JP2007131724A - Joined article composed of liquid crystalline resin composition, method for treatment of liquid crystalline resin formed article and joining method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a joined article having improved adhesiveness of a formed article of a liquid crystalline resin having excellent fluidity, heat-resistance, low gas-generation and excellent mechanical properties. <P>SOLUTION: A joined article of a liquid crystalline resin article is produced by forming a composition containing a liquid crystalline resin, and joining the formed liquid crystalline resin article after heat-treating at a temperature higher than the joining treatment temperature and not higher than the crystallization temperature of the liquid crystalline resin composition. The joining treatment is preferably carried out by using an epoxy-based adhesive or silicone-based adhesive, and the heat-treatment temperature is preferably ≥170°C. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a bonded molded article having improved adhesion of a liquid crystalline resin molded article, a method for treating a liquid crystalline resin molded article, and a bonding method.

  In recent years, there has been an increasing demand for higher performance of plastics, and many polymers having various new performances have been developed and put on the market. Among them, optical anisotropy is characterized by parallel arrangement of molecular chains. Liquid crystalline resins are attracting attention because they have excellent fluidity, heat resistance, low gas properties and mechanical properties.

  Liquid crystal resins tend to be used as parts of high-functional products that are rapidly becoming thinner and smaller in recent years, taking advantage of the above characteristics. In such high-functional parts, there are many restrictions on the shape due to the necessity of being incorporated in a limited product space, and as a result, the product shape is often very complicated. Along with the complexity of this product shape, for example, a bonding method using an adhesive is adopted for bonding the parts, but since the liquid crystalline resin has very few reactive groups and good chemical resistance, The reaction was also small, and the problem was that the adhesiveness was inferior compared to other thermoplastic resins.

As a method of overcoming such problems, a method of adding a modifier to a liquid crystalline resin has been proposed. For example, a method of adding a polyalkylene ether compound to a liquid crystal polyester (see, for example, Patent Document 1), And methods of adding ester compounds (see, for example, Patent Document 2) are already known. However, since these additives generate extremely large amounts of gas generated by heating, such as mold contamination and mold corrosion. There is a problem that defects are likely to occur and liquid crystal polyester molding processability is impaired.
Japanese Patent Laid-Open No. 5-140431 (paragraphs [0004] to [0008]) JP 2003-73555 A (paragraphs [0009] to [0010])

  The present invention has been achieved as a result of studying the solution of the problems in the prior art described above as an issue.

  Accordingly, an object of the present invention is to provide a joined molded product comprising a liquid crystalline resin molded product with improved adhesion.

  As a result of intensive studies to solve the above problems, the present inventors can obtain a bonded molded article having strong adhesive strength by heat-treating the liquid crystalline resin under conditions that could not be conventionally assumed after molding. The present inventors have found that the present invention can be accomplished and have completed the present invention.

That is, the present invention
(1) Liquid crystallinity characterized in that, after molding a composition containing a liquid crystalline resin, bonding is performed after heat treatment at a temperature higher than the treatment temperature at the time of bonding and below the crystallization temperature of the liquid crystalline resin composition. A joined molded article comprising a resin composition,
(2) A bonded molded article comprising the liquid crystalline resin composition according to (1), wherein the heat treatment temperature is higher than 170 ° C. and is not higher than the crystallization temperature of the liquid crystalline resin composition,
(3) A method for treating a liquid crystalline resin molded article, comprising: after the molding of the composition containing the liquid crystalline resin, heat treatment at a temperature higher than the treatment temperature at the time of bonding and lower than the crystallization temperature of the liquid crystalline resin composition. ,
(4) The method for treating a liquid crystalline resin molded article according to (3), wherein the heat treatment temperature is higher than 170 ° C. and is equal to or lower than the crystallization temperature of the liquid crystalline resin composition,
(5) A method for joining liquid crystalline resin molded products, comprising joining the liquid crystalline resin molded products treated by the method for treating liquid crystalline resin molded products according to (3) or (4),
(6) The bonding method of the liquid crystalline resin molded product according to (5), wherein the bonding is performed using an epoxy-based adhesive or a silicone-based adhesive, and (7) the processing temperature during bonding is 120 ° C. or higher and lower than 170 ° C. (5) or (6) is a method for bonding liquid crystalline resin molded products.

