ≦ φ2 ≦ 1.3φ1.   4. The part for forming the mother substrate sealing material is within 5 mm from the end of the mother counter substrate, and no overcoat film is formed. A method for producing a liquid crystal display device according to claim 1. A mother substrate having a mother TFT substrate on which a plurality of TFT substrates on which pixels having pixels and TFTs are formed is formed, and a mother counter substrate on which a plurality of counter substrates on which color filters are formed are formed,
Around the mother substrate, a mother substrate sealing material having a first glass fiber is formed in a line shape at a predetermined pitch so as to jump out in an island shape through a gap between seals,
When the width in the linear direction of the mother substrate sealing material is q1, and the gap between the seals is g, q1> g, and g is 5 mm or less,
A part of the island-shaped mother substrate sealing material is replaced by a temporary fixing material having a second glass fiber,
The diameter of the second glass fiber is larger than the diameter of the first glass fiber,
A mother substrate sealing material is formed between the mother substrate sealing material and the mother substrate sealing material and between the mother substrate sealing material and the temporary fixing material on the end side of the mother substrate. And mother board.   6. The mother substrate according to claim 5, wherein 1.1φ1 ≦ φ2 ≦ 1.4φ1 when the diameter of the first glass fiber is φ1 and the diameter of the second glass fiber is φ2. .   The mother substrate according to claim 6, wherein the diameter of the first glass fiber is φ1 and the diameter of the second glass fiber is φ2, and 1.2φ1 ≦ φ2 ≦ 1.3φ1. .   The portion for forming the mother substrate sealing material is within 5 mm from the end of the mother counter substrate, and no overcoat film is formed. Mother board as described in

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