JP2009283803A - Electronic component mounting device and electronic component mounting operation performing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device and an electronic component mounting operation performing method capable of performing mounting operation without requiring almost any positioning adjustment of stoppers or sensors even when handling a substrate of a different type having notches or protrusions in its end portion on the side of a reference for substrate positioning. <P>SOLUTION: The electronic component mounting device includes a substrate positioning sensor S2 for positioning a substrate in a first division mounting area MA1 and a second division mounting area MA2, while the first division mounting area MA1 and the second division mounting area MA2 are set on a substrate carrying conveyer, using the downstream end as a positioning reference. In this device, when the substrate 4C of a different type having a notch in an end portion on the side of the positioning reference is to be handled, the mounting operation is performed by positioning the substrate in the first operation position. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting work execution method used in an electronic component mounting line for manufacturing electronic devices by mounting electronic components on a substrate.

  An electronic component mounting apparatus that constitutes an electronic component mounting system that manufactures a mounting substrate by mounting electronic components on a substrate is provided with a substrate transport mechanism for transporting the substrate from the upstream side to the downstream side. The transport mechanism includes board positioning means for positioning a board to be mounted at a predetermined work position such as a component mounting work position. As the substrate positioning means, a mechanical stopper system that positions the substrate by bringing the leading end of the positioning reference side of the substrate into contact with a mechanical stopper, or the substrate is placed in a predetermined position by detecting the leading end of the substrate with a sensor. A sensor system for stopping is used.

In many cases, the planar shape of the board that is the target for mounting electronic components is generally a rectangular basic shape. However, depending on the type of board, a notch is provided partially at the tip of the board or the tip is partially In some cases, a deformed substrate having a protruding shape is a target (see Patent Document 1). In this patent document, an example is shown in which a substrate having a notch portion at the tip is targeted for positioning (see FIG. 8).
JP 2001-15995 A

  When such a deformed substrate is to be positioned, if the portion where the stopper abuts or the portion to be detected by the sensor is cut out, the stopper is not necessarily the substrate in the process of transporting the substrate from the upstream side. The sensor does not always contact the leading end of the substrate, and the sensor does not always detect the positioning reference position of the substrate. For this reason, when such an irregular substrate is a target for electronic component mounting work, it is necessary to adjust the position of the stopper or sensor each time, and it is possible to make it a mounting target without requiring adjustment work. There was a restriction on the shape of the substrate.

  Therefore, the present invention can be used as a work object with little need for adjusting the position of the stopper or sensor even when the target board is a deformed board having a notch or a protrusion at the tip on the board positioning reference side. An object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting work execution method.

The electronic component mounting apparatus of the present invention constitutes an electronic component mounting system for manufacturing a mounting substrate by mounting the electronic component on the substrate, and performs a predetermined electronic component mounting operation on the substrate. A work operation mechanism for performing the electronic component mounting work by moving a work head for performing the electronic component mounting work by a head moving mechanism; and an upstream side of the substrate in the substrate transport direction. A substrate conveyer that conveys from the substrate to the downstream side, a first work position that is set on the substrate conveyer and where the electronic component mounting work is performed by the work operation mechanism, and a second that is located downstream of the first work position The substrate is positioned at the first work position or the second work position with the downstream end of the substrate conveyor as the positioning reference. And positioning the deformed substrate at the first work position when the electronic component mounting work is to be performed on the substrate positioning means and the deformed substrate having a notch at the end on the positioning reference side in the positioning. And a control means for controlling the substrate transfer conveyor and the substrate positioning means.

  The electronic component mounting work execution method of the present invention is a work operation for executing the electronic component mounting work by moving a work head for performing an electronic component mounting work for a substrate by a head moving mechanism. A mechanism, a substrate transport conveyor that transports the substrate from the upstream side to the downstream side in the substrate transport direction, a first work position that is set in the substrate transport conveyor and for performing electronic component mounting work by the work operation mechanism, and this A second work position located downstream of the first work position, and a board for positioning the board at the first work position or the second work position with the downstream end of the board transport conveyor as a positioning reference. The electronic component mounting apparatus includes a positioning unit, and performs an electronic component mounting operation on the board. In the method, when an irregular substrate having a notch at an end on the positioning reference side in the positioning is an object for mounting an electronic component, the irregular substrate is positioned at the first working position. The substrate transfer conveyor and the substrate positioning means are controlled.