  According to the present invention, as will be described below, a bonded molded product of a liquid crystalline resin molded product having excellent adhesiveness can be obtained, so that it has a great effect on highly functional products that require confidentiality.

  The shape and structure of the bonded molded product of the present invention are not particularly limited, and are molded products bonded using an epoxy, silicone, urethane, cyanoacrylate, or the like, preferably epoxy or silicone. A molded article joined with an adhesive, more preferably a molded article joined with a silicone-based adhesive.

  Examples of the liquid crystalline resin used in the present invention include a liquid crystalline polyester and a liquid crystalline polyester amide that form an anisotropic molten phase, and specific examples thereof include an aromatic oxycarbonyl unit, an aromatic dioxy unit, an aromatic Liquid crystalline polyester that forms an anisotropic melt phase composed of structural units selected from dicarbonyl units, ethylenedioxy units, etc., and the above structural units and aromatic iminocarbonyl units, aromatic diimino units, aromatic iminooxy units, etc. And a liquid crystalline polyester amide that forms an anisotropic molten phase comprising a structural unit selected from

  Examples of the liquid crystalline polyester forming the anisotropic melt phase are preferably liquid crystalline polyesters comprising the following structural units (I), (II) and (IV), (I), (II), (III ) And (IV) structural units, and (I), (III) and (IV) structural units.

(However, R1 in the formula is

  One or more groups selected from: R2 is

One or more groups selected from In the formula, X represents a hydrogen atom or a chlorine atom, and the sum of the structural units (II) and (III) and the structural unit (IV) are substantially equimolar. )
The structural unit (I) is a structural unit of a polyester formed from p-hydroxybenzoic acid, and the structural unit (II) is 4,4′-dihydroxybiphenyl, 3,3 ′, 5,5′-tetramethyl. -4,4'-dihydroxybiphenyl, hydroquinone, t-butylhydroquinone, phenylhydroquinone, methylhydroquinone, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,2-bis (4-hydroxyphenyl) propane and 4 , 4′-dihydroxydiphenyl ether selected from one or more aromatic dihydroxy compounds, the structural unit (III) is a structural unit generated from ethylene glycol, the structural unit (IV) is terephthalic acid, Isophthalic acid, 4,4′-diphenyldicarboxylic acid, 2,6 -Naphthalenedicarboxylic acid, 4,4'-diphenyl ether dicarboxylic acid, 1,2-bis (phenoxy) ethane-4,4'-dicarboxylic acid and 1,2-bis (2-chlorophenoxy) ethane-4,4'- Each of the structural units generated from one or more aromatic dicarboxylic acids selected from dicarboxylic acids is shown. Of these, R1 is

And R2 is

Are particularly preferred.

  Examples of liquid crystalline polyesteramides include 6-hydroxy-2-naphthoic acid, liquid crystalline polyesteramide formed from p-aminophenol and terephthalic acid, p-hydroxybenzoic acid, 4,4′-dihydroxybiphenyl and terephthalic acid. Examples thereof include liquid crystalline polyesteramides (Japanese Patent Laid-Open No. 64-33123) produced from acids, p-aminobenzoic acid and polyethylene terephthalate.

  The liquid crystalline polyester that can be preferably used in the present invention is a copolymer comprising the above structural units (I), (II) and (IV), or comprising (I), (II), (III) and (IV). It is a copolymer, and the copolymerization amount of the structural units (I), (II), (III) and (IV) is arbitrary. However, the following copolymerization amount is preferable from the viewpoint of fluidity.

