JP2011248916A - Vacuum control system and vacuum control method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide technology for controlling gas flow in a vacuum vessel.SOLUTION: A vacuum controlling system 10 is provided, which controls using a vacuum pump the vacuum pressure and flow of process gas in a vacuum vessel 500 that performs a process to a subject of process with a supply of process gas from a gas supply unit. The vacuum control system 10 is provided with vacuum controlling valves 100, 200 that are connected between a plurality of gas exhaust ports 561, 562 disposed at different positions from each other in the vacuum vessel 500 and a vacuum pump 300; a pressure measurement unit 631 that measures the vacuum pressure of the process gas supplied to the subject of process; and a control device 610 that operates a degree of opening of the plurality of vacuum control valves 561, 562 in accordance with a measured vacuum pressure.

Description

  The present invention relates to a technique for controlling the behavior of a fluid in a vacuum vessel used in a manufacturing process with a vacuum control valve.

  In the semiconductor manufacturing process, for example, a wafer W to be processed is placed inside a vacuum chamber 710 (see FIGS. 20 and 21) such as chemical vapor deposition (CVD), and a process surface Ws of the wafer W is set. There is a step of exposing to a process gas (also referred to herein simply as a gas). The process gas contains a thin film constituent element and reacts on the process surface Ws to form a film material.

  In order to form a uniform film, a more stable and uniform supply of process gas to the wafer W is required. On the other hand, in the conventional CVD process, evacuation by a vacuum pump is performed while supplying a process gas with a configuration as shown in FIGS. This exhaust control is generally performed by manipulating the conductance of the exhaust system using a pendulum valve that moves the pendulum 720 to manipulate the opening / closing amount.

JP 2009-117444 A

  However, in such a method, when the position of the pendulum 720 is moved to adjust the conductance, the center of the opening moves as the pendulum 720 moves. Such movement of the center of the opening causes a bias in the gas flows FL1 and FL2 inside the vacuum vessel 710, causing non-uniform gas supply such as generation of a stagnation region where gas supply is stagnant. . Further, the gas supply non-uniformity occurs as a decrease in the concentration of the thin film constituent elements in the vicinity of the exhaust side of the wafer W in the configuration in which the gas is supplied from one side of the wafer W and the gas is exhausted from the other side. . Such a bias in the supply of gas causes a bias in the film pressure on the process surface Ws, and the influence has become apparent with the progress of higher precision and higher density of the product as described above.

  The present invention has been created to solve at least a part of the above-described conventional problems, and an object thereof is to provide a technique for controlling the flow of gas inside a vacuum vessel.

  Means 1 is a vacuum control system that uses a vacuum pump to control the vacuum pressure and flow of the process gas in a vacuum vessel that receives a process gas from a gas supply unit and executes a process on a process target. The vacuum control system includes a vacuum control valve connected between each of a plurality of gas discharge ports arranged at different positions in the vacuum vessel and the vacuum pump, and is supplied to the process target. A pressure measuring unit for measuring the vacuum pressure of the process gas, and a control device for operating the respective opening degrees of the plurality of vacuum control valves according to the measured vacuum pressure.

  The means 1 can control the vacuum pressure and the flow direction of the process gas in the vacuum vessel by manipulating the discharge amounts from the discharge portions arranged at different positions in the vacuum vessel. As a result, not only the process gas pressure and flow rate but also the process gas flow direction can be operated as the third operation parameter as a semiconductor process condition setting, so that a new freedom of the process gas flow direction can be obtained. You can get a degree.

  In addition, the vacuum pump may be connected to a common vacuum pump from a plurality of vacuum control valves, or one vacuum pump may be provided for each of the plurality of vacuum control valves. Further, the control of the flow of the process gas may be implemented so as to intentionally operate the direction, and on the process target surface as follows, the process gas is uniformly distributed from the process gas supply unit to each exhaust unit. You may mount so that the flow of a process gas may be implement | achieved.

  Means 2 is means 1, in which the plurality of gas discharge ports are arranged at positions sandwiching a process reaction region in which the process is performed inside the vacuum vessel. The pressure measuring unit measures a vacuum pressure in the process reaction region. In this way, it is possible to increase the amount of operation of the gas flow vector in the vacuum vessel by adjusting each gas outlet while controlling the vacuum pressure in the process reaction region. Furthermore, if the exhaust gas flow rate is uniform, a uniform process gas flow on the process target surface can be easily realized.

  The “position where the process reaction regions are sandwiched between” does not have to be arranged in a plane parallel to the plane to be processed, and may be arranged shifted in the vertical direction. Further, when the number of gas discharge ports is an odd number, the positions arranged at equal intervals or non-uniform intervals in the annular position centering on the process gas supply section are also “positions that sandwich the process reaction regions. "include.

  Means 3 is means 2, in which the control device has at least one of a difference in conductance from the process reaction region to each gas outlet and an individual difference in each exhaust system including the vacuum pump and the vacuum control valve. One is compensated and the exhaust flow rates of the plurality of vacuum control valves are controlled so as to approach each other.

  According to the means 3, even if there is a difference in conductance from the process reaction region to each exhaust part or an individual difference in each exhaust system, the process gas is uniformly supplied from the process gas supply part to each exhaust part on the process target surface. Process gas flow can be realized. Furthermore, design restrictions due to conductance can be relaxed, and the degree of freedom of design inside the vacuum vessel can be increased.

  Means 4 is means 2, in which the control device has at least one of a difference in conductance from the process reaction region to each gas outlet and an individual difference in each exhaust system including the vacuum pump and the vacuum control valve. One is compensated, and the effective pumping speeds in the process reaction regions of the plurality of vacuum control valves are controlled so as to approach each other.

  According to the means 4, the vacuum pressure and the flow of the gas are simply controlled using the effective exhaust speed that can be directly calculated based on the gas supply amount that can be actually measured and the vacuum pressure of the process gas. be able to.

  Means 5 is the means 3 or means 4, wherein the control device is configured to store an offset value for compensating for at least one of the difference and the individual difference, and an offset read from the offset value storage. A target value setting unit that sets a target value for controlling the opening degree of the plurality of vacuum control valves using the value. By so doing, it is possible to easily control the opening degree of the plurality of vacuum control valves.

  Means 6 is means 5, wherein the plurality of vacuum control valves have a shut-off function for shutting off a gas flow. The control device has a function of generating the offset value based on characteristic data of each of the plurality of vacuum control valves and storing the generated offset value in the offset value storage unit. The characteristic data is data for setting the target value acquired in a state where one of the plurality of vacuum control valves is operated and the other valves of the plurality of vacuum control valves are shut off. is there.

  According to the means 6, since the characteristic data of the plurality of vacuum control valves can be individually obtained, simple mounting is possible using the linearity of the gas flow. Data for setting the target value has a broad meaning and is not necessarily limited to data representing the target value itself, but may be data representing the opening degree of the vacuum control valve (measurement value of the opening degree), for example.

  Means 7 is means 5 or means 6 wherein the control device is a common command value that is a common command value for operating the respective opening degrees of the plurality of vacuum control valves in accordance with the measured vacuum pressure. A common main control unit that outputs a degree command value, and a plurality of vacuum control valves that are provided for each of the vacuum control valves to control the degree of opening of each of the plurality of vacuum control valves according to the common opening command value And a subordinate control unit. Each subordinate control unit acquires an actual value of the opening degree of each vacuum control valve, and sets the opening degree of each vacuum control valve according to each actual value, the common opening command value, and the offset value. Control.

  According to the means 7, since the control is performed based on the actually measured value of the opening degree of each vacuum control valve, the linearity of the relationship between the control input and the opening degree can be ensured. By utilizing this linearity, the present configuration can be controlled with a common control law by the main control unit even if the opening ranges of the vacuum control valves are mutually shifted by the offset value. In other words, this configuration realizes the suppression of the change in the characteristics of the vacuum control valve even if the opening range is shifted by securing the linearity of the opening and the control input by actually measuring the opening. It is.

  The means 8 is the vacuum control system according to any one of the means 1 to 7, wherein the plurality of vacuum control valves are vacuum control valves for controlling a vacuum pressure in the vacuum vessel by operating a valve opening degree with a working fluid. A control valve body having a flow path connecting the vacuum vessel and the vacuum pump, and a valve seat formed in the flow path, and the valve by adjusting a lift amount which is a distance between the valve seat and An operation unit including a valve body that performs an operation of an opening degree and that blocks the flow path by contact with the valve seat; a piston; and a rod that couples the valve body and the piston; and the control A cylinder connected to the valve main body for accommodating the piston; Gap the piston Comprising a bellofram sealing while following the operation, the. The operating part and the cylinder are spaces that are sealed by the bellophram and have a cylindrical shape surrounding the rod, and a direction in which the lift amount is increased with respect to the piston in accordance with the working pressure of the working fluid. The valve opening operation chamber that generates a load on the valve, and the valve opening operation chamber and the central axis are shared, and the load is generated in the direction of reducing the lift amount with respect to the operating portion in response to the supply of the working fluid. A breaking load generating chamber.

  The means 8 is controlled by a vacuum control valve that seals a gap between the outer peripheral surface of the piston and the inner peripheral surface of the cylinder with a film-like elastic body that seals while following the operation of the piston. Since the vacuum control valve having such a configuration has a low hysteresis characteristic, the control performance of the vacuum control system can be remarkably improved.

  Means 9 is the means 8, wherein the cylinder includes a head cover having a sliding protrusion accommodated in the breaking load generating chamber. The vacuum control valve has a sealing surface that seals between the blocking load generation chamber and the sliding projection, and the sealing surface according to the supply of the working fluid to the blocking load generation chamber The sealing part which can raise the surface pressure of is provided.

  In the vacuum control valve of the means 9, a sealing portion in which the surface pressure of the sealing surface is increased in accordance with the supply of the working fluid to the interrupting load generating chamber is used for the interrupting load generating chamber. As a result, when the valve opening is manipulated, that is, when the valve is not cut off, the pressure of the sealing surface of the breaking load generating chamber can be suppressed and the sliding can be performed with low friction. As a result, for example, the operation of the valve opening with low hysteresis can be realized with a simple configuration without performing a bellophram.

  Means 10 is means 9, in which the sliding convex portion shares a central axis with the valve opening operation chamber and has a cylindrical shape having an outer diameter smaller than the inner diameter of the valve opening operation chamber, The operating portion has a guide portion extending in the direction of the operation in a space surrounded by an inner peripheral surface of the sliding convex portion, and the vacuum control valve is located between the guide portion and the sliding convex portion. And a bearing that enables sliding in the direction of the operation and restrains the positional relationship between the guide portion and the sliding projection in a direction perpendicular to the direction of the operation.

