JP2009302241A - Method for manufacturing resin seal, method for manufacturing board for packaging led chip, metal mold of the board for packaging the led chip, the board for packaging the led chip and led - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a board for packaging an LED chip which enhances a connection reliability simply. <P>SOLUTION: This method for manufacturing the board for packaging the LED chip has the steps of: clamping a lead frame 10 by an upper metal mold 50 and a lower metal mold 60 for resin molding, whereby a chamfering part 13 is formed on the board packaging face side at an end part located on an outer periphery serving as a package of an LED for a first inner lead and a second inner lead by a protrusion 59 provided in one of the upper metal mold 50 and the lower metal mold 60; and filling a space formed by the upper metal mold 50 and the lower metal mold 60 with resin 80 in the state where the lead frame 10 is clamped by the upper metal mold 50 and the lower metal mold 60. The lead frame 10 is configured to be cut at the end part of the first inner lead and the second inner lead provided with the chamfering part 13. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for producing a resin encapsulant and a method for producing an LED chip mounting substrate. The present invention also relates to a mold for an LED chip mounting substrate, an LED chip mounting substrate, and an LED.

    Conventionally, a light emitting diode (LED) that emits light by applying a forward bias between a pair of electrodes of an anode electrode and a cathode electrode is known.

  Among such LEDs, for example, a surface mount (surface mount) type LED is formed by mounting an LED chip on an electrode formed on a lead frame and resin molding. Further, as disclosed in FIG. 1 and the like of Japanese Patent Application Laid-Open No. 2006-173155 (Patent Document 1), in this type of LED, outer leads that protrude from the package side surface of each LED are mounted on a printed circuit board or the like. It can be surface-mounted by being bent to the surface side and further bent to the lower surface side of the LED to form a J-bend type.

As another method of manufacturing a surface-mounted LED, a lead frame on which a plurality of LED chips are mounted is collectively resin-sealed so that the lead frame is exposed at the bottom of the package and cut into a package shape to obtain individual pieces. There is also a way to make it. According to this method, since the outer lead bending step can be omitted, the LED package can be manufactured at low cost.
JP 2006-173155 A

    However, in such a manufacturing method, unlike the manufacturing method disclosed in the patent document, burrs facing the bottom surface may occur in the cut lead.

    The burr generated on the cut surface may prevent the LED from reliably contacting the board mounting surface when mounting the LED on a board mounting surface such as a printed board. If burrs occur on the mounting surface side, the contact between the electrode surface of the LED and the electrode surface on the mounting surface side becomes insufficient, which may reduce connection reliability. In this case, deburring after separating into pieces eliminates such a problem, but increases the cost for the process.

    Accordingly, an object of the present invention is to provide a method for manufacturing a resin-sealed body and a method for manufacturing a substrate for mounting an LED chip, in which connection reliability is simply improved while solving the above-described problems. . Another object of the present invention is to provide an LED chip mounting substrate mold, an LED chip mounting substrate, and an LED that can solve the above-described problems.

  According to another aspect of the present invention, there is provided a method of manufacturing a resin encapsulant comprising: a resin encapsulant that clamps a lead frame with an upper die and a lower die for resin molding to form a resin encapsulant on the lead frame. In the manufacturing method, the lead frame is clamped by the upper mold and the lower mold, and the substrate of the inner lead of the lead frame is formed by a protrusion provided on one of the upper mold or the lower mold. A step of forming a chamfered portion on the outer peripheral position of the package shape on the mounting surface side, and in a state where the lead frame is clamped by the upper mold and the lower mold, on the other of the upper mold and the lower mold Filling the space formed by the provided cavity with resin, and the lead frame is configured to be cut at the position on the outer periphery where the chamfered portion is formed. There.

The manufacturing method of the LED chip mounting substrate as another aspect of the present invention,
A method of manufacturing an LED chip mounting substrate before mounting a plurality of LED chips, wherein the upper die or the lower die is clamped by clamping a lead frame with an upper die and a lower die for resin molding. Forming a chamfered portion on the board mounting surface side of the end portion of the first inner lead and the second inner lead located on the outer periphery of the LED package as a projection by a protrusion provided on one of the upper mold, and the upper mold And filling the resin formed in the space formed by the upper mold and the lower mold in a state where the lead frame is clamped by the lower mold, and the chamfered portion is formed on the lead frame. The first inner lead and the second inner lead are cut at ends of the second inner lead.

    According to another aspect of the present invention, there is provided a mold die for an LED chip mounting substrate, an upper die for holding a lead frame having a first inner lead and a second inner lead from the upper surface side, and the lead frame. A lower mold that presses down from the lower surface side, and a protrusion is formed on one of the upper mold or the lower mold, and the mold mold includes the upper mold and the lower mold. By clamping the lead frame, a chamfered portion is formed on the board mounting surface side of the end portions of the first inner lead and the second inner lead, and the upper die and the lower die are formed. The lead frame is configured to be filled with resin, and the lead frame is configured to be cut at the end portions of the first inner lead and the second inner lead in which the chamfered portion is formed. It has been.

    An LED chip mounting substrate according to another aspect of the present invention is an LED chip mounting substrate before mounting a plurality of LED chips, and is used for electrical connection to the first electrode of the LED chip. A lead frame having a first inner lead and a second inner lead for electrical connection to the second electrode of the LED chip; and the first inner lead and the second inner lead. A chamfered portion is formed on the end surface of the first inner lead and the second inner lead on the board mounting surface side, and the lead frame has the chamfered portion. The first inner lead and the second inner lead formed with a portion are cut at the end portions of the first inner lead and the second inner lead. Resin chamfered portion is formed.

    According to another aspect of the present invention, an LED includes an LED chip that emits light by applying a forward bias between a first electrode and a second electrode, and the LED chip. A first inner lead electrically connected to the first electrode of the chip; a lead frame comprising a second inner lead electrically connected to the second electrode of the LED chip; A resin that insulates between the first inner lead and the second inner lead, and a translucent resin that seals the LED chip, and the first inner lead and the second inner lead The cut portion is formed with a chamfered portion on the substrate mounting surface side, and the resin is formed with a resin chamfered portion on the substrate mounting surface side.

    Other objects and advantages of the present invention are illustrated in the following examples.

    ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the resin sealing body and the manufacturing method of the board | substrate for LED chip mounting which improved the connection reliability simply can be provided, solving the above problems.

    Moreover, according to this invention, the mold die of the LED chip mounting board | substrate which can solve the above problems, the LED chip mounting board | substrate, and LED can be provided.

    Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

    First, Example 1 of the present invention will be described.

    FIG. 1 is an overall structural view of a lead frame in the present embodiment. 1A is a plan view of the lead frame, FIG. 1B is a side view of the lead frame of FIG. 1A viewed from the B direction, and FIG. 1C is FIG. 1A. FIG. 6 is a side view of the lead frame when viewed from the C direction.

    In FIG. 1, 10 is a lead frame. The lead frame 10 is made of, for example, a copper alloy, and is provided for mounting a plurality of LED chips. As will be described later, a plurality of LED chips are mounted on the lead frame 10 and resin molding is performed, and then dicing (cutting) to complete a plurality of surface-mounted LEDs (Light-Emitting Diodes). To do.

    Reference numeral 20 denotes a lead forming hole (a punching hole). The lead formation holes 20 form inner leads (free ends 11a and 11b, external electrode portions 16a and 16b) by punching the lead frame 10 by press working at the LED chip mounting position described later.

    External electrode portions 16a and 16b are formed on the edge portion of the lead forming hole 20 in a state of being aligned on a straight line. Specifically, in each lead forming hole 20, 12 external electrode portions 16a are formed in a state of being aligned in the vicinity of one edge located on the left side of the figure, and are positioned on the right side of the figure. Twelve external electrode portions 16b are formed in a straight line in the vicinity of the other edge.

    The inner lead is a portion covered with resin by a resin mold (a portion of the lead sealed with resin). In this embodiment, the free end portion 11a (first free end portion) and the external electrode portion 16a constitute a first inner lead, and the free end portion 11b (second free end portion) and the external electrode portion 16b A second inner lead is formed.

    The free end portion 11a is disposed on both sides of the free end portion 11b. As shown in FIG. 1, the free end portion 11a extends from the left side to the right side. The free end portion 11a is electrically connected to the first electrode (anode electrode) of the LED by a bonding wire.

    The free end portion 11b is disposed between the two free end portions 11a. As shown in FIG. 1, the free end portion 11a extends from the right side to the left side. Thus, the free end portion 11a and the free end portion 11b extend in opposite directions so as to face each other. In addition, an LED chip is mounted on the distal end portion of the free end portion 11b. For this reason, the free end portion 11b is electrically connected to the second electrode (cathode electrode) of the LED. In the present embodiment, the first electrode and the second electrode only need to form a pair of electrodes. For example, the first electrode is a cathode electrode and the second electrode is an anode electrode. You can also.

    The lead forming hole 20 insulates between a pair of electrodes (between the first electrode and the second electrode) of the LED chip, that is, the free end portion 11a (external electrode portion 16a) constituting the inner lead. It is provided to insulate the free end portion 11b (external electrode portion 16b).

    Half edges 12a and 12b are formed on the free ends 11a and 11b, respectively. The half edges 12a and 12b are provided at locations where the lead frame 10 is bent as will be described later. By forming the half edges 12a and 12b, the lead frame 10 can be easily bent. In addition, the height of the LED chip in the LED as a package can be secured by bending the lead frame 10 as in this embodiment.

    As shown in FIG. 1A, in the lead forming hole 20 formed in the lead frame 10, the unit structures shown in the range 15 are arranged in the same size and shape. The unit structure (range 15) of the lead forming hole 20 is formed substantially the same as the size of the outer shape of the LED which is one package in this embodiment, and constitutes a part of one LED. However, a plurality of LED chips can be mounted on one LED.

As shown in FIGS. 1B and 1C, the lead frame 10 before being clamped to the mold has a flat plate shape.
FIG. 2 is an enlarged view of a main part of the lead frame in the present embodiment. 2A is a plan view of the lead frame, FIG. 2B is a cross-sectional view of the BB cut surface in FIG. 2A, and FIG. 2C is C in FIG. 2A. It is sectional drawing of a -C cut surface. FIG. 2D is a plan view when the lead frame in FIG. 2C is viewed from the D direction.
FIG. 2 is an enlarged view of a region corresponding to the range 15 in FIG. In FIG. 2B, the left side of the drawing is the upper surface (front surface) side of the lead frame, and the right side is the lower surface (back surface) side of the lead frame.

