JP2008010554A - Substrate processing device and component mounting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate waste in production by rationally advancing production of multi-piece substrates. <P>SOLUTION: A component mounting system incudes a dispenser 2, first-third mounting devices 3-5, a reflow furnace 6, and an inspection device 7 so as to apply prescribed processing to the multi-piece substrates, respectively including a plurality of blocks with each device 2-7 while successively transferring them. The dispenser 2 (a controller 2A) counts the number of the blocks included in the substrate so as to carry out the substrate as the final substrate to the first mounting device 3, after applying coating processing to the substrate for blocks corresponding to the planned number of the blocks to be produced when a total count value reaches the planned number of the blocks to be produced, and also, to transmit final-substrate information to the first mounting device 3 (a controller 3A) so that mounting processing is applied to the final substrate for the blocks corresponding to the planned number of the blocks to be produced. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a component mounting system composed of a plurality of processing devices including a processing device for a substrate such as a component mounting device and a coating liquid coating device, or a mounting device, and the like, which is suitable for producing a so-called multi-sided substrate. It is.

  2. Description of the Related Art Conventionally, there has been known a component mounting system in which a plurality of mounting apparatuses and a coating apparatus such as solder are incorporated in a line, and a board (PCB) is produced by processing each apparatus while sequentially transporting the board (PWB). Yes.

Production of a board of this type of component mounting system is normally advanced on a board-by-board basis, and the system is controlled so that the production is terminated when a pre-programmed number of productions is reached (for example, Patent Document 1). ).
JP 2003-69296 A

  In recent years, in order to efficiently produce a small substrate, cases of producing a substrate in the form of a so-called multi-sided substrate are increasing. That is, a plurality of blocks having the same circuit are included in one board, and after this board is produced, it is finally divided into blocks for use.

  However, in the conventional component mounting system, even when such a multi-sided board is produced, there is a problem in that production is proceeding in units of boards in the same manner as a normal board (single-piece board). . In other words, in the production of a multi-sided board including 4 blocks, even if the number of blocks actually required is “13”, the production proceeds in units of boards, resulting in the production of 4 boards (16 blocks). Three extra blocks are produced.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to eliminate the waste of production by rationally promoting the production of so-called multi-sided substrates.

  In order to solve the above-described problems, the present invention provides a processing apparatus for performing a predetermined process on a multi-sided substrate including a plurality of blocks in which the same circuit is formed, and sequentially determines the number of blocks included in the substrate to be processed. Counting means for counting, and when the count value by the counting means reaches a preset production planned number of blocks, operation control is performed so that the processing is performed for the block corresponding to the number of blocks and the processing of the substrate is finished. Control means to perform.

  According to this apparatus, when the count value by the counting means reaches the preset production planned block number, the substrate is processed by the amount corresponding to the production planned block number, and unprocessed blocks remain. Even in such a case, the processing operation is terminated without performing processing for the block. For this reason, excess blocks are not produced exceeding the number of blocks to be produced.

  In addition, when a block with a serious defect such as a circuit defect is present on a multi-sided substrate, a predetermined mark (a mark for specifying the necessity of processing) is usually used to prohibit the production of the block. Attached. Therefore, the apparatus further includes a recognition unit that is capable of recognizing a mark that is attached to a multi-sided substrate and that specifies the necessity of the processing in each block, and the counting unit includes the recognition unit. Based on the recognition result by the means, it is preferable to count the number of blocks excluding blocks that do not require processing from among the blocks of the substrate to be processed.

  According to this apparatus, blocks that do not need to be processed can be excluded in advance from the counting target, and the number of blocks can be accurately counted in relation to the number of blocks scheduled for production.

  On the other hand, a component mounting system according to the present invention includes a plurality of processing devices including at least a mounting device for mounting components on a substrate, and sequentially conveys a multi-sided substrate including a plurality of blocks on which the same circuit is formed. In a component mounting system that performs predetermined processing by each processing device, a counting unit that counts the number of the blocks included in a substrate carried into a device located at the most upstream among the processing devices, and a count value by the counting unit When the number of production planned blocks set in advance is reached, a control means for controlling the mounting apparatus so as to finish the processing by mounting components for the number of blocks corresponding to the number of production planned blocks for the board, and It is equipped with.