  According to the present invention, the first work position where the electronic component mounting work by the work operation mechanism is performed on the board transport conveyor for transporting the board from the upstream side to the downstream side, and the first work position located downstream of the first work position. In the electronic component mounting apparatus comprising the substrate positioning means for positioning the substrate at the first working position or the second working position with the downstream work position being set as a positioning reference, the positioning reference side When a deformed board having a notch at the end of the electronic component is the target of the electronic component mounting work, the stopper or sensor is obtained by positioning the deformed board at the first work position and executing the electronic component mounting work. Therefore, it is possible to make it an object for mounting work with little need for position adjustment.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory diagram of a configuration of an electronic component mounting system according to an embodiment of the present invention, FIG. 2 is a perspective view of an electronic component mounting apparatus constituting the electronic component mounting system according to an embodiment of the present invention, and FIG. 4 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 4 is an explanatory diagram of the structure of a substrate transport mechanism of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 5 is an embodiment of the present invention. 6 is a partial cross-sectional view of the electronic component mounting apparatus, FIG. 6 is an explanatory diagram of a mounting area, a standby area, and a sensor arrangement in the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 7 is an electronic component according to the embodiment of the present invention. FIG. 8 is a functional diagram of a sensor used in the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 9 is an electronic component according to the embodiment of the present invention. Block diagram showing the configuration of the control system of the mounted device, 10, FIG. 11 is an explanatory view of a placed state of the substrate in the electronic component mounting apparatus of one embodiment of the present invention.

  First, with reference to FIG. 1, a configuration of an electronic component mounting system having a function of manufacturing a mounting substrate by mounting electronic components on a substrate will be described. In FIG. 1, the electronic component mounting system MS has a plurality of electronic component mounting devices M2, M3, M4, and M5 connected in series on the downstream side of the board supply device M1, and a reflow device (not shown) connected further downstream. It has a configuration. The substrate supply device M1 has a function of storing a plurality of unmounted substrates and sequentially supplying these substrates one by one to a downstream device. The substrates supplied to the downstream electronic component mounting device M2 by the substrate supply device M1 are transported to the downstream side in the order of the electronic component mounting devices M2, M3, M4, and M5. As a result, an electronic component mounting operation for each substrate is executed.

Next, the structure of the electronic component mounting apparatuses M2 to M5 will be described with reference to FIGS. This electronic component mounting apparatus constitutes an electronic component mounting system that manufactures a mounting substrate by mounting the electronic component on a substrate, and has a function of taking out the electronic component from the component supply unit and mounting it on the substrate. 2 and 3, a substrate transport mechanism 2 is disposed on the base 1 in the X direction. The substrate transport mechanism 2 is provided with a substrate support 3, and a substrate 4 supplied from an upstream device and subjected to a mounting operation by the device is transported to the substrate support 3 by the substrate transport mechanism 2. The The transported substrate 4 is received and supported from the lower surface side by the substrate receiving portion 3, and in this state, the component mounting operation by the component mounting mechanism described below is performed, and the substrate 4 that has completed the component mounting operation is again The substrate is transported downstream by the substrate transport mechanism 2 and unloaded to the downstream apparatus.

  Component supply units 5 are provided on both sides of the substrate transport mechanism 2, and a plurality of tape feeders 6 are attached to the component supply unit 5. A Y-axis moving table 8 having a linear drive mechanism is disposed horizontally at one end of the base 1 in the X direction. The Y-axis moving table 8 is mainly composed of a beam member 8a provided in an elongated shape in the horizontal direction, and linear rails 9 are arranged in the horizontal direction on the beam member 8a. Two linear coupling brackets 11 are mounted on the linear rail 9 via a linear block 10 so as to be slidable in the Y direction. Similar to the Y-axis movement table 8, the two coupling brackets 11 are coupled to an X-axis movement table 12 having a linear drive mechanism, and each X-axis movement table 12 performs an electronic component mounting operation. A mounting head 13, which is a working head, is mounted so as to be movable in the X direction.

  The mounting head 13 is a multiple head including a plurality (eight in this case) of unit mounting heads 14. At the lower end of each unit mounting head 14, a suction nozzle 14 a that sucks and holds electronic components is provided. It is installed. The suction nozzle 14a is moved up and down individually by a nozzle lifting mechanism built in the unit mounting head 14. The Y-axis moving table 8 and the X-axis moving table 12 constitute a head moving mechanism, and by driving this head moving mechanism, the mounting head 13 moves in the X direction and the Y direction. The electronic component is taken out from the tape feeder 6 of the component supply unit 5 and transferred and mounted on the substrate 4 positioned by the substrate transport mechanism 2 and received by the substrate receiving unit 3.