  The vacuum control valve of the means 10 is provided with a guide portion extending in the direction of movement in the space surrounded by the inner peripheral surface of the cylindrical sliding convex portion. The sliding surface of the sliding projection is arranged at a position close to the bearing. Thereby, the precision of the clearance of the sliding surface between the interruption | blocking load generation | occurrence | production chamber and a sliding convex part which has a severe request | requirement of precision than a belofram can be improved easily.

  The means 11 is any one of the means 8 to 10, wherein the breaking load generating chamber is formed inside the rod.

  The means 12 is any one of the means 8 to 11, wherein the control device includes a pressure sensor for measuring a vacuum pressure in the vacuum vessel, a working fluid supply section for supplying a working fluid, and the working fluid. And a pneumatic circuit for supplying the working fluid to the vacuum control valve, and operating the working fluid supplied from the pneumatic circuit to the vacuum control valve to operate the vacuum. A controller for controlling the vacuum pressure in the container.

  Means 13 is means 12 in which the control device is configured to receive a vacuum pump stop signal including information indicating the stop of the vacuum pump, and to flow between the valve opening operation chamber and the working fluid exhaust unit. And a flow path between the breaking load generation chamber and the working fluid supply unit is connected.

  The vacuum control system of means 13 is in an operation mode in which a shut-off load is applied in response to reception of a vacuum pump stop signal, so a shut-off state is secured even if the pressure on the vacuum pump rises due to an unexpected stop of the vacuum pump. Has the advantage of being able to. Note that “reception of the vacuum pump stop signal” has a broad meaning including, for example, confirmation of the state of the internal contact on the vacuum pump side indicating the operating state of the vacuum pump and failure of the normal signal of the vacuum pump.

  The means 14 is the means 12 or 13, wherein the pneumatic circuit is in a non-energized state with a first solenoid valve that connects a flow path between the valve opening operation chamber and the working fluid exhaust part in a non-energized state. And a second electromagnetic valve for connecting a flow path between the breaking load generation chamber and the working fluid supply unit.

  In the vacuum control system of the means 14, a first electromagnetic valve that connects a flow path between the valve opening operation chamber and the working fluid exhaust part in a non-energized state, and the shut-off load generation chamber in a non-energized state Since it has the 2nd electromagnetic valve which connects the flow path between the said working fluid supply parts, it will be in an emergency interruption state by all means at the time of power-off or a power failure. This makes it possible to easily realize a system design that considers ensuring safety during an emergency stop or power failure.

  The means 15 is a vacuum control method for controlling the vacuum pressure and flow of the process gas in a vacuum vessel that receives the process gas from the gas supply unit and executes the process on the process target using a vacuum pump. The vacuum control method includes the steps of preparing each vacuum control valve connected between each of a plurality of gas discharge ports arranged at different positions in the vacuum vessel and the vacuum pump, and the process A pressure measuring step of measuring the vacuum pressure of the process gas supplied to the object, and a control step of operating the respective opening degrees of the plurality of vacuum control valves according to the measured vacuum pressure.

  Note that the present invention is not limited to a semiconductor manufacturing apparatus, but can also be applied to a semiconductor manufacturing method, and further, can be used for a process apparatus for flowing gas into a vacuum vessel.

  According to the first means, not only the pressure and flow rate of the process gas but also the direction of the process gas can be operated as the third operation parameter, so that a new degree of freedom of the flow direction can be added to the semiconductor process condition setting. Can be provided.

A sectional view showing the composition of vacuum control system 10 of a 1st embodiment. 1 is a plan view of a vacuum control system 10. FIG. FIG. 3 is a control block diagram of the vacuum control system 10. 4 is a flowchart showing the operation content of a control system of the vacuum control system 10. The flowchart which shows the content of the offset valve opening command value acquisition process. Explanatory drawing which shows a mode that the vacuum control valve 100 act | operates alone. Explanatory drawing which shows the calculation formula used for calculation of an effective exhaust speed. Sectional drawing which shows the structure of the vacuum control system 10a of a modification. Sectional drawing which shows the structure of the vacuum control valve 30 at the time of the no-energization (valve fully closed) in 2nd Embodiment. The expanded sectional view which shows the structure of the rod cover 81 which the vacuum control valve 30 has at the time of non-energization. Sectional drawing which shows the structure of the vacuum control valve 30 at the time of valve full open. Sectional drawing which shows the operation state at the time of control of the vacuum pressure of the vacuum control valve 30. FIG. FIG. 3 is an enlarged cross-sectional view showing a friction surface between a packing 70 and an inner peripheral surface 63. The schematic diagram which shows the mounting state of the packing 70, and demonstrates the sealing principle. The schematic diagram which shows the state at the time of non-pressurization of the interruption | blocking load generation chamber 39, and demonstrates a sealing principle. The schematic diagram which shows the time of pressurization to the interruption | blocking load generation | occurrence | production chamber 39, and demonstrates a sealing principle. The schematic diagram which shows the structure of the vacuum control system 20 of embodiment. The schematic diagram which shows the structure and action | operation content of the pneumatic circuit 22 of embodiment. The control block diagram of the vacuum control system 20 of embodiment. Explanatory drawing which shows the flow of the gas in the inside of the vacuum vessel 710 of a prior art. Explanatory drawing which shows the flow of the gas in the inside of the vacuum vessel 710 of a prior art.

  Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.

(A. Configuration of the vacuum control system of the first embodiment)
FIG. 1 is a cross-sectional view showing a configuration of a vacuum control system 10 of the first embodiment. FIG. 2 is a plan view of the vacuum control system 10 of the first embodiment. The vacuum control system 10 controls the flow of gas supplied to the vacuum vessel 500 that performs a chemical vapor deposition (CVD) process. The vacuum control system 10 includes two vacuum control valves 100 and 200 and one turbo molecular pump 300. The vacuum control valve 100 is connected between the gas outlet 561 of the vacuum vessel 500 and the turbo molecular pump 300. The vacuum control valve 200 is connected between the gas discharge port 562 of the vacuum vessel 500 and the turbo molecular pump 300. In this embodiment, the two vacuum control valves 100 and 200 have the same configuration. The turbo molecular pump 300 is connected in series with a dry pump (not shown).

  The vacuum vessel 500 protects the wafer stage 520 that supports the wafer W to be processed, the gas dispersion unit 510 that distributes and supplies gas to the process surface Ws of the wafer W, and the vacuum control valves 100 and 200. For this purpose, a shielding plate 530 and a pressure measuring unit 631 are provided. In the first embodiment, the process surface Ws is supported by the wafer stage 520 so as to be parallel to a horizontal plane, that is, a plane perpendicular to the direction of gravity. A gas supply pipe 512 for supplying gas from the outside of the vacuum vessel 500 and a support structure (not shown) are connected to the gas dispersion unit 510.

  The gas dispersion unit 510 has a facing surface 511 parallel to the process surface Ws. The facing surface 511 supplies the gas flow FL from a direction substantially perpendicular to the process surface Ws. The shielding plate 530 has a disk shape that covers each of the gas discharge ports 561 and 562. In the first embodiment, the pressure measurement unit 631 includes a pressure detection unit 632 that detects a pressure near the process center Wc in the horizontal plane. In this specification, “in a horizontal plane” means in a state projected onto a horizontal plane. The process center Wc is a preset position in an area where the process is executed. The area where the process is performed is also referred to as the “process reaction area”. Since almost no pressure loss occurs in the process reaction region, the pressure detector 632 may be disposed anywhere in the process reaction region.

  As can be seen from FIGS. 1 and 2, the housing of the vacuum vessel 500 has a dome portion 551 having a dome shape for storing the gas dispersion portion 510, two gas discharge pipes 571, 572, and a frame 554. And a lower housing 553 to which the wafer table 520 is fixed. The dome portion 551 has a gas supply port Gc in the vicinity of the process center Wc in the horizontal plane.

  As can be seen from FIG. 2, the two gas discharge pipes 571 and 572 are installed at positions sandwiching the process reaction regions in the horizontal plane. The vacuum control valves 100 and 200 are connected to the two gas discharge pipes 571 and 572, respectively. The two vacuum control valves 100 and 200 are also connected in opposite directions at a position sandwiching the process reaction regions in the horizontal plane.

  The flow of gas in the vacuum vessel 500 is as follows. As shown in FIG. 1, the gas is supplied from the gas supply port Gc to the vacuum vessel 500. As described above, the gas supplied from the gas supply port Gc is supplied from the facing surface 511 of the gas dispersion unit 510 as a gas flow FL from a direction substantially perpendicular to the process surface Ws. The gas supplied to the process surface Ws bypasses the shielding plate 530 and is sucked into the gas discharge ports 561 and 562 while performing the CVD process on the process surface Ws. The gas sucked into the gas discharge ports 561 and 562 is discharged from the turbo molecular pump 300 via the two vacuum control valves 100 and 200. The turbo molecular pump 300 generates effective exhaust speeds Soa and Sob (m ^ 3 / sec) in the vicinity of the inlet 301. The effective exhaust speed Soa is a share of the flow path passing through the gas discharge port 561. The effective exhaust speed Sob is a share of the flow path that passes through the gas discharge port 562. The two effective exhaust velocities Soa and Sob coincide with each other in the first embodiment.

  The vacuum control valve 100 includes an upstream flow path 141 connected to the gas discharge port 561 of the vacuum vessel 500, a downstream flow path 142 connected to the turbo molecular pump 300, an upstream flow path 141, and a downstream flow path. A poppet valve body 110 that opens and closes to and from 142, a biasing spring 133 that biases the poppet valve body 110 to the closed side, a cylinder chamber 135 that moves the poppet valve body 110 to the open side by the force of compressed air, and a cylinder An air channel 134 for guiding compressed air to the chamber 135, an electropneumatic control valve 131 for operating the compressed air supplied to the air channel 134, and an air port 132 for supplying compressed air to the electropneumatic control valve 131 And an exhaust port 137 (see FIG. 2) for discharging the compressed air from the electropneumatic control valve 131.

  The downstream channel 142 is provided with a pressure sensor 145 having a detection surface 146 that measures the pressure P2a inside the channel. Similarly, the vacuum control valve 200 includes a pressure sensor 245 having a detection surface 246 that measures the pressure P2b inside the flow path. The poppet valve body 110 has an elastic seal member 112, and can be cut off between the upstream flow path 141 and the downstream flow path 142 by being pressed against the valve seat 143 by the biasing spring 133.