  According to this system, when the count value by the counting means reaches the number of blocks scheduled for production, the board is subjected to component mounting processing corresponding to the number of blocks scheduled for production, and unprocessed blocks remain. However, the block is carried out downstream without processing. For this reason, the production of the board can be advanced without mounting the parts on the extra blocks exceeding the number of blocks to be produced.

  In the case where the processing device further includes a coating device capable of individually applying a coating solution such as solder to the mounted portion of the substrate, the control means is configured such that the count value by the counting means is the production scheduled block. When the number reaches the number, the coating process is performed on the substrate for the number of blocks corresponding to the number of blocks to be produced, and the coating apparatus is controlled so as to end the processing of the substrate.

  According to this system, even in the coating process, the above-described substrate is subjected to the coating process corresponding to the number of blocks scheduled to be produced, and even if an unprocessed block remains, the block is processed. It is carried out downstream. That is, in this system, when there are blocks exceeding the number of blocks to be produced, neither the coating liquid nor the component mounting is performed on the blocks.

  In each of the above systems, the processing apparatus located at the uppermost stream is provided with a recognition unit that can recognize a mark attached to the substrate and for specifying whether or not each block needs to be processed. Preferably, the counting means counts the number of blocks excluding blocks that do not require processing among the blocks of the substrate to be processed based on the recognition result by the recognition means.

  According to this system, blocks that do not need to be processed can be excluded in advance from the counting target, and the number of blocks can be accurately counted in relation to the number of blocks scheduled for production.

  Note that when the line is dropped due to damage or processing failure in the middle of the system, the actual number of produced blocks is reduced with respect to the count value by the counting means, and the reliability of the count value by the counting means is impaired. For this reason, it is preferable that the counting means corrects the count value based on information relating to a production-completed substrate.

  According to this system, when the substrate drops, etc., the number of blocks can be counted more accurately by correcting the count value so that extra blocks are produced accordingly. It becomes.

  In this case, specifically, the processing device further includes an inspection device for inspecting the quality of the processing of each block of the substrate, and the counting means produces the number of defective blocks detected by the inspection device. As the information regarding the finished substrate, it is conceivable that the count value is corrected based on this information.

  According to the processing apparatus and the component mounting system of the present invention, with respect to the production of so-called multi-sided boards, the blocks are not produced beyond the number of blocks scheduled to be produced, so that the production of multi-sided boards can be rationalized without waste. You will be able to proceed.

  Embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 schematically shows a component mounting system according to the present invention. In this system, a loader 1, a dispenser (coating device) 2, a first mounting device 3, a second mounting device 4, a third mounting device 5, a reflow furnace 6, an inspection device 7 and an unloader 8 are connected in series from the upstream side. It has been configured. Then, while transporting a printed circuit board (hereinafter simply referred to as a substrate) fed out from the loader 1, various coating liquid coating processes, component mounting processes, coating liquid curing processes, and product inspections are sequentially performed on the unloader 8. It is configured to pay out.

  Each of the devices 1 to 8 is an autonomous device provided with its own control device 1A to 8A, and each of the devices 1 to 8 is individually driven and controlled by its own control device 1A to 8A. Yes. The dispenser 2, the mounting devices 3 to 5, and the inspection device 7 are connected to a LAN 9, and are connected to each other via the LAN 9 so that they can communicate with each other and to a host computer S that manages the system in an integrated manner. Are connected to communicate. The host computer S stores data related to the production plan such as the type of substrate and the number of productions, and the dispenser 2 and the like proceed with each process with reference to this data.

  2 and 3 schematically show the configuration of the dispenser 2, FIG. 2 is a plan view, and FIG. 3 is a front view showing the dispenser 2.

  As shown in these drawings, a conveyor 12 is arranged on the base 11 of the dispenser 2, and the substrate P is transported on the conveyor 12 and stopped and positioned at a predetermined work position. Yes. In addition, the conveyance direction of the board | substrate P by the conveyor 12 is the same as the conveyance direction (arrangement direction of each apparatus 1-8) of the board | substrate P in the said system, and the conveyance direction of this board | substrate P is X-axis direction in the following description. In the description, the direction orthogonal to the X axis on the horizontal plane is defined as the Y axis direction, and the direction orthogonal to the X axis and the Y axis is defined as the Z axis direction.

  Above the conveyor 12, a head unit 14 for applying various coating liquids such as solder paste and adhesive onto the substrate P is provided, and the head unit 14 is in the X axis direction and the Y axis direction within a certain area. Each can be moved.