    As shown in FIGS. 2A to 2D, half edges 12a to 12d are formed at the free ends 11a and 11b constituting the inner lead. Specifically, as shown in FIGS. 2 (A) and 2 (C), on the surface side of the lead frame 10, a half edge 12a is formed at the free end 11a, and at the free end 11b. Is formed with a half edge 12b.

    2C and 2D, on the back side of the lead frame 10, a half edge 12c is formed at the free end portion 11a, and a half edge is formed at the free end portion 11b. 12d is formed. These half edges 12 a to 12 d make it easy to bend the lead frame 10.

    The free ends 11a and 11b constituting the inner lead are formed so as to extend in opposite directions to substantially the center of the lead forming hole 20. The free end portion 11b is used as a die pad for mounting an LED chip. On the other hand, a connecting means such as a gold wire for electrical connection with the LED chip is bonded to the free end portion 11a.

    The LED chip is an LED element that includes a pair of electrodes, an anode electrode (positive electrode) and a cathode electrode (negative electrode), and emits light by applying a predetermined voltage with a forward bias between these electrodes. For this reason, for example, when the cathode electrode surface of the LED chip is mounted on the free end portion 11b, the free end portion 11a and the anode electrode of the LED chip are connected by a connecting means such as a gold wire. Thereby, the free end portion 11a of the lead frame 10 and the anode electrode of the LED chip are electrically connected.

    In this embodiment, since one electrode of the LED chip and the free end portion 11a are connected by two wires, two free end portions 11a are provided. However, the present invention is not limited to this, and the number of wires may be one or three or more. In accordance with this, the number of free end portions 11a can be increased or decreased. In this embodiment, the lead frame on the free end portion 11b side is described as being on the cathode side. However, the present invention is not limited to this, and the free end portion 11b is changed depending on the type of the LED chip. It may be the anode side. In this case, the lead frame on the side where the free end portion 11a is provided is the cathode side.

    Further, for example, the LED chip may be of a flip chip type. At this time, a pair of electrodes arranged on the lower surface of the LED chip can be bonded and mounted on each of the free ends 11a and 11b.

    FIG. 3 shows a lower mold in the present embodiment. 3A is a plan view of the lower mold, FIG. 3B is a cross-sectional view taken along the line BB in FIG. 3A, and FIG. 3C is in FIG. 3A. It is sectional drawing of a CC cut surface.

    The lower mold 60 presses the lead frame 10 from the lower surface (front surface) side during resin molding. In the lower mold 60 of this embodiment, a concave portion having a rectangular shape in plan view that forms the cavity 70 is formed. In the area of the cavity 70, a support portion 67 for supporting the lower surface of the planar lead frame 10 is formed on the lower mold 60 so as to protrude to the same height as the parting surface of the lower mold 60. Yes. The flat portion at the tip of the support portion 67 serves as a clamping surface for clamping the vicinity of the external electrode portions 16a and 16b of the flat lead frame 10. For this reason, the lead frame 10 is formed so as to protrude at the same interval as the interval between the external electrode portions 16a and 16b.

    Further, the lower mold 60 includes a free end support portion 68 for supporting the lead frame 10 (free end portions 11 a and 11 b) bent by an upper mold, which will be described later, from the lower side. It is formed lower than the surface. The free end support portion 68 is formed at a position between the two support portions 67. Therefore, on the contrary, the support part 67 at the position sandwiched between the free end support parts 68 is, as shown in FIG. 3C, free end parts 11a and 11b that are bent by the two free end support parts 68, respectively. Two protrusions are provided so as to support the base end side (that is, the external electrode portions 16a and 16b). On the other hand, the support portion 67 formed along the wall surface of the cavity 70 is provided with one protrusion so as to support the base end side of either of the free ends 11a and 11b bent by the single free end support 68. Have.

  As shown in FIG. 3 (A), the free end support portions 68 are provided at the same intervals as the number of formation sets of the free end portions 11a and 11b in the lead frame 10, and are arranged in a matrix of 12 rows and 5 columns. It is arranged. Moreover, the free end support part 68 is comprised so that it may become circular shape seeing from a plane. In the present embodiment, a plurality of pins 63 are inserted into the lower mold 60 in order to form the circular free end support portion 68. The surfaces of the tips of the pins 63 have a circular shape, and the tips of the pins 63 constitute a free end support portion 68.

    Such a flat front end portion of the free end support portion 68 serves as a clamping surface for clamping the planar lead frame 10 (free end portions 11a and 11b). The lower mold 60 is provided with a plunger 110 and a pot 112. As will be described later, at the time of resin molding, a resin tablet (not shown) is introduced into the pot 112 and melted, and the plunger 110 is moved upward to pump the molten resin, thereby feeding the upper mold 50 and the lower mold 60. The space between them (particularly the cavity 70) is filled with resin or the like.

    FIG. 4 shows an upper mold in this embodiment. 4A is a plan view of the upper mold, FIG. 4B is a cross-sectional view taken along the line BB in FIG. 4A, and FIG. 4C is in FIG. 4C. It is sectional drawing of a CC cut surface.

    The upper mold 50 presses the lead frame 10 from the upper surface (back surface) side during resin molding. The upper mold 50 is formed with a plurality of pressing portions 58 for bending the planar lead frame 10 (free end portions 11a and 11b).

    The same number of pressing portions 58 as the free end support portions 68 are provided at the same interval, and are arranged in a matrix of 12 rows and 5 columns. For this reason, at the time of mold clamping, it is possible to clamp in a state where the set (unit structure) of the free end portions 11a and 11b in the lead frame 10, the pressing portion 58, and the free end support portion 68 are overlapped in the clamping direction. It becomes.

    Also, the upper mold 50 is formed with a plurality of projections 59 (10 in this embodiment) for forming the chamfered portion 13 (V-shaped groove, V notch) on the substrate mounting surface (back surface) side of the lead frame 10. Has been. Two protrusions 59 are formed at positions spaced apart from the pressing portions 58 by a predetermined interval for each row of the pressing portions 58 so as to sandwich the row of the pressing portions 58 by a plurality (12 in this embodiment). Yes. As the cross-sectional shape of the protrusion 59, various shapes other than the inverted V shape, such as an inverted U shape and a trapezoid, can be adopted depending on the shape of the protrusion to be formed.

    Further, since the protrusions 59 are formed at the same interval in the row direction as the protrusions of the support part 67 in the lower mold 60, the protrusions and the external electrodes are clamped by clamping the lead frame 10 at the position as described above. The portions 16a and 16b overlap with each other in the clamping direction. Further, the protrusion 59 is formed longer than the formation region of the pressing portion 58 in the row direction. Specifically, the protrusion 59 extends to the upper side of the pressing portion 58 on one end side (for example, the upper side in FIG. 4A) and from the pressing portion 58 on the other end side (for example, the lower side in the figure). Is formed so as to extend to the lower side.

    The chamfered portion 13 formed on the protrusion 59 is formed at a cut portion when cutting the lead frame 10 and a resin sealing portion described later formed on the lead frame 10 when forming the LED which is the final product in this embodiment. . In other words, the protrusions 59 are formed at intervals that cut the lead frame 10 and the resin sealing portion. The position of the cut portion corresponds to the end portion of the inner lead (first and second inner leads) in the LED located on the outer periphery of the LED package.

    For this reason, in this embodiment, the position where the chamfered portion 13 is formed in the lead frame 10 before being cut is referred to as an end portion of the inner lead. Thus, the lead frame 10 of the LED chip mounting substrate in the present embodiment is configured to be cut at the end portion of the inner lead where the chamfered portion 13 is formed.

    As shown in FIG. 4A, in this embodiment, a plurality of linear protrusions 59 are arranged. The lead frame 10 is cut when it is divided into each LED which is the final product, but the projection 59 of the mold is formed on the cutting line of the lead frame 10. However, the present embodiment is not limited to this. For example, a protrusion may be formed so as to surround each pressing portion 58.

    In the upper mold 50, a cull 55 and a runner 56 are formed in a concave shape with respective shapes and sizes. The tip flat portion of the pressing portion 58 of the upper mold 50 serves as a clamping surface for clamping the planar lead frame 10 (free end portions 11a and 11b). With this clamping surface, the free ends 11a and 11b of the lead frame 10 are bent downward.

    Note that the chamfered portion 13 is formed by a protrusion 59 provided on one of the upper mold 50 and the lower mold 60. Which mold is provided with the protrusion 59 is determined in consideration of the direction of the substrate mounting surface of the LED.

  FIG. 5 is a cross-sectional view showing the positional relationship of each part when the upper mold and the lower mold are combined in the present embodiment.

    The mold die according to the present embodiment (hereinafter, also simply referred to as “die”) is mainly composed of an upper die 50 and a lower die 60. At the time of resin molding, the lead frame 10 is clamped by the upper mold 50 and the lower mold 60 to bend specific portions of the inner leads of the lead frame 10 as described later, and a resin (not shown) is transferred by transfer molding to the upper mold 50. The space formed between the lower mold 60 and the lower mold 60 is filled. Here, for example, a resin tablet obtained by molding a thermosetting resin or the like into a tablet (column) is used.

    At the time of resin molding, a resin tablet (not shown) is put into the pot 112 of the preheated lower mold 60 and melted. Then, the plunger 110 is moved up to pump the molten resin, whereby the space (in particular, the cavity 70) between the upper mold 50 and the lower mold 60 is filled with the resin. The plunger 110 is configured to be slidable up and down along the pot 112 by a transfer mechanism (not shown). In addition, it replaces with a resin tablet and liquid thermosetting resin can also be supplied with a dispenser (not shown).

    When the mold is clamped, the resin is pumped by the plunger 110, so that the molten resin passes through the cull 55 and the runner 56, and between the lead forming hole 20 and between the upper mold 50 and the lower mold 60. It is formed and supplied to the cavity 71 that constitutes the package of each LED. In this embodiment, since the lead forming hole 20 communicates with the cavity 71 itself, the resin can be supplied to the cavity communicated with the lead forming hole 20. For this reason, the resin is sequentially supplied from the cavity 71 (see FIG. 6) constituting one LED package close to the cull 55 and the runner 56 in the cavity 70 toward the cavity 71 far from the cavity 71.

