JP2007326585A - Method for shipping semiconductor apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique which enables the discrimination of reuse makers handling a storing body of a reuse article. <P>SOLUTION: In a reuse maker cleaning/selecting the storing body of the reuse article, or a semiconductor maker purchasing the storing body of the reuse article and storing a semiconductor apparatus in the storing body of the reuse article and delivering it to a mounting maker, a displaying for discrimination is written on the surface of the storing body of the reuse article by using an ink containing a fluorescent material which can be easily visually recognized only by irradiating it with ultraviolet rays with a wavelength of 200-400 nm, and when inconvenience is generated on the storing body of the reuse article, or when it becomes necessary to grasp the number of regeneration or the like of the reuse article, the displaying for discrimination for the storing body of the reuse article is confirmed by irradiating with ultraviolet rays. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for shipping a semiconductor device, and more particularly to a technique that is effective when applied to a method for shipping electronic components such as a semiconductor device using a container for reuse products, such as a tray, a magazine case, or a tape reel. Is.

  Containers used for delivery of electronic components such as semiconductor devices include new containers and reused containers. Reusable containers are used for delivery of electronic parts such as semiconductor devices, and are then inspected, cleaned and regenerated. By using reused containers, the cost of the containers is reduced. In addition, it is possible to reduce the amount of industrial waste and effectively use resources, so that environmental protection can be considered.

For example, a multi-layered tray composed of a base part in which a plurality of pockets are formed in a matrix and a side wall formed on the peripheral part of the base part. An electronic tag consisting of a stored mu chip is embedded, and the mu chip of this electronic tag contains information on the tray ID, manufacturer name, product number, product name, quantity, lot number, etc. A storing technique is described in Japanese Patent Application Laid-Open No. 2004-284601 (Patent Document 1).
JP 2004-284601 A

  In general, reuse trays (hereinafter sometimes referred to as reuse trays for convenience) are procured to semiconductor manufacturers as follows. First, a tray that is no longer needed by the collection maker is collected from the customer (for example, a packaging maker that mounts the semiconductor device on the mounting board). (In some cases, the manufacturer is the same), but the trays to be reused are inspected, washed and regenerated for use. Then, it is supplied from the reuse manufacturer to the semiconductor manufacturer and reused.

  However, the reuse tray has various problems described below. For reuse trays, heat treatment at the mounting manufacturer (for example, heat treatment for 24 hours at a temperature of 125 ° C. performed to blow off water vapor in the package before mounting the semiconductor device on the mounting substrate) and cleaning at the reuse manufacturer are repeatedly performed. Therefore, foreign matter remains in the reuse tray, and the outer shape of the reuse tray may be deformed by heat shrinkage. For example, if foreign matter remains in the reuse tray, the semiconductor device cannot be removed from the reuse tray, and if the outer shape of the reuse tray is deformed, other reuse trays that overlap the deformed reuse tray cannot be removed. Therefore, the semiconductor manufacturer does not deliver the reuse tray having the above-described defects but returns it to the reuse manufacturer.

  However, there are multiple reuse manufacturers, and there are stamps that are integrally molded at the beginning of manufacture, but there are no other landmarks. Therefore, reuse trays purchased by semiconductor manufacturers are purchased from which reuse manufacturer. It may be difficult to identify whether or not.

Therefore, various methods for discriminating reuse makers have been proposed. Below, the technique for discriminating the reuse maker examined by the present inventors will be exemplified, and the advantages or disadvantages thereof will be briefly summarized. However, although there are examples of use, each has problems to be solved, and an effective method for identifying a reuse tray has not yet been specified.
(1) Place a scribble in the reuse tray. The scribble is visible under natural light. However, since the scribing scratches the reuse tray, it causes the generation of foreign matter, and since it can be visually observed, it is easily mistaken for a scratch. Furthermore, it is difficult to present a sufficient amount of information with a graffiti.
(2) Place a stamp on the reuse tray. Burns cause the generation of foreign matter. In addition, the portion where the semiconductor device is accommodated may be deformed due to heat generated when the brand mark is put into the reuse tray. If the reuse tray is deformed, for example, the trays cannot be stacked or the leads of the semiconductor device are bent.
(3) Put a sticker on the reuse tray. The seal is visible under natural light. However, since the seal uses an adhesive, it causes the generation of adhesive foreign matter, and since it can be visually observed, it is easily misidentified as a foreign matter. Furthermore, since the heat resistance of the seal is low, the heat treatment temperature of the reuse tray is limited.
(4) Mark the reuse tray with colored markers. A mark using a colored marker can be seen even under natural light. However, since a mark using a colored marker is visible, it is easily misidentified as a foreign object.
(5) Cut a groove in the tray. It is necessary to cut the grooves in advance at the stage of manufacturing the tray.
(6) Embed the microchip in the tray. Equipment for transferring data and reading information on the microchip is required, which increases equipment costs. Moreover, it is necessary to embed a microchip in advance at the stage of manufacturing the tray.