  That is, a pair of fixed rails 15 extending in the Y-axis direction and a ball screw shaft 16 that is driven to rotate by a Y-axis servomotor 17 are disposed on the base 11, and a head support is provided on the fixed rail 15. A member 18 is disposed, and a nut portion 19 provided on the support member 18 is screwed onto the ball screw shaft 16. The support member 18 is provided with a guide member 20 extending in the X-axis direction and a ball screw shaft 21 driven by an X-axis servo motor 22 so that the head unit 14 can move to the guide member 20. The nut portion 23 that is held and provided in the head unit 14 is screwed into the ball screw shaft 21. Then, the ball screw shaft 16 is rotated by the operation of the Y-axis servo motor 17 and the support member 18 is moved in the Y-axis direction, while the ball screw shaft 21 is rotated by the operation of the X-axis servo motor 22 and the head The unit 14 moves in the X-axis direction with respect to the support member 18.

  The head unit 14 is equipped with two dispense heads 25A and 25B (hereinafter abbreviated as heads 25A and 25B) for applying the coating liquid onto the substrate P, and a substrate recognition camera 28.

  The heads 25A and 25B are mounted on the head unit 14 in a state where they are aligned in the X-axis direction. The head unit 14 can be moved in the Z direction (vertical direction) and rotated around the R axis (vertical axis) with respect to the frame of the head unit 14 and driven by the Z axis servo motor 26 and the R axis servo motor 27, respectively. It has become.

  Each of the heads 25A and 25B includes a syringe 34 containing a coating liquid and a nozzle 30 for applying the coating liquid stored in the syringe 34, and the syringe 34 is supplied by an air pressure supply unit (not shown). By supplying the air pressure therein, an amount of coating liquid corresponding to the air pressure is applied onto the substrate P while being pushed out to the tip of the nozzle 30.

  The substrate recognition camera 28 is composed of, for example, a CCD area camera, and is directed downward with respect to the head unit 14 so that a postscript fiducial mark M1 and a butt mark M3 attached to the substrate P can be imaged, that is, the imaging direction is downward. It is fixed with.

  In the dispenser 2, first, the substrate P conveyed from the loader 1 is positioned and fixed at the work position, and then the head unit 14 moves and the substrate recognition camera 28 images the mark M 1 and the like on the substrate P. . Thereby, recognition processing necessary for work such as the position of the substrate P is performed. Thereafter, as the head unit 14 moves, the coating liquid is applied to the substrate P by applying a predetermined amount of the coating liquid while the heads 25 </ b> A and 25 </ b> B are sequentially disposed on the portion to be coated of the substrate P.

  4 and 5 schematically show the first mounting device 3, FIG. 2 is a perspective view, and FIG. 3 is a front view showing the first mounting device 3, respectively.

  As shown in these drawings, a conveyor 32 capable of transporting the substrate P in the X-axis direction is disposed on the base 31 of the first mounting apparatus 3, and the substrate P is transported on the conveyor 32 to a predetermined level. It stops and is positioned at the work position.

  On both sides of the conveyor 32, component supply units 34 and 35 for supplying components for mounting are provided. Among these component supply units 34 and 35, the component supply unit 34 located on the front side of the apparatus has a plurality of rows of tape feeders 34a arranged in the X-axis direction. Each tape feeder 34a is loaded with a tape that holds and holds small chip components such as ICs, transistors, capacitors, etc. wound around a reel, and the tape is fed from the reel to the component take-out portion at the tip of the feeder. The components are picked up by a head unit 36, which will be described later.

  On the other hand, a tray feeder 35a is disposed in the component supply unit 35 located on the rear side of the apparatus. In the tray feeder 35a, a plurality of trays T in which large-sized components such as QFP and BGA or large-sized components such as mounting connectors are stored in a matrix are stored in a plurality of upper and lower stages, and necessary components are placed on the tray feeder 35a. The components are picked up by the head unit 36 in a state where the tray T is pulled out to the conveyor 32 side.

  Above the base 31, a head unit 36 for mounting components is further provided.

  The head unit 36 is movable in the X-axis direction and the Y-axis direction within a certain region so that the components can be sucked from the component supply units 34 and 35 and mounted on the substrate P.