    In addition, although the lead formation hole 20 of a present Example communicates and comprises one hole, it is not limited to this. For example, a plurality of lead formation holes may be formed by providing one lead formation hole in one LED region. At this time, even if cavities (matrix cavities) in which a plurality of cavities do not communicate with each other are provided in the mold, by providing half edges in the mold or the lead frame, resin is formed in all the lead forming holes. Can be supplied.

  Next, the manufacturing method of the LED chip mounting substrate before mounting a plurality of LED chips will be described in detail. In addition, the board | substrate for LED chip mounting in a present Example is demonstrated as an example of the resin sealing body of this invention. For this reason, the manufacturing method of the board | substrate for LED chip mounting demonstrated below is applicable also to the manufacturing method of resin sealing bodies other than the board | substrate for LED chip mounting.

    6A to 6F are cross-sectional views for explaining the manufacturing process of the LED chip mounting substrate in the present embodiment. 6A to 6F are cross-sectional views in which the vicinity of the cavity 71 for one LED is enlarged in the CC cross section in FIG. For this reason, a similar operation is performed in the cavity 70.

    In the manufacturing process of the present embodiment, first, the mold is set in the resin mold apparatus so that the pressing part 58 of the upper mold 50 and the free end support part 68 of the lower mold 60 overlap each other. FIG. 6A shows a first state in the manufacturing process of this embodiment. A planar lead frame 10 for mounting a plurality of LED chips is prepared by preheating, and the lead frame 10 is placed on the lower mold 60 so that the protrusions of the support portion 67 and the external electrode portions 16a and 16b overlap. It will be in a 1st state by mounting in this way. At this time, the set (unit structure) of the free end portions 11a and 11b, the pressing portion 58, and the free end support portion 68 are overlapped in the clamping direction.

    A support portion 67 is formed on the lower mold 60 so as to extend upward, and the lead frame 10 is supported by the mold surface and the support portion 67 that constitute the outer edge of the cavity 70. At this time, the resin tablet is also put into the pot 112 at the same time. As will be described later, a part of the lead frame 10 supported by the support portion 67 constitutes external electrode portions 16a and 16b that serve as external electrodes of the LED.

    In the manufacturing process of the present embodiment, the lead frame 10 is placed on the lower mold 60 so that the LED chip mounting side surface (front surface) faces downward in FIG. 6A. In other words, the lead frame 10 is arranged with the LED chip mounting surface facing down and the surface (back surface) opposite to the LED chip mounting surface facing down. For this reason, in the free end 11a, the half edge 12c is located on the upper side, and the half edge 12a (see FIG. 6C) is located on the lower side. Similarly, in the free end portion 11b, the half edge 12d is located on the upper side, and the half edge 12b is located on the lower side.

    The lower mold 60 is provided with a free end support portion 68 below the free ends 11a and 11b (inner leads). The free end support portion 68 has a projection structure lower than the support portion 67, and supports and clamps the bent free end portions 11a and 11b from below as will be described later.

    The lower mold 60 has a cavity 71 (space) for filling with resin as will be described later. The cavity 71 is surrounded by the support part 67 and the free end support part 68, and the shape of the cavity 71 is determined by the shape of the support part 67 and the free end support part 68.

    A pressing portion 58 is formed on the upper mold 50. The pressing portion 58 has a structure in which the convex portion protrudes downward, and is provided to press the upper surfaces of the free end portions 11a and 11b of the lead frame 10 downward. Further, the pressing portion 58 is located above the free end support portion 68 of the lower mold 60.

    Further, the upper mold 50 is provided with a protrusion 59. The protrusion 59 is provided in order to form the chamfered portion 13 at the cut portion of the lead frame 10 (the end portion of the inner lead). As will be described later, by forming the chamfered portion 13 on the board mounting surface side of the end portion of the inner lead, the completed LED can be stably mounted on the mounting board surface such as a printed board. Since the protrusion 59 forms the chamfered portion 13 on the upper surface of the lead frame 10, the length from the root of the protrusion 59 to the tip (length in the vertical direction) is shorter than the thickness of the lead frame 10. .

    In the first state shown in FIG. 6A, the upper mold 50 is located above the lead frame 10 and is not in contact with the lead frame 10.

    FIG. 6B shows a second state during the mold closing operation in the manufacturing process of the present embodiment. After the planar lead frame 10 is placed on the lower mold 60, as shown in FIG. 6B, the upper mold 50 is moved downward, and the leading end surface of the pressing portion 58 of the upper mold 50 is moved to the lead frame. 10 (free end portions 11a and 11b) are brought into contact with each other.

  Since the protrusion length of the protrusion 59 of the upper mold 50 is shorter than the protrusion length of the pressing portion 58, the protrusion 59 is not in contact with the lead frame 10 in the second state shown in FIG. 6B.

    FIG. 6C shows a third state during the bending of the inner lead in the manufacturing process of the present embodiment. After the pressing portion 58 of the upper mold 50 is brought into contact with the lead frame 10 (free end portions 11a and 11b), the upper mold is further moved downward. At this time, the free end portions 11 a and 11 b are pushed downward by the pressing portion 58 of the upper mold 50. The free end portion 11a is bent downward at the location where the half edge 12c is formed. Similarly, the free end portion 11b is bent downward at the location where the half edge 12d is formed.

    The lead frame 10 is supported from below by a support portion 67 in the regions around the free end portions 11a and 11b (external electrode portions 16a and 16b). Part of this region constitutes external electrode portions 16a and 16b that serve as external electrodes of the LED. As described above, the regions other than the free end portions 11a and 11b of the lead frame 10 including the external electrode portions 16a and 16b maintain the state from the first state as it is.

    As shown in FIG. 6C, half edges 12 c and 12 d are formed on the upper surface of the lead frame 10 in the bent portion of the lead frame 10 that is bent from the top to the bottom. That is, the strength of the bent portion of the lead frame 10 is weaker than that of other portions of the lead frame 10. For this reason, the lead frame 10 can be easily bent from top to bottom.

    FIG. 6D shows a fourth state in which the inner lead has been bent more than the third state in the manufacturing process of the present embodiment. After the free ends 11a and 11b are bent downward at the locations where the half edges 12c and 12d are formed, the upper mold is further moved downward. At this time, the free ends 11 a and 11 b are pushed further downward by the pressing portion 58 of the upper mold 50 that has entered the lower mold 60, and the tips of the free ends 11 a and 11 b are free of the lower mold 60. Contact the end support 68.

    The free end portion 11a is bent upward at a location where the half edge 12a is formed between the tip and the half edge 12c. Similarly, the free end portion 11b is bent upward at a location where the half edge 12b is formed between the tip and the half edge 12d.

    The lead frame 10 is supported from below by a support portion 67 around the free ends 11a and 11b. Part of this region constitutes external electrode portions 16a and 16b that serve as external electrodes of the LED. For this reason, even in the fourth state, the regions other than the free ends 11a and 11b of the lead frame 10 (for example, the external electrode portions 16a and 16b) maintain the state from the first state as it is.

    FIG. 6E shows a fifth state in which the bending of the inner lead is completed in the manufacturing process of the present embodiment. When the upper mold 50 is further moved downward, the lead frame 10 is reliably clamped (sandwiched) between the upper mold 50 and the lower mold 60. At this time, the free ends 11a and 11b are securely clamped between the pressing portion 58 of the upper mold 50 and the free end support 68 of the lower mold. More specifically, the distal end portion 11aa of the free end portion 11a, which is a region between the distal end of the free end portion 11a and the half edge 12a, is clamped between the pressing portion 58 and the free end support portion 68. Similarly, the distal end portion 11ba of the free end portion 11b, which is a region between the distal end of the free end portion 11b and the half edge 12b, is clamped between the pressing portion 58 and the free end support portion 68.

    As shown in FIG. 6E, a step is formed between the distal end portion 11aa of the free end portion 11a and the external electrode portion 16a. For this reason, the root portion 11ab of the free end portion 11a, which is a region between the half edge 12a and the half edge 12c of the free end portion 11a, is held inclined. Similarly, a step is formed between the distal end portion 11ba of the free end portion 11b and the external electrode portion 16b. For this reason, the root portion 11bb of the free end portion 11b, which is a region between the half edge 12b and the half edge 12d of the free end portion 11b, is held inclined.

    At this time, the root portion 11ab of the free end portion 11a and the root portion 11bb of the free end portion 11b are not in contact with the side surface of the pressing portion 58 of the upper mold 50. For this reason, a space (cavity 72) is formed between the root portions 11ab and 11bb and the side surface of the pressing portion 58. A cavity 70 formed between the upper mold 50 and the lower mold 60 includes a cavity 71 formed between the lower mold 60 and the lead frame 10, and the upper mold 50 and the lead frame 10. And a cavity 72 formed therebetween.

    The external electrode portions 16 a and 16 b of the lead frame 10 are securely clamped by the support portion 67 of the lower mold 60 and the upper mold 50. Further, the distal end portion 11aa of the free end portion 11a and the distal end portion 11ba of the free end portion 11b are securely clamped by the free end support portion 68 of the lower die 60 and the pressing portion 58 of the upper die 50. For this reason, the 1st plane which comprises tip part 11aa of free end part 11a and tip part 11ba of free end part 11b is parallel to the 2nd plane which constitutes external electrode parts 16a and 16b.

    Thus, in this embodiment, as shown in FIG. 6E, the free end portion of the lead frame 10 is obtained by clamping the lead frame 10 using the upper mold 50 and the lower mold 60 for resin molding. Bend 11a and 11b. More specifically, the free ends 11 a and 11 b are bent by being clamped between the pressing portion 58 formed on the upper mold 50 and the lower mold 60.