  An object of the present invention is to provide a technique capable of discriminating a reuse maker that handles a container for reuse products.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  According to the present invention, after a semiconductor device is accommodated in a reuse product container delivered from a reuse manufacturer to a semiconductor manufacturer, the reuse product container in which the semiconductor device is accommodated is shipped from the semiconductor manufacturer to the mounting manufacturer. A method of shipping a semiconductor device, in which a reuse maker or a semiconductor maker uses an ink containing a fluorescent material that can be easily viewed only by irradiating ultraviolet rays having a wavelength of 315 to 400 nm. An identification label is written on the surface.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  Identify the reuse manufacturer that handles the container of the reused product by writing an identification label that makes it easy to visually recognize the container of the reused product by using an ink containing fluorescent material. can do.

  In the present embodiment, when referring to the number of elements, etc. (including the number, numerical value, quantity, range, etc.), unless otherwise specified, the case is clearly limited to a specific number in principle, etc. It is not limited to the specific number, and it may be more or less than the specific number. Further, in the present embodiment, the constituent elements (including element steps and the like) are not necessarily essential unless particularly specified and apparently essential in principle. Yes. Similarly, in this embodiment, when referring to the shape, positional relationship, etc. of the component, etc., the shape, etc. substantially, unless otherwise specified, or otherwise considered in principle. It shall include those that are approximate or similar to. The same applies to the above numerical values and ranges.

  Further, in the drawings used in this embodiment mode, hatching is given to make the drawings easy to see even if they are plan views. Further, in all drawings for explaining the present embodiment, parts having the same function are denoted by the same reference numerals, and repeated explanation thereof is omitted. Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
In the first embodiment of the present invention, a method for shipping a semiconductor device in the case of using a reused tray will be described with reference to FIGS. The tray is used for packing and transporting, for example, a surface mount package (for example, QFP, LQFP, SOP, SSOP). In the first embodiment, a semiconductor package is exemplified as the semiconductor device accommodated in the tray. However, the present invention is not limited to this. For example, a semiconductor chip or other electronic component is accommodated in the tray and transported. You can also.

  FIG. 1 is a configuration diagram showing a flow of a tray used for housing and transporting a semiconductor package according to the first embodiment.

  First, a plurality of semiconductor packages manufactured by a semiconductor manufacturer are stored in a tray (in this case, either a reused tray or a new tray can be used), and a plurality of trays storing a plurality of semiconductor packages are stored. Are stacked and packed (step 100).

  Thereafter, the packed tray is shipped to mounting manufacturers A and B. The mounting manufacturers A and B take out the semiconductor package from the delivered tray and mount it on the mounting board. After that, the tray collection company collects the used trays that are emptied by the mounting manufacturers A and B. The tray collection trader removes trays that are clearly damaged or not targeted from the collected used trays, and then delivers reusable trays to reuse manufacturers A and B.

  In reuse makers A and B, trays are sorted by semiconductor manufacturer. After sorting or before sorting, the tray is cleaned by ultrasonic cleaning, wet cleaning, air blow, or the like, and the tray is regenerated to be usable again. Further, the reuse manufacturers A and B check the tray for scratches and breakage by visual inspection, and discard the tray whose inspection result does not satisfy a predetermined standard. Also, those that have passed a certain period (for example, about 1 to 3 years) based on the tray manufacturing date are discarded. Thereafter, the tray is delivered to the semiconductor manufacturer, and the semiconductor manufacturer reuses the tray delivered from the reuse manufacturers A and B as the reuse product tray.