  The conductance operation of the vacuum control valve 100 is performed by operating the lift amount of the poppet valve body 110. In this specification, the lift amount means a distance La between the poppet valve body 110 and the valve seat 143. The conductance of the vacuum control valve 100 can be manipulated as the conductance between the upstream channel 141 and the downstream channel 142 by adjusting the lift amount La. The vacuum control valve 200 has the same configuration as that of the vacuum control valve 100, and the conductance can be operated in the same manner. The internal pressure of the downstream flow path 142 fluctuates due to such conductance operation. This internal pressure P <b> 2 a is measured by a pressure sensor 145 having a detection surface 146 inside the downstream side flow path 142, and is sent to the controller 610. Similarly, in the vacuum control valve 200, the internal pressure P2b is measured and sent to the controller 610.

(B. Configuration and operation content of vacuum control system of first embodiment)
FIG. 3 is a control block diagram of the vacuum control system 10 of the first embodiment. This control system includes a first slave loop that controls the lift amount of the poppet valve body 110 of the vacuum control valve 100, a second slave loop that controls the lift amount of the poppet valve body 210 of the vacuum control valve 200, and the vacuum vessel 500. It is comprised as a cascade control of the double loop structure which has a master loop which controls the internal pressure of this. Each control loop of the slave loop and the master loop can be configured as, for example, a known PID control system. The slave loop and the master loop are also called a main control unit and a subordinate control unit, respectively.

  The first slave loop is a control aimed at causing the electropneumatic control valve 131 (see FIG. 1) of the electropneumatic control unit 130 to operate the pressure in the cylinder chamber 135 so that the position of the poppet valve body 110 approaches the target value. It is a loop. The electropneumatic control valve 131 can manipulate the internal pressure of the cylinder chamber 135 and manipulate the lift amount by the balance with the urging force of the urging spring 133. The target value is given to the electropneumatic control valve 131 by the controller 610 as a reference valve opening command value pv1 representing the lift amount of the poppet valve body 110. The lift amount of the poppet valve body 110 is measured by the valve body position sensor 138 and fed back to the electropneumatic control valve 131. The reference valve opening command value pv1 is also called a common opening command value.

  The first slave loop operates the lift amount of the poppet valve body 110 so as to reduce the deviation δ1 between the feedback amount and the reference valve opening command value pv1. Thereby, the first slave loop can control the lift amount of the poppet valve body 110 to approach the reference valve opening command value pv1 given from the controller 610. Manipulating the lift amount is physically equivalent to manipulating the orifice diameter.

  Instead of the lift amount, the internal pressure of the cylinder chamber 135 may be measured and used as a feedback amount. However, if the lift amount is fed back, it is possible to suppress a decrease in accuracy due to nonlinearity between the command value (control input) from the master loop and the lift amount (opening degree). This decrease in accuracy occurs when the opening ranges of the vacuum control valves are mutually shifted by the offset value. In this configuration, the linearity between the opening and the control input is ensured by actually measuring the opening, thereby suppressing the change in the characteristics of the vacuum control valve even if the opening range is mutually shifted.

  The second slave loop is different from the first slave loop in that the target value is not the reference valve opening command value pv1 but the valve opening command value pv2, and the other configuration is common. The valve opening command value pv2 is a command value generated by adding the offset valve opening command value pva to the reference valve opening command value pv1. As the offset valve opening command value pva, a value read from the correction value data storage unit 620 is used. The offset valve opening command value pva is a correction value set so that the effective exhaust speeds Sa and Sb (m ^ 3 / sec) when the entire control system is stable in a steady state are matched with each other. The correction value data storage unit 620 is also called an offset value storage unit.

  The effective pumping speed Sa1 (see FIG. 3) regards the flow path from the process center Wc to the inlet 301 of the turbo molecular pump 300 via the gas discharge port 561 (see FIG. 1) and the turbo molecular pump 300 as one body. It means the exhaust speed when the process center Wc is handled as the inlet of the turbo molecular pump 300. The process center Wc is a pressure measurement position by the pressure measurement unit 631. The effective pumping speed Sa1 is an pumping speed considering reduction due to conductance from the process center Wc to the inlet 301 of the turbo molecular pump 300, and has a meaning as an effective pumping speed at the process center Wc. On the other hand, the effective pumping speed Sb1 (see FIG. 3) is a pumping speed considering reduction due to conductance from the process center Wc to the inlet 301 of the turbo molecular pump 300 via the gas discharge port 562 (see FIG. 1). It has a physical meaning as an effective exhaust speed at the process center Wc.

  The fact that the effective exhaust speeds Sa1 and Sb1 (m ^ 3 / sec) coincide with each other means that the turbo molecular pump 300 generates the same effective exhaust speed at the process center Wc by the conductance operation. On the other hand, in the process center Wc, the route passing through the gas discharge port 561 and the route passing through the gas discharge port 562 share the same pressure, so the same exhaust flow rate (Pa · m ^ 3 / sec) is obtained. Will be realized. As a result, gas is discharged at the same exhaust flow rate from the two gas discharge ports 561 and 562 arranged at positions sandwiching the process reaction region.

  The master loop is a control loop in which the controller 610 operates the conductances of the two vacuum control valves 100 and 200 to bring the pressure near the process center Wc of the vacuum vessel 500 closer to the pressure target value P1t. . The pressure target value P1t is a fixed pressure value set in advance as a value suitable for the process. Since the valve opening command value pv2 is a value corrected by adding a fixed offset valve opening command value pva to the reference valve opening command value pv1, the valve opening command value pv2 and the reference valve opening command value pv1 Will change as a whole. As a result, the two vacuum control valves 100 and 200 move integrally with the offset lift amount as the center position, so that the responsiveness is hardly impaired even for control by a single vacuum control valve. There is an advantage that a control law can be easily built.

  FIG. 4 is a flowchart showing the operation contents of the control system of the vacuum control system 10 of the first embodiment. In step S100, the user executes an offset valve opening command value acquisition process. The offset valve opening command value acquisition process is a process of operating each of the two vacuum control valves 100 and 200 individually to acquire characteristic data and acquiring the offset valve opening command value pva. Details of the offset valve opening command value acquisition processing will be described later.

  In step S200, the user performs a pressure target value input process. The pressure target value input process is a process of inputting a pressure target value P1t, which is a preset fixed target value, to the controller 610. The pressure target value P1t is determined as a value suitable for the process to be executed in the vacuum vessel 500.

  In step S300, the controller 610 executes a reference valve opening command value determination process. The reference valve opening command value determination process is a process of sequentially calculating the reference valve opening command value pv1 according to the deviation δm between the measured pressure inside the vacuum vessel 500 and the pressure target value P1t. Reference valve opening command value pv1 is determined based on a control law stored in controller 610 in advance. The reference valve opening command value pv1 is used as a target value of the first slave loop that controls the vacuum control valve 100.

  In step S400, an offset valve opening command value addition process is executed. The offset valve opening command value addition process is a process in which the offset valve opening command value pva read from the correction value data storage unit 620 is added to the reference valve opening command value pv1. The valve opening command value pv2 is generated by this addition process. The valve opening command value pv2 is used as a target value for the second slave loop that controls the vacuum control valve 200. In this way, the two vacuum control valves 100 and 200 are integrally controlled using the reference valve opening command value pv1 and the valve opening command value pv2 which are target values offset from each other as target values.

  In step S500, a lift amount operation process is executed. The lift amount operation process is a process in which each of the two poppet valve bodies 110 and 210 is operated in accordance with the reference valve opening command value pv1 and the valve opening command value pv2. Thereby, the orifice diameter of the vacuum control valves 100 and 200 is substantially operated, and the conductance of the vacuum control valves 100 and 200 is operated.

  In step S600, a vacuum container pressure measurement process is executed. The vacuum container internal pressure measurement process is a process in which the internal pressure of the vacuum container 500 is measured by the pressure measurement unit 631. The measurement position is in the vicinity of the process center Wc in the vacuum vessel 500. As a result, the pressure in the vicinity of the process center Wc is controlled so as to approach the pressure target value P1t, and the gas is equally discharged from both the vacuum control valves 100 and 200.

  As described above, in the first embodiment, if the offset valve opening command value pva can be acquired, the control law can be easily applied to the control by a single vacuum control valve without impairing the responsiveness. Can be assembled.

(C. Acquisition method of offset valve opening command value in the first embodiment)
FIG. 5 is a flowchart showing the contents of the offset valve opening command value acquisition process of the first embodiment. In step S110, the user closes the vacuum control valve 200. Thereby, the influence of the operation of the vacuum control valve 200 can be eliminated, and the exhaust gas characteristic data by the vacuum control valve 100 can be acquired.

  FIG. 6 is an explanatory diagram showing a state in which the vacuum control valve 100 of the first embodiment operates alone. In the example of FIG. 6, since the vacuum control valve 200 is closed and the vacuum control valve 100 is in the open state, all the supplied gas is supplied via the gas discharge port 561. 100 will be sucked into. Thus, it can be seen that the characteristic data of the vacuum control valve 100 can be acquired.

  In step S120, the user sets a target value. The target values are the pressure target value P1t in the vicinity of the process center Wc and the gas supply amount (Q / 2) from the gas supply port Gc. The pressure target value P1t is set as a vacuum pressure suitable for the assumed process. The gas supply amount (Q / 2) is set to half of the flow rate Q suitable for the assumed process as the flow rate shared by the vacuum control valve 100 and the turbo molecular pump 300.

  In step S130, the user causes the vacuum control by the vacuum control valve 100 to be executed. In preparation for this vacuum control, the user performs evacuation by a dry pump (not shown) connected in series to the turbo molecular pump 300 to reduce the internal pressure of the vacuum vessel 500 to the molecular region. Next, the turbo molecular pump 300 is started to be in a stable operation state.

  When the internal pressure of the vacuum container 500 reaches the vicinity of the pressure target value P1t, the user starts the gas supply at the flow rate Q / 2 and activates the vacuum control by the vacuum control valve 100. This control operates as cascade control in a state where the master loop and the first slave loop function and the second slave loop is stopped in the control system of FIG. In the gas supply control of the first embodiment, the gas supply amount (Q / 2) is set as a set value, and the gas is stably supplied at the set value.

  As shown in FIG. 8, the controller 610 transmits the reference valve opening command value pv1 to the vacuum control valve 100, and executes control to bring the vacuum pressure P1 closer to the pressure target value P1t. The controller 610 acquires the inlet pressure P2a of the turbo molecular pump 300 and the lift amount La from the vacuum control valve 100. The inlet pressure P <b> 2 a is measured by the pressure sensor 145 having the detection surface 146 as the pressure of the downstream side flow path 142 and is transmitted to the controller 610. The lift amount La is transmitted from the valve body position sensor 138 to the controller 610 via the electropneumatic control valve 131.