  At this time, the protrusion 59 of the upper mold 50 is pressed against the upper surface of the lead frame 10 and bites into the upper surface of the lead frame 10 because the support portion 67 supports the lower surface of the lead frame 10 directly below the protrusion 59. It becomes a state. For this reason, as will be described later, a chamfered portion 13 (V notch) is formed in the cut portion of the lead frame 10 (the end portion of the inner lead or the tip portion of the external electrode portions 16a and 16b). The chamfered portion 13 (V notch) formed in the lead frame 10 using the upper mold 50 provided with the protrusions 59 causes plastic deformation in the lead frame 10 and stress applied to the lead frame 10 when the lead frame 10 is bent. To break. For this reason, the bending of the lead frame 10 formed by clamping with the upper metal mold | die 50 and the lower metal mold | die 60 can be made more reliable and firm. Therefore, in this embodiment, it is possible to manufacture a more reliable LED chip mounting substrate and LED by forming the chamfered portion 13 using a mold.

    Next, FIG. 6F shows a sixth state in which the cavity is filled with resin in the manufacturing process of the present embodiment. In the sixth state, the resin 80 is transferred into the cavity 70 (specifically, the cavities 71 and 72) by transfer molding while the upper die 50 and the lower die 60 are maintained in the fifth state shown in FIG. 6E. Fill. That is, the resin 80 is filled in the space formed by the upper mold 50 and the lower mold 60 in a state where the lead frame 10 is clamped using the upper mold 50 and the lower mold 60.

    As shown in FIG. 6F, the pressing portion 58 of the upper mold 50 is in close contact with the upper surfaces of the distal end portion 11aa of the free end portion 11a and the distal end portion 11ba of the free end portion 11b. The free end support portion 68 of the lower mold 60 is in close contact with the lower surfaces (LED chip mounting surfaces) of the tip portions 11aa and 11ba. For this reason, even if the resin 80 is sealed in this state, the distal end portion 11aa of the free end portion 11a and the distal end portion 11ba of the free end portion 11b are not covered with the resin 80. For this reason, when the upper mold 50 and the lower mold 60 are removed after resin molding, at least a part of both surfaces of the free end portions 11a and 11b (both surfaces of the free end portions 11aa and 11ba) are transferred to the resin 80. It will be in an exposed state without being covered. Therefore, flashing to the mounting surface of the LED chip is surely prevented. Subsequently, the resin 80 is thermally cured, the molded product is removed from the mold, and the mold is cleaned to complete one resin mold.

    In addition, when the LED manufactured using the mold of the present embodiment is mounted on a printed board, the LED chip mounting surface on the lower mold 60 side is set on the upper side, and the mounting board surface such as a printed board is used. Implemented.

    As described above, a space (cavity 72) is formed between the root portion 11ab of the free end portion 11a, the root portion 11bb of the free end portion 11b, and the side surface of the pressing portion 58. For this reason, the periphery of the root portions 11ab and 11bb is filled with the resin 80. Accordingly, it is possible to effectively suppress the occurrence of cracks or the like in the resin 80 due to the stress of the root portions 11ab and 11bb (inner leads). Further, since the base portions 11ab and 11bb are sandwiched by the resin 80 integrally formed from above and below, the inner leads are reliably prevented from dropping from the resin 80. As a result, according to the present embodiment, it is possible to provide a highly reliable LED chip mounting substrate and LED.

  By filling the resin 80 between the free ends 11a and 11b constituting the pair of electrodes of the LED chip, the free ends 11a and 11b can be reliably insulated.

    As the resin 80 of the present embodiment, for example, an epoxy resin or a silicone resin is used. However, the present invention is not limited to this, and other thermosetting resins can also be used.

    The resin 80 contains a filler. As the filler, for example, a material mainly composed of aluminum nitride (AlN) is used for light reflection and heat dissipation. When the filler containing aluminum nitride as a main component is contained, the color of the resin 80 is white, and light from the LED chip can be effectively reflected. In addition, since the resin containing the aluminum nitride filler has high thermal conductivity, the heat generated from the LED chip can be efficiently conducted to the outside and radiated. The filler contained in the resin 80 is not limited to aluminum nitride, and other fillers may be contained. Further, the color of the resin 80 is not limited to white, and may have other colors.

    FIG. 7 is an overall structural diagram of the LED chip mounting substrate in the present embodiment. FIG. 7A is a plan view of an LED chip mounting substrate (LED chip mounting surface), and FIG. 7B is a side view of the LED chip mounting substrate in FIG. FIG. 7C is a side view of the LED chip mounting substrate in FIG. 7A viewed from the C direction.

    As shown in FIG. 7A, a resin sealing portion 81 having a rectangular shape in plan view formed by curing the resin 80 is provided on the lead frame 10. The resin sealing portion 81 shown in the figure is formed in a map type mainly by filling a cavity 70 formed between the lower mold 60 and the lead frame 10 with resin.

    The LED chip mounting area 18 is resin-molded because the free end support portion 68 of the lower mold 60 is in close contact with a predetermined area of the lead frame 10. The part 81 is exposed without being covered. As shown in FIG. 7A, a plurality of LED chip mounting regions 18 are formed in the lead frame 10, and one LED chip is mounted in each LED chip mounting region 18.

    Further, the LED chip mounting region 18 is surrounded by a resin sealing portion 81 that functions as a reflector by being configured to be higher than the circular region. The resin sealing portion 81 surrounding the LED chip mounting region 18 is filled in a cavity 70 (cavity 71) formed between the lower mold 60 and the lead frame 10. For this reason, the resin sealing portion 81 reflects the shape of the cavity 71, in other words, has a shape obtained by inverting the shape of the cavity 71.

    The reason why the LED chip mounting area 18 is surrounded by a circular shape having a predetermined inclination is to improve the reflection efficiency of light from the LED chip.

    The LED chip (not shown) is mounted on the free end portion 11ba inside the LED chip mounting area 18. Also, as shown in FIGS. 7B and 7C, the resin sealing portion 81 is formed by filling the cavity 70 with the resin 80, so that the cavity 70 on the lead frame 10 is formed. It is formed at a certain height corresponding to the depth.

  FIG. 8 is an overall structural diagram of the LED chip mounting substrate in the present embodiment. 8A is a plan view of the LED chip mounting substrate, FIG. 8B is a side view of the LED chip mounting substrate in FIG. 8A viewed from the B direction, and FIG. ) Is a side view of the LED chip mounting substrate in FIG. FIG. 8A shows a surface (substrate mounting surface) opposite to the LED chip mounting surface.

    As shown in FIG. 8A, a resin sealing portion 81 is formed at a predetermined location on the lead frame 10. The resin sealing portion 81 shown in this figure is mainly formed by filling a cavity 72 formed between the upper mold 50 and the lead frame 10 with resin.

    The exposed region 19 is formed by resin molding while the pressing portion 58 of the upper mold 50 is in close contact with a predetermined region of the lead frame 10. For this reason, the exposed region 19 is exposed without being covered with the resin sealing portion 81 except for the lead forming hole 20. That is, in the exposed region 19, the surface of the free end portion 11aa and the free end portion 11ba is exposed. As shown in FIG. 8A, a plurality of exposed regions 19 are formed in the lead frame 10, and one LED chip is mounted on the back side of each exposed region 19 (the distal end portion 11ba of the free end portion). Is done.

    The exposed region 19 is surrounded by a resin sealing portion 81 that is higher than the rectangular region and functions as a leg portion. In this way, the resin sealing portion 81 surrounding the exposed region 19 in a rectangular shape is filled in the cavity 72 formed between the upper mold 50 and the lead frame 10. For this reason, the rectangular resin sealing portion 81 has a shape obtained by inverting the pressing portion 58 constituting the cavity 72. Although the exposed region 19 of the present embodiment is surrounded by the rectangular resin sealing portion 81, the present invention is not limited to this. It can be changed by changing the shape of the pressing portion 58 as described above.

    FIG. 9 is an enlarged view of a main part of the LED chip mounting substrate in the present embodiment. 9A is a plan view of the LED chip mounting substrate, FIG. 9B is a cross-sectional view taken along the line BB in FIG. 9A, and FIG. 9C is FIG. 9A. It is sectional drawing of the CC cut surface in the inside. FIG. 9D is a plan view of the LED chip mounting substrate in FIG. 9C viewed from the D direction. The range shown in FIG. 9 corresponds to the range 15 in the lead frame 10 in FIG. 1A or the LED chip mounting substrate in FIG. 7A, and is in the component part of one LED that is the final product in this embodiment. Equivalent to.

    As shown in FIG. 9A, an annular resin sealing portion 81 is formed on the LED chip mounting surface side of the LED chip mounting substrate of this embodiment. The annular resin sealing portion 81 functions as a reflector that reflects light from the LED chip, and the inside thereof has a mortar shape.

    The outer periphery of the reflector (resin sealing portion 81) of the present embodiment is formed by dicing a pair of arc-shaped wall portions in which the shape of the protrusion of the support portion 67 is inverted and a position orthogonal to these. However, the present invention is not limited to this. The inner periphery and outer periphery of the reflector can be formed into an appropriate shape such as a circular shape or a rectangular shape. However, in the case of the configuration as in the present embodiment, since the resin 80 is filled in a state where the lead frame 10 is supported by the support portion 67, the side surface of the reflector portion of the resin sealing portion 81 extends from the dicing line to the support portion 67. It is necessary to have a concave shape with a width of.

    The LED chip mounting region 18 is surrounded by an annular resin sealing portion 81, and the surfaces of the two free end portions 11aa and the one free end portion 11ba are exposed. On the left and right sides of FIG. 9A, external electrode portions 16a and 16b that are exposed without being covered with the resin sealing portion 81 are disposed as described later.

    As shown in FIGS. 9A and 9B, in the LED chip mounting region 18, the periphery (lead formation hole 20) of the tip portions 11aa and 11ba is filled with a resin sealing portion 81, Insulation between the tip portion 11aa and the tip portion 11ba is ensured. An LED chip 90 described later is mounted on the tip portion 11ba.

    As shown in FIGS. 9C and 9D, an exposed region 19 is formed on the opposite side of the LED chip mounting region 18 with respect to the tip portions 11aa and 11ba. The exposed region 19 is surrounded by a rectangular annular resin sealing portion 81 that fills the cavity 72 and functions as a leg portion. In the exposed region 19, the tip portions 11aa and 11ba are exposed.