  In the above description, there are two mounting manufacturers, mounting manufacturer A and mounting manufacturer B, but there may be more than three, and there are two reuse manufacturers, reuse manufacturer A and reuse manufacturer B. It may be more than a company. Moreover, although the case where tray collection traders and reuse makers A and B differ was demonstrated, both may be the same makers.

  Next, a method for discriminating the trays for reuse items will be described with reference to FIGS. 2A and 2B are a top view and a side view showing an example of the outer shape of the tray according to the first embodiment, respectively, and FIG. 3 confirms the identification display of the tray of the reuse product according to the first embodiment. It is a schematic diagram explaining the method to do.

  As shown in FIG. 2, the tray 1 has a quadrangular shape, and an index portion 2 in which the corner portion is cut is formed at one of the four corner portions of the quadrangular shape. The tray 1 is a laminated plate-like material that accommodates a plurality of semiconductor packages arranged in a matrix, and a plurality of pockets (concave portions) arranged in a matrix are formed on both front and back surfaces. The semiconductor package is accommodated in each pocket of the tray 1 and shipped from the semiconductor manufacturer to the mounting manufacturer. Further, the carbon particles are included in the tray 1 to prevent charging and to avoid electrostatic breakdown of the semiconductor package. For this reason, the tray 1 is generally black.

  In the first embodiment, for identifying a reuse manufacturer, an identification display written with ink containing a fluorescent substance (hereinafter referred to as fluorescent ink) is used on the side of a tray of a reuse product delivered to a semiconductor manufacturer. As a result, the reuse manufacturers A and B that handle the trays of the reused products are discriminated. In the tray flow shown in FIG. 1, the entry operation of the identification display on the tray of the reused product is performed by one of the reuse manufacturers A and B or the semiconductor manufacturer, or in some cases both manufacturers. In the reuse manufacturers A and B, for example, an identification display is written in the reuse product tray at the time of shipment, and in a semiconductor manufacturer, for example, an identification display is written in the reuse product tray in the fluorescence ink at the time of delivery.

  The fluorescent ink contains, for example, water, glycogens, synthetic resins, dyes, etc., and reacts only with ultraviolet rays. The wavelength of the ultraviolet light applied to the fluorescent ink is considered to be an appropriate range of, for example, 315 to 400 nm (not to be limited to this range depending on other conditions). Moreover, it is thought that the range of 300-400 nm etc. which make about 350 nm a center value is the most suitable. That is, since the reflectance of the fluorescent ink is lower than the reflectance of the surface of the tray under natural light, it is difficult to visually observe the fluorescent ink, but the reflectance of the fluorescent ink becomes the reflectance of the surface of the tray by irradiating ultraviolet rays. It becomes easier to visually observe the fluorescent ink.

  Therefore, since the history of the reused product need not be confirmed while the tray 3 of the reused product is used for storing, packing or transporting the semiconductor package, for example, as shown in FIG. The operation is performed without irradiating the tray 3 with ultraviolet rays. However, once trouble occurs in the tray 3 of the reuse product, as shown in FIG. 3B, the identification display (ABC display in FIG. 3B) is performed by irradiating ultraviolet rays from the ultraviolet fluorescent lamp BL. The history of the reused tray 3 is confirmed visually.

  Next, a method for entering the identification display on the tray of the reuse product will be described with reference to FIG. FIG. 4 is a perspective view showing an example of a reuse product tray on which an identification display according to the first embodiment is written.

  In accordance with a unified method for entering an identification display, the identification display using fluorescent ink is sequentially stamped on the side surface of the tray 3 of the reuse product from the first time.

  For example, as shown in FIG. 4, the starting point of the identification marking is the index part 2, and identification display with fluorescent ink counterclockwise on the side surface in the longitudinal direction of the reused tray 3 (indicated by hatching in the figure) Can be sequentially stamped. For example, if the content of the identification display is the reuse manufacturer's identification mark (manufacturer abbreviation) and the date on which the identification display is stamped on the tray, for example, if a reuse tray is delivered by reuse manufacturer A in May 2006, “0605A Can be stamped. FIG. 4 illustrates the first to third stamps, but if reuse is further repeated, the identification display is sequentially performed in the direction of the arrow shown in the figure on the side of the tray 3 of the reuse product. Is done.