  In step S140, the controller 610 detects that a preset stability condition is satisfied, and stores the lift amount La in the correction value data storage unit 620 in response to the detection. The stability condition may be, for example, that both the deviation δm of the master loop and the deviation δ1 of the first slave loop are smaller than a preset threshold value for a predetermined time. The controller 610 further calculates the effective exhaust speed Sa1 of the vacuum control valve 100 and stores it in the correction value data storage unit 620.

  FIG. 7 is an explanatory diagram showing a calculation formula used for calculating the effective exhaust speed Sa1. The effective exhaust speed Sa1 is calculated as follows. First, the controller 610 calculates the conductance C from the vicinity of the process center Wc to the inlet of the turbo molecular pump 300 using the calculation formula F2 (see FIG. 7). Second, the controller 610 calculates the effective exhaust speed Sa1 from the conductance C and the exhaust speed Sa2 of the turbo molecular pump 300 using the calculation formula F4. Here, the conductance C can be calculated from the measured pressure P1m measured by the pressure measuring unit 631 near the process center Wc and the measured value of the inlet pressure P2a of the turbo molecular pump 300 measured by the pressure sensor 122. it can. On the other hand, the exhaust speed Sa2 of the turbo molecular pump 300 can be calculated by the continuous equation F5. In this way, the controller 610 calculates the effective exhaust speed Sa1 of the vacuum control valve 100, and stores the calculation result in the correction value data storage unit 620.

  Calculation formulas F1 to F4 are based on vacuum theory and are determined as follows. The calculation formula F2 is derived by mathematically transforming the calculation formula F1. The calculation formula F1 is based on the conductance definition formula, the gas supply amount (Q / 2), the measured value of the inlet pressure P2a of the turbo molecular pump 300, and the vacuum pressure P1 (measured value) in the vicinity of the process center Wc. , Is substituted. The calculation formula F4 is derived by mathematically modifying the calculation formula F3. The calculation formula F3 is a theoretical formula that represents the relationship among the exhaust speed, the conductance, and the effective exhaust speed Sa1. On the other hand, the calculation formula F5 is determined by using the fact that the gas flow is treated as a one-dimensional flow of the compressive fluid and the mass flow rate is constant.

  In the first embodiment, the conductance C is calculated from the measured value of the inlet pressure P2a of the turbo molecular pump 300 in order to easily understand the inventive concept. However, in the vacuum vessel 500 of the first embodiment, it is sufficient to obtain the lift amount La when the measured pressure P1m measured by the pressure measuring unit 631 in the vicinity of the process center Wc matches the pressure target value P1t. This is because the valve lift amount La that realizes an appropriate pressure P1t can be obtained at a flow rate suitable for the process (share share = Q / 2). In other words, in the gas supply amount (Q / 2), the valve lift amount La that achieves an appropriate effective exhaust speed Sa1 in the vicinity of the process center Wc can be acquired (P1 × Sa1 = Q / 2). Thus, it is not always necessary to calculate the conductance C.

  In step S150, the user stops the control by the vacuum control valve 100 and closes it. The vacuum control valve 100 is closed after the gas supply is stopped. The turbo molecular pump 300 is stopped after the vacuum control valve 100 is closed to prevent the turbo molecular pump 300 from being damaged.

  In step S160, the user sets a target value for the vacuum control valve 200. The set target value is the same as the target value of the vacuum control valve 200. That is, the target values are the pressure target value P1t in the vicinity of the process center Wc and the gas supply amount from the gas supply port Gc (Q / 2: share of the vacuum control valve 200).

  In step S <b> 170, the user executes vacuum control by the vacuum control valve 200. The vacuum control method is the same as the vacuum control by the vacuum control valve 100 (step S130). In step S180, the controller 610 detects that a preset stability condition is satisfied, and stores the lift amount Lb in the correction value data storage unit 620 in response to the detection. The method for obtaining the lift amount Lb is the same as the method for obtaining the lift amount La.

  Thereby, at each shared flow rate (Q / 2), the lift amount La of the vacuum control valve 100 when it coincides with the pressure target value P1t of the process center Wc, the command value Ca at this time, and the lift amount of the vacuum control valve 200 Lb and the command value Cb at this time can be acquired. The lift amount La is the lift amount of the vacuum control valve 100 for setting the pressure at the process center Wc to the pressure target value P1t at the shared flow rate (Q / 2). The lift amount Lb is the lift amount of the vacuum control valve 200 for setting the pressure at the process center Wc to the pressure target value P1t at the shared flow rate (Q / 2).

  Therefore, if the vacuum control by both the vacuum control valves 100 and 200 is functioned, the gas supply amount Q is exhausted at the same shared flow rate (Q / 2). In this vacuum control, the effective pumping speeds Sa1 and Sb1 generated at the process center Wc by the conductance operation of each of the vacuum control valves 100 and 200 by the route via the gas discharge port 561 and the route via the gas discharge port 562. (M ^ 3 / sec) can also be grasped as control for matching each other. The offset valve opening command value pva can be calculated as a difference between the command value Ca and the command value Cb.

  Thus, the vacuum control system 10 of the first embodiment can calculate the offset valve opening command value pva semi-automatically and store it in the correction value data storage unit 620. Thereby, the control system of 1st Embodiment can be functioned. As a result, the gas flow on the process surface Ws can be suppressed from affecting the operation of the vacuum control valve in the vacuum control system, and a uniform flow can be realized in the vicinity of the process surface Ws.

  In the first embodiment, in particular, the two vacuum control valves 100 and 200 move as a unit, and the center of the valve opening moves in the same way in the direction of gravity. The flow deviation is also effectively suppressed.

  In the above-described embodiment, on the vacuum control valve 100 side, the pressure sensor 145 (see FIG. 6) is configured to measure the pressure inside the flow path in the downstream flow path, but the modified example shown in FIG. As described above, the pressure may be measured at each of the gas discharge ports 561 and 562. In this modification, the pressure at the gas discharge port 561 is measured by a pressure sensor 581a having a pressure detection surface 582a inside the gas discharge port 561. On the vacuum control valve 200 side, a pressure sensor 581b having a detection surface 582b for measuring the pressure P2b inside the flow path is also provided. This is because even in such a configuration, the same handling as in the above-described embodiment is possible using the calculation formulas F1 to F5.

  Thus, the pressure measurement position is any position between the gas outlet 561 and the turbo molecular pump inlet 301, any position between the gas outlet 562 and the turbo molecular pump inlet 301, and As long as it is equipped. However, if the pressures P2a and P2b are measured downstream of the vacuum control valves 100 and 200 as in the above-described embodiment, the pressures P2a and P2b fluctuate sharply with respect to the valve lift amount. There is an advantage that the degree command value can be acquired.

(D. Configuration of the vacuum control system 20 of the second embodiment)
The vacuum control system 20 of the second embodiment is different from the vacuum control system 10 of the first embodiment in that a plurality of vacuum control valves 30 having low hysteresis characteristics are used. Since the vacuum control valve 30 has a low hysteresis characteristic, it is possible to perform a highly responsive and precise conductance operation, thereby remarkably improving the vector operability of the reaction gas flow.

  In the following description, a single vacuum control valve 30 and a system for operating the single vacuum control valve 30 are described. However, in application to the present invention, the vacuum control valve 100 of the first embodiment is described. , 200 will be replaced.

  FIG. 9 is a cross-sectional view showing the configuration of the vacuum control valve 30 when not energized (valve fully closed). FIG. 10 is an enlarged cross-sectional view showing the configuration of the rod cover 81 included in the vacuum control valve 30 when not energized. FIG. 11 is a cross-sectional view showing the configuration of the vacuum control valve 30 when the valve is fully opened. The vacuum control valve 30 includes a control valve main body 43, a cylinder tube 31, and an operation member 32. The control valve main body 43 has a cylindrical shape extending in the moving direction (axial direction) of the operation member 32. The control valve main body 43 is formed with a valve box 45 that is a substantially cylindrical recess that opens toward the cylinder tube 31 in the axial direction. The opening of the valve box 45 is closed by a rod cover 81 having a through hole 82 through which the operating member 32 is slidably penetrated.

  The operating member 32 includes a valve body 33 that operates the valve opening degree of the vacuum control valve 30 in the valve box 45, a rod 32r that passes through the through hole 82, and a piston 51 that is connected to an end of the rod 32r. ing. The valve body 33 is connected to the rod 32r, and the lift amount La can be changed by moving the operation member 32 in the axial direction. In this embodiment, the lift amount La corresponds to the valve opening. The operation member 32 corresponds to an operation unit.

  The valve body 33 has a function of blocking the flow path by contacting the valve seat 42 formed in the control valve main body 43. The flow path is blocked by bringing the valve body 33 into contact with the valve seat 42 inside the valve box 45 to isolate the secondary port 44 from the valve box 45. Sealing at the time of blocking is realized by bringing an O-ring 75 partially protruding from the valve body 33 into contact with the valve seat 42 and crushing. The valve seat 42 is, for example, an annular region facing the valve element 33 in the axial direction, and is a region having a small surface roughness formed around the connection port with the secondary port 44. The O-ring 75 has an annular shape at a position facing the valve seat 42 in the axial direction.

  The piston 51 has an annular shape extending in the radial direction toward the inner peripheral surface 53 of the cylinder tube 31, and the valve opening operation chamber 36 (see FIG. 11) sealed on the inner peripheral surface 53 of the cylinder tube 31. Forming. A cylindrical member 51v having a cylindrical shape extending to the opposite side of the valve opening operation chamber 36 in the axial direction is connected to the outer peripheral end portion of the piston 51. The piston 51 is connected to a bellophram 34 that seals the valve opening operation chamber 36.

  The valve opening operation chamber 36 is formed as a donut-shaped sealed space with a variable volume surrounded by the bellophram 34, the rod cover 81, the rod 32r, and the piston 51 (bellowram retainer 52). . The inner end of the bellophram 34 is fastened by a screw 54 between the piston 51 and the bellophram retainer 52. On the other hand, the outer end 34 a of the belofram 34 is sandwiched between the cylinder tube 31 and the rod cover 81. Thereby, the space between the bellophram 34 and the rod cover 81 and the space between the bellophram 34 and the cylinder tube 31 are sealed (sealed). The valve opening operation chamber 36 is formed by partitioning an internal space formed by the inner peripheral surface 53 by the bellophram 34. Operating air can be supplied to the valve opening operation chamber 36 via the valve opening air flow path 37 and the connection flow path 87. A method for supplying the operating air will be described later. Operating air corresponds to the working fluid.

