JP2006228780A - Method for packaging electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To precisely package electronic components while removing a thermal influence when packaging the electronic components, such as an IC chip having a bump (junction member) that is made minute, to a substrate. <P>SOLUTION: In the packaging of electronic components for packaging the electronic components on the substrate by bringing a plurality of electrodes in electronic components held by a component holding member into contact with a plurality of electrodes on the substrate held by a substrate holding member via the junction member, data on the amount of displacement in the distance between the component holding member and the substrate holding member generated following the expansion and contraction of the component holding member and the substrate holding member are acquired by a packaging preparation process when heating and cooling each junction member. The relative position control of the component holding member to the substrate holding member is made so that the amount of displacement is removed, based on the data, and the electronic component is packaged on the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for mounting an electronic component on a substrate, and in particular, mounts an electronic component such as an IC chip having micronized bumps at a component mounting position on a substrate placed on a stage. The present invention relates to an electronic component mounting method.

  Conventionally, various kinds of electronic component mounting methods are known. For example, there is a mounting method for an electronic component that mounts an electronic component such as an IC chip having bumps on a substrate placed on a stage (see, for example, Patent Documents 1 and 2).

  Specifically, cream solder is supplied by means of printing or the like onto a plurality of pads (substrate electrodes) formed at the component mounting position on the substrate placed on the stage, and the formation of each solder portion is performed. Do. Next, an electronic component in which bumps are formed on a plurality of electrodes arranged on the mounting side surface is sucked and held by a head tool on the surface opposite to the mounting side surface, and the component on the substrate The mounting position and the electronic component are aligned. Thereafter, the head tool is lowered and brought into contact with the pads of the substrate through the bumps and solder portions of the electronic components held by suction. After that, the bumps and solder parts are heated and melted by heating from the head tool and the stage, and then cooled and solidified, so that the respective electrodes of the electronic component and the respective pads of the substrate are respectively bumped. In addition, the electronic parts can be mounted at the component mounting positions on the board.

  In addition, the electronic component remains held by the head tool from the contact between the bump of the electronic component and the solder portion of the substrate until the respective bump and solder portion are cooled and solidified. Therefore, when mounting electronic components that can hold the relative position of the electronic component with respect to the substrate from contact to cooling and solidification reliably and with high accuracy and the bump pitch is narrowed Even so, it can be dealt with reliably.

  Furthermore, by providing the head tool with a load cell and performing a constant load control so as to keep the load at the time of the contact at a predetermined value, the extension amount of the head tool at the time of heating is substantially removed. Control (cancellation control of elongation amount) can be performed, and occurrence of bump crushing or the like can be suppressed by the elongation of the head tool caused by heat.

JP 2003-8196 A JP 2003-31993 A

  In recent years, the bump pitch in electronic parts has been increasingly narrowed, and along with this, the formed bumps themselves have been miniaturized, and thus the electronic parts having such miniaturized bumps can be mounted. It is hoped that.

  As the bump pitch narrows and bumps become smaller in this way, the distance between the mounting surface of the electronic component and the surface of the substrate must be securely held at a predetermined distance from the contact to cooling solidification. There is. In other words, it is necessary to reliably prevent the miniaturized bumps from being crushed and peeled off by maintaining the distance in this way.

  However, in the above-described conventional mounting method, since the bumps and the solder portions start to melt and then solidify, the bumps and the solder portions are melted to cause load loss. There is a problem in that it is impossible to perform constant load control for removing the amount of tool elongation and the like. In such a case, the extension or shrinkage of the head tool due to heat cannot be removed, and the distance between the mounting surface of the electronic component and the surface of the substrate (or the tip surface of the head tool and the stage) The distance between the substrate holding surface and the substrate holding surface cannot be maintained, and bump crushing or peeling may occur.

  On the other hand, while the bumps and solder parts are in a molten state as described above, the extension amount and shrinkage amount of the head tool are measured using a special measuring instrument, and the elongation amount / shrinkage amount is calculated based on the measurement result. It is conceivable to perform such control as to eliminate. However, during the above heating and cooling, not only the head tool, but also the stage and the electronic component itself are stretched and shrunk, and it is difficult to measure all these states, and it is possible to measure, for example. Even so, the configuration of the measuring instrument becomes complicated and the equipment cost increases, and there is a problem that it is difficult in practice.

  Accordingly, an object of the present invention is to solve the above-described problem, and to remove a thermal influence in mounting an electronic component such as an IC chip having a miniaturized bump (joining member) on a substrate. An object of the present invention is to provide an electronic component mounting method that enables reliable and highly accurate mounting.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the plurality of electrodes in the electronic component held by the component holding member are brought into contact with the plurality of electrodes in the substrate held by the substrate holding member with the joining member interposed therebetween. Then, each of the joining members is heated and melted, and each of the melted joining members is cooled and solidified, and then the holding of the electronic component by the component holding member is released, and the electronic component is In the mounting method of electronic components to be mounted on a substrate,
Data on the amount of displacement of the distance between the component holding member and the substrate holding member, which is generated when the component holding member and the substrate holding member are expanded or contracted, which can be generated when the respective bonding members are heated and cooled. Get
The relative position of the component holding member with respect to the substrate holding member so as to remove the displacement amount based on the acquired displacement amount data of the distance when the respective bonding members are heated and cooled. An electronic component mounting method is provided, wherein the electronic component is mounted on the substrate by performing control.