  The stamping operation for identifying and displaying the reused product on the tray 3 can be performed, for example, as follows. First, fluorescent ink that reacts only to ultraviolet rays is prepared. Next, an identification display such as a rubber stamp or the like engraved with date, manufacturer abbreviation, lot or the like is prepared. Next, an identification display is stamped by pressing a rubber stamp or the like with fluorescent ink on a specific part of the tray 3 of the reuse product.

  Next, a method of reading the identification display entered in the reuse product tray will be described with reference to FIG. FIG. 5 is a side view showing an example of six trays in a stacked state according to the first embodiment. In addition, here, a method of reading the identification display written in the tray of the reuse product by ultraviolet irradiation in a state where a plurality of trays are stacked is illustrated, but the identification display is similarly performed even for one reuse product tray. Can be read. In addition, here, six trays in a stacked state in which five reuse trays and one new tray are stacked are illustrated, but the number of each is not limited thereto.

  First, the six trays 3a to 3f are stacked with the index portions aligned. The identification display is written by a unified entry method on the side surfaces of the six trays 3a to 3f, that is, the identification display is sequentially written counterclockwise on the side surfaces in the longitudinal direction of the trays 3a to 3f starting from the index portion 2. Therefore, the identification display of all the trays 3a to 3f can be confirmed by irradiating ultraviolet rays and looking at one side of the six stacked trays 3a to 3f.

  When one side surface on which the identification indications of the stacked trays 3a to 3f are written is irradiated with ultraviolet rays, the identification indications of the respective trays 3a to 3f can be visually observed, and the information of the respective trays 3a to 3f can be read. . When the identification display is, for example, a manufacturer abbreviation and entry date, it is possible to easily read the identification of the reuse manufacturer that performed the last reuse work, the number of reuses, and the history of the reuse work. For example, since the first reuse product tray 3a is displayed as “0601C” and “0605C”, the reuse manufacturer that performed the last reuse work is the C manufacturer, and the number of times reused is twice. It can be seen that the days are January 2006 and May 2006. The information can be similarly read from the second, third, fourth and sixth reused trays 3b to 3d and 3f. In addition, although the identification display is not visible on the fifth tray 3e, this means that the tray is not a reuse product but a new tray.

  In this way, the fluorescent ink that is difficult to confirm under natural light reacts by irradiating with ultraviolet light, and the identification indications written in the trays 3a to 3f can be confirmed. And the trays 3a to 3d and 3f for reuse products can be discriminated. Furthermore, the method for filling in the identification display using fluorescent ink that reacts only to ultraviolet rays is difficult to visually confirm unless ultraviolet rays are irradiated. It is possible to reduce the cost because it does not cause the generation of foreign matter, and no dedicated equipment is required.

  Next, a method for housing a semiconductor package in a tray performed by the semiconductor manufacturer according to the first embodiment will be described with reference to FIGS. FIG. 6 is an enlarged view showing a state in which two trays are stacked and a BGA package is stored, and FIG. 7 is an enlarged view showing a state in which two trays are stacked and a QFP package is stored.

  As shown in FIG. 6, a plurality of pockets 5a and 5b, which are concave portions, are formed on the front and back surfaces of the tray 4 for storing the BGA package (shown by hatching in the figure), and the tray 4 is laminated. In this case, the pocket 5a on one surface of the lower tray 4 is covered with the pocket 5b on the other surface of the upper tray 4 arranged to face the pocket 5a. If the lower surface of the tray 4 is the back surface side and the upper surface is the front surface side, one BGA package sucked and conveyed by the suction collet is placed in each pocket 5a on the front surface side of the tray 4 arranged in the lower stage. Accommodate. Thereafter, the stacking of the tray 4 and the accommodation of the BGA package are repeated to stack the tray 4 on which the BGA package is mounted. At that time, since the uppermost tray 4 serves as a lid, the BGA package is not accommodated. The accommodated BGA package is covered with a pocket 5b on the back surface side of another tray 4 in which the main surface faces upward and the main surface is stacked and arranged in the upper stage.

  Further, in the tray for storing the BGA package, in order to prevent the bump electrode attached to the BGA package from being damaged, a recess for preventing the bump electrode from contacting the tray is provided in the pocket on the surface side of the tray. ing. However, if the tray has a defect such as deformation or breakage, the bump electrode of the BGA package may come into contact with the tray and be damaged. For this reason, when the above-mentioned trouble is found in the reuse product tray, it is necessary to identify the reuse maker that delivered the troubled reuse product tray and take immediate measures. In the first embodiment, since the identification display is written on the side surface of the reuse product tray, it is possible to easily identify the reuse maker and the number of times the reuse product tray is reproduced. As a result, it is possible to take an appropriate measure for the tray of the reused product that stores the BGA package.