  Therefore, the Y-axis moving table 8, the first X-axis moving table 12, and the mounting head 13 are mounted with components that transfer and mount the electronic components on the substrate 4 by moving the mounting head 13 holding the electronic components by the head moving mechanism. It is a mechanism (that is, a work operation mechanism for executing a work operation of the electronic component mounting apparatus as an electronic component mounting apparatus). A component recognition device 7 is disposed between the component supply unit 5 and the substrate transport mechanism 2, and when the mounting head 13 that has taken out an electronic component from the component supply unit 5 moves above the component recognition device 7. The component recognition apparatus 7 captures and recognizes the electronic component held by the mounting head 13.

  A substrate recognition camera 15 is mounted on the mounting head 13 and is located on the lower surface side of the X-axis moving table 12 and moves integrally (see FIG. 5). As the mounting head 13 moves, the substrate recognition camera 15 moves above the substrate 4 held by the substrate receiving portion 3 and images and recognizes the substrate 4. In the mounting operation of the electronic component on the substrate 4 by the mounting head 13, the mounting position correction is performed in consideration of the recognition result of the electronic component by the component recognition device 7 and the substrate recognition result by the substrate recognition camera 15.

Next, the structure of the substrate transport mechanism 2 will be described with reference to FIG. As shown in FIG. 4A, the substrate transport mechanism 2 has a configuration in which two fixed transport rails 20A and a movable transport rail 20B each having a horizontal conveyor mechanism are arranged in parallel to each other. ing. Two feed screws 22 pass through the fixed transport rail 20A and the movable transport rail 20B, and the nut member 21 into which the feed screw 22 is screwed is fixed to the movable transport rail 20B. One feed screw 22 is a drive shaft that is rotationally driven by a width adjusting motor 23, and the other feed screw 22 is rotationally driven via a belt 24 by this drive shaft. By driving the width adjusting motor 23, the nut member 21 screwed into the two feed screws 22 moves in the Y direction (direction orthogonal to the substrate transport direction) together with the movable transport rail 20B. Can be adjusted according to the width of the target substrate 4.

  The conveyor mechanism provided on these transport rails is divided into three in the substrate transport direction, and is driven by the first transport conveyor 25 and the conveyor drive motor 28 having the conveyor length L1 driven by the conveyor drive motor 26. The conveyor belt L is composed of three conveyor belt mechanisms including a conveyor 27 having a conveyor length L2 and a second conveyor 29 having a conveyor length L3 driven by a conveyor driving motor 30. As shown in FIG. 4B, the first transport conveyor 25, the mounting conveyor 27, and the second transport conveyor 29 are all arranged in accordance with the board transport level PL in the electronic component mounting system MS. . These conveyor mechanisms can be used by switching the transport direction between forward and reverse, and the substrate 4 transported from the left side (arrow a direction) in FIG. 4 is received by the mounting conveyor 27 via the first transport conveyor 25. The substrate 4 transferred and transferred from the right side (in the direction of arrow b) is transferred to the mounting conveyor 27 via the second transfer conveyor 29.

  In the above configuration, the mounting conveyor 27 conveys the substrate 4 from the upstream side to the downstream side in the substrate conveyance direction by the belt conveyor, so that the work position (mounting work position) of the electronic component by the work operation mechanism (component mounting mechanism) is achieved. ) Is a work conveyor (substrate conveyor). When the substrate transport direction is set in the direction of arrow a in FIG. 4, the first transport conveyor 25 is disposed adjacent to the upstream side of the mounting conveyor 27, which is a work conveyor, and is transported from the upstream side. As a carry-in conveyor for carrying Further, the second transfer conveyor 29 is disposed adjacent to the downstream side of the mounting conveyor 27 and functions as an unloading conveyor for unloading the substrate 4 from the mounting conveyor 27. When the substrate transport direction is switched and the substrate is transported from the direction of the arrow b in FIG. 4, the second transport conveyor 29 is a carry-in conveyor and the first transport conveyor 25 is a carry-out conveyor.

  Next, the structure of each conveyor mechanism will be described with reference to FIG. The first conveyor 25 adjusts the conveyor belt 25a horizontally to two pulleys 25b arranged at intervals corresponding to the conveyor length L1, and further conveys the conveyor belt 25a via the pulleys 25c and 25d to the conveyor drive motor 26. It is the structure which led to the drive pulley. In this configuration, by driving the conveyor drive motor 26 forward and backward, the conveyor belt 25a reciprocates at the substrate transfer level PL, whereby the substrate 4 placed on the conveyor belt 25a is transferred in the forward and reverse directions. In the above-described method of introducing the conveyor belt 25a, by additionally arranging the pulley 25d, the surface of the conveyor belt 25a on the conveying side of the substrate 4 and the contact driving surface of the conveyor belt 25a that contacts the driving pulley of the conveyor driving motor 26 are provided. A belt conveyor mechanism with less slippage is realized.