  The belofram 34 is a flexible space partition member having a top hat shape and capable of following or rolling (moving the folded portion) in a long stroke (stroke). The bellophram 34 is a bellophram that seals the gap between the outer peripheral surface 51 s (see FIG. 11) of the piston 51 and the inner peripheral surface 53 of the cylinder tube 31 while following the operation of the piston 51. The bellophram 34 is also referred to as a rolling diaphragm, and does not form a surface contact that causes friction between the operating member 32 and the valve opening operation chamber 36. Therefore, the sliding resistance is extremely small, and low hysteresis characteristics and a small pressure are provided. It has unique characteristics such as responsiveness and high sealing performance. The belofram 34 is configured to ensure a gap between the outer peripheral surface 51s and the inner peripheral surface 53 by the linear bearing 65 so that rolling can be performed smoothly. Details of the linear bearing 65 will be described later.

  Since the bellophram 34 seals the sliding portion between the inner peripheral surface 53 of the cylinder tube 31 having the largest diameter in the vacuum control valve 30 and the piston 51, the friction surface is eliminated and the operation member 32 is remarkably removed. The sliding frictional resistance can be reduced. Thereby, adjustment of the lift amount La with high responsiveness in the low hysteresis characteristic is realized by the pressure operation of the operation air supplied from the electropneumatic control valve 26 to the valve opening air flow path 37. The operating member 32 may be configured to move using an electric motor.

  On the other hand, as shown in FIG. 10, the seal between the rod 32r and the rod cover 81 is configured as follows. In the through hole 82 of the rod cover 81, a mounting recess 83 is formed at a position close to the valve box 45 side, and a mounting groove 84 is formed at a position closer to the cylinder tube 31 side than the mounting recess 83. The mounting recess 83 is equipped with a first-stage light load seal 76 and a second-stage light load seal 77 that have relatively low pressure resistance and low dynamic friction resistance. The mounting groove 84 is provided with a packing 74 having a relatively high pressure resistance. On the other hand, the rod cover 81 is formed with a leak detection port 85 communicating with the mounting recess 83 between the packing 74 and the first-stage light load seal 76 and penetrating to the outside.

  The leak detection port 85 can detect leakage in the packing 74 and leakage in the first-stage light load seal 76 and the second-stage light load seal 77. Leakage in the packing 74 can be detected as leakage of operating air. Leakage in the first-stage light load seal 76 and the second-stage light load seal 77 injects helium gas into the leak detection port 85, while the valve box 45 connected to the helium leak detector (not shown) is in a vacuum state. Can be detected.

  The piston 51 is biased by a biasing spring 55. The biasing spring 55 applies a biasing force to the piston 51 of the operating member 32 in a direction in which both the lift amount La and the volume of the valve opening operation chamber 36 are reduced. The urging spring 55 is accommodated in a space surrounded by the inner peripheral surface 53 of the cylinder tube 31 and the head cover 61 having an annular shape. One of the urging springs 55 is in contact with the piston 51 on the side opposite to the valve opening operation chamber 36 in the axial direction (back side). The other side of the urging spring 55 is in contact with the head cover 61.

  The head cover 61 includes a cylindrical portion 61b having a cylindrical shape and a sliding convex portion 61a having a cylindrical shape having a smaller diameter than the cylindrical portion 61b. The head cover 61 shares the central axis with the sliding convex portion 61a and the cylindrical portion 61b. The difference in diameter between the sliding convex portion 61a and the cylindrical portion 61b forms a stroke limiting surface 61e. The stroke restricting surface 61e is a contact surface that restricts the rising amount of the piston 51 by contacting the stroke restricting end portion 51e formed on the piston 51. As a result, the stroke of the piston 51 is restricted in the ascending direction (lift amount La increasing direction) by the stroke restricting surface 61e, while the descending direction (lift amount La decreasing direction) is restricted by the valve seat 42. .

  The sliding protrusion 61 a is accommodated in a breaking load generation chamber 39 formed inside the operation member 32. The breaking load generation chamber 39 is formed inside the valve opening operation chamber 36 with respect to a center line extending in the operation direction of the operation member 32. As a result, the breaking load generation chamber 39 is provided at a position overlapping the valve opening operation chamber 36 in the operation direction of the operation member 32. As a result, an increase in the size of the vacuum control valve 30 (particularly an increase in the operation direction of the operation member 32) due to the equipment of the breaking load generation chamber 39 can be suppressed. Furthermore, since the sliding radius of the head cover 61 can be reduced, the generation of sliding resistance due to the equipment of the blocking load generation chamber 39 can also be suppressed.

  The application of the breaking load by the breaking load generation chamber 39 can also improve the manufacturability of the vacuum control valve 30. This is because the load when the urging spring 55 is set (load when the valve is closed) at the time of manufacture can be reduced to facilitate manufacture. In other words, the biasing spring 55 is equipped with a spring coefficient that generates a requested breaking load at the time of breaking (when the lift amount La is zero) and an initial deflection amount that generates an initial load (preload) in the prior art. It is requested to do.

  As a result, both the spring coefficient and the initial deflection amount become excessive as the diameter of the vacuum control valve 30 increases, and it is difficult for the vacuum control valve 30 to be manufactured as well as to increase the size of the vacuum control valve 30. It was found by. However, in this configuration, the initial load of the urging spring 55 can be reduced by generating a blocking load between the head cover 61 and the blocking load generation chamber 39.

  The linear bearing 65 restrains the positional relationship in the radial direction (direction perpendicular to the axial direction) between the head cover 61 and the guide rod 56, and relative to the axial direction (moving direction of the operating member 32) with small friction. It is a bearing that can reciprocate. The linear bearing 65 is a space inside the inner peripheral surface of the sliding convex portion 61 a having a cylindrical shape, and is disposed outside the outer peripheral surface of the guide rod 56.

  Since the guide rod 56 is connected to the operation member 32, the linear bearing 65 can maintain (restrain) the positional relationship (gap) between the piston 51 and the inner peripheral surface 53. Thereby, the belofram 34 can move the operating member 32 with respect to the cylinder tube 31 with almost no friction by smoothly moving the folded portion.

  The guide rod 56 is equipped with a valve body position sensor 35 for measuring the operation amount of the guide rod 56 with respect to the head cover 61. An insertion pipe 35b into which the probe 35a of the valve body position sensor is inserted is connected to the guide rod 56 via an adapter 35c. The valve body position sensor 35 can generate an electrical signal corresponding to the insertion length of the probe 35a into the insertion tube 35b. Since the movement amount of the guide rod 56 relative to the head cover 61 can be set as a variation amount of the insertion length, the lift amount La can be measured according to the variation amount. For the valve body position sensor 35, for example, a linear pulse coder (registered trademark) or the like can be used.

  The head cover 61 has two cylindrical sliding surfaces that share a central axis. The first sliding surface is a sliding surface between the outer peripheral surface 61as and the inner peripheral surface 63 of the sliding convex portion 61a. The second sliding surface is a sliding surface between the inner peripheral surface 62as of the sliding convex portion 61a and the guide rod 56. The clearance (gap) between the first sliding surface and the second sliding surface is accurately maintained by the linear bearing 65.

  The linear bearing 65 is disposed between the sliding convex portion 61a and the guide rod 56 as described above, and the mutual positional relationship between the sliding convex portion 61a and the linear bearing 65 is also the same as that of the operation member 32. Maintained regardless of operation. Thereby, the precision of the clearance gap between the interruption | blocking load generation | occurrence | production chamber 39 and the sliding convex part 61a can be improved easily. On the other hand, the linear bearing 65 is maintained with respect to the packing 74 provided in the through hole 82 regardless of the operation of the operation member 32, and the piston 51 and the inner peripheral surface 53 sealed by the bellophram 34 are maintained. It is maintained nearer than the sliding surface in between. As a result, the sliding surface, which requires strict accuracy of the clearance of the sliding surface, is arranged in the vicinity of the linear bearing 65, so that both improvement in sealing performance and reduction in sliding resistance can be easily achieved. Can do.

  In the first sliding surface, a mounting groove 78 (see FIG. 10) having a concave shape is formed on the outer peripheral surface 61as on the entire outer periphery, and a V-shaped packing 70b is formed in the mounting groove 78. It is installed. In the second sliding surface, a mounting groove 79 having a concave shape is formed in the inner peripheral surface 62as over the inner periphery, and a V-shaped packing 70a is mounted in the mounting groove 79. The V-shaped packings 70a and 70b are also called V packings.

  Next, a method for operating the lift amount La of the vacuum control valve 30 will be described with reference to FIG. FIG. 12 is a cross-sectional view showing an operating state when the vacuum pressure of the vacuum control valve 30 is controlled. As described above, the vacuum control valve 30 adjusts the lift amount La, which is the distance between the valve element 33 and the valve seat 42, as the valve opening, so that the vacuum control valve 30 is located between the primary side port 41 and the secondary side port 44. The conductance can be manipulated. The lift amount La is adjusted by moving the position of the operation member 32 relative to the valve seat 42. Conductance means the ease of fluid flow in the flow path.

  The lift amount La is manipulated by a balance between the driving force to the operating member 32 and the biasing force of the biasing spring 55 that is opposite to the driving force. The driving force to the operating member 32 is generated by the action of the operating air pressure inside the valve opening operation chamber 36. In the control of the lift amount La, it is desired to reduce the frictional force resulting from the relative movement between the operation member 32 and the cylinder tube 31. This is because the frictional force is a major factor that causes hysteresis and hinders precise control.

  As shown in FIG. 10, the operating member 32 has three friction surfaces between the operating member 32 and the cylinder tube 31. The first friction surface is a friction surface between the packing 70 b mounted in the mounting groove 78 and the inner peripheral surface 63. The second friction surface is a friction surface between the packing 70 a mounted in the mounting groove 79 and the guide rod 56. The third friction surface is a friction surface between the packing 74 attached to the through hole 82 of the rod cover 81 and the outer peripheral surface of the rod 32r.

  The third friction surface has reduced sliding resistance mainly by reducing the operating pressure in the valve opening operation chamber 36. In the present embodiment, the operation pressure in the valve opening operation chamber 36 can be reduced by reducing the load when the biasing spring 55 is set (the load when the valve is closed) as described above. Further, according to the experiment by the present inventor, it was confirmed that the reduction in sliding resistance and the necessary vacuum leak characteristics can be ensured by setting the surface roughness Ra of the outer peripheral surface of the rod 32r to about 0.2. ing. Note that the third friction surface may be configured to be sealed by covering the operation member 32 with a bellows.