  Similarly, as shown in FIG. 7, a plurality of pockets 7a and 7b, which are concave portions, are formed on the front and back surfaces of the tray 6 for storing the QFP package (shown by hatching in the figure). When the stacks 6 are stacked, the pockets 7a on one surface of the lower tray 6 are covered with the pockets 7b on the other surface of the upper tray 6 disposed opposite thereto. If the lower surface of the tray 6 is the back surface side and the upper surface is the front surface side, one QFP package sucked and conveyed by the suction collet is placed in each pocket 7a on the front surface side of the tray 6 arranged in the lower stage. Accommodate. Thereafter, the stacking of the tray 6 and the accommodation of the QFP package are repeated to stack the tray 6 on which the QFP package is mounted. At that time, since the uppermost tray 6 serves as a lid, the QFP package is not accommodated. The accommodated QFP package is covered with a pocket 7b on the back surface side of another tray 6 in which the main surface is directed upward and the main surface is further laminated in the upper stage.

  Also, in the tray for storing the QFP package, the mold part of the QFP package is pressed and fixed between the upper tray and the lower tray in order to prevent the lead electrode attached to the QFP package from being deformed or damaged. A recess for preventing the lead electrode from coming into contact with the tray is provided in the front surface side pocket. However, if the tray has a defect such as deformation or breakage, the lead electrode of the QFP package may come into contact with the tray and be damaged. For this reason, when the above-mentioned trouble is found in the reuse product tray, it is necessary to identify the reuse maker that delivered the troubled reuse product tray and take immediate measures. In the first embodiment, since the identification display is written on the side surface of the reuse product tray, it is possible to easily identify the reuse maker and grasp the number of times the reuse product tray is reproduced. As a result, it is possible to take an appropriate measure for the tray of the reused product that stores the QFP package.

  Next, a semiconductor package packaging method performed by the semiconductor manufacturer according to the first embodiment will be described with reference to FIGS. 8 to 10 are perspective views showing an example of a packaging method of the semiconductor package.

  First, as shown in FIG. 8, a tray 8 is prepared. The tray 8 prepared here is a new tray or a reused tray, and the reused tray is identified and displayed using fluorescent ink that can be seen only by irradiating the side surface with ultraviolet rays, as described above. Is filled in. When a defect is found in the reused product tray, the reuse maker to which the tray 8 is delivered can be determined by irradiating the tray 8 with ultraviolet rays and confirming the tray identification display.

  Next, the semiconductor package is accommodated in the pocket of the tray 8 by, for example, the semiconductor package accommodation method described with reference to FIGS. Thereafter, the stacked trays 8 are fixed by the band 10. A desiccant 11 and a humidity indicator 12 are attached to the stacked tray 8.

  Next, as shown in FIG. 9, tray packing is performed. First, the stacked tray 8 is accommodated in the moisture-proof bag 13 and sealed by heating to seal the package. The moisture-proof bag 13 is formed mainly of aluminum, for example. Thereafter, the interior label 14 is pasted on the surface of the moisture-proof bag 13. The interior label 14 is filled with product name, lot number, quantity, etc. so that the housed product can be seen.

  Next, as shown in FIG. First, in the tray packing, the stacked tray 8 accommodated in the moisture-proof bag 13 is accommodated in the interior box 15, and a cushioning material is further placed on the tray 8 for packaging. Subsequently, the lid of the interior box 15 is stopped with the tape 16, and an interior label 17 is attached to the surface of the interior box 15. Thereafter, the interior box 15 is shipped in the outer layer box.

  Next, a semiconductor package mounting method performed by the mounting manufacturer according to the first embodiment will be described.

  After confirming that the semiconductor package housed in the stacked tray shipped from the semiconductor manufacturer has been delivered correctly, the tray placed at the top is removed. Subsequently, the mold (mark) surface of the semiconductor package is sucked and held by the suction collet, the semiconductor packages are taken out one by one and transferred onto the mounting substrate, and the semiconductor package is incorporated into the product. The mounting board is, for example, a printed wiring board such as an epoxy board containing glass fiber, a film board, or a glass board.