  The mounting conveyor 27 adjusts the conveyor belt 27a horizontally to two pulleys 27b arranged at intervals according to the conveyor length L2, and further conveys the conveyor belt 27a via pulleys 27c, 27d, 27e, and 27f. It is the structure which led to 28 drive pulleys. In this configuration, by driving the conveyor drive motor 28 forward and backward, the conveyor belt 27a reciprocates at the substrate transport level PL, whereby the substrate 4 placed on the conveyor belt 27a is transported in the forward and reverse directions. Similarly, in the above-described method of introducing the conveyor belt 27a, the surface on the conveyance side of the substrate 4 by the conveyor belt 27a and the contact driving surface of the conveyor belt 27a contacting the driving pulley of the conveyor driving motor 28 are made to coincide with each other by pulley arrangement. ing.

The second conveyor 29 adjusts the conveyor belt 29a horizontally to the two pulleys 29b arranged at intervals according to the conveyor length L3, and further connects the conveyor belt 29a to the pulley 29.
It has the structure which led to the drive pulley of the conveyor drive motor 30 via c and 29d. In this configuration, by driving the conveyor drive motor 30 forward and backward, the conveyor belt 29a reciprocates at the transport level, whereby the substrate 4 placed on the conveyor belt 29a is transported in the forward and reverse directions. Similarly, in the above-described method for introducing the conveyor belt 29a, the surface of the conveyor belt 29a on the conveying side of the substrate 4 and the contact driving surface of the conveyor belt 29a contacting the driving pulley of the conveyor driving motor 30 are made to coincide with each other by pulley arrangement. ing.

  Next, the board receiving part 3 disposed below the mounting conveyor 27 will be described. The board receiving part 3 has a function of supporting the board 4 from below during the component mounting operation. In the present embodiment, a plurality (here, two) that can be individually operated so that a plurality of (here, two) boards can be individually positioned on the mounting conveyor 27 and can be subjected to component mounting operations. ) Corresponding to the arrangement of the first divided mounting area [MA1] and the second divided mounting area [MA2] shown in FIG. 6, that is, by the component mounting mechanism. It is provided corresponding to the mounting work position.

  The first lower receiving portion 3A and the second lower receiving portion 3B have the same structure, and both are configured to move up and down the lower receiving block 32 in which the lower receiving pins 33 are implanted by an elevating mechanism 34 driven by an elevating drive motor 31. It has become. By driving the raising / lowering drive motor 31, the lower receiving pin 33, which is a lower receiving member, moves up and down together with the lower receiving block 32 by the lifting mechanism 34. As a result, the lower receiving pins 33 come into contact with the lower surface of the board 4 carried into the mounting work position, and the board 4 is lifted from the conveyor belt 27a to the work height position by the mounting head 13 of the component mounting mechanism, that is, the component mounting level ML. Hold.

  Details of the method of receiving the substrate 4 by the substrate receiving portion 3 in the substrate transport mechanism 2 will be described with reference to FIG. The fixed conveyance rail 20A and the movable conveyance rail 20B both have the belt receiving part 20a for running the conveyor belt 27a at the board conveyance level PL and the upper surface of the board 4 lifted by the board lower receiving part 3 at the component mounting level. A substrate pressing member 20b for holding the ML is provided. In addition, a sandwiching member 35 that is in contact with the lower surface of the substrate 4 and sandwiches the substrate 4 with the substrate pressing member 20b is biased upward by the spring member 36 at the side end of the lower receiving block 32. Is provided.

  When the substrate 4 conveyed by the mounting conveyor 27 has reached the component mounting work position, the support block 32 is raised, so that the sandwiching member 35 first comes into contact with the lower surface of the substrate 4 and the substrate 4 is moved by the conveyor belt 27a. Lift from transport level. By further raising the lower receiving block 32, the upper surface of the substrate 4 is pressed against the lower surface of the substrate pressing member 20b and clamped by the sandwiching member 35 and the substrate pressing member 20b. The top part contacts the lower surface of the substrate 4 to support the entire substrate 4 from below. In this way, the electronic component P sucked and held by the suction nozzle 14a of each unit mounting head 14 is mounted on the substrate 4 whose both ends are clamped and whose lower surface is received by the lower receiving pins 33. .