  FIG. 13 is an enlarged cross-sectional view showing the first friction surface, that is, the friction surface between the packing 70 mounted in the mounting groove 78 and the inner peripheral surface 63. The packing 70 is a V-shaped packing having a heel portion 71 and a pair of lip portions 72a and 72b divided into two forks. The packing 70b is configured such that the pair of lip portions 72b are directed to the breaking load generating chamber 39 and the surface pressure is increased by receiving pressure from the breaking load generating chamber 39. The second friction surface is sealed in the same manner as the first friction surface.

  In the design of the sliding portion, the design parameter is the relationship between the clearance S2 of the sliding portion, the depth S1 of the mounting groove 78 and the size difference in the width direction of the pair of lip portions 72a and 72b of the packing 70b. Become. In the present embodiment, since the airtightness of the shutoff load generation chamber 39 is required only when the valve body 33 abuts against the valve seat 42 to generate the shutoff load, the crushing amount of the packing 70b is reduced as will be described later. be able to. Thereby, the amount of friction between packing 70b and inner skin 63 can be reduced, and hysteresis can be reduced.

  Next, with reference to FIG. 14 thru | or FIG. 16, the sealing mechanism by the packing 70b is demonstrated in detail. FIG. 14 is a schematic diagram illustrating the sealing principle by showing the mounting state of the packing 70b. FIG. 15 is a schematic diagram illustrating the sealing principle by showing a state when the breaking load generation chamber 39 is not pressurized. FIG. 16 is a schematic diagram illustrating the sealing principle by showing the pressure applied to the breaking load generation chamber 39. 14 and 16, the surface pressure distributions Pd1 and Pd2 of the packing 70b are shown. Since the vacuum control valve 30 pressurizes the interrupting load generation chamber 39 only at the time of disconnection, pressurization to the interrupting load generation chamber 39 is not performed in a state where the lift amount La is controlled.

  As shown in FIG. 15, the packing 70 b is mounted in the mounting groove 78 in a state in which it is elastically deformed with a crushing amount Q. At the time of non-pressurization, the contact surface pressure and the surface pressure region of the packing 70b are extremely small as indicated by the surface pressure distribution Pd1. This is because the surface pressure distribution Pd1 is a surface pressure distribution generated due to the rigidity and crushing amount Q of the pair of lip portions 72a and 72b. As a result, in a state where the vacuum control is performed by the electropneumatic control valve 26 (when the breaking load generation chamber 39 is not pressurized), there is very little dynamic friction between the breaking load generation chamber 39 and the head cover 61. Will occur.

  On the other hand, as shown in FIG. 16, the breaking load generation chamber 39 can realize sufficient sealing performance as indicated by the surface pressure distribution Pd2 when the breaking load is applied. Further, since the valve body 33 is in the shut-off state in which the shut-off load is in contact with the valve seat 42, there is no need for relative movement between the shut-off load generating chamber 39 and the head cover 61, and there is no control state. It can be seen that the occurrence does not cause any problems. Further, the present inventor has also found that the surface pressure distribution Pd1 can be reduced because leakage during sliding is allowable. Thereby, even if the breaking load generating chamber 39 and the sliding protrusion 61a are provided in order to provide the breaking load generation function, it is possible to realize a design in which the sliding does not newly cause hysteresis. It was found.

  Next, the vacuum control system 20 using the vacuum control valve 30 will be described with reference to FIGS.

  FIG. 17 is a schematic diagram illustrating a configuration of the vacuum control system 20 according to the embodiment. The vacuum control system 20 is connected in series to a vacuum vessel 90 for performing an etching process, a vacuum control valve 30, a controller 21, a pneumatic circuit 22, a turbo molecular pump 300, and a turbo molecular pump 300. A dry pump for evacuation. While the reactive gas G is supplied to the vacuum vessel 90 at a constant supply amount, it is exhausted by the turbo molecular pump 300 through the vacuum control valve 30. The vacuum pressure in the vacuum vessel 90 is controlled by manipulating the conductance of the vacuum control valve 30. The turbo molecular pump 300 corresponds to a vacuum pump.

  The vacuum container 90 includes a reactive gas supply hole 91 to which a reactive gas G is supplied, an exhaust hole 93, and a vacuum pressure sensor 92. A certain amount of reactive gas G measured by a mass flow sensor (not shown) is supplied to the reactive gas supply hole 91. The primary port 41 of the vacuum control valve 30 is connected to the exhaust hole 93. The vacuum pressure sensor 92 measures the vacuum pressure inside the vacuum vessel 90 and transmits an electrical signal to the controller 21. The vacuum pressure is used for operation of the vacuum control valve 30 by the controller 21.

  The internal pressure of the valve opening operation chamber 36 is operated by supplying or exhausting operating air from the pneumatic circuit 22 via the valve opening air flow path 37. The pneumatic circuit 22 is connected to a high-pressure side working fluid supply unit 95 for supplying operation air and a low-pressure side working fluid exhaust unit 96 for exhausting operation air.

  The shut-off load is a load that moves the valve body 33 to the valve seat 42 by operating air supplied from the pneumatic circuit 22 to the shut-off air flow path 38 and presses the valve body 33 against the valve seat 42 after the movement. Function. The blocking load acts as a resultant force with the urging load by the urging spring 55.

  In this embodiment, the blocking load is applied when the controller 21 receives a vacuum pump stop signal from the turbo molecular pump 300 and urgently stops the vacuum control system 20, for example. Below, the operation | movement content in each operation mode including an emergency stop is demonstrated. The controller 21 corresponds to a control unit. The vacuum pump stop signal is a signal that is transmitted, for example, when the vacuum pump stop signal is stopped or when the rotational speed of the turbo molecular pump 300 is abnormally reduced.

  Next, the operation contents of the pneumatic circuit 22 and the vacuum control valve 30 will be described with reference to FIG. FIG. 18 is a schematic diagram illustrating the configuration and operation contents of the pneumatic circuit 22 of the embodiment. The pneumatic circuit 22 is a circuit that supplies operation air in accordance with a command from the controller 21 and operates the vacuum control valve 30 by this. The pneumatic circuit 22 includes an electropneumatic control valve 26 and three electromagnetic valves SV1, SV2, and SV3. The electropneumatic control valve 26 has an air supply valve 26a connected to the high pressure side of the operating air, and an exhaust valve 26b connected to the exhaust side of the operating air.

  In this embodiment, the controller 21 is configured as a programmable logic controller (PLC) including two PID control circuits 24a and 24b. The programmable logic controller 21 is a logic circuit that can realize highly reliable control using, for example, ladder logic. The two PID control circuits 24a and 24b are used for feedback control of the vacuum pressure of the vacuum vessel 90, details of which will be described later. The controller 21 transmits to the pneumatic circuit 22 an on / off command to each of the three electromagnetic valves SV1, SV2, and SV3 and a pulse width modulation signal to the electropneumatic control valve 26. The solenoid valve SV2 and the solenoid valve SV3 are also called a first solenoid valve and a second solenoid valve, respectively.

  The electropneumatic control valve 26 operates, for example, a valve opening air passage for compressed air supplied from the outside by operating the valve opening time (duty) of the air supply valve 26a and the exhaust valve 26b by a known pulse width modulation method. The supply pressure to 37 can be manipulated. The electropneumatic control valve 26 increases air pressure acting on the operation member 32 in the valve opening operation chamber 36 by increasing the valve opening time (duty) of the air supply valve 26a and decreasing the valve opening time of the exhaust valve 26b. Can be high. Thereby, the lift amount La of the valve body 33 can be increased.

  On the other hand, the electropneumatic control valve 26 reduces the valve opening time (duty) of the air supply valve 26a and increases the valve opening time of the exhaust valve 26b, thereby acting on the operating member 32 in the valve opening operation chamber 36. The pressure can be lowered, whereby the lift amount La of the valve element 33 can be reduced by the load from the biasing spring 55.

  The electromagnetic valve SV1 is an electromagnetic valve that switches the flow path connected to the electromagnetic valve SV2 to either the electropneumatic control valve 26 or the working fluid supply unit 95, and is connected to the electropneumatic control valve 26 when not energized. . The electromagnetic valve SV2 is an electromagnetic valve that switches the flow path connected to the valve opening air flow path 37 to either the electromagnetic valve SV1 or the working fluid exhaust part 96. Connected. The electromagnetic valve SV3 is an electromagnetic valve that switches the flow path connected to the shut-off air flow path 38 to either the working fluid supply section 95 or the working fluid exhaust section 96, and the working fluid supply section 95 is not energized. Connected to.

  Next, the contents of each operation mode of the pneumatic circuit 22 will be described with reference to Table T. Table T is a table showing energization states of the three solenoid valves SV1, SV2, and SV3 in each operation mode. In Table T, ON and OFF are indicated by “ON” and “OFF”, respectively.

  In the operation mode at the time of emergency stop of the vacuum control system 20, the electropneumatic control valve 26 and the three electromagnetic valves SV1, SV2, SV3 are all turned off. The emergency stop is an operation mode as a worst case defined in the system design of the vacuum control system 20, and is an operation mode when the controller 21 receives a vacuum pump stop signal from a dry pump (not shown), for example. The dry pump is a pump that is connected in series to the turbo molecular pump 300 and used for evacuation. In this operation mode, all of the atmospheric pressure is applied as a differential pressure between the secondary side port 44 in the atmosphere open state and the primary side port 41 of the vacuum side. This differential pressure load is applied to the valve body 33 in a direction to increase the lift amount La, and the valve body 33 is moved away from the valve seat 42 and acts in a direction to allow the air to flow back to the vacuum vessel 90. In the emergency stop according to the present embodiment, backflow can be prevented against the above-described differential pressure by the blocking load.

  Thus, the high-pressure side working fluid supply unit 95 is connected to the shut-off air flow path 38, and the exhaust-side working fluid exhaust part 96 is connected to the valve opening air flow path 37. As a result, the air pressure in the breaking load generating chamber 39 to which the breaking load is applied increases, and the interior of the valve opening operation chamber 36 to which the load on the valve opening side (lift amount La increases) is lowered to the atmospheric pressure. . As a result, the valve element 33 connected to the operation member 32 moves rapidly in the direction of the valve seat 42, and the vacuum control valve 30 is closed (blocked) and the application of the blocking load is continued.