  That is, when the structural unit (III) is included, the total of the structural units (I) and (II) is the structural units (I) and (II) from the viewpoint of heat resistance, flame retardancy and mechanical properties. 60-95 mol% is preferable with respect to the sum total of (III) and 75-93 mol% is more preferable. Further, the structural unit (III) is preferably 40 to 5 mol%, more preferably 25 to 7 mol%, based on the total of the structural units (I), (II) and (III). The molar ratio [(I) / (II)] of the structural unit (I) to the structural unit (II) is preferably 75/25 to 95/5 from the viewpoint of the balance between heat resistance and fluidity. Preferably it is 78 / 22-93 / 7. The structural unit (IV) is substantially equimolar to the sum of the structural units (II) and (III).

  On the other hand, when the structural unit (III) is not included, the structural unit (I) is preferably 40 to 90 mol% based on the total of the structural units (I) and (II) from the viewpoint of fluidity. 60 to 88 mol% is particularly preferable. The structural unit (IV) is substantially equimolar with the structural unit (II).

  In the above, “substantially equimolar” means that the unit constituting the polymer main chain excluding the terminal is equimolar of the dioxy unit and the dicarbonyl unit, but the unit constituting the terminal is not necessarily equimolar. Means not limited.

  In addition, when polycondensating the liquid crystalline polyester that can be preferably used in the present invention, in addition to the components constituting the structural units (I) to (IV), 3,3′-diphenyldicarboxylic acid, 2,2 ′ Aromatic dicarboxylic acids such as diphenyldicarboxylic acid, aliphatic dicarboxylic acids such as adipic acid, azelaic acid, sebacic acid and dodecanedioic acid, alicyclic dicarboxylic acids such as hexahydroterephthalic acid, chlorohydroquinone, methylhydroquinone, 4, Aromatic diols such as 4′-dihydroxydiphenyl sulfone, 4,4′-dihydroxydiphenyl sulfide, 4,4′-dihydroxybenzophenone, 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, 1,4 -Cyclohexanediol, 1,4-cyclohexane dimethyl In addition, an aliphatic group such as a diol, an alicyclic diol, an aromatic hydroxycarboxylic acid such as an m-hydroxybenzoic acid and a 2,6-hydroxynaphthoic acid, and the like are further added in a small proportion within a range that does not impair the object of the present invention. It can be polymerized. Further, examples of the liquid crystalline polyester amide preferably include those obtained by copolymerizing p-aminophenol and / or p-aminobenzoic acid with the above preferred liquid crystalline polyester.

  The method for producing the liquid crystalline resin in the present invention is not particularly limited, and can be produced according to a known polyester polycondensation method.

For example, in the production of the above-mentioned liquid crystalline polyester that is preferably used, when the structural unit (III) is not included, the production methods of the following (1) and (2) include the structural unit (III): ) Is preferably mentioned.
(1) Deacetic acid polycondensation reaction from diacylated products of aromatic dihydroxy compounds such as p-acetoxybenzoic acid and 4,4′-diacetoxybiphenyl, 4,4′-diacetoxybenzene, and aromatic dicarboxylic acids such as terephthalic acid A method for producing a liquid crystalline polyester.
(2) Acetic anhydride is reacted with p-hydroxybenzoic acid, aromatic dihydroxy compounds such as 4,4′-dihydroxybiphenyl and hydroquinone, and aromatic dicarboxylic acids such as terephthalic acid and isophthalic acid to acylate phenolic hydroxyl groups. And then producing a liquid crystalline polyester by a deacetic acid polycondensation reaction.
(3) In the presence of a bis (β-hydroxyethyl) ester of an aromatic dicarboxylic acid such as a polyester polymer such as polyethylene terephthalate, an oligomer, or bis (β-hydroxyethyl) terephthalate, by the method of (1) or (2) A method for producing a liquid crystalline polyester.

  Although these polycondensation reactions proceed even without a catalyst, it is sometimes preferable to add a metal compound such as stannous acetate, tetrabutyl titanate, potassium acetate and sodium acetate, antimony trioxide, and metal magnesium.