In addition, the conveyor drive motor 28 that drives the mounting conveyor 27 in the above-described substrate transport mechanism 2 avoids the position directly below the mounting conveyor 27 in order to prevent interference with the substrate receiving portion 3, and moves in the Y axis that constitutes the component mounting mechanism. It is arranged below the table 8. By adopting such an arrangement, it is possible to secure a space for arranging the substrate receiving portion 3 including the first lower receiving portion 3A and the second lower receiving portion 3B below the mounting conveyor 27. ing. That is, in the electronic component mounting apparatus shown in the present embodiment, a head moving mechanism is configured above the second transport conveyor 29 that is a carry-out conveyor, and the mounting head 13 is directed in a direction perpendicular to the substrate transport direction (X direction) ( A Y-axis movement table 8 that moves in the Y direction) is disposed, and a conveyor drive motor 28 that drives the mounting conveyor 27 is disposed below the Y-axis movement table 8.

  Next, with reference to FIG. 6, the area division in the substrate transport mechanism 2 and the types and arrangement of sensors used for positioning and transport control of the substrate 4 in each of these areas will be described. In FIG. 6, the range corresponding to the mounting conveyor 27 is a mounting area [MA] in which a board on which electronic components are to be mounted is positioned and held, and the mounting area [MA] is a small-sized board. Are divided (in this case, divided into two) into a first divided mounting area [MA1] and a second divided mounting area [MA2]. That is, in the present embodiment, a first component mounting work position (first work position) at which a component mounting operation as an electronic component mounting operation by the work operation mechanism is performed on the mounting conveyor 27 as a substrate transfer conveyor. In addition, a first component mounting work position (second work position) located downstream of the first work position is set.

  Next, with reference to FIG. 7, the kind of board | substrate used as the work object of the electronic component mounting system MS is demonstrated. In the present embodiment, a plurality of types of substrates whose basic planar shape is rectangular and whose dimensions and detailed shapes are different are set as work targets by the same apparatus. The plurality of types of substrates include a large substrate having a length dimension A, such as a substrate 4A shown in FIG. 7A, and a length dimension B, such as a substrate 4B shown in FIG. 7B, and the end E1 on the positioning reference side (the right side in the figure) has a cutout C that is partially cut out, as shown in FIG. The deformed substrate 4C in which the range where E1 remains forms the protrusion F is also a work target.

  When such a deformed substrate 4C is used as an object, the end E1 cannot be used as a positioning reference, and a notch end E2 corresponding to the rear edge of the notch C is used instead as a positioning reference. In this case, the position reference of the mounting data used for the mounting work on the odd-shaped substrate 4C is shifted with the change of the positioning reference. For this reason, the dimension between the end E1 and the notch end E2, that is, the positioning reference when the deformed substrate 4C actually stops in positioning the deformed substrate 4C (the end to be detected by the substrate positioning sensor S2). It is necessary to cause the component mounting mechanism to perform the component mounting operation after performing the data correction that takes into account the movement of the mounting data based on the position reference by the offset distance D indicating the difference from the detection part used as the component). In order to enable this data correction, in the electronic component mounting apparatus shown in the present embodiment, the offset distance D is stored in advance for each substrate.

  In the case of targeting a large substrate 4A on which only one can be placed in the mounting area [MA] of the mounting conveyor 27, only one substrate 4A shown in FIG. 7A is positioned in the mounting area [MA]. The first lower receiving portion 3A and the second lower receiving portion 3B are supported by the lower receiving portion. On the other hand, when a small substrate 4B on which a plurality (two in this case) can be placed in the mounting area [MA] is targeted, the substrate 4B shown in FIG. [MA1] and the second divided mounting area [MA2] are individually positioned at the respective component mounting positions and individually supported by the first and second receiving portions 3A and 3B. When the deformed substrate 4C shown in FIG. 7C is targeted, an irregular substrate mounting / positioning method is adopted as will be described later.

  The upstream side (left side in FIG. 6) and the downstream side (right side in FIG. 6) of the mounting area [MA] correspond to the first transport conveyor 25 and the second transport conveyor 29, respectively. ], The second standby area [SA2] is set. The first standby area [SA1] is a standby area where the board 4 loaded into the mounting area [MA] stands by until the loading timing, and the second standby area [SA2] is the board 4 unloaded from the mounting area [MA]. It has a function as a standby area that stands by until conveyance to the downstream side is permitted. When the substrate transport direction is reversed, the functions of the first standby area [SA1] and the second standby area [SA2] are switched.

  A pair of substrate detection sensors S1 are opposed to each other at positions corresponding to both ends of the first standby area [SA1] and the second standby area [SA2] on the upper surface of the fixed transfer rail 20A and the movable transfer rail 20B. Arranged. A pair of substrate positioning sensors S2 are arranged opposite to each other at positions corresponding to both ends of the first divided mounting area [MA1] and the second divided mounting area [MA2]. Furthermore, a pair of substrate detection sensors S1 are arranged opposite to each other at positions corresponding to the central portions of the first divided mounting area [MA1] and the second divided mounting area [MA2].