  A mechanism for moving the head unit 36 is substantially the same as that of the dispenser 2. In other words, the head support member 41 is movably disposed on the rail 37 in the Y-axis direction, and the head unit 36 is mounted on the support member 41 and supported movably along the guide member 44 in the X-axis direction. . Then, a support member 41 is screwed and attached to a ball screw shaft (not shown) driven by the Y-axis servomotor 39, whereby the support member 41 is moved in the Y-axis direction, while the X-axis servomotor 45 is moved. The head unit 36 is mounted on the ball screw shaft 43 driven by the movement of the head unit 36 so that the head unit 36 is moved in the X-axis direction.

  The head unit 36 is mounted with a plurality of mounting heads 50 for picking up components and mounting them on the substrate P. In this embodiment, six heads 50 are arranged in a row in the X-axis direction. It is mounted in a state arranged in.

  These heads 50 are connected to a lifting mechanism and a rotating mechanism (not shown) so as to be driven in the vertical direction (Z-axis direction) and around its own axis (R-axis direction) with respect to the head unit 36, respectively. It has become. Then, a component suction nozzle 51 is attached to the tip of each head 50, and suction of the component is performed by supplying negative pressure to the nozzle 51 from a negative pressure supply unit (not shown). ing.

  The head unit 36 is further provided with a substrate recognition camera 56 for imaging a fiducial mark M1, a bat mark M3, and the like attached on the substrate P. The camera 56 is composed of a CCD area sensor, similar to that of the dispenser 2, and is attached to the head unit 36 so as to face downward so that the mark M1 and the like can be imaged.

  On the other hand, a component recognition camera 47 is provided on the base 31 for recognizing components sucked by the heads 50 of the head unit 36. The component recognition camera 47 is composed of a CCD linear sensor, and is provided at a position on the side of the conveyor 2 of the component supply units 34 and 35 with the imaging direction facing upward. Thus, after the component suction, when the head unit 36 passes the component recognition camera 47 in a predetermined direction, the suction component by each head 51 is imaged by the component recognition camera 47.

  In such a first mounting device 3, first, after the substrate P conveyed from the dispenser 2 is positioned and fixed at the above-described working position, the head unit 36 moves and the mark M 1 on the substrate P is moved by the component recognition camera 47. Thus, recognition processing necessary for work such as the position of the substrate P is performed. Thereafter, the components are mounted while the head unit 36 reciprocates between the component supply units 34 and 35 and the substrate P. Specifically, the head unit 36 moves above the component supply units 34 and 35, and the components are sucked from the tape feeder 4a or the tray feeder 5a by each head 50 (nozzle 51). Then, after the head unit 36 passes above the component recognition camera 47 and the image recognition such as the positional deviation of the suction component by each head 50 is performed, each head 50 is sequentially covered with the movement of the head unit 36. The components are mounted while being arranged on the mounting portion. Thus, the component mounting process on the substrate P is advanced while the head unit 36 moves between the component supply units 34 and 35 and the substrate P.

  The above is the configuration of the first mounting device 3, but the other mounting devices 4 and 5 basically have the same configuration.

  Although not shown in detail, the reflow furnace 6 has, for example, a board transfer conveyor, a hot air fan, and the like, and heats the substrate P after component mounting to cure the coating liquid. The component is configured to be fixed on the substrate P. Further, the inspection device 7 has a head unit on which a substrate recognition camera composed of a CCD area sensor is mounted, and this head unit is relative to the substrate P by a mechanism substantially similar to the dispenser 2 and the first mounting device 3. The component mounting portion is imaged while being moved, and a predetermined item such as a component mounting position shift is inspected from the imaging result.

  FIG. 7A shows a so-called multi-sided board P, which is a kind of board P produced by the component mounting system.

  The multi-sided board P includes a plurality of blocks (six blocks B1 to B6 in the illustrated example) on which the same circuit is formed, and a coating liquid coating process and a component mounting process are performed as a single board. Thereafter, each of the blocks B1 to B6 is separated and used.

  On the substrate P shown in this figure, a pair of fiducial marks M1 for recognizing the position of the substrate P, identification information outside the drawing for specifying the substrate P, and the like are formed, and each block B1 to B6 has Are individually formed with a block fiducial mark M2 for increasing the processing accuracy of the dispenser 2 and the mounting devices 3 to 5. Further, in the blocks B1 to B6 having a severe defect such as a circuit damage, a bat mark M3 is formed for identifying the block and omitting processing such as component mounting. In the illustrated example, the bat mark M3 is attached to the block B1, and the arrangement in the case where the bat mark M3 is formed is shown by broken lines in the other areas E2 to E6 for convenience.