  Some (A) liquid crystalline resins in the present invention are capable of measuring logarithmic viscosity in pentafluorophenol. In that case, the value measured at 60 ° C. at a concentration of 0.1 g / dl is 0. 5 dl / g or more is preferable, and when the structural unit (III) is included, 1.0 to 3.0 dl / g is preferable, and when the structural unit (III) is not included, 2.0 to 10.0 dl / g is preferable. Is preferred.

  In addition, the melt viscosity of the (A) liquid crystalline resin in the present invention is preferably 1 to 2,000 Pa · s, and more preferably 2 to 1,000 Pa · s.

  In addition, said melt viscosity is the value measured with the Koka flow tester on condition of melting | fusing speed | rate (Tm) +10 degreeC of liquid crystalline resin, and the conditions of a shear rate of 1,000 / sec.

  Here, the melting point (Tm) refers to the endothermic peak temperature Tm1 observed when the polymer is measured from the room temperature at 20 ° C./min by differential calorimetry, and then the temperature is increased to Tm1 + 20 ° C. Then, after holding at the same temperature for 5 minutes, the temperature is once cooled to room temperature under a temperature drop condition of 20 ° C./min, and then the endothermic peak temperature observed when measured again under a temperature rise condition of 20 ° C./min.

  The liquid crystalline resin molded product of the present invention can be obtained by molding a composition in which the above liquid crystalline resin is blended with known fillers, additives and the like. Specific examples of fillers and additives to be added to the liquid crystalline resin composition include fibrous reinforcing materials (for example, glass fibers, milled glass fibers, carbon fibers, alumina fibers, silicon carbide fibers, ceramic fibers, asbestos fibers, Gypsum fibers, whiskers (for example, aluminum borate whiskers, potassium titanate whiskers, gypsum whiskers, etc.), metal fibers (for example, stainless steel fibers, magnesium fibers, copper fibers, etc.), scaly reinforcements (for example, mica, talc, etc.) , Kaolin, glass flakes, wollastonite, graphite, etc.), antioxidants and heat stabilizers (eg hindered phenols, hydroquinones, phosphites and their substitutes), UV absorbers (eg resorcinol, salicylate, benzotriazole) , Benzo Enone), release agents (such as montanic acid and salts thereof, esters thereof, half esters thereof, stearyl alcohol, stearamide and polyethylene wax), dyes (such as nigrosine) and pigments (such as cadmium sulfide, phthalocyanine, carbon black) Normal additives such as colorants, plasticizers, flame retardants, flame retardant aids, antistatic agents, and other thermoplastic resins (such as fluororesins) can be added to impart predetermined characteristics. . In this case, since it is not preferable to easily inhibit the adhesion, attention should be paid to the type and the amount added.

  In addition, as a method of molding this liquid crystalline resin composition, it is molded into various molded products by molding methods such as injection molding, extrusion molding, sheet molding, blow molding, etc., but by utilizing its excellent thin-wall fluidity, injection molding It is preferable to do.

When joining the liquid crystalline resin molded products thus obtained, an epoxy, silicone, urethane or cyanoacrylate adhesive is usually used, preferably an epoxy or silicone adhesive, more preferably silicone. Adhesives based on adhesives are used, but even if the molded product is directly joined with an adhesive, the adhesive strength is low and it is often not suitable for actual use.
Therefore, it is important to heat-treat the liquid crystalline resin molded product by the method of the present invention before joining.

  The heat treatment temperature must be higher than the treatment temperature at the time of bonding and not more than the crystallization temperature of the liquid crystalline resin composition. Specifically, the heat treatment is more preferably performed at a temperature higher than 170 ° C., and the heat treatment is more preferably performed at a temperature higher than 200 ° C. If the temperature is equal to or lower than the processing temperature at the time of bonding, the bonding strength is not improved, and if it is higher than the crystallization temperature of the liquid crystalline resin composition, the shape of the molded product cannot be maintained, which is not preferable.