  In the first embodiment, an identification display using fluorescent ink is not written on a new tray. However, an identification display using fluorescent ink may be written on a new tray. The amount can be increased.

  As described above, according to the first embodiment, the reused product tray is irradiated with ultraviolet rays when a failure occurs in the reused product tray or when it is necessary to investigate the history of the reused product tray. Because it is possible to see the identification display that is difficult to see under natural light and to confirm the identification display written on the tray of the reuse product, it is possible to determine the reuse manufacturer that handled the tray of the reuse product, It is also possible to distinguish between a new tray and a reuse tray.

(Embodiment 2)
In the second embodiment of the present invention, a method of shipping a semiconductor device (semiconductor package) when a reused magazine case is used will be described with reference to FIGS. The magazine case is used for packing and transporting, for example, an insertion type package (for example, DIP, SDIP, SIP) and a surface mount type package (for example, SOP, SSOP). 11 and 13 to 15 are perspective views illustrating an example of a packaging method of a semiconductor package accommodated in a magazine case, and FIG. 12 is a schematic diagram illustrating a method for confirming the identification display of a magazine case of a reuse product.

  First, as shown in FIG. 11, a magazine case 20 is prepared. The magazine case 20 prepared here is a new magazine case or a reused magazine case, and the reused magazine case is irradiated with ultraviolet rays on its upper surface or side surfaces as in the first embodiment. The identification display is filled in using fluorescent ink that can be visually observed only by the above. When a defect is found in the reused magazine case 20, as shown in FIG. 12, the magazine case 20 is irradiated with ultraviolet rays from the ultraviolet fluorescent lamp BL to confirm the identification display (ABC display in FIG. 12). Thereby, the reuse maker who delivered the magazine case 20 can be discriminated. Subsequently, after a predetermined number of semiconductor packages are accommodated in each magazine case 20, the magazine case 20 is sealed with a stopper 21.

  Next, as shown in FIG. 13, after stacking and bundling a plurality of magazine cases 20 that have been accommodated in the semiconductor package, the bundled magazine cases 20 are fixed by a band 22. A desiccant 23 and a humidity indicator 24 are attached to the bundled magazine case 20.

  Next, as shown in FIG. 14, the magazine case is packed. First, the bundled magazine case 20 is accommodated in a moisture-proof bag 25 and sealed by heating to seal the package. For example, the moisture-proof bag 25 is formed mainly of aluminum. Thereafter, the interior label 26 is pasted on the surface of the moisture-proof bag 25. The interior label 26 is filled with the product name, lot number, quantity, etc. so that the housed product can be seen.

  Next, as shown in FIG. First, in the magazine case packing, the bundled magazine case 20 accommodated in the moisture-proof bag 25 is accommodated in the interior box 27 and further packed with a cushioning material thereon. Subsequently, the lid of the interior box 27 is stopped with the tape 28, and an interior label 29 is attached to the surface of the interior box 27. Thereafter, the interior box 29 is shipped in the outer layer box.

  As described above, according to the second embodiment, even when a semiconductor package is packed in a magazine case, it is possible to perform identification display of a reused magazine case using fluorescent ink that can be visually observed by irradiating ultraviolet rays. Therefore, the same effect as in the first embodiment can be obtained.

(Embodiment 3)
In the first embodiment of the present invention, a method for shipping a semiconductor device when a reused tape reel is used will be described with reference to FIGS. The tape reel is used for packing and transporting, for example, a surface mount type package (for example, AFP, LQFP, SOP, SSOP). FIGS. 16 and 18 to 21 are perspective views showing an example of a packaging method for a semiconductor package accommodated in a tape reel, and FIG. 17 is a schematic diagram for explaining a method for confirming the identification display of a reused tape reel.

  First, as shown in FIG. 16, a tape reel 30 is prepared. The tape reel 30 includes a carrier tape 31 that can store a plurality of semiconductor packages, and a reel 32 that winds up the carrier tape 31. A plurality of pockets (concave portions) 33 arranged in a line at substantially equal intervals along the longitudinal direction of the carrier tape 31 are formed, and a semiconductor package is stored in the pockets 33.