  In the component mounting system described above, in order to rationally produce such a multi-planar board P without waste, the production of the board P is advanced in units of blocks. Specifically, the host computer S of this system stores the number of production planned blocks as production plan data relating to the multi-planar substrate P, and the control device 2A of the dispenser 2 which is a processing device arranged at the most upstream position. When the number of blocks is counted and the counted value (total number of blocks) reaches the number of blocks scheduled to be produced, the coating process in the dispenser 2 is terminated, and final board information to be described later is sent to downstream mounting devices 3 to 5 and The data is transmitted to the inspection device 7. That is, in this embodiment, the control device 2A of the dispenser 2 functions as a counting unit according to the present invention, and the control device 2A and the control devices 3A to 5A of the mounting devices 3 to 5 function as the control unit.

  When a defective block is generated due to a component mounting failure or the like, an error occurs between the count value of the control device 2A and the number of produced blocks. In order to avoid this, the control of the inspection device 7 is performed. The apparatus 7A is configured to transmit the inspection results of the blocks B1 to B6 of each substrate P (one piece of information related to the production-finished substrate according to the present invention) to the dispenser 2 (control device 2A). Accordingly, the total number of blocks is corrected so as to compensate for the insufficient number of blocks.

  Here, the production of multi-sided boards in this component mounting system will be described based on the flowchart of FIG.

  FIG. 6 is a flowchart showing the operation of the dispenser 2 based on the control of the control device 2A. As shown in this figure, when producing a multi-sided board P, as a production preparation, the control device 2A first switches the production program corresponding to the multi-sided board P (hereinafter simply referred to as the board P unless otherwise necessary). Performed (step S1).

  Next, the number of production planned blocks registered as the production plan is read from the host computer S to the control device 2A of the dispenser 2 (hereinafter, simply described as the dispenser 2 for convenience), and the production of the substrate P is started. A request signal for the substrate P is transmitted from the dispenser 2 to the loader 1, and in response thereto, the substrate P is loaded from the loader 1 into the dispenser 2 and positioned at the working position (steps S3 and S5).

  When the positioning is completed, the dispenser 2 checks the presence or absence of the bat mark M3 on the substrate P based on the mark recognition by the substrate recognition camera 28. If there is no bat mark M3, the number of blocks included in the substrate P (6 blocks). ) Is counted (step S9). On the other hand, if there is a bat mark M3, the number of remaining blocks excluding the block with the mark M3 is counted (step S21). When the dispenser 2 detects the bat mark M3, the dispenser 2 transmits the identification information of the substrate P and the information of the blocks B1 to B6 to which the bat mark M3 is attached to the mounting devices 3 to 5 and the inspection device 7. To do.

  Next, the dispenser 2 refers to the inspection result transmitted from the inspection device 7, and corrects the count value (total number of blocks) of the blocks as necessary (steps S11 and S13). This point will be described in detail later.

  Further, the dispenser 2 checks whether or not the total number of blocks has reached the number of production planned blocks (step S15). If not, the production is continued, that is, all the blocks B1 to B6 (bat mark M3 of the board P) A coating process is performed on the substrate P (excluding those attached) (step S23). After the process, the substrate P is unloaded and a request signal for the next substrate P is transmitted to the loader 1.

  On the other hand, when the total number of blocks has reached the number of production planned blocks (YES in step S15), the dispenser 2 uses the board P as the final board, and plans to produce among the blocks B1 to B6 included in the board P. Processing is performed for blocks corresponding to the number of blocks (step S17). Specifically, the dispenser 2 checks whether or not the total number of blocks exceeds the planned number of blocks. If not, that is, if the total number of blocks and the planned number of blocks are the same, all the blocks on the substrate P are included. A coating process is performed on B1 to B6. On the other hand, when the total number of blocks exceeds the number of blocks scheduled for production, the dispenser 2 is equivalent to the number of blocks corresponding to the number of blocks scheduled for production, that is, the excess amount from the number of blocks (6) of the substrate P. The coating process is performed only on the remaining blocks after subtracting. Specifically, for example, when the total number of blocks is “502” and the planned production number of blocks is “500”, 2 blocks are excessive. In this case, only 4 blocks minus 2 blocks are processed. For example, as shown in FIG. 7B, the application process is performed only on the processing target blocks (parts other than the shaded part; blocks B1 to B4 in the illustrated example) assigned in a predetermined order, and the remaining blocks The processing of the substrate P is finished without performing the coating process on B5 and B6.