    Further, external electrode portions 16a and 16b electrically connected to the tip end portions 11aa and 11ba through the root portions 11ab and 11bb are exposed at a pair of outer edges of the leg portions of the resin sealing portion 81. A chamfered portion 13 (V notch) is formed on the mounting substrate surface side in the external electrode portions 16a and 16b (end portions of the inner leads), so that mounting on the mounting substrate is facilitated as will be described later. Yes. As shown in FIG. 9D, the resin chamfered portion 14 is formed in the resin sealing portion 81, and the resin chamfered portion 14 is provided on the extension line of the chamfered portion 13. By forming the resin chamfered portion 14 in the resin sealing portion 81 on the substrate mounting surface side, it is possible to further improve the reliability when mounting the substrate.

    In addition, the chamfered portion 13 and the resin chamfered portion 14 of this embodiment are formed only on the left side and the right side in FIG. This is because the linear mold 59 is provided on the mold of this embodiment. However, the present embodiment is not limited to this. For example, a protrusion is provided so as to surround each pressing portion 58, and all of the LED mounting surfaces (including the upper side and the lower side in FIG. 9D). The resin chamfered portion 14 may be formed.

    FIG. 10 is an enlarged cross-sectional view of the LED in this example. The LED shown in FIG. 10 is obtained by mounting the LED chip 90 on the LED chip mounting substrate of this embodiment, and filling the LED chip mounting area 18 including the LED chip 90 with the translucent resin 85.

    The LED chip 90 is mounted on the tip portion 11ba of the free end portion 11b via solder. The LED chip 90 is a semiconductor chip configured to emit light of a specific color by emitting a light of a specific color by applying a predetermined voltage. The emission color differs depending on the material used for the LED chip. For example, as the LED chip 90, AlGaAs that emits red light, GaP that emits green light, GaN that emits blue light, or the like is used. Furthermore, an LED chip that emits ultraviolet rays can also be used.

    A cathode electrode is provided on the back surface (lower surface) of the LED chip 90 of this embodiment. By connecting the LED chip 90 to the free end portion 11ba (inner lead) with solder, the cathode electrode of the LED chip 90 is electrically connected to the free end portion 11ba. An anode electrode is provided on the surface (upper surface) of the LED chip 90. The anode electrode of the LED chip 90 is electrically connected to the free end portion 11aa by a wire (not shown) such as gold.

    After the LED chip 90 is mounted, the LED chip mounting substrate on which the LED chip 90 is mounted is clamped by using an upper mold and a lower mold (not shown) for forming the convex lens portion, and the LED chip mounting area 18 is filled with translucent resin 85. The translucent resin 85 filled in the LED chip mounting area 18 is cured to form an LED lens portion, and the LED chip 90 is sealed therein.

    Although the lens part which consists of translucent resin 85 is convex shape, it is not limited to this, For example, planar shape may be sufficient. Moreover, the translucent resin 85 is not limited to that formed by transfer molding, and can be formed by potting, for example.

    In the LED chip mounting area 18, the lead forming hole 20 (between each free end) is filled with a resin sealing portion 81. For this reason, the translucent resin 85 is filled only in the LED chip mounting surface which is one of the LED chip mounting substrates. Therefore, the translucent resin 85 is not filled in the exposed region 19 on the other surface, and the exposed region 19 remains exposed.

    As the translucent resin 85, a silicone resin having translucency and thermosetting is used. Further, unlike the resin 80, the translucent resin 85 is used without containing a filler such as aluminum nitride in order to transmit the light of the LED chip 90. Note that silicone resin is suitable for sealing the LED chip 90 because it has a property that its translucency is less likely to be lowered by ultraviolet rays or heat than an epoxy resin, for example. The translucent resin 85 is not limited to a transparent color, and any resin having a translucency, such as a resin colored with red or a phosphor, can also be used.

  The resin sealing part 81 surrounding the translucent resin 85 functions as a reflector that reflects the light emitted from the LED chip 90. Thus, by forming the resin sealing portion 81 that functions as a reflector, the light emission efficiency as an LED can be improved. Moreover, the luminous efficiency as LED can further be improved by making the resin sealing part 81 contain a white filler like a present Example.

    After filling with the translucent resin 85, dicing into a plurality of LEDs is performed, and the plurality of LEDs are made into individual pieces so that the planar shape shown in FIG. Specifically, it is only necessary to cut the chamfered portion 13 and cut both sides of the LED at a predetermined interval at which reflectors as shown in FIG. In this embodiment, the external electrode portions 16a and 16b of the LED are mounted on a printed circuit board 180 (mounting board) via solder 190. However, it is not limited to this, LED of a present Example can also be mounted on surfaces other than a printed circuit board.

    Moreover, since the resin sealing part 81 of a present Example contains the aluminum nitride as a filler, the resin sealing part 81 has favorable heat dissipation. For this reason, the heat inside the LED is efficiently radiated to the external printed circuit board 180. In addition, heat dissipation can be further improved by inserting a heat dissipation member (not shown) in the exposed region 19.

    A chamfered portion 13 is formed at a cut portion (end portions of the first inner lead and the second inner lead) in the external electrode portions 16a and 16b of the LED. In the chamfered portion 13, the external electrode portions 16 a and 16 b are inclined at the printed circuit board 180 side which is the substrate mounting surface side. By forming such a chamfered portion 13, even when a burr is formed toward the lower surface when the LED is divided into pieces, it protrudes from the side of the chamfered portion 13 away from the lower surface of the LED. . In this case, the burrs do not protrude from the lower surface of the LED, and deterioration of adhesion with the printed circuit board 180 due to the generation of burrs at the cut portion can be effectively suppressed. For this reason, it becomes possible to fix LED on the printed circuit board 180 reliably.

    Further, since the chamfered portion 13 is formed at the outermost part of the external electrode portions 16a and 16b, the solder 190 reaches the outermost portion of the external electrode portions 16a and 16b. In this case, since the solder 190 can be hardened in a substantially triangular space between the external electrode portions 16a and 16b and the printed circuit board 180, the connection between the printed circuit board 180 and the external electrode portions 16a and 16b is more reliable. Can be.

    For this reason, it is not necessary to employ a J-bend structure in which the external electrode portions 16a and 16b of the LED are bent downward, a structure in which the outer lead portion of the lead frame 10 is extended outward in a step shape, and the like. Accordingly, the step of forming the outer lead can be eliminated, and the external electrode portion can be easily formed at a low cost.

    Further, the angle α of the base portion 11bb of the free end with respect to the plane of the printed circuit board 180 is smaller than the angle β of the resin sealing portion 81 constituting the side wall of the exposed region 19. That is, the angle at which the base portion 11bb is bent with respect to the mounting substrate surface is smaller than the angle of the side surface of the pressing portion 58 of the upper mold 50. As shown in FIG. 9C, the root portion 11ab is the same as the root portion 11bb.

    By adopting the LED chip mounting substrate or LED having the lead frame 10 and the resin sealing portion 81 satisfying such a relationship, the root portion 11bb is reliably covered with the resin sealing portion 81 from both the upper side and the lower side. Is called. For this reason, generation | occurrence | production of defects, such as a crack in the resin sealing part 81 as mentioned above, and dropping, can be suppressed effectively.

    FIG. 11 is a perspective view of an LED chip mounting substrate (piece) in the present embodiment. FIG. 11A shows a case where the LED chip mounting substrate is viewed from the front surface (LED chip mounting surface), and FIG. 11B shows a case where this is viewed from the back surface.

    The LED chip mounting substrate is covered with a resin sealing portion 81 except for the free end tip portions 11aa and 11ba and the external electrode portions 16a and 16b. As described above, an LED chip (not shown) is mounted on the free end portion 11ba shown in FIG. 11A, and the inside of the LED chip mounting region 18 is filled with a translucent resin.

    Further, a chamfered portion 13 is formed on the mounting substrate surface side at the cut portions of the external electrode portions 16a and 16b shown in FIG. For this reason, the LED of this embodiment can be reliably mounted on the printed circuit board 180. Further, in order to further improve the reliability at the time of mounting the substrate, the resin sealing portion 81 is formed with a resin chamfered portion 14 on the mounting substrate surface side. The resin chamfered portion 14 is formed to extend from the chamfered portions 13 of the external electrode portions 16a and 16b.

    The chamfered portion 13 and the resin chamfered portion 14 formed at the cut portion (end portion of the inner lead) by dicing have a planar shape of an inclined surface when the chamfered portion 13 and the resin chamfered portion 14 before cutting are V-shaped grooves. . Further, when the chamfered portion 13 and the resin chamfered portion 14 before cutting are U-shaped grooves, they have a curved surface (R surface, arc) shape. Other structures such as a trapezoidal groove and a rectangular groove may be used as long as the influence of burrs during mounting can be suppressed.

    In this embodiment, the protrusion 59 is formed on the upper mold 50 and the cavity 70 is formed on the lower mold 60, but the present invention is not limited to this. When the LED chip is mounted on the lower surface of the lead frame during clamping with a mold, the protrusion 59 can be formed in the lower mold 60 and the cavity 70 can be formed in the upper mold 50. In this embodiment, as long as the protrusion 59 and the cavity 70 are formed in different molds (upper mold and lower mold), their directions (upper mold and lower mold) do not matter.

    As described above, according to the present embodiment, it is possible to provide an LED chip mounting substrate, an LED, a manufacturing method thereof, and a mold for manufacturing these, which can suppress the influence of burrs when mounting the substrate. Can do.

  Next, a second embodiment of the present invention will be described. The present embodiment is different from the first embodiment in that the V notch is formed at the time of clamping but the lead frame is not bent.

    FIG. 12 is an overall structural diagram of the lead frame in the present embodiment. FIG. 12A shows a plan view of the lead frame, and FIG. 12B shows a side view of the lead frame.

    In the lead frame 10a of the present embodiment, a plurality of lead forming holes 20a (outlet holes) are formed. A plurality of lead formation holes 20a are formed by punching out the lead frame 10a by press working for each mounting position of the LED chip to form an inner lead. The lead forming hole 20a is provided to insulate the pair of electrodes of the LED chip.

    As shown in FIG. 12A, each of the plurality of lead formation holes 20a formed in the lead frame 10a has the same size and shape. Each of these lead formation holes 20a is formed to be approximately the same as the size of one LED package in the present embodiment, and constitutes a part of one LED package. A half edge is formed on the back surface of the lead frame 10a as represented by a broken line.

