JP2010182864A - Electronic component device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a miniaturizable electronic component device with a simple structure, and formed by considering improvement of transmission characteristics by influence of a high-frequency ground current. <P>SOLUTION: This electronic component device includes: a dielectric substrate 1; a grounded conductor 2 formed on the back surface of the dielectric substrate; a transmission line installed on the front surface of the dielectric substrate through a space region; an active element 6 mounted on the front surface of the dielectric substrate in the space region of the transmission line for amplifying power of a microwave signal passing through the transmission line; grounding leads 6c of the active element extending from the active element and projecting to recede away from the transmission line; first front surface ground conductors 5 electrically connected to the grounding leads by electric connection means and formed on the front surface of the dielectric substrate; second front surface ground conductors 7 electrically connected to the first front surface ground conductors through patterns on the transmission line side of the first front surface ground conductors; through-hole parts 8 formed on the second front surface ground conductors and electrically connected to the grounded conductor; and dams 9 formed on the dielectric substrate front surface for preventing the electric connection means from impregnating into the through-hole parts. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to an electronic component device mounted on a transmission / reception module, an antenna device, or the like.

It is desired to improve an electronic component device that can be miniaturized by mounting a semiconductor device or the like on a transmission line on a dielectric substrate with a simple structure. In particular, it is important to improve the transmission characteristics due to the high-frequency ground current in the microwave band. For example, FIG. 3 of Japanese Patent Laid-Open No. 2001-144221 (refer to Patent Document 1) discloses a high-frequency circuit in which a substrate member 1aa and a microstrip line pattern 2a on the outer surface are arranged inside a first ground conductor 4a. ing.

Further, FIG. 2 (see Patent Document 2) of Japanese Patent Laid-Open No. 2008-85796 discloses a high frequency circuit board in which a ground strip conductor 23 is disposed on a surface opposite to a ground strip conductor 22 continuous with the ground conductor 15 through a through hole. Is disclosed.

JP 2001-144221 A (FIG. 3) Japanese Patent Laying-Open No. 2008-85796 (FIG. 2)

  However, although the thing of patent document 1 can connect the ground current 11 in the shortest distance by wiring the connection board | substrate 104 between the multilayer high frequency package 101a and the external circuit 101b, the dielectric substrate of multilayer structure is In order to maintain good high frequency characteristics, there is a limit to the type of multilayer substrate and applicable substrate thickness, and there is a problem that it is expensive in terms of cost.

In addition, in the device described in Patent Document 2, by adjusting the line lengths of the ground strip conductor 22 and the ground strip conductor 23, the connection portion between the wire 26b and the ground of the semiconductor chip is short-circuited at a desired frequency. Although the transmission mode can be converted, there is a problem that the ground strip conductors 22 and 23 need to be adjusted depending on the desired frequency.

The present invention has been made to solve the above-described problems, and provides an electronic component device that can be reduced in size with a simple structure and that takes into account the improvement of transmission characteristics due to the influence of a high-frequency ground current. For the purpose.

According to a first aspect of the present invention, there is provided an electronic component device comprising: a dielectric substrate; a wide ground conductor formed on the back surface of the dielectric substrate; an input line installed on the surface of the dielectric substrate via a gap region; A transmission line composed of a line, and an active element placed on the surface of the dielectric substrate near the gap region of the transmission line and housed in a package for amplifying a microwave signal passing through the transmission line, A ground lead terminal of the active element extending from the active element and projecting away from the transmission line, and a first electrode formed on the surface of the dielectric substrate electrically connected to the ground lead terminal by electrical connection means. A first surface ground conductor, a second surface ground conductor electrically connected in a pattern with the first surface ground conductor on the transmission line side of the first surface ground conductor, and the second surface ground conductor. And a through hole portion of the body and electrically connected, in which the electrical connection means to the through hole portion and a dam provided on the dielectric substrate surface to prevent penetration.

An electronic component device according to a second aspect of the present invention is the electronic component device according to the first aspect, wherein the dam is disposed so as to surround the second surface ground conductor.

The electronic component device according to a third aspect of the present invention is the electronic component device according to the first or second aspect, wherein the first surface ground conductor and the second surface ground conductor are disposed on both sides of the transmission line.

According to a fourth aspect of the present invention, there is provided an electronic component device comprising: a dielectric substrate; a wide ground conductor formed on the back surface of the dielectric substrate; an input line installed on the surface of the dielectric substrate via a gap region; A transmission line composed of a line, and an active element placed on the surface of the dielectric substrate near the gap region of the transmission line and housed in a package for amplifying a microwave signal passing through the transmission line, A ground lead terminal of the active element extending from the active element and projecting away from the transmission line, and a first electrode formed on the surface of the dielectric substrate electrically connected to the ground lead terminal by electrical connection means. A first surface ground conductor, a second surface ground conductor electrically connected to the first surface ground conductor by a conductive wire on the transmission line side of the first surface ground conductor, and the second surface ground conductor. in front And a through hole portion of the ground conductor and electrically connected, in which the electrical connection means to the through hole portion and a dam provided on the dielectric substrate surface to prevent penetration.