  The tape reel 30 prepared here is a new tape reel or a reused tape reel, and the reused tape reel is irradiated with ultraviolet rays on the outer side surface as in the first embodiment. The identification display is filled in using fluorescent ink that can be visually observed only by the above. When a defect is found in the reused tape reel 30, as shown in FIG. 17, the tape reel 30 is irradiated with ultraviolet rays from the ultraviolet fluorescent lamp BL to confirm the identification display (ABC display in FIG. 17). Thereby, the reuse maker who delivered the tape reel 30 can be discriminated.

  Next, after storing a predetermined number of semiconductor packages in each pocket 33, the pocket 33 is covered with a urethane cover film 34 so as to correspond to each pocket 33, and sealed with heat, so that the inside of the pocket 33 is almost sealed. By doing so, the semiconductor package is accommodated. Subsequently, the carrier tape is wound around the tape reel 30. The carrier tape 31 is provided with a plurality of guide holes at substantially equal intervals in parallel with the 33 rows of pockets in the width direction, and is used as a feeding guide when the carrier tape 31 is transported.

  Next, as shown in FIG. 18, a reel band 35 for preventing deformation of the reel flange is mounted on the outside of the carrier tape 31 wound around the tape reel 30. Next, as shown in FIG. 19, after attaching a desiccant 36 and a humidity indicator 37 to the tape reel 30, the tape reel 30 is housed in a moisture-proof bag 38 and sealed by heating as shown in FIG. And seal the packaging. The moisture-proof bag 38 is formed mainly of aluminum, for example. Thereafter, an interior label 39 is pasted on the surface of the moisture-proof bag 38.

  Next, as shown in FIG. First, the tape reel 30 accommodated in the moisture-proof bag 38 is accommodated in the interior box 40, and further, a cushioning material is put on it and packed. Subsequently, the lid of the interior box 40 is stopped with the tape 41, and an interior label 42 is attached to the surface of the interior box 40. Thereafter, the interior box 40 is shipped in the outer layer box.

  As described above, according to the third embodiment, even when the semiconductor package is packed on the tape reel, the identification of the reused tape reel is displayed using the fluorescent ink that can be easily observed by irradiating ultraviolet rays. Since it can be performed, the same effect as in the first embodiment can be obtained.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  The method for shipping a semiconductor device of the present invention can be applied to grasping information relating to a reused product or a new container for packing a semiconductor device when the semiconductor device is shipped from a semiconductor manufacturer to a mounting manufacturer.

It is a block diagram which shows the flow of the tray used for accommodation and conveyance of the semiconductor device by Embodiment 1 of this invention. (A) And (b) is the top view and side view which respectively show an example of the external shape of the tray by Embodiment 1 of this invention. (A) And (b) is a schematic diagram before and at the time of ultraviolet irradiation which demonstrates the method of confirming the identification display of the tray of the reuse goods by Embodiment 1 of this invention, respectively. It is a perspective view which shows an example of the tray of the reuse goods in which the identification display by Embodiment 1 of this invention was filled. It is a side view which shows an example of the six trays of the lamination state by Embodiment 1 of this invention. It is an enlarged view which shows the state which laminated | stacked two trays by Embodiment 1 of this invention, and accommodated the BGA package. It is an enlarged view which shows the state which laminated | stacked two trays by Embodiment 1 of this invention, and accommodated the QFP package. It is a perspective view which shows an example of the packaging method of the semiconductor package by Embodiment 1 of this invention. It is a perspective view which shows an example of the packaging method of the semiconductor package by Embodiment 1 of this invention. It is a perspective view which shows an example of the packaging method of the semiconductor package by Embodiment 1 of this invention. It is a perspective view which shows an example of the shipment method of the semiconductor package accommodated in the magazine case of the reuse goods by Embodiment 2 of this invention. It is a schematic diagram at the time of the ultraviolet irradiation explaining the method to confirm the identification display of the magazine case of the reuse goods by Embodiment 1 of this invention. It is a perspective view which shows an example of the shipment method of the semiconductor package accommodated in the magazine case of the reuse goods by Embodiment 2 of this invention. It is a perspective view which shows an example of the shipment method of the semiconductor package accommodated in the magazine case of the reuse goods by Embodiment 2 of this invention. It is a perspective view which shows an example of the shipment method of the semiconductor package accommodated in the magazine case of the reuse goods by Embodiment 2 of this invention. It is a perspective view which shows an example of the shipment method of the semiconductor package accommodated in the tape reel of the reuse goods by Embodiment 3 of this invention. It is the schematic diagram at the time of the ultraviolet irradiation explaining the method of confirming the identification display of the tape reel of the reuse goods by this Embodiment 3 of invention. It is a perspective view which shows an example of the shipment method of the semiconductor package accommodated in the tape reel of the reuse goods by Embodiment 3 of this invention. It is a perspective view which shows an example of the shipment method of the semiconductor package accommodated in the tape reel of the reuse goods by Embodiment 3 of this invention. It is a perspective view which shows an example of the shipment method of the semiconductor package accommodated in the tape reel of the reuse goods by Embodiment 3 of this invention. It is a perspective view which shows an example of the shipment method of the semiconductor package accommodated in the tape reel of the reuse goods by Embodiment 3 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Tray 2 Index part 3 Reuse goods tray 3a, 3b, 3c, 3d, 3e, 3f Tray 4 Tray 5a, 5b Pocket 6 Tray 7a, 7b Pocket 8 Tray 10 Band 11 Desiccant 12 Humidity indicator 13 Dampproof bag 14 Interior label 15 Inner Box 16 Tape 17 Inner Label 20 Magazine Case 21 Stopper 22 Band 23 Desiccant 24 Humidity Indicator 25 Moisture-proof Bag 26 Inner Label 27 Inner Box 28 Tape 29 Inner Label 30 Tape Reel 31 Carrier Tape 32 Reel 33 Pocket 34 Cover Film 35 Reel Band 36 Desiccant 37 Humidity indicator 38 Moisture proof bag 39 Interior label 40 Interior box 41 Tape 42 Interior label BL UV fluorescent lamp