  Functions of the substrate detection sensor S1 and the substrate position determination sensor S2 will be described with reference to FIG. The substrate detection sensor S1 is a transmissive optical sensor in which the light projecting unit S1a and the light receiving unit S1b are combined. As shown in FIG. 8A, the optical axis X is shielded by the substrate 4 to be detected. Whether or not the substrate 4 is present at the position of the optical axis X is detected by the substrate detector 42 (FIG. 9). On the other hand, the substrate positioning sensor S2 shown in FIG. 8B has the substrate 4 in the optical band W projected from the light projecting unit S2a to the light receiving unit S2b with a predetermined width b (several millimeters). Therefore, it has a function of detecting which range is shielded from light. That is, when the substrate position detection unit 43 (FIG. 9) receives a signal from the light receiving unit S1b, the position of the tip of the substrate 4 is appropriately set to the reference position of the optical band W (such as the end or center position of the optical band W). Measured value Δx associated with (settable) is detected.

  The substrate detection sensor S1 in the first standby area [SA1] and the second standby area [SA2] is used for detecting the timing of deceleration or stop of the substrate 4 conveyed from the upstream side. The board positioning sensor S2 in the first divided mounting area [MA1] and the second divided mounting area [MA2] positions the board 4 delivered from the first conveyor 25 at the mounting work position by the component mounting mechanism. It is used for position detection.

  That is, in the first divided mounting area [MA1] and the second divided mounting area [MA2], positions corresponding to the front edge or the rear edge of the board 4 in a state where the board 4 is placed at a position for component mounting work. In the state where the substrate positioning sensor S2 is disposed on the substrate 4 and the substrate 4 transported from the upstream side is stopped, the substrate positioning sensor S2 detects the end of the front edge or the rear edge of the substrate 4 by the substrate positioning sensor S2. The position is detected by the substrate position detection unit 43, and the detection result is sent to the control unit 40. At this time, if the actual stop position is within a preset allowable positioning error range, the board 4 is correctly positioned, and the component mounting operation is performed on the board 4 in the positioned state. That is, the mounting head 13 is moved above the substrate 4 together with the substrate recognition camera 15, the substrate recognition camera 15 images the substrate 4, performs substrate recognition, and then the electronic component is transferred to the substrate 4 by the mounting head 13. Mount.

  The configuration of the control system will be described with reference to FIG. The control unit 40 is a CPU, and controls execution of operations and processes of each unit described below. The storage unit 41 stores programs for operations and processes executed by the control unit 40, and also position data (in this case, the mounting position of the electronic component in the mounting operation) indicating the work target position on the board in the electronic component mounting operation. Mounting data 41a) and offset distance data 41b indicating the offset distance D shown in FIG. 7C are stored for each substrate.

  The board detection unit 42 detects the presence or absence of a board at the sensor position based on the detection signal of the board detection sensor S1 (see FIG. 8A). The substrate position detection unit 43 detects the position of the end portion of the substrate at the sensor position based on the detection signal of the substrate position detection sensor S2 (see FIG. 8B). The mechanism drive unit 44 is controlled by the control unit 40 and drives operations such as drive motors of each unit constituting the component mounting mechanism 45 and the board carrying conveyor constituting the board carrying mechanism 2.

  When it is detected by the substrate positioning sensor S2 that the actual stop position of the substrate 4 is displaced beyond the positioning error range, the control unit 40 moves the conveyor belt 27a by the detected displacement amount. The conveyor drive motor 28 is controlled so as to move, and the stop position of the substrate 4 is corrected. In the above configuration, the conveyor drive motor 28 driven by the board position detecting unit 43 and the mechanism driving unit 44 for detecting the position of the board 4 based on the detection signal of the board positioning sensor S2 mounts the board 4 by the component mounting mechanism. A substrate positioning means for positioning at the work position is configured. Although the example in which the position detection method by the substrate positioning sensor S2 is used as the substrate positioning means is shown here, a mechanical stopper is provided on the mounting conveyor 27 so that the end of the substrate 4 on the positioning reference side is disposed. You may employ | adopt the system which positions this board | substrate mechanically by making it contact | abut to a stopper.

  In the above configuration, the storage unit 41 stores the offset distance D from the position used as the positioning reference when the substrate is actually stopped in positioning of the deformed substrate 4C by the substrate positioning means to the end serving as the positioning reference. It is an offset distance storage unit. The control unit 40 constitutes a control unit that controls the operation of the conveyor drive motor 28 based on the position detection results of the substrate position determination sensor S2 and the substrate position detection unit 43.