  Here, the crystallization temperature (Tc) of the liquid crystalline resin composition is Tm1 + 20 ° C. after observing the endothermic peak temperature Tm1 observed when the polymer is measured by differential calorimetry under the temperature rising condition from room temperature to 20 ° C./min. This is the exothermic peak temperature observed when the temperature is raised to a temperature of 5 ° C., kept at the same temperature for 5 minutes, and then cooled to room temperature under a temperature drop condition of 20 ° C./min.

  Moreover, although it does not specifically limit as heat processing time, It is preferable to carry out between 0.1 hours-24 hours, and it is more preferable to carry out between 0.5 hours-10 hours.

  Furthermore, the heat treatment can be performed under any conditions such as a nitrogen atmosphere or an air atmosphere, but it is preferable to perform in a nitrogen atmosphere in terms of thermal stability.

  By performing the heat treatment time within this range, the adhesive strength of the bonded molded product can be improved.

  As described above, after the molded product made of the liquid crystalline resin composition is heat-treated at the above temperature, the bonded molded product made of the liquid crystalline resin composition of the present invention can be obtained by performing the bonding treatment.

  The partner member to which the liquid crystalline resin composition molded product is joined is joined with a liquid crystal resin composition molded product, a molded product made of another resin composition, a member according to the use of the joint molded product such as metal or ceramics. Preferably, the liquid crystal resin composition molded articles are joined to each other.

  It is preferable to use an epoxy-based, silicone-based, urethane-based, or cyanoacrylate-based adhesive for the bonding treatment of the liquid crystalline resin molded product. Here, the epoxy adhesive is a one-component or two-component adhesive containing an epoxy group, and either a room temperature curable type or a heat curable type can be used. The curing temperature is preferably 120 ° C. or higher and lower than 170 ° C. A silicone adhesive is an adhesive containing a silicone resin, which is a one-component or two-component adhesive, and can be used at room temperature curing type or heat curing type. A curing type is preferable, and a curing temperature is preferably 120 ° C. or higher and lower than 170 ° C.

  In addition, since air is often involved during application of the adhesive, it is preferable to deaerate by applying pressure to the joint surface before performing the curing process.

  In addition, when the liquid crystalline resin molded product is bonded, the bonding surface can be roughened to provide unevenness, or the skin layer can be scraped to improve the adhesion. As a method of roughening the joint surface, a method of applying a frictional force to the surface with sandpaper, a file, a method of applying thermal energy to the surface with a laser or a soldering iron, a method of roughening the surface by dissolving the surface with chemicals, or the like is preferable.

  And the liquid crystalline resin molded product of the present invention is not limited to applications such as electricity, electronics, automobiles, machinery, miscellaneous goods, and can be used as molded products for applications that require bonding with an adhesive, but a silicone adhesive is used. Utilizing the point that it can be used for bonding, it can be preferably used as an adhesive seal in a portion requiring airtightness.

  Specific examples of molded products made of the liquid crystalline resin composition of the present invention include: various housings, housings, coil sealing parts, containers enclosing gas, liquid, solid, etc., relay parts, metal insert parts, card connectors , FPC connectors, precision component transport containers, optical pickup lens holders, molded products mounted on printed boards, and the like.

  Hereinafter, the present invention will be described in more detail by way of examples.