An electronic component device according to a fifth aspect of the present invention is the electronic component device according to the fourth aspect, wherein the dam is installed so as to surround the second surface ground conductor.

The electronic component device according to a sixth aspect of the present invention is the electronic component device according to the fourth or fifth aspect, wherein the first surface ground conductor and the second surface ground conductor are disposed on both sides of the transmission line.

According to the electronic component device of the present invention, the solder material or conductive adhesive flowing out from the electrical connection means is prevented from being dammed up by the dam and penetrating into the through hole portion. Even if it is provided, it is possible to prevent performance deterioration of the frequency characteristics and to obtain a simple and inexpensive electronic component device.

1 is a perspective view of an electronic component device according to Embodiment 1 of the present invention. 1 is a plan view of an electronic component device according to Embodiment 1 of the present invention. It is a top view of the electronic component apparatus by Embodiment 2 of this invention. It is a top view of the electronic component apparatus which applied virtual grounding. It is a top view of the electronic component apparatus of the sample 1 for a test. It is a top view of the electronic component apparatus of the sample 2 for a test. It is a graph which shows the frequency characteristic of a test article and the improvement goods shown in Embodiment 1.

Embodiment 1 FIG.
Hereinafter, an electronic component device according to Embodiment 1 of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component device according to Embodiment 1 of the present invention. In FIG. 1, 1 is a dielectric substrate, 2 is a ground conductor (ground conductor) provided on the back surface of the dielectric substrate 1, 3 is an input line provided along the surface of the dielectric substrate 1, and 4 is a dielectric substrate 1. The output line 5 and the input line 3 are disposed along the surface of the dielectric substrate 1 so as to be spaced from the input line 3. The first surface ground conductor is disposed on the surface of the dielectric substrate 1 so as to be away from the input line 3 or the output line.

6 is an active element such as a WBG (WIDE BAND GAP) element or a high-frequency FET element device housed in a package, 6a is a gate electrode (also called a bias electrode) of the active element 6, 6b is a drain electrode of the active element 6, Reference numeral 6 c denotes a source electrode (ground lead terminal) of the active element 6. The input line 3 and the output line 4 are collectively referred to as a transmission line. The active element 6 has a package portion disposed between the input line 3 and the output line 4.

Reference numeral 7 denotes a first surface ground conductor (first surface ground pattern) 5 which is pattern-connected to the second surface ground conductor (second surface ground pattern) provided close to the source electrode 6c of the active element 6, and 8 denotes a second surface ground conductor. This is a through-hole portion that electrically connects the surface ground conductor 7 and the ground conductor 2 on the back surface of the dielectric substrate 1. Reference numeral 9 denotes a dam (flow-preventing member) which is made of a dielectric material such as a solder resist material or a silk printing material, and is installed near the connection boundary between the first surface ground conductor 5 and the second surface ground conductor 7. In the drawings, the same reference numerals indicate the same or corresponding parts.

FIG. 2 is a plan view of the electronic component device according to Embodiment 1 of the present invention. In FIG. 2, reference numeral 10 denotes an electrical connection means for electrically connecting each electrode of the active element 6 to the transmission line and the first surface ground conductor 5. The input line 3 has a stripline configuration including the ground conductor 2 and is electrically connected to the gate electrode 6a of the active element 6 by an electrical connection means 10 such as a conductive adhesive or a solder material. The output line 4 has a strip line configuration including the ground conductor 2, and is electrically connected to the drain electrode 6b of the active element 6 by an electrical connection means 10 such as a conductive adhesive or a solder material. The first surface ground conductor 5 is electrically connected to the source electrode 6c of the active element 6 by an electrical connection means 10 such as a conductive adhesive or a solder material.

Next, the operation will be described with reference to FIGS. The high-frequency signal input to the input line 3 is amplified by a semiconductor chip housed in the package of the active element 6 via the gate electrode 6 a of the active element 6, and the amplified signal is the drain of the active element 6. It is transmitted to the output line 4 via the electrode 6b. The ground potential of the source-grounded semiconductor chip is grounded by the ground conductor 2 through the through-hole portion 8 provided in the second surface ground conductor 7 connected to the first surface ground conductor 5 provided on the surface of the dielectric substrate 1. Is done.