  As shown in FIG. 4, the mounting conveyor 27 includes a first lower receiving portion 3A and a second lower receiving portion corresponding to the first divided mounting area [MA1] and the second divided mounting area [MA2] shown in FIG. Since 3B is provided separately and the above-described substrate positioning means is provided individually, different work operations are performed in the two areas of the first divided mounting area [MA1] and the second divided mounting area [MA2]. Can be executed concurrently. That is, while the component mounting operation is being performed on the board 4B previously carried into the second divided mounting area [MA2], the board 4B is lifted from the conveyor belt 27a by the first receiving part 3A. Therefore, the mounting conveyor 27 can operate independently of the substrate 4B in the second divided mounting area [MA2]. Therefore, it is possible to drive the mounting conveyor 27 and simultaneously perform board loading / positioning operations for the subsequent board 4 in the first divided mounting area [MA1].

  Next, with reference to FIGS. 10 and 11, a method for positioning the above-described substrates 4A, 4B, and 4C will be described. FIG. 10A shows a case where the large substrate 4A is targeted. In this case, the substrate 4A is detected by detecting the front edge or the rear edge of the substrate 4A placed on the entire mounting area [MA] by the substrate positioning sensors S2 located at both ends of the mounting area [MA]. Positioning is performed. FIG. 10B shows a case where a small substrate 4B is targeted. In this case, in the first divided mounting area [MA1] and the second divided mounting area [MA2], the positions of the two boards 4B are individually detected by the board positioning sensor S2 provided in each, The two substrates 4B are positioned individually.

  FIG. 11 shows an example of the substrate positioning operation when the deformed substrate 4C is targeted. In this case, a command indicating that the board is the odd-shaped board 4C is input in advance to the control device by the machine operator. First, the odd-shaped substrate 4C is positioned in the first divided mounting area [MA1] using the notch end portion E2 as a positioning reference. At this time, the protruding portion F of the odd-shaped substrate 4C protrudes to the downstream side and is located within the component mounting target range within the second divided mounting area [MA2], but the rear edge G of the odd-shaped substrate 4C is the first divided portion. It protrudes upstream from the mounting area [MA1] and is outside the component mounting target range. In this state, the component mounting operation by the component mounting mechanism is executed for the odd-shaped substrate 4C in the first divided mounting area [MA1] and the second divided mounting area [MA2].

Next, a component mounting operation for the rear edge G of the odd-shaped substrate 4C is performed. That is, FIG.
As shown in FIG. 11B, the deformed substrate 4C is moved downstream as shown in FIG. 11B, and the position of the end portion on the rear edge side of the deformed substrate 4C is detected by the substrate positioning sensor S2. Then, the odd-shaped substrate 4C is positioned so that the rear edge portion G is included in the first divided mounting area [MA1]. In this state, by performing the component mounting operation for the rear edge G, the component mounting operation for the entire range of one deformed substrate 4C is completed.

  The substrate positioning operation is performed by the control unit 40 controlling the substrate transport mechanism 2 and the above-described substrate positioning means in response to an instruction input from a machine operator. That is, when a modified substrate 4C having a notch at the positioning reference side end in positioning is a target for mounting an electronic component as a mounting target substrate, the modified substrate 4C is the first working position. The substrate transfer conveyor of the substrate transfer mechanism 2 and the above-described substrate positioning means are controlled so as to position in the one-divided mounting area [MA1]. When the control unit 40 controls the component mounting mechanism 45, the offset distance data 41b is read from the storage unit 41, and the offset distance D shown here is added to the mounting data 41a to accompany the movement of the positioning reference position. The component mounting operation is executed after correcting the position gap.

  As described above, in the present invention, the first work position where the electronic component mounting work by the work operation mechanism is performed on the board transport conveyor for transporting the board 4 from the upstream side to the downstream side, and the first work position. Mounting a second work position located downstream of the board, and board positioning means for positioning the board 4 at the first work position or the second work position with the downstream end as a positioning reference. In the apparatus, when the irregular substrate 4C having a notch at the end on the positioning reference side is the target of the electronic component mounting operation, the irregular substrate 4C is positioned at the first work position and the electronic component mounting operation is performed. To do. Thereby, the deformed substrate 4C can be the target of the mounting work with almost no need to adjust the position of the stopper or the sensor.