[Reference Example 1]
994 parts by weight of p-hydroxybenzoic acid, 126 parts by weight of 4,4′-dihydroxybiphenyl, 112 parts by weight of terephthalic acid, 216 parts by weight of polyethylene terephthalate having an intrinsic viscosity of about 0.6 dl / g, and 960 parts by weight of acetic anhydride are stirred. A reaction vessel equipped with a blade and a distilling tube was charged, while stirring in a nitrogen gas atmosphere, the reaction was carried out for 3 hours while raising the temperature from room temperature to 150 ° C., and the temperature was raised from 150 ° C. to 250 ° C. in 2 hours. The temperature was raised from 350 ° C. to 330 ° C. over 1.5 hours, then the pressure was reduced to 6.5 × 10 −3 Pa at 325 ° C. over 1.5 hours, and stirring was continued for about 0.25 hours to perform polycondensation. Melting point 314 ° C., melt viscosity 25 Pa · s (324) consisting of 80 molar equivalents of aromatic oxycarbonyl units, 7.5 molar equivalents of aromatic dioxy units, 12.5 molar equivalents of ethylene dioxy units, 20 molar equivalents of aromatic dicarboxylic acid units A liquid crystalline polyester (A1) having a temperature of 0 ° C., an orifice of 0.5 mm diameter × 10 mm, and a shear rate of 1,000 / second was obtained.

[Reference Example 2]
994 parts by weight of p-hydroxybenzoic acid, 168 parts by weight of 4,4′-dihydroxybiphenyl, 150 parts by weight of terephthalic acid, 173 parts by weight of polyethylene terephthalate having an intrinsic viscosity of about 0.6 dl / g, and 1011 parts by weight of acetic anhydride were stirred. Charged to a reaction vessel equipped with a blade and a distilling tube, stirred for 3 hours while raising the temperature from room temperature to 150 ° C. with stirring in a nitrogen gas atmosphere, heated from 150 ° C. to 250 ° C. in 2 hours, After raising the temperature to 335 ° C. over 1.5 hours, the pressure was reduced to 6.5 × 10 −3 Pa at 335 ° C. over 1.5 hours, and stirring was continued for about 0.25 hours to perform polycondensation. Melting point 328 ° C., melt viscosity 18 Pa · s (338 ° C., orifice 0) consisting of 80 molar equivalents of aromatic oxycarbonyl units, 10 molar equivalents of aromatic dioxy units, 10 molar equivalents of ethylene dioxy units, and 20 molar equivalents of aromatic dicarboxylic acid units A liquid crystalline polyester (A2) having a diameter of 0.5 mm × 10 mm and a shear rate of 1,000 / second was obtained.

[Reference Example 3]
870 parts by weight of p-hydroxybenzoic acid, 327 parts by weight of 4,4′-dihydroxybiphenyl, 89 parts by weight of hydroquinone, 292 parts by weight of terephthalic acid, 157 parts by weight of isophthalic acid and 1367 parts by weight of acetic anhydride (1. 03 equivalents) was charged into a reaction vessel equipped with a stirring blade and a distillation tube, and reacted for 2 hours while raising the temperature from room temperature to 145 ° C. with stirring in a nitrogen gas atmosphere, from 145 ° C. to 320 ° C. in 4 hours. The temperature rose. Thereafter, the polymerization temperature was reduced to 133 Pa at 320 ° C. for 1.0 hour, and the mixture was further stirred for about 1.5 hours to carry out polycondensation. The p-oxybenzoate unit is 70 molar equivalents relative to the sum of the p-oxybenzoate unit, the 4,4′-dioxybiphenyl unit and the 1,4-dioxybenzene unit, and the 4,4′-dioxybiphenyl unit is 4 Melting point 314 ° C., melting point 70 mol equivalent to the total of 4,4′-dioxybiphenyl unit and 1,4-dioxybenzene unit, terephthalate unit consisting of 65 mol equivalent to the sum of terephthalate unit and isophthalate unit A liquid crystalline polyester (A3) having a viscosity of 25 Pa · s (324 ° C., orifice 0.5 mm diameter × 10 mm, shear rate 1,000 / sec) was obtained.