In the first embodiment, grounding is strengthened by using the first surface ground conductor 5 and the second surface ground conductor 7 as ground patterns on both sides of the transmission line. In addition, the second surface ground conductor 7 provided with the through-hole portion 8 is provided on both sides of the transmission line at a position closest to the package side of the source electrode 6 c protruding from the package of the active element 6. As a result, the distance between the active element 6 and the through-hole portion 8 is made close to the short circuit in terms of DC as well as in terms of high frequency.

Next, the electrical connection means will be described. When the electrical connection means 10 is a solder material, the solder material flows into the through-hole portion 8 connected to the second surface ground pattern 7 provided in the vicinity of the active element 6 by thermal melting of the solder material, and the through-hole portion Cracks occur on the inner wall surface formed of the metal plating film 8 and cause peeling. In particular, in the case where a conductive resin for reinforcing the ground is applied to the hollow portion of the through-hole portion 8, the heat conduction in the hollow portion region of the through-hole portion 8 is deteriorated, and the resin is blackened (burned). In addition to the deterioration of high frequency performance, the appearance is reduced.

  Therefore, by providing a dam (weir) 9 at the boundary between the second surface ground pattern 7 provided in the vicinity of the active element 6 and the first surface ground conductor 5 through which the solder material flows, the solder material becomes the second surface. The penetration into the through-hole portion 8 through the surface ground layer 7 is prevented.

  Next, the case where the electrical connection means 10 is a conductive adhesive will be described. When the lower surface of each electrode of the active element 6 is electrically connected to the transmission line and the first surface ground conductor 5, it is preferable to use a low-temperature curable conductive resin. In this case, although the thermal problem is solved, the active element 6 is pressed down and connected to the first surface ground pattern 5, so that it easily penetrates into the through-hole portion 8 due to the protruding conductive resin. Therefore, by providing a dam (weir) 9 at the boundary between the second surface ground pattern 7 provided in the vicinity of the active element 6 and the first surface ground conductor 5 through which the conductive resin flows, the conductive resin can be 2) It is prevented from passing through the surface contact pattern 7 and penetrating into the through hole 8.

As described above, according to the first embodiment, the solder material and the conductive adhesive flowing out from the electrical connection means 10 that electrically connects the source electrode 6c of the active element 6 and the surface ground conductor 5 are blocked by the dam, and the through-hole portion 8 Therefore, even if the through-hole portion 8 is provided in the vicinity of the active element 6, it is possible to prevent the performance deterioration of the ground potential and the frequency characteristic.

Embodiment 2. FIG.
An electronic component device according to Embodiment 2 of the present invention will be described with reference to the drawings. 3 is a plan view of an electronic component device according to Embodiment 2 of the present invention. In FIG. 3, reference numeral 90 denotes a dam (flow prevention member) that is made of a dielectric material such as a solder resist material or a silk printing material, and is disposed so as to surround the second surface ground conductor 7. In the figure, the same reference numerals as those in FIG. 2 denote the same or corresponding parts.
In the first embodiment, the dam 9 is provided at the boundary between the first surface ground conductor 5 and the second surface ground conductor 7. However, even if the dam 90 is provided in the entire area of the second surface ground conductor 7, the same as in the first embodiment. Has the effect of.

Embodiment 3 FIG.
In the first and second embodiments, the dam is made of a dielectric material such as a solder resist material or a silk printing material, and the first surface ground conductor 5 and the second surface ground pattern 7 are connected in a pattern. A gap may be provided between the ground conductor 5 and the second surface ground conductor 7, and the electrical connection between them may be a dam using a number of elongated metal wires. That is, the first surface ground conductor 5 and the second surface ground conductor 7 are electrically connected to each other by providing a large number of gold wires of about 30 μmφ in parallel by wire bonding. Also in this case, the electrical connection means 10 does not penetrate into the through-hole portion 8 of the surface ground conductor 7 due to the gap between the elongated wires arranged in parallel and the undulation in the height direction of the wire.

Next, frequency characteristics depending on the grounding method will be described. FIG. 4 is a plan view of an electronic component device to which virtual grounding is applied. In FIG. 4, reference numeral 91 denotes a dam (flow prevention member) made of a dielectric material such as a solder resist material or a silk printing material, and installed near the connection boundary between the first surface ground conductor 5 and the second surface ground conductor 7. is there. In the figure, the same reference numerals as those in FIG. 2 denote the same or corresponding parts. In this example, a virtual ground is formed by grounding at a position separated from the source (S) of the active element 6 by a half wavelength of the use frequency wavelength (λg) or a multiple thereof. However, when the transmission line is elongated, the width of the casing (not shown) that houses the transmission line increases in the direction orthogonal to the transmission line, and is difficult to apply to an electronic component device used for many phased array antennas. It is.