  In the example shown in the present embodiment, an electronic component mounting apparatus provided with a component mounting mechanism as a work operation mechanism is shown as an example of an electronic component mounting apparatus. However, the present invention is limited to the electronic component mounting apparatus. Instead, the present invention is applicable to any apparatus that constitutes an electronic component mounting system and that performs a predetermined electronic component mounting operation on a substrate transported by a substrate transport mechanism. . For example, a coating apparatus having a coating mechanism that applies a paste for bonding electronic components to a substrate as a work operation mechanism, or an inspection mechanism that optically inspects a solder printing state or a component mounting state by imaging the substrate as a work operation mechanism. The present invention can also be applied to an inspection apparatus or the like having

  The electronic component mounting apparatus and the electronic component mounting work execution method of the present invention can adjust the positions of stoppers and sensors even when a deformed substrate having a notch or a protrusion at the front end on the substrate positioning reference side is targeted. It is useful in the field of manufacturing a mounting board by mounting electronic components on a board.

Structure explanatory drawing of the electronic component mounting system of one embodiment of this invention The perspective view of the electronic component mounting apparatus which comprises the electronic component mounting system of one embodiment of this invention The top view of the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the board | substrate conveyance mechanism of the electronic component mounting apparatus of one embodiment of this invention The fragmentary sectional view of the electronic component mounting apparatus of one embodiment of the present invention Explanatory drawing of the mounting area, standby area, and sensor arrangement | positioning in the electronic component mounting apparatus of one embodiment of this invention The top view of the board | substrate used as the work object in the electronic component mounting system of one embodiment of this invention Functional explanatory drawing of the sensor used for the electronic component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the mounting state of the board | substrate in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the mounting state of the board | substrate in the electronic component mounting apparatus of one embodiment of this invention

Explanation of symbols

MS electronic component mounting system 2 substrate transport mechanism 4, 4A, 4B substrate 4C irregular substrate 5 component supply unit 25 first transport conveyor 27 mounting conveyor (substrate transport conveyor)
28 Conveyor Drive Motor 29 Second Conveyor S1 Substrate Detection Sensor S2 Substrate Positioning Sensor M1 Substrate Supply Device M2 to M5 Electronic Component Mounting Device [MA] Mounting Area [MA1] First Divided Mounting Area [MA2] Second Split mounting area

Claims (4)

An electronic component mounting apparatus that configures an electronic component mounting system that mounts an electronic component on a substrate and manufactures a mounting substrate, and performs a predetermined electronic component mounting operation on the substrate,
A work operation mechanism for performing the electronic component mounting work by moving a work head for performing the electronic component mounting work by a head moving mechanism, and the substrate from the upstream side to the downstream side in the substrate transport direction. A board transport conveyor for transporting, a first work position set on the board transport conveyor and performing an electronic component mounting work by the work motion mechanism, and a second work position located downstream of the first work position; Substrate positioning means for positioning the substrate at the first working position or the second working position with the downstream end of the substrate conveying conveyor as a positioning reference;
In the case where a deformed substrate having a notch at the positioning reference side end in the positioning is a target for electronic component mounting work, the substrate transfer conveyor and the substrate transporting conveyor are positioned so as to position the deformed substrate at the first work position. An electronic component mounting apparatus comprising: control means for controlling the board positioning means.   In the positioning of the deformed substrate by the substrate positioning means, an offset distance storage unit is provided for storing an offset distance from the position used as a positioning reference when the substrate is actually stopped to the end, and the control means 2. The electronic component mounting apparatus according to claim 1, wherein the work operation mechanism is controlled by adding the offset distance to position data indicating a work target position on the substrate in the electronic component mounting operation. A work operation mechanism for performing the electronic component mounting work by moving a work head for performing an electronic component mounting work for the board by a head moving mechanism, and an upstream side of the board in the board transport direction. A substrate conveyer that conveys from the substrate to the downstream side, a first work position that is set on the substrate conveyer and where the electronic component mounting work is performed by the work operation mechanism, and a second that is located downstream of the first work position An electronic component mounting apparatus comprising: a work position; and a board positioning means for positioning the board at a first work position or a second work position with the downstream end of the board conveyor as a positioning reference. An electronic component mounting work execution method for executing a predetermined electronic component mounting operation on the substrate,
In the case where a deformed substrate having a notch at the positioning reference side end in the positioning is a target for electronic component mounting work, the substrate transfer conveyor and the substrate transporting conveyor are positioned so as to position the deformed substrate at the first work position. An electronic component mounting work execution method characterized by controlling the board positioning means.   In the positioning of the irregular substrate by the substrate positioning means, the offset distance from the position used as a positioning reference when the substrate is actually stopped to the end is stored in advance, and the electronic component mounting work 4. The electronic component mounting work execution method according to claim 3, wherein the work movement mechanism is controlled by adding the offset distance to unique position data indicating a work target position on the board.

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