  When the processing of the final substrate is completed, the dispenser 2 unloads the substrate P, and identifies the substrate P (final substrate) identification information and the blocks B1 to B1 of the substrate P to the mounting devices 3 to 5 and the inspection device 7. Final board information including information for specifying a block to be processed in B6, in other words, information for specifying a block on which application processing has been performed in the dispenser 2 (blocks B1 to B4 in the example of FIG. 7B). Thus, the coating process for the series of multi-sided substrates P is completed (step S19).

  Although the above is the processing operation by the dispenser 2, the production of the substrate P is advanced as follows for the other devices 3 to 7.

  In the first mounting apparatus 3, for the board P other than the final board, the component mounting process is performed on all the blocks B1 to B6 (except the block with the butt mark M3), and the next second mounting is performed. The substrate P is carried out to the apparatus 4. And about a last board | substrate, based on the said last board | substrate information, a mounting process is implemented only about the block used as a process target among the said blocks B1-B6, and it carries out to the 2nd mounting apparatus 4. FIG. Thus, predetermined processing (component mounting processing, reflow processing, and inspection) is performed in each of the devices 4 to 7 while transporting the substrate P over the second mounting device 4, the third mounting device 5, the reflow furnace 6, and the inspection device 7. Process) is carried out to carry the substrate P downstream. Thereby, also in each of the other apparatuses 4 to 7, the predetermined processing is performed on all the blocks B1 to B6 for the substrate P other than the final substrate, and the dispenser 2 of the blocks B1 to B6 is used for the final substrate. The processing is performed only on the block to be processed in. However, the reflow process is performed on the entire substrate of the final substrate P due to the structure of the reflow furnace 6.

  The inspection device 7 images the mounting part of the component by the substrate recognition camera 28, and inspects predetermined items such as component mounting position deviation for each of the blocks B1 to B6 from the imaging result, and the inspection result is displayed on the substrate. Each time it is transmitted sequentially to the dispenser 2. The dispenser 2 detects the number of defective blocks based on the inspection result and corrects the total number of blocks (steps S11 and S13 in the flowchart of FIG. 6). Specifically, the number of defective blocks is subtracted from the total number of blocks. In other words, when a defective block occurs, the number of blocks that have actually been produced becomes smaller than the block count value (total number of blocks) by the dispenser 2, so that the inspection result by the inspection device 7 is obtained as described above. When the number of defective blocks is fed back to the dispenser 2 and the total number of blocks is subtracted by that amount, the number of blocks scheduled for production is accurately counted.

  As described above, in the component mounting system of this embodiment, when the multi-sided board P is produced, the processing of the board P is sequentially performed while the number of blocks is counted by the dispenser 2 positioned at the uppermost stream. When the cumulative total (total number of blocks) reaches the number of blocks scheduled for production, the substrate P at that time is used as the final substrate, and processing is performed for the blocks corresponding to the number of blocks scheduled for production among the blocks B1 to B6 of the substrate P. Even if the remaining block remains, the block is excluded from the processing target and the production of the substrate P is advanced, so that an excess block exceeding the planned number of blocks is not produced. Therefore, there is an effect that the production of the multi-planar substrate P can be rationally advanced without waste.

  In particular, in this component mounting system, the inspection result of the inspection device 7 is fed back to the dispenser 2, and when a defective block occurs, the number of defective blocks is subtracted from the count value (total count value) of the dispenser 2. Since the count value is corrected, there is no error between the total count value and the number of blocks that have been produced (the number of blocks that have been properly produced). There is an effect that can be performed.

  Further, in this component mounting system, regarding the production of the final board P, the final board information including the identification information of the final board and the information for specifying the processing target blocks B1 to B6 as described above is supplied from the dispenser 2 to the mounting apparatuses 3 to 5. Since the data is transmitted to the inspection apparatus 7, there is no work for specifying the processing target blocks B1 to B6 of the final substrate in these apparatuses 3 to 5 and 7. Therefore, the final substrate P can be quickly processed in the mounting devices 3 to 5 and the inspection device 7, and there is an effect that it can contribute to efficient production of the substrate P.

  The component mounting system described above is an example of a preferred embodiment of the component mounting system according to the present invention, and the specific configuration thereof can be appropriately changed without departing from the gist of the present invention.