  Note that the solenoid valve SV3 may be configured such that a flow path connected to the shut-off air flow path 38 is connected to the working fluid exhaust section 96 when not energized. However, as described above, the power supply to the pneumatic circuit 22 is stopped at the time of a power failure if it is configured to be connected to the working fluid supply unit 95 at the time of non-energization. Thus, it can be set as the operation mode of the operation content same as the time of an emergency stop.

  As described above, in a power failure or emergency stop of the vacuum control system 20, the vacuum control valve 30 can be closed and a blocking load can be applied in any operation mode. As a result, in the vacuum control system 20 of the present embodiment, when the power supply to the pneumatic circuit 22 is stopped, the valve element 33 is moved by the urging force of the urging spring 55 and the pressurization of the breaking load generating chamber 39. The air circuit is configured to move to the valve seat 42 and apply a blocking load.

  In such a configuration, it is ensured that the shut-off state is always ensured even when the power is turned off or during a power failure, and thus there is an advantage that a system design that takes safety into consideration in an emergency stop or power failure can be realized easily. is there. Furthermore, in the present embodiment, the controller 21 enters the emergency stop operation mode in response to the reception of the vacuum pump stop signal, so that the pressure of the secondary side port 44 temporarily increases due to the unexpected stop of the turbo molecular pump 300. However, it also has an advantage that a shut-off state can be secured.

  Next, in the operation mode in which the vacuum control valve 30 is closed, the two solenoid valves SV1, SV2, SV3 are turned on, while the solenoid valve SV3 is turned off. In this operation mode, the vacuum control valve 30 is closed when the turbo molecular pump 300 is operating normally. In this operation mode, the biasing spring 55 is set so as to apply a load to the extent that the O-ring 75 is crushed with an appropriate crushing amount in order to close the vacuum control valve 30 in a normal operation state. Thereby, the durability of the O-ring 75 can be enhanced.

  Thus, since this embodiment is provided with the mechanism which generates the interception load for responding to an emergency, the urging force of the urging spring 55 to such an extent that the O-ring 75 is crushed with a crushed amount suitable for normal operation. It is also possible to provide a degree of design freedom that can be set.

  On the other hand, in the operation mode in which the vacuum control valve 30 is opened, all the three solenoid valves SV1, SV2, SV3 are turned on. As a result, the working fluid supply unit 95 on the high pressure side is connected to the valve opening air passage 37 via the two electromagnetic valves SV1 and SV2 in the on state. On the other hand, the exhaust-side working fluid exhaust part 96 is connected to the shut-off air flow path 38 via the electromagnetic valve SV3 in the on state. On the other hand, the electropneumatic control valve 26 is in a state where the flow path is separated from the valve opening air flow path 37 by the electromagnetic valve SV1 in the on state. Thereby, regardless of the operating state of the electropneumatic control valve 26, the vacuum control valve 30 can be rapidly opened (the lift amount La is maximum).

  Finally, in the operation mode in which the vacuum pressure is controlled by the vacuum control valve 30, the electromagnetic valve SV1 is turned off, while the two electromagnetic valves SV2 and SV3 are both turned on. Thereby, the working fluid supply unit 95 on the high pressure side is connected to the valve opening air passage 37 through the electropneumatic control valve 26, the off-state electromagnetic valve SV1, and the on-state electromagnetic valve SV2 in order. Is done. On the other hand, the working fluid exhaust part 96 on the exhaust side passes through the electromagnetic valve SV3 in the on state, and the flow path is connected to the shut-off air flow path 38. Thereby, the electropneumatic control valve 26 can adjust the lift amount La by supplying the operation air from the valve opening air flow path 37 to operate the internal pressure of the valve opening operation chamber 36.

  Next, the control content of the vacuum control system 20 will be described with reference to FIG. FIG. 19 is a control block diagram of the vacuum control system 20 of the embodiment. This control system is configured as a cascade control of a double loop structure having a slave loop SL that controls the lift amount La of the valve element 33 of the vacuum control valve 30 and a master loop ML that controls the internal pressure of the vacuum vessel 90. ing. Each control loop of slave loop SL and master loop ML can be configured as, for example, a well-known PID control system.

  The slave loop SL is a control loop for operating the internal pressure of the valve opening operation chamber 36 by the electropneumatic control valve 26 to bring the lift amount La of the valve element 33 close to the valve opening command value Vp. . In the slave loop SL, the PID control circuit 24b generates a control signal according to the deviation δm between the valve opening command value Vp (target value) and the lift amount La (measured value), and sends the pulse width modulation signal to the electropneumatic control valve. 26. The electropneumatic control valve 26 operates the internal pressure of the valve opening operation chamber 36 in accordance with the pulse width modulation signal to adjust the driving force to the operating member 32 to which the valve element 33 is attached.

  The lift amount La is measured by the valve body position sensor 35 and used as a feedback amount by the PID control circuit 24b. Thereby, the vacuum control valve 30 can feedback-control the lift amount La. Thereby, the conductance of the flow path between the vacuum vessel 90 and the turbo molecular pump 300 can be adjusted.

  In the master loop ML, the PID control circuit 24a determines the valve opening command value Vp according to a preset deviation δp between the target pressure value Pt and the measured pressure value Pm, and transmits it to the PID control circuit 24b. The measured pressure value Pm is the pressure inside the vacuum container 90 measured by the vacuum pressure sensor 92. The PID control circuit 24a adjusts the valve opening command value Vp so that the measured pressure value Pm approaches the target pressure value Pt.

  Note that the feedback loop of the lift amount La may be deleted, and simple single loop control in which the internal pressure of the valve opening operation chamber 36 is operated so that the deviation δp approaches zero may be configured. However, if a double loop configuration is used to feed back the lift amount La, it is possible to suppress a decrease in accuracy due to nonlinearity between the command value (control input) from the master loop ML and the lift amount (opening). This decrease in accuracy occurs when the opening ranges of the vacuum control valves are mutually shifted by the offset value. This configuration is configured such that the characteristics of the vacuum control valve are flat in any opening range by ensuring the linearity of the opening and the control input by actually measuring the opening.

  The vacuum control system 20 further has an open loop AL that applies a blocking load to the valve body 33 via the operation member 32. The programmable logic controller 21 generates a breaking load by applying air pressure to the breaking load generation chamber 39 (see FIG. 10) by turning off the two solenoid valves SV2 and SV3. The magnitude of the breaking load can be set in advance by appropriately setting the inner diameter of the breaking load generating chamber 39 and the outer shape of the head cover 61 regardless of whether the electromagnetic valve SV1 is on or off.

  The embodiment described above has the following advantages.

  In the vacuum control valve 30 of the second embodiment, since the space between the inner peripheral surface of the main cylinder having the largest diameter and the outer peripheral surface of the main piston is sealed by the bellophram, the sliding resistance is reduced and hysteresis is reduced. Can be relaxed. As a result, the vacuum control valve 30 of the second embodiment can easily realize accurate operation with low hysteresis and accurate measurement of its operating state, thereby realizing precise and highly responsive vacuum control. can do.

  Furthermore, in the vacuum control valve 30 of the present embodiment, since the interrupting load generation chamber 39 that generates an interrupting load by supplying the working fluid is formed in the operating portion, the interrupting load is effectively utilized by utilizing the space occupied by the operation member 32. A generation chamber 39 can be equipped. Furthermore, by forming the breaking load generation chamber inside the operating portion, it is possible to provide a degree of freedom in design in the direction of reducing the diameter of the breaking load generation chamber 39. As a result, an increase in the size of the vacuum control valve caused by the equipment of the breaking load generation chamber 39 is suppressed, and the sliding area of the breaking load generation chamber 39 is reduced to reduce the hysteresis caused by the friction of the breaking load generation chamber 39. Can be made.

  In the vacuum control system 20 of the present embodiment, the air circuit is configured so that the valve element 33 immediately moves to the valve seat 42 and the cutoff load is applied in a state where the power supply to all the solenoid valves is stopped. Has been. This makes it possible to easily realize a system design that considers ensuring safety during an emergency stop or power failure.

  In the vacuum control system 20 of the present embodiment, the air circuit is configured so that the valve element 33 immediately moves to the valve seat 42 and the cutoff load is applied in a state where the power supply to all the solenoid valves is stopped. Has been. This makes it possible to easily realize a system design that considers ensuring safety during an emergency stop or power failure.

  In the second embodiment, the gap between the breaking load generating chamber 39 and the blocking piston 61 is sealed with packing, but the gap between the breaking load generating chamber 39 and the blocking piston 61 is sealed with bellophram. You may comprise as follows. However, if the gap between the breaking load generating chamber 39 and the blocking piston 61 is sealed with packing, the configuration of the vacuum control valve can be simplified and the size can be reduced.

  In the second embodiment, a V-shaped packing is used for the sealing surface that seals between the blocking load generation chamber 39 and the blocking piston 61. However, for example, an O-ring may be used. This is because the O-ring also has a property that the contact surface pressure increases in accordance with the supply of the working fluid to the breaking load generation chamber 39. For sealing between the breaking load generation chamber 39 and the blocking piston 61, generally, a sealing portion in which the surface pressure of the sealing surface is increased according to the supply of the working fluid to the breaking load generation chamber 39 is used. Thus, the hysteresis of the vacuum control valve can be reduced. However, if a V-shaped packing is used, the dynamic friction force at the time of non-pressurization can be reduced.

  In the second embodiment, the breaking load generating chamber 39 is formed inside the operation member 32 and the blocking piston 61 is arranged inside the biasing spring. However, the blocking load generating chamber 39 and the blocking piston 61 are separated from each other. A reversed arrangement may also be used. However, if the breaking load generating chamber 39 is formed inside the operating member 32 blocking piston 61, the breaking load generating chamber 39 can be formed using the internal space of the operating member 32. The valve can be downsized.

  In the second embodiment, the vacuum control valve is connected with the primary side port (vacuum vessel side connection port) as the low pressure side and the secondary side port (vacuum pump side connection port) as the high pressure side, and shuts off against the differential pressure load. It is comprised as a form which maintains the interruption | blocking state with a load. However, the high pressure side and the low pressure side may be reversed. If it carries out like this, it can open to oppose the differential pressure load of the direction which maintains the interruption | blocking state. Furthermore, it can be used not only for vacuum vessels but also for pressure control of high-pressure vessels.

(E. Modification)
In addition, it is not limited to the description content of each embodiment mentioned above, For example, you may implement as follows.

  (A) In each of the above-described embodiments, gas discharge from the route via the gas discharge port 561 and the route via the gas discharge port 562 are executed by the single turbo molecular pump 300. You may make it equip with a turbo-molecular pump. By doing this, it is possible to shorten the flow path from the turbo molecular pump to the gas discharge port and increase the effective exhaust speed, thereby realizing high pump efficiency.