[Reference Example 4]
According to Japanese Patent Laid-Open No. 54-77691, 921 parts by weight of p-acetoxybenzoic acid and 435 parts by weight of 6-acetoxy-naphthoic acid were charged into a reaction vessel equipped with a stirring blade and a distillation tube, and polycondensation was performed. Melting point 283 ° C. melt viscosity 30 Pa · s (293 ° C., orifice 0.5 mm diameter × 10 mm, consisting of 57 molar equivalents of structural units produced from p-acetoxybenzoic acid and 22 molar equivalents of structural units produced from 6-acetoxy-naphthoic acid, A liquid crystalline polyester (A4) having a shear rate of 1,000 / second was obtained.

[Examples 1 to 4, Comparative Examples 1 to 9]
Fillers and additives were melt-kneaded with 100 parts by weight of the liquid crystalline resin obtained in Reference Examples 1 to 3 in the ratios shown in Tables 1 and 2, to obtain pellets. A differential calorimeter (model: Diamond) manufactured by PerkinElmer Co., Ltd. The crystallization temperature (Tc) and melting point (Tm) were measured by DSC. The pellets were molded using the SE-30D molding machine manufactured by Sumitomo Heavy Industries, Ltd. under the conditions of a melting point of + 10 ° C, a mold temperature of 90 ° C, and a filling time of 0.2 seconds. . Thereafter, heat treatment was performed at a temperature higher than the curing temperature of the adhesive for joining the molded product and lower than the crystallization temperature. Thereafter, 0.02 g of an adhesive was dropped on one of the molded products, and the other molded product was joined so that the adhesion area was 1 cm ² and fixed with a clip. Thereafter, bonding was performed at a predetermined curing temperature to obtain a bonded molded product shown in FIG. The joint molded product was subjected to a tensile test at a strain rate of 1 mm / min and a span distance of 80 mm, and the adhesive strength was obtained by dividing the maximum strength when the adhesive surface was peeled by the adhesive area.

  From the above results, it can be seen that the bonded molded article of the present invention is a molded article having excellent adhesiveness as compared with the bonded molded article of the comparative example.

  Since it is possible to obtain a joint molded product with improved adhesion of the liquid crystalline resin molded product of the present invention, it is suitably used for parts that require adhesion of high-functional products.・ Mounted on housing, coil sealing parts, containers filled with gas, liquid, solid, etc., relay parts, metal insert parts, card connectors, FPC connectors, precision parts transport containers, optical pickup lens holders, printed circuit boards It can be suitably used for molded articles and the like.

It is the schematic of the molded article created in the Example. It is the schematic of the joining molded article created in the Example.

Explanation of symbols

1 Molded Product 2 Liquid Crystalline Resin Composition Molded Product 3 Liquid Crystalline Resin Composition Molded Product 4 Adhesive G1 Side Gate

Claims (7)

A liquid crystalline resin composition characterized in that, after molding a composition containing a liquid crystalline resin, bonding is performed after heat treatment at a temperature higher than the treatment temperature at the time of bonding and lower than the crystallization temperature of the liquid crystalline resin composition. Joined molded product consisting of The bonded molded article comprising the liquid crystalline resin composition according to claim 1, wherein the heat treatment temperature is higher than 170 ° C. and the temperature is not higher than the crystallization temperature of the liquid crystalline resin composition. A method for treating a liquid crystalline resin molded article, comprising: heat-treating a composition containing a liquid crystalline resin at a temperature higher than a treatment temperature at the time of bonding and lower than a crystallization temperature of the liquid crystalline resin composition. The method for treating a liquid crystalline resin molded article according to claim 3, wherein the heat treatment temperature is higher than 170 ° C and not higher than the crystallization temperature of the liquid crystalline resin composition. 5. A method for joining liquid crystalline resin molded products, comprising joining the liquid crystalline resin molded products treated by the method for treating a liquid crystalline resin molded product according to claim 3 or 4. The method for joining liquid crystal resin molded products according to claim 5, wherein the joining is performed using an epoxy adhesive or a silicone adhesive. The method for bonding a liquid crystalline resin molded article according to claim 5 or 6, wherein the treatment temperature during bonding is 120 ° C or higher and lower than 170 ° C.

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