  For example, in the above-described embodiment, a component mounting system including the dispenser 2, the mounting devices 3 to 5, the reflow furnace 6, and the inspection device 7 is configured as the processing device. It is not limited to. For example, the present invention can also be applied to a component mounting system including only a plurality of mounting apparatuses. In this case, the number of blocks may be counted in the mounting apparatus located on the most upstream side. The present invention is also applicable to a component mounting system in which a screen printing apparatus is provided in place of the dispenser 2 in the component mounting system shown in FIG. In this case, the number of blocks may be counted in the screen printing apparatus. However, since the screen printing apparatus integrally performs the printing process on the entire substrate and cannot basically perform the printing process in units of blocks, in this system, the screen printing apparatus does not have the number of blocks. Counting may be performed and the first mounting device 3 may specify the processing target block on the final substrate.

  In the embodiment, the inspection result of the substrate P is fed back from the inspection device 7 to the dispenser 2 as information on the production-completed substrate, and when there is a defective block, the count value (total number of blocks) of the dispenser 2 is corrected. However, when the line of the substrate P further drops, the information may be fed back to the dispenser 2 to correct the total number of blocks. According to this, the number of blocks can be accurately counted in consideration of the line drop of the substrate P.

It is the schematic which shows the component mounting system which concerns on this invention. It is a top view which shows an example of the dispenser (coating device) integrated in a component mounting system. It is a front view which shows a dispenser (application | coating apparatus). It is a perspective view which shows an example of the mounting apparatus integrated in a component mounting system. It is a front view which shows a mounting apparatus. It is a flowchart which shows the processing operation of the dispenser contained in a component mounting system. (A) is a top view which shows an example of the multi-cavity board | substrate (PWB) produced with a component mounting system, (b) is a top view which shows the example of a process target block when the board | substrate becomes a last board | substrate. It is.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Loader 2 Dispenser 3 1st mounting apparatus 4 2nd mounting apparatus 5 3rd mounting apparatus 6 Reflow furnace 7 Inspection apparatus 8 Unloader 1A-8A Control apparatus S Host computer

Claims (7)

In a processing apparatus for performing a predetermined process on a multi-sided substrate including a plurality of blocks in which the same circuit is formed,
Counting means for counting the number of blocks included in the substrate to be processed;
When the count value by the counting means reaches a preset number of blocks to be produced, control means for controlling the operation so as to finish the processing of the substrate by performing the processing for the block corresponding to the number of blocks, and A processing apparatus comprising: The processing apparatus according to claim 1,
Recognizing means capable of recognizing the mark attached to the multi-sided substrate and identifying the necessity of the processing in each block;
The processing apparatus is characterized in that the counting means counts the number of blocks excluding blocks that do not need to be processed among the blocks of the substrate to be processed based on the recognition result by the recognition means. Component mounting that includes a plurality of processing devices including at least a mounting device for mounting components on a substrate, and performs predetermined processing by each processing device while sequentially transporting a multi-sided substrate including a plurality of blocks on which the same circuit is formed. In the system,
A counting means for counting the number of blocks included in a substrate carried into a device located at the most upstream of the processing devices;
When the count value by the counting means reaches a preset production planned number of blocks, the mounting apparatus is configured so as to finish the process by mounting components for the board corresponding to the production planned number of blocks. And a control means for controlling the component mounting system. In the component mounting system according to claim 3,
As the processing apparatus, further provided with a coating apparatus capable of individually applying a coating liquid such as solder to the mounted portion of the substrate,
When the count value by the counting means reaches the planned production block number, the control means performs a coating process corresponding to the production planned block number on the substrate and finishes the processing of the substrate. A component mounting system that controls the coating apparatus. In the component mounting system according to claim 3 or 4,
The processing apparatus located at the uppermost stream includes a recognition unit that can recognize a mark that is attached to the substrate and that specifies whether processing of each block is necessary,
The component mounting system is characterized in that the counting means counts the number of blocks excluding blocks that do not need to be processed among the blocks of the substrate to be processed based on the recognition result by the recognition means. In the component mounting system according to any one of claims 3 to 5,
The component mounting system, wherein the counting means corrects the count value based on information on a production-completed board. The component mounting system according to claim 6,
As the processing apparatus, further comprising an inspection apparatus for inspecting the quality of processing of each block of the substrate,
The counting means uses the number of defective blocks detected by the inspection apparatus as information related to the production-completed board, and corrects the counted value based on this information.

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