Claims (16)

(A) a process of cleaning a container of reused goods at a reuse maker;
(B) delivering a container for the reuse product from the reuse manufacturer to the semiconductor manufacturer;
(C) a step of accommodating a semiconductor device in the reuse product container in the semiconductor manufacturer;
(D) shipping a container for the reuse product in which the semiconductor device is accommodated from the semiconductor manufacturer to a mounting manufacturer;
In the reuse maker or the semiconductor maker, an identification display is written on a surface of the reuse product container using an ink containing a fluorescent material that can be easily viewed only by irradiating ultraviolet rays. A method for shipping semiconductor devices.   2. The method for shipping a semiconductor device according to claim 1, wherein the wavelength of the ultraviolet light applied to the reused product container is in a range of 315 to 400 nm.   2. The method of shipping a semiconductor device according to claim 1, wherein the identification display is read by irradiating the reused product container with the ultraviolet light to confirm the history of the reused product container. shipping method.   2. The method for shipping a semiconductor device according to claim 1, wherein the identification display includes an identification mark of the reuse maker that has delivered the reuse product container.   2. The method of shipping a semiconductor device according to claim 1, wherein the identification display includes a date on which the identification display is written in a container for the reuse product. The method for shipping a semiconductor device according to claim 1, wherein the semiconductor device is further housed in a new housing body in the step (c).
Shipment of a semiconductor device, wherein in the step (d), the new container housing the semiconductor device and the reuse product housing housing the semiconductor device are shipped together. Method.   2. The semiconductor device shipping method according to claim 1, wherein the reuse product container is a tray.   8. The semiconductor device shipping method according to claim 7, wherein the identification display is written on a side surface of the tray.   8. The semiconductor device shipping method according to claim 7, wherein the tray includes carbon particles.   10. The semiconductor device shipping method according to claim 9, wherein the tray is black.   2. The semiconductor device shipping method according to claim 1, wherein the reuse product container is a magazine case.   12. The semiconductor device shipping method according to claim 11, wherein the identification display is written on an upper surface or a side surface of the magazine case.   2. The semiconductor device shipping method according to claim 1, wherein the reuse product container is a tape reel.   14. The method for shipping a semiconductor device according to claim 13, wherein the identification display is written on an outer side surface of the tape reel.   2. The method for shipping a semiconductor device according to claim 1, wherein the semiconductor device accommodated in the reuse product container is a semiconductor package in which a semiconductor chip is incorporated.   2. The method of shipping a semiconductor device according to claim 1, wherein the semiconductor device accommodated in the reuse product container is a semiconductor chip.