    The lead frame 10a has a plurality of half edges 32 for each lead formation hole 20a. The half edge 32 functions as a part of the gate that allows the resin injected from the gate of the mold during the transfer molding described later to pass through the lead forming hole 20a.

As shown in FIG. 12B, the lead frame 10a has a flat planar shape.
FIG. 13 is an enlarged view of a main part of the lead frame in the present embodiment. 13A is a plan view of the lead frame, FIG. 13B is a cross-sectional view taken along the line BB in FIG. 13A, and FIG. 13C is C in FIG. 13A. It is sectional drawing of a -C cut surface. FIG. 13D is a plan view of FIG. 13C viewed from the D direction. In FIG. 13B, the left side of the drawing is the upper surface side of the lead frame, and the right side is the lower surface side of the lead frame.

    As shown in FIGS. 13A to 13D, a half edge 22 is formed at a part of the edge of each lead forming hole 20a. Specifically, the half edge 22 is formed in a shape such that each lead forming hole 20a is convex toward the upper surface in the BB cross section of FIG.

    21a and 21b are inner leads. The inner lead 21b is formed in a shape that extends to a substantially central portion by the lead forming hole 20a, and is used as a die pad for mounting an LED chip. The other inner lead 21a is formed in a shape extending to a position where the inner lead 21b is sandwiched by each lead forming hole 20a.

    A gold wire of an LED chip is bonded to the inner lead 21a. In this embodiment, since two wires are connected to one electrode of the light emitting chip, two inner leads 21a are provided.

    FIG. 14 is a cross-sectional view showing the state of the resin mold in this example. The left side of FIG. 14 shows the state before resin molding, and the right side of FIG. 14 shows the state after resin molding. As shown in the figure, the lead frame 10a is resin-sealed by transfer molding.

    Reference numeral 51 denotes an upper mold for determining the shape of the resin filled in the lead frame 10a. In the upper mold 51, a plurality of cavities 74 for forming reflectors are formed at the same intervals as the plurality of lead forming holes 20a formed in the lead frame 10a. The upper mold 51 presses the lead frame 10a from the upper surface side so that the plurality of lead forming holes 20a and the plurality of cavities 74 overlap during resin molding.

    Similarly, 61 is a lower mold. As will be described later, the lower mold 61 is provided with a protrusion 59a (see FIG. 16) for forming a chamfered portion on the board mounting surface side of the lead frame 10a. The lower mold 61 presses the lead frame 10a from the lower surface side so that the cut portion of the lead frame 10a (end portions of the inner leads 21a and 21b) and the protrusion 59a overlap each other during resin molding.

    The mold according to the present embodiment (hereinafter also simply referred to as “metal mold”) is mainly composed of an upper mold 51 and a lower mold 61. At the time of resin molding, the upper die 51 and the lower die 61 clamp (lead) the lead frame 10a, and the plurality of cavities 74 and the plurality of lead forming holes 20a are overlapped to fill the inside with the resin 80. To do.

    80a is a resin tablet. At the time of resin molding, as shown on the right side of FIG. 14, the resin tablet 80a is put into the pot 113 of the preheated lower mold 61 and melted. Then, the molten resin 80 is pumped by moving the plunger 111 upward, so that the space between the upper mold 51 and the lower mold 61 is filled with the resin 80. The plunger 111 is configured to be slidable up and down along the pot 113 by a transfer mechanism (not shown). Although it is preferable to form the chamfered portion without using a release film, in some cases, the resin 80 is supplied after covering the parting surface of the upper mold 51 with a release film (not shown). Thus, the lead frame 10a can be clamped by the upper mold 51 through the release film.

    As the resin 80 is pumped by the plunger 111, the molten resin 80 is supplied to the lead forming hole 20 a and the cavity 74 through the cull 55 a, the runner 56 a, the gate 57 a and the half edge 32. Specifically, since each lead forming hole 20 a communicates with the through gate 76, the resin 80 can be supplied also to the cavity 74 communicated with the lead forming hole 20. For this reason, the resin 80 is sequentially supplied toward the lead formation hole 20a and the cavity 74 far from the lead formation hole 20a and the cavity 74 near the gate 57a.

    In this way, the resin tablet 80 a is melted to become the resin 80 and is injected into the space formed by the upper mold 51 and the lower mold 61. As a result, as shown on the right side of FIG. 14, the space between the upper mold 51 and the lower mold 61 is filled with the resin 80.

    In addition, the broken line illustrated as 160 in FIG. 14 shows the sealing shape of the LED (light emitting device) of this embodiment formed by sealing the LED chip with a translucent resin 85 (silicone resin). Is. That is, it corresponds to the shape of the upper mold used at the time of formation.

    FIG. 15 is a structural diagram of the upper mold 51 used in this embodiment. FIG. 15A is a cross-sectional view of the upper mold 51, and FIG. 15B is a plan view of the upper mold 51 as viewed from below.

    In the upper mold 51, a cavity 74, a through gate 76, a cull 55a, a runner 56a, and a gate 57a are formed in a concave shape having respective shapes and sizes. In the upper mold 51, a region surrounded by a cavity 74 formed in an annular shape in plan view is a clamping surface for clamping the lead frame 10a. By this clamping surface, as shown in FIG. 14, each mounting position of the LED chip on the lead frame 10a is clamped.

    FIG. 16 is a structural diagram of the lower mold 61 used in this embodiment. 16A is a cross-sectional view of the lower mold 61, and FIG. 16B is a plan view of the lower mold 61 as viewed from above.

    The lower mold 61 is formed with a plurality of linear protrusions 59a. The protrusion 59a in this embodiment has an inverted V shape. Thus, also in this embodiment, the concave shape and the protrusion 59a constituting the cavity 74 are formed in different molds as in the previous embodiment, so that the resin sealing portion 81 is formed in the lead frame 10a. The surface to be formed is different from the surface on which the chamfered portion is formed. The present embodiment is common to the previous embodiment in that each of the cavities 74 and the protrusions 59a is formed in a mold opposite to the previous embodiment, but each is formed in a different mold.

    In FIG. 16B, the lead forming holes 20a (inner leads 21a and 21b) of the lead frame 10a to be placed on the lower mold 61 are indicated by two-dot dashed lines. As shown in this figure, the linear protrusion 59a is disposed at the end of the inner leads 21a, 21b (the end of the lead forming hole 20a). However, the protrusion 59a is not limited to this, and may be formed so as to surround each lead forming hole 20a, for example.

    When the protrusion 59a is pressed against the lead frame 10a (ends of the inner leads 21a and 21b), a V-shaped chamfered portion 13a is formed on the lower surface of the lead frame 10a (the contact surface with the lower mold 61). As will be described later, the end portions of the inner leads 21a and 21b serve as cutting portions when dicing the lead frame 10a (a plurality of LEDs).

    Also, as shown in FIGS. 16A and 16B, the resin tablet 80 a is disposed on the plunger 111 (see FIG. 14) inside the pot 113 of the lower mold 61. The resin tablet 80 a is dissolved and pumped by the plunger 111, whereby the lead forming hole 20 a and the cavity 74 are filled with the resin 80.

    FIG. 17 is an enlarged view showing a state of the resin mold in the present example. FIG. 17A shows a state before resin molding, and FIG. 17B shows a state after resin molding. The range shown in FIG. 17 corresponds to a component for one LED which is the final product in this embodiment.

    The lower mold 61 is provided with a protrusion 59a for forming the chamfered portion 13 on the board mounting surface side (lower surface side) of the lead frame 10a. The lower die 61 has a clamping surface for clamping the lead frame 10a in the region where the lead frame 10a is disposed. By clamping the lead frame 10a using the upper mold 51 and the lower mold 61, the protrusion 59a of the lower mold 61 bites into the lower surface of the lead frame 10a, and the chamfered portion 13a is formed in the lead frame 10a. At this time, since the inner leads 21a and 21b are clamped, even if the inner leads 21a and 21b are extended or bent due to the plastic deformation that occurs when the chamfered portion 13a is formed, the inner leads 21a and 21b are deformed from the intended shape. Is suppressed.

    Further, as shown in FIG. 17A, a cavity 74 is formed between the upper mold 51 and the lower mold 61. As described above, the resin 80 is filled into the cavity 74 and the lead forming hole 20a that are in communication with each other by operating the transfer mechanism to pump the resin 80.

    FIG. 17B shows a state in which the resin 80 is filled in the cavity 74 and the lead forming hole 20a. After filling with the resin 80, the resin 80 waits for a predetermined time to cure the resin 80, and the upper mold 51 and the lower mold 61 are opened. Next, after the resin-molded LED chip mounting substrate is carried out, the parting surface of the mold is cleaned, and one resin mold is completed. Thereby, the LED chip mounting substrate of this embodiment is formed.

    On the upper surface side of the lead frame 10a, the resin 80 cured in the cavity 74 constitutes a reflector. The reflector is formed on the LED chip mounting surface of the lead frame 10a and has a function of reflecting light from the LED chip upward.

  FIG. 18 is an overall structural diagram of the LED chip mounting substrate in the present embodiment. 18A is a plan view of the surface of the LED chip mounting substrate (LED chip mounting surface), and FIG. 18B is a plan view of the back surface of the LED chip mounting substrate. FIG. 18C is a side view of the LED chip mounting substrate. The front surface shown in FIG. 18A is the upper side, and the back surface shown in FIG. 18B is the lower side.

  The LED chip mounting substrate shown in FIGS. 18A and 18B is an LED chip mounting substrate before mounting a plurality of LED chips. In this LED chip mounting substrate, a plurality of lead formation holes 20a are filled with resin 80 to form a closed portion between inner leads 21a and 21b, and a plurality of reflectors are formed on the upper surface of lead frame 10a with resin 80. Is formed. Thus, the LED chip mounting substrate has a structure in which a plurality of LED chips can be mounted inside the plurality of reflectors.