  (B) In each of the above-described embodiments, two gas discharge ports arranged at positions sandwiching the process reaction region are used. However, for example, three or more gas discharge ports may be used. Any device that uses a discharge port may be used. Further, each of the four turbo molecular pumps may be connected to each gas exhaust port (the number of gas exhaust ports is 4) via each vacuum control valve (the number of vacuum control valves is 4).

  In the case where the number of gas discharge ports is an odd number (for example, three), it is preferable that the gas discharge ports are arranged at equal intervals in an annular position centered on the process supply unit and the process center Wc. The “position where the process reaction regions are sandwiched between” does not have to be arranged in a horizontal plane, that is, in a plane parallel to the plane to be processed, and may be arranged shifted in the vertical direction. Specifically, both the exhaust ports may be arranged on the lower surface or the upper surface instead of the side surface (first embodiment) of the vacuum container, and one may be the lower surface and the other may be the upper surface. Further, when the number of gas discharge ports is an odd number, the positions arranged at equal intervals or non-uniform intervals in the annular position centering on the process gas supply section are also “positions that sandwich the process reaction regions. "include.

  (C) In each of the above-described embodiments, the difference between the target values of the first slave loop and the second slave loop is used as a correction value. For example, the first slave loop and the second slave loop with respect to the reference value Both of the target values may have a correction value. Such a configuration is effective, for example, in a configuration in which the correction value is stored on the vacuum control valve side.

  (D) A pressure sensor may be additionally provided at each gas discharge port (a total of five sensors in the above embodiment). In this way, the conductance between the inlet of the turbo molecular pump and the gas discharge port is acquired to compensate for individual differences on the exhaust system side, or the conductance difference in the vacuum vessel from the process center Wc to the gas discharge port It is also possible to realize separately the correction for compensating for. In general, it is only necessary to compensate for at least one of the difference in conductance from the gas supply unit to each exhaust unit and the individual difference of each exhaust system including the vacuum pump and the vacuum control valve.

  (E) In each of the above-described embodiments, mounting in a chemical vapor deposition (CVD) process is illustrated, but the present invention can also be used for a process such as etching or sputtering. In general, it can be used for vacuum control of a vacuum vessel that requires control to maintain a vacuum state while supplying gas.

  Each above-mentioned embodiment has a remarkable effect in an etching process. In the etching process, for example, there is a process of placing a wafer W to be processed in a vacuum chamber and exposing the process surface of the wafer W to an etching gas. For example, in reactive ion etching, an etching gas is turned into plasma by discharge ionization or the like inside a vacuum vessel, and a high frequency magnetic field is generated at the cathode on which the wafer W is placed. Thereby, ion species and radical species in the plasma are accelerated in the direction of the wafer W and collide with each other. As a result, sputtering by ions and the chemical reaction of the etching gas occur simultaneously, so that etching with high accuracy suitable for microfabrication can be performed.

  Such high-precision etching is also applied to MEMS (Micro Electro Mechanical Systems), and the practical use of integrated devices such as mechanical element parts, sensors, actuators, and electronic circuits has been realized. This is because high-precision etching requires a more stable and uniform supply of the etching gas to the wafer W.

  (F) In each of the embodiments described above, the process reaction regions are arranged at positions sandwiching each other, but may be arranged at different positions. As a result, not only the pressure and flow rate of the process gas but also the direction of the process gas can be operated as the third operation parameter as a condition setting of the semiconductor process. Because it can be obtained. The operation in the direction of the process gas may be fed back based on the state of the process, for example.

  (G) In each of the above-described embodiments, a turbo molecular pump and a dry pump are used as the vacuum pump. However, for example, a configuration using a dry pump alone may be used, and a vacuum pump is generally used. If it is.

  (H) In each of the above-described embodiments, the vacuum vessel is used in the semiconductor manufacturing process, but may be used for other purposes. However, in the semiconductor manufacturing process, since the influence on the process due to minute fluctuations in the gas flow is great, a remarkable effect can be obtained.

DESCRIPTION OF SYMBOLS 10 ... Vacuum control system, 100, 200 ... Vacuum control valve, 300 ... Turbo molecular pump, 610 ... Controller, Positive value data storage part ... 620.

Claims (15)

A vacuum control system that uses a vacuum pump to control the vacuum pressure and flow of a process gas in a vacuum vessel that receives a process gas supply from a gas supply unit and executes a process on a process target.
Each vacuum control valve connected between each of a plurality of gas discharge ports arranged at different positions in the vacuum container and the vacuum pump;
A pressure measuring unit for measuring a vacuum pressure of a process gas supplied to the process target;
In accordance with the measured vacuum pressure, a control device for operating the opening degree of each of the plurality of vacuum control valves,
With a vacuum control system. The vacuum control system according to claim 1,
The plurality of gas discharge ports are disposed at positions sandwiching a process reaction region in which the process is performed inside the vacuum vessel,
The said pressure measurement part is a vacuum control system which measures the vacuum pressure of the said process reaction area | region. The vacuum control system according to claim 2,
The control device compensates for at least one of a difference in conductance from the process reaction region to each gas outlet and an individual difference in each exhaust system including the vacuum pump and the vacuum control valve, and A vacuum control system that controls the exhaust flow of vacuum control valves so that they approach each other. The vacuum control system according to claim 2,
The control device compensates for at least one of a difference in conductance from the process reaction region to each gas outlet and an individual difference in each exhaust system including the vacuum pump and the vacuum control valve, and A vacuum control system for controlling the effective exhaust speed in the process reaction region of the vacuum control valve so as to approach each other. The vacuum control system according to claim 3 or 4,
The controller is
An offset value storage unit that stores an offset value that compensates for at least one of the difference and the individual difference;
A target value setting unit for setting a target value for controlling the opening degree of the plurality of vacuum control valves using the offset value read from the offset value storage unit;
Having a vacuum control system. The vacuum control system according to claim 5,
The plurality of vacuum control valves have a blocking function for blocking a gas flow,
The control device has a function of generating the offset value based on characteristic data of each of the plurality of vacuum control valves, and storing the generated offset value in the offset value storage unit,
The characteristic data is data for setting the target value acquired in a state where one of the plurality of vacuum control valves is operated and the other valves of the plurality of vacuum control valves are shut off. There is a vacuum control system. The vacuum control system according to claim 5 or 6,
The controller is
A common main control unit that outputs a common opening command value that is a common command value for operating the opening of each of the plurality of vacuum control valves according to the measured vacuum pressure;
A plurality of subordinate control units provided for each of the vacuum control valves in order to control the opening of each of the plurality of vacuum control valves according to the common opening command value;
With
Each subordinate control unit acquires an actual value of the opening degree of each vacuum control valve, and sets the opening degree of each vacuum control valve according to each actual value, the common opening command value, and the offset value. Vacuum control system to control. A vacuum control system according to any one of claims 1 to 7,
The plurality of vacuum control valves are vacuum control valves that control a vacuum pressure in the vacuum vessel by operating a valve opening degree with a working fluid,
A control valve body having a flow path connecting the vacuum vessel and the vacuum pump, and a valve seat formed in the flow path;
A valve body for operating the valve opening by adjusting a lift amount, which is a distance to the valve seat, and blocking the flow path by contact with the valve seat; a piston; the valve body and the piston A rod that couples to
A cylinder connected to the control valve body and containing the piston;
A biasing portion that biases the operating portion in a direction in which the lift amount decreases;
Bellofram that seals the gap between the outer peripheral surface of the piston and the inner peripheral surface of the cylinder while following the operation of the piston;
With
The operating part and the cylinder are
A valve opening that is sealed by the bellophram and has a cylindrical shape surrounding the rod, and generates a load in the direction of increasing the lift amount with respect to the piston in accordance with the working pressure of the working fluid. An operation room,
A shut-off load generation chamber that shares a central axis with the valve opening operation chamber and generates a load in a direction to reduce the lift amount with respect to the operating portion according to the supply of the working fluid,
With a vacuum control system. The cylinder includes a head cover having a sliding protrusion accommodated in the breaking load generation chamber,
The vacuum control valve has a sealing surface that seals between the blocking load generation chamber and the sliding projection, and the sealing surface according to the supply of the working fluid to the blocking load generation chamber The vacuum control system according to claim 8, further comprising a sealing portion that increases a surface pressure of the vacuum. The sliding convex portion shares a central axis with the valve opening operation chamber, and has a cylindrical shape with an outer diameter smaller than the inner diameter of the valve opening operation chamber,
The operating portion has a guide portion extending in the direction of the operation in a space surrounded by an inner peripheral surface of the sliding convex portion,
The vacuum control valve is disposed between the guide portion and the sliding convex portion, enables sliding in the direction of the operation, and is perpendicular to the direction of the operation of the guide portion and the sliding convex portion. The vacuum control system of Claim 9 provided with the bearing which mutually restrains the positional relationship of a direction.   The vacuum control system according to claim 8, wherein the breaking load generation chamber is formed inside the rod. The controller is
A pressure sensor for measuring a vacuum pressure in the vacuum vessel;
A pneumatic circuit connected to a working fluid supply unit for supplying the working fluid and a working fluid exhaust unit for exhausting the working fluid, and supplying the working fluid to the vacuum control valve;
A controller that controls a vacuum pressure in the vacuum vessel by operating a working fluid supplied from the pneumatic circuit to the vacuum control valve;
A vacuum control system according to any one of claims 8 to 11.   The control device connects a flow path between the valve opening operation chamber and the working fluid exhaust unit in response to reception of a vacuum pump stop signal including information indicating the stop of the vacuum pump, and the blocking load. The vacuum control system according to claim 12, wherein a flow path between the generation chamber and the working fluid supply unit is connected.   The pneumatic circuit includes a first electromagnetic valve that connects a flow path between the valve opening operation chamber and the working fluid exhaust part in a non-energized state, and the shut-off load generation chamber and the working fluid in a non-energized state. The vacuum control system according to claim 12, further comprising a second electromagnetic valve that connects a flow path to the supply unit. A vacuum control method for controlling a vacuum pressure and a flow of a process gas in a vacuum vessel that receives a process gas supply from a gas supply unit and executes a process on a process target using a vacuum pump,
Preparing each vacuum control valve connected between each of a plurality of gas discharge ports arranged at different positions in the vacuum container and the vacuum pump;
A pressure measuring step for measuring a vacuum pressure of a process gas supplied to the process object;
In accordance with the measured vacuum pressure, a control step of operating the opening degree of each of the plurality of vacuum control valves,
A vacuum control method comprising:

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