FIG. 5 is a plan view of the electronic component device of the test sample 1. In FIG. 5, reference numeral 92 denotes a dam (flow prevention member) made of a dielectric material such as a solder resist material or a silk printing material, and installed near the connection boundary between the first surface ground conductor 5 and the second surface ground conductor 7. is there. In the figure, the same reference numerals as those in FIG. 2 denote the same or corresponding parts. In this sample 1 for test, it is grounded at a position different from the position separated from the source (S) of the active element 6 by a half wavelength of the use frequency wavelength (λg).
That is, since the ground is grounded at the tip of the first surface ground conductor 7, the distance from the active element 6 to the through-hole portion 8 is relatively long, so that the virtual ground becomes ambiguous and the frequency characteristics are deteriorated.

FIG. 6 is a plan view of the electronic component device of the test sample 2. As shown in FIG. 6, by providing the through-hole portion 8 in the vicinity of the active element 6, good frequency characteristics can be obtained as in the first embodiment, but the solder passes through when the ground terminal (S) of the active element 6 is soldered. Flowing out to the ground conductor 2 on the back surface through the hole portion 8 may cause insufficient soldering, resulting in a quality problem. For this reason, in order to prevent the flow of the solder material or the like, the through-hole portion 8 is filled with resin, and further, electrolytic plating or electroless plating may be performed, which increases the number of steps and becomes expensive. Further, there is a method of replacing the through hole portion 8 with a BVH (blind via hole) or the like, but the substrate becomes more expensive.

FIG. 7 is a graph showing frequency characteristics (phase change characteristics) of the above-described sample 1 (sample 1), sample 2 (sample 2), and the improved product shown in the first embodiment. is there. In FIG. 7, in the electronic component device and the sample 2 described in the first embodiment, the frequency characteristics in the X band are good, but in the sample 1, the frequency characteristics in the X band are deteriorated. Is solved.

1. ・ Dielectric substrate 2. ・ Grounding conductor (ground conductor) 3. ・ Input line 4. ・ Output line 5. ・ First surface ground conductor (first surface ground pattern)
6. Active element 6a Gate electrode 6b Drain electrode 6c Source electrode (ground lead terminal)
7. Second surface ground conductor (second surface ground pattern)
8 ・ ・ Through hole part 9 ・ ・ Dam (flow prevention member)
10. Electric connection means 90. Dam (flow prevention member) 91 Dam (flow prevention member) 92 Dam (flow prevention member)

Claims (6)

A transmission line composed of a dielectric substrate, a wide ground conductor formed on the back surface of the dielectric substrate, an input line and an output line installed on the surface of the dielectric substrate via a gap region, and the transmission line An active element mounted on a surface of the dielectric substrate in the vicinity of the gap region and housed in a package for amplifying a microwave signal passing through the transmission line, and extending from the active element, and from the transmission line A ground lead terminal of the active element projecting away from the ground, a first surface ground conductor formed on the surface of the dielectric substrate electrically connected to the ground lead terminal by electrical connection means, and the first surface ground conductor A second surface ground conductor electrically connected in pattern with the first surface ground conductor on the transmission line side, a through hole portion provided on the second surface ground conductor and electrically connected to the ground conductor, Electronic component device and a dam provided on the dielectric substrate surface for preventing the electrical connecting means in the through hole portion of the permeates. The electronic component device according to claim 1, wherein the dam is disposed so as to surround the second surface ground conductor. The electronic component device according to claim 1, wherein the first surface ground conductor and the second surface ground conductor are disposed on both sides of the transmission line. A transmission line composed of a dielectric substrate, a wide ground conductor formed on the back surface of the dielectric substrate, an input line and an output line installed on the surface of the dielectric substrate via a gap region, and the transmission line An active element mounted on a surface of the dielectric substrate in the vicinity of the gap region and housed in a package for amplifying a microwave signal passing through the transmission line, and extending from the active element, and from the transmission line A ground lead terminal of the active element projecting away from the ground, a first surface ground conductor formed on the surface of the dielectric substrate electrically connected to the ground lead terminal by electrical connection means, and the first surface ground conductor A second surface ground conductor electrically connected to the first surface ground conductor by a conductive wire on the transmission line side, and a through hole portion provided on the second surface ground conductor and electrically connected to the ground conductor , An electronic component device that includes a dam provided on the dielectric substrate surface to prevent the possible electrical connection means penetrates into the through hole portion. The electronic component device according to claim 4, wherein the dam is installed so as to surround the second surface ground conductor. The electronic component device according to claim 4, wherein the first surface ground conductor and the second surface ground conductor are disposed on both sides of the transmission line.

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