    As shown in FIG. 18B, a plurality of linear chamfered portions 13a (V-shaped grooves, V notches) are formed on the back surface (substrate mounting surface) of the LED chip mounting substrate. The chamfered portion 13 a is formed by plastic deformation so that the back surface of the lead frame 10 a is recessed by a linear protrusion 59 a provided on the lower mold 61. Further, as shown in FIG. 18C, in the LED chip mounting substrate of this embodiment, the resin 80 constituting the reflector is formed at a certain height on the LED chip mounting surface side (surface side). Yes.

    FIG. 19 is an enlarged view of a main part of the LED chip mounting substrate in the present embodiment. 19A is a plan view of an LED chip mounting substrate, FIG. 19B is a cross-sectional view taken along the line BB in FIG. 19A, and FIG. 19C is FIG. 19A. Sectional drawing of the CC cut surface in the inside is shown. FIG. 19D is a plan view of FIG. 19C viewed from the D direction.

  As shown in FIGS. 19A, 19B, and 19C, the reflector made of the resin 80 has an annular shape with a mortar shape on the inner surface on the upper surface (LED chip mounting surface) of the lead frame 10a. Is formed. Although the reflector of a present Example is circular shape in the inner periphery and outer periphery, it is not limited to this. Either the inner periphery or the outer periphery of the reflector may be rectangular. Moreover, both the inner periphery and outer periphery of a reflector can also be made into a rectangular shape. Note that the cross-sectional views of FIGS. 19B and 19C are obtained by cutting the LED chip mounting substrate of FIG. 19A in a direction orthogonal to each other.

    As shown in FIG. 19D, a chamfered portion 13a is formed on the board mounting surface side of the end portions (outer end portions) of the inner leads 21a and 21b. The chamfered portions 13a of the inner leads 21a and 21b (lead frame 10a) are formed by being plastically deformed so as to be recessed by the protrusion 59a of the lower mold 61 as described above.

    Further, a resin chamfered portion 14a is formed on the substrate mounting surface side of the end portion of the resin 80 filled in the lead forming hole 20a. The resin chamfered portion 14a is formed by reflecting this shape due to the presence of the protrusion 59a when the resin 80 is filled. Since the lower mold 61 of this embodiment is provided with the linear protrusion 59a, the resin chamfered portion 14a is formed linearly on the extended line of the chamfered portion 13a.

    FIG. 20 is an external configuration diagram of an LED in the present embodiment. FIG. 20A shows a side view of the LED, and FIG. 20B shows a plan view of the back surface (substrate mounting surface) of the LED.

    An LED chip (not shown) is mounted on the above-described LED chip mounting substrate and filled with a translucent resin 85 so as to seal the reflector (resin sealing portion 81) inside, thereby a plurality of LEDs ( LED package) is formed. The translucent resin 85 covers the periphery to protect the LED chip mounted on the inner lead 21b, and also serves as a lens portion of light emitted from the LED chip. The translucent resin 85 is formed by, for example, transfer molding. In this state, a plurality of LEDs are formed on one lead frame 10a. Finally, an LED (LED package) is configured by dicing a plurality of LEDs.

    In the LED of this example, as shown in FIG. 20B, the plane formed by the planar inner leads 21a and 21b and the resin sealing portion 81 that seals the lead forming hole 20a is the LED. It becomes the bottom (board mounting surface). As shown in FIG. 20B, each of the inner leads 21a and 21b divided into two by the resin sealing portion 81 becomes an external electrode portion connected to the anode electrode or the cathode electrode of the LED chip. These external electrode portions are directly soldered to a mounting board such as a printed board (not shown).

    As described above, the chamfered portion 13a and the resin chamfered portion 14a are formed in the cut portion by dicing (the end portion of the inner lead). The chamfered portion 13a formed on the LED after cutting by dicing has a planar shape of an inclined surface when the chamfered portion 13a before cutting is a V-shaped groove.

    Further, when the chamfered portion 13a before cutting is a U-shaped groove, it has a curved surface (R surface, arc) shape. Other structures such as a trapezoidal groove and a rectangular groove may be used as long as the influence of burrs during mounting can be suppressed. For example, when it is desired to form an R chamfered chamfered portion 13a on the package, a convex projection 59a having both side surfaces recessed into a curved surface may be used. At this time, if the center in the thickness direction of the dicing blade is moved from the center (width direction) of the protrusion 59a to the outside of the package so that the center of the protrusion 59a coincides with the side surface of the blade, the cross-sectional shape of the protrusion 59a Half of this will remain as the chamfered portion 13a.

    Further, when it is desired to form the chamfered chamfered portion 13a on the package, a convex projection 59a formed in an isosceles triangle shape with a right angle of cross section having an inclination angle of both sides of 45 degrees may be used. The chamfered portion 13a and the resin chamfered portion 14a are formed when a mold die having a linear protrusion 59a is used. For this reason, the resin chamfered portion 14a of the LED shown in FIG. 20B is formed only on the right side and the left side in the drawing.

    However, the present invention is not limited to this. For example, if the projection of the mold is formed so as to surround each lead forming hole 20a, the entire outer periphery of the LED mounting surface (including the upper side and the lower side in the figure) The resin chamfered portion 14a is formed.

    As described above, also in this embodiment, it is possible to provide an LED chip mounting substrate, an LED, a manufacturing method thereof, and a mold for manufacturing them, which can suppress the influence of burrs when mounting the substrate. it can.

  Next, Embodiment 3 of the present invention will be described. This embodiment is the same as the second embodiment in that the V-notch is formed at the time of clamping but the lead frame is not bent. However, in this embodiment, the map-type resin sealing portion 81 is formed. And very different.

    FIG. 21 is an overall structural diagram of the LED chip mounting substrate in the third embodiment. 21A is a plan view of the front surface (LED chip mounting surface), FIG. 21B is a plan view of the back surface, and FIG. 21C is a side view.

  In the present embodiment, a mold similar to the lower mold 60 of the first embodiment is used as a mold (upper mold or lower mold) for clamping the LED chip mounting surface of the LED chip mounting substrate. That is, in the present embodiment, an upper mold in which the pressing portion 58 of the upper mold 50 of the first embodiment is omitted is used. In addition, a die having a free end support portion having the same height as the support portion 67 is used by making the free end support portion 68 of the lower die 60 of the first embodiment higher.

  As shown in FIG. 21A, when resin molding is performed using the mold of this embodiment, the cavity formed by the mold communicates, so that the lead frame on the LED chip mounting surface is on the lead frame. The integrally formed resin sealing portion 81 is formed. In the resin sealing portion 81, a plurality of LED chip mounting regions 18a where a plurality of inner leads 21b are exposed without being covered with resin are formed.

  Moreover, the metal mold | die of a present Example is provided with the support part in the position of the LED cutting part (external electrode part). For this reason, if it is an area | region which opposes the lead frame support surface of the support part, the chamfer part 13b and the resin chamfer part 14b can be formed in any position by providing a protrusion in the predetermined position in the area | region. it can.

    For example, as shown in FIG. 21B, the positions at which the chamfered portion 13b and the resin chamfered portion 14b of this embodiment are formed are respectively compared with the chamfered portion 13a and the resin chamfered portion 14b of the second embodiment. It is close to the center of the LED (LED chip mounting area side). Thus, according to the present embodiment, by adjusting the position of the support portion 67, the formation position of the chamfered portion 13b and the resin chamfered portion 14b, that is, the position of the cut portion at the time of cutting the lead frame can be appropriately changed. it can.

    In addition, as shown in FIG. 21C, the resin sealing portion 81 filled in the communicating cavity is formed on the lead frame 10a at a certain height.

    As described above, also in this embodiment, it is possible to provide an LED chip mounting substrate, an LED, a manufacturing method thereof, and a mold for manufacturing them, which can suppress the influence of burrs when mounting the substrate. it can.

    Next, a fourth embodiment of the present invention will be described. This embodiment is different from the above embodiments in that a chamfered portion is formed when a resin sealing portion is formed on a lead frame on which a semiconductor chip is mounted. In this embodiment, a semiconductor device as an example of a resin sealing body is formed.

    FIG. 22 is a cross-sectional view showing a state of the resin mold in Example 4. In this figure, four LED chips are mounted on a lead frame, and a light-transmitting resin is filled so that each LED chip is individually resin-sealed.

    As shown in FIG. 22, the LED chip 91 is mounted on the lead frame 10 b, and the LED chip 91 and the lead frame 10 b are electrically connected by bonding wires 95. In the lead frame 10b, the inner lead on which the LED chip 91 is mounted and the inner lead to which the bonding wire 95 is connected constitute a set of an anode electrode and a cathode electrode of the LED.

    In this embodiment, the lead frame 10b is clamped using the upper mold 52 and the lower mold 62 in a state where the LED chip 91 is mounted on the lead frame 10b. It clamps with these metal mold | dies, and the translucent resin 84 is filled with a transfer mold. A plurality of cavities 78 are formed in the upper mold 52, and the translucent resin 84 is mainly filled in the cavities 78.

    The LED chip 91 mounted on the lead frame 10b is disposed on the upper mold 52 side where the cavity 78 is formed. For this reason, the LED chip 91 is sealed with the translucent resin 84 by filling the cavity 78 with the translucent resin 84. At the same time, the bonding wire 95 is also sealed with the translucent resin 84.

    The lower mold 62 is formed with a protrusion 59b. The protrusion 59b clamps the lead frame 10b with the upper mold 52 and the lower mold 62, thereby forming a chamfered portion 13c (V notch) on the lower surface of the lead frame 10b. The chamfered portion 13c of the lead frame 10b is formed at a cutting portion (dicing line 130) when cutting the lead frame 10b when forming the LED as the final product. In other words, in this embodiment, the position on the outer periphery of the package shape on the board mounting surface side (the lower surface side in FIG. 22) of the inner lead of the lead frame 10b by the protrusion 59b provided on one of the upper mold 52 and the lower mold 62. A chamfered portion 13c is formed on the surface. In the present embodiment, the “package shape” does not strictly mean only the outer shape of the resin sealing portion 81 but the shape in plan view including the lead portion remaining in the LED as a finished product. In other words, the package shape is a rectangular shape of the LED cut by dicing.

  As described above, the chamfered portion 13c of the present embodiment is a mold (upper mold 52) for filling the translucent resin 84 for sealing the LED chip 91 with the LED chip 91 mounted on the lead frame 10b. The lower die 62) is formed by clamping the lead frame 10b.

    As described above, also in this embodiment, it is possible to provide an LED as a resin encapsulant that can suppress the influence of burrs during substrate mounting, this manufacturing method, and a mold for manufacturing these. . As described above, the present invention can also be adopted when using a lead frame on which a semiconductor chip is mounted when the elongation or bending of the inner lead due to the formation of the chamfered portion 13c is sufficiently small.

  In this embodiment, the chamfered portion 13c is formed on the lead frame 10b on which the LED chip 91 is mounted. However, the present invention is not limited to this. This embodiment can also be applied to a resin sealing body in which a semiconductor chip other than an LED chip, for example, a semiconductor chip used as a signal processing device or a storage device is mounted on a lead frame. At this time, the resin 80 is used instead of the translucent resin 84 of the present embodiment. The resin 80 is filled in the cavity with the semiconductor chip mounted on the lead frame.

  For this reason, according to the present Example, the manufacturing method of the resin sealing body which can suppress the influence by the burr | flash at the time of board | substrate mounting can be provided.

  In this embodiment, the semiconductor chip such as the LED chip 91 is arranged on the upper surface side of the lead frame, but the present invention is not limited to this. A semiconductor chip may be arranged on the lower surface side of the lead frame. However, in this case, the cavity 78 is formed in the lower mold, and the protrusion 59b is formed in the upper mold.

    As mentioned above, according to LED of each Example, the influence by generation | occurrence | production of a burr | flash can be suppressed and connection reliability can be improved.

    Therefore, according to each said Example, the manufacturing method of the resin sealing body and LED chip mounting board | substrate which improved connection reliability simply, LED board mounting board | substrate, and LED can be provided. Further, it is possible to provide a mold die for an LED chip mounting substrate that can easily improve the connection reliability of the LED.

  In the above, the Example of this invention was described concretely. However, the present invention is not limited to the matters described in the above embodiments, and can be appropriately changed without departing from the technical idea of the present invention.

    For example, in the above-described embodiment, the description has been given of the configuration in which the protrusions 59 and 59a collectively form the chamfered portions on all the inner leads 21, 21, 21a and 21b existing on a straight line. However, the present invention is not limited to this. is not. For example, it is possible to adopt a configuration in which protrusions having a length capable of forming a chamfered portion for each inner lead are provided by the number of inner leads. In this case, it is possible to form a chamfered portion at a portion where the dicing line and the inner lead intersect, that is, a portion where burrs are generated from the lead frame by dicing. Moreover, it is good also as a structure which provides the processus | protrusion of the length which can form a chamfering part collectively in a some inner lead.

BRIEF DESCRIPTION OF THE DRAWINGS It is the whole lead frame structural drawing in Example 1, (A) The top view of a lead frame, (B) The side view from B direction, (C) The side view from C direction. 1 is an enlarged view of a main part of a lead frame in Example 1, (A) a plan view of the lead frame, (B) a cross-sectional view of a BB cut surface, (C) a cross-sectional view of a CC cut surface, (D). It is a top view from the D direction. It is a lower metal mold | die in Example 1, (A) Top view, (B) Sectional drawing of a BB cut surface, (C) Sectional drawing of a CC cut surface. It is an upper metal mold | die in Example 1, (A) top view, (B) sectional drawing of a BB cut surface, (C) sectional drawing of a CC cut surface. It is sectional drawing which shows the positional relationship of each part at the time of combining the upper metal mold | die and the lower metal mold | die in Example 1. FIG. 6 is a cross-sectional view showing a first state in the manufacturing process of the LED chip mounting substrate of Example 1. FIG. 6 is a cross-sectional view illustrating a second state in the manufacturing process of the LED chip mounting substrate of Example 1. FIG. 6 is a cross-sectional view showing a third state in the manufacturing process of the LED chip mounting substrate of Example 1. FIG. 6 is a cross-sectional view showing a fourth state in the manufacturing process of the LED chip mounting substrate of Example 1. FIG. FIG. 10 is a cross-sectional view showing a fifth state in the manufacturing process of the LED chip mounting substrate of Example 1; FIG. 10 is a cross-sectional view showing a sixth state in the manufacturing process of the LED chip mounting substrate of Example 1; BRIEF DESCRIPTION OF THE DRAWINGS It is a whole block diagram of the board | substrate for LED chip mounting in Example 1, (A) The top view of the substrate surface, (B) The side view from B direction, (C) The side view from C direction. BRIEF DESCRIPTION OF THE DRAWINGS It is a whole structure figure of the board | substrate for LED chip mounting in Example 1, (A) The top view of a substrate back surface, (B) The side view from B direction, (C) The side view from C direction. It is the principal part enlarged view of the board | substrate for LED chip mounting in Example 1, (A) The top view of a board | substrate for LED chip mounting, (B) Sectional drawing of a BB cut surface, (C) CC cut surface Sectional drawing, (D) It is a top view from D direction. 3 is an enlarged cross-sectional view of an LED in Example 1. FIG. It is a perspective view of the board | substrate for LED chip mounting (piece | piece) in Example 1, (A) The surface side and (B) The back surface side are shown. FIG. 4 is an overall structural view of a lead frame in Example 2, (A) a plan view of the lead frame, and (B) a side view of the lead frame. It is the principal part enlarged view of the lead frame in Example 2, (A) The top view of a lead frame, (B) Sectional drawing of a BB cut surface, (C) Sectional drawing of a CC cut surface, (D) It is a top view from the D direction. It is sectional drawing which shows the state of the resin mold in Example 2. FIG. FIG. 5 is a structural diagram of an upper mold used in Example 2. 6 is a structural diagram of a lower mold used in Example 2. FIG. It is an enlarged view which shows the state of the resin mold in Example 2, and is the state after (A) resin mold and (B) resin mold. It is the whole structure figure of the board | substrate for LED chip mounting in Example 2, (A) The top view of the surface (LED chip mounting surface), (B) The top view of a back surface, (C) The side view. It is a principal part enlarged view of the board | substrate for LED chip mounting in Example 2, (A) The top view of a board | substrate for LED chip mounting, (B) Sectional drawing of a BB cut surface, (C) CC cut surface of FIG. Sectional drawing, (D) It is a top view from D direction. It is an external appearance block diagram of LED in Example 2, (A) The side view of LED, (B) The top view of a back surface. It is a whole structure figure of the board | substrate for LED chip mounting in Example 3, (A) The top view of the surface (LED chip mounting surface), (B) The top view of a back surface, (C) The side view. It is sectional drawing which shows the state of the resin mold in Example 4. FIG.

Explanation of symbols

10, 10a, 10b ... lead frames 11a, 11b ... free end portions 13, 13a, 13b, 13c ... chamfered portions 14, 14a, 14b ... resin chamfered portions 16a, 16b ... external electrode portions 20, 20a ... lead forming holes 50, 51, 52 ... Upper mold 59, 59a, 59b ... Protrusion 60, 61, 62 ... Lower mold 67, 69 ... Support part 70, 71, 72, 74 ... Cavity 80 ... Resin 81 ... Resin sealing part 84, 85 ... Translucent resin 90, 91 ... LED chip 180 ... Printed circuit board 190 ... Solder

Claims (6)

A method for producing a resin sealing body, wherein a lead frame is clamped with an upper mold and a lower mold for resin molding to form a resin sealing portion on the lead frame,
By clamping the lead frame with the upper mold and the lower mold, a package shape on the substrate mounting surface side of the inner lead of the lead frame by a protrusion provided on one of the upper mold or the lower mold Forming a chamfer at a position on the outer periphery of the
Filling the space formed by the cavity provided in the other of the upper mold or the lower mold with the lead frame clamped by the upper mold and the lower mold. And
The lead frame is configured to be cut at the position on the outer periphery where the chamfered portion is formed. A method of manufacturing an LED chip mounting substrate before mounting a plurality of LED chips,
By clamping the lead frame with the upper mold and the lower mold for the resin mold, the LEDs of the first inner lead and the second inner lead are formed by a protrusion provided on one of the upper mold or the lower mold. Forming a chamfered portion on the board mounting surface side of the end located on the outer periphery as the package;
Filling the space formed by the upper mold and the lower mold with a resin in a state where the lead frame is clamped by the upper mold and the lower mold, and
The lead frame is configured to be cut at an end portion of the first inner lead and the second inner lead in which the chamfered portion is formed. Method.     A resin chamfered portion is formed on the substrate mounting surface side of the resin by the protrusion by filling the space with the resin while the lead frame is clamped by the upper mold and the lower mold. The manufacturing method of the board | substrate for LED chip mounting of Claim 2. A mold for an LED chip mounting substrate,
An upper mold for pressing a lead frame having a first inner lead and a second inner lead from the upper surface side;
A lower mold for pressing the lead frame from the lower surface side,
A protrusion is formed on one of the upper mold and the lower mold,
The mold mold has a chamfered portion on the board mounting surface side of the end portions of the first inner lead and the second inner lead by clamping the lead frame with the upper mold and the lower mold. Formed and configured to fill a resin into a space formed by the upper mold and the lower mold,
The lead frame is configured to be cut at an end of the first inner lead and the second inner lead in which the chamfered portion is formed. Mold. An LED chip mounting board before mounting a plurality of LED chips,
A first inner lead for electrical connection to the first electrode of the LED chip, and a lead frame comprising a second inner lead for electrical connection to the second electrode of the LED chip;
A resin that insulates between the first inner lead and the second inner lead;
A chamfered portion is formed on the substrate mounting surface side at the end portions of the first inner lead and the second inner lead,
The lead frame is configured to be cut at an end portion of the first inner lead and the second inner lead in which the chamfered portion is formed,
The LED chip mounting substrate, wherein a resin chamfered portion is formed on the resin on the substrate mounting surface side. An LED chip that emits light by applying a forward bias between the first electrode and the second electrode;
A first inner lead mounted on the LED chip and electrically connected to the first electrode of the LED chip, and a second inner lead electrically connected to the second electrode of the LED chip A lead frame with
A resin that insulates between the first inner lead and the second inner lead;
A translucent resin for sealing the LED chip;
Have
A chamfered portion is formed on the substrate mounting surface side at the cut portion of the first inner lead and the second inner lead,
The LED, wherein a resin chamfered portion is formed in the resin on the substrate mounting surface side.