  According to the second aspect of the present invention, the displacement data of the distance is obtained by the component holding accompanying the expansion or contraction caused by the heat amount change transmitted to the component holding member and the substrate holding member by the heating or cooling. The component holding for moving the component holding surface close to or away from the substrate holding surface so as to remove the displacement amount of the distance between the component holding surface of the member and the substrate holding surface of the substrate holding member. An electronic component mounting method according to a first aspect, which is position data of a movement position of a member, is provided.

According to the third aspect of the present invention, the displacement data of the distance includes the elongation generated in the substrate and the electronic component in a direction orthogonal to the component holding surface when the respective joining members are heated or cooled. Or data on the amount of displacement of the distance due to shrinkage,
The electronic component mounting method according to the second aspect, wherein the component holding member is moved so as to further remove the expansion and contraction of the substrate and the electronic component.

According to the fourth aspect of the present invention, the data acquisition electronic component formed of substantially the same material as the electronic component is held by the component holding member, and the surface of the substrate held by the substrate holding member In addition, the heating and cooling of the data acquisition electronic component is performed based on the same temperature profile as the temperature profile in the heating and cooling of the respective joining members while directly contacting the data acquisition electronic component. As the data of the displacement amount of the distance between the component holding member and the substrate holding member during the heating and cooling, the data held by the component holding member during the heating and cooling. The position of the component holding member when the position control of the component holding member is performed so that the load applied to the electronic component for data acquisition is substantially constant. To get the location data,
When the electronic component is mounted on the substrate using the bonding members, the substrate holding member is controlled by controlling the position of the component holding member based on the acquired position data of the component holding member. The electronic component mounting method according to any one of the first aspect to the third aspect, in which the amount of displacement of the distance between the electronic component and the component holding member is removed.

According to the fifth aspect of the present invention, in the position control of the component holding member such that the load is substantially constant, from the generation of the displacement amount of the distance between the substrate holding member and the component holding member, Obtain control time difference data required to complete the removal of the load change caused by the generation of the displacement,
When the electronic component is mounted on the substrate using each of the bonding members, a distance between the substrate holding member and the component holding member based on the acquired position data and the control time difference data. The electronic component mounting method according to the fourth aspect, wherein the position control of the component holding member is performed so as to remove the displacement amount.

According to the sixth aspect of the present invention, when mounting the electronic component on the substrate using the respective joining members,
In the process of cooling and solidifying the melted joining member, the amount of change in load applied to the electronic component is detected,
In accordance with the detected change amount of the load, the position data of the component holding member is corrected so that the change amount of the load is removed,
The electronic component mounting method according to the fourth aspect, in which the position control of the component holding member is performed based on the corrected position data.

According to the seventh aspect of the present invention, the load applied to the electronic component from the component holding member is observed during the period from the contact of the electronic component to the substrate to the solidification of the respective joining members. ,
When it is detected that the observed load exceeds or is insufficient with respect to the load profile, the position data of the component holding member is corrected so as to suppress the occurrence of the excess or deficiency,
The electronic component mounting method according to the fourth aspect, in which the position control of the component holding member is performed based on the corrected position data.

According to an eighth aspect of the present invention, the joining member is a bump formed on each of the electrodes of the electronic component,
The electronic component for data acquisition provides the electronic component mounting method according to any one of the fourth aspect to the seventh aspect, in which the respective bumps are not formed.

  According to the present invention, when an electronic component is mounted on a board, the component holding member, the board holding member, and the electronic component itself or the board itself are caused by the expansion / contraction caused by heat. By performing relative position control of the component holding member with respect to the substrate holding member, based on the displacement amount data, the displacement amount of the distance between the component holding surface and the substrate holding surface of the substrate holding member, It can be removed reliably.

  In particular, the amount of displacement generated in a composite or comprehensive manner due to such expansion / contraction of each member is such that the electronic component is disposed between the component holding surface and the substrate holding surface in an actual mounting process. Therefore, for example, it is difficult to measure using a displacement measuring device, or it is difficult to measure due to load loss in a load detected by a load cell or the like due to heating and melting of the joining member. However, by using the data acquisition electronic component as in the present invention, the displacement amount can be measured in advance as a mounting preparation step, and the displacement amount data can be created.

  That is, an electronic component without bumps that does not contain a material that is melted by heating at the time of mounting is used as the data acquisition electronic component, and the data acquisition electronic component is heated / heated using a temperature profile at mounting. A movement trajectory of the height position of the component holding member when constant load control is performed while performing cooling control is acquired as profile data (position data), and based on the acquired profile data, the component holding member By mounting the actual electronic component on the substrate while performing movement control, it is possible to remove the influence of the heat caused by the expansion / contraction of each member.

  Therefore, in particular, the above electronic components having bumps whose bump pitch is narrowed and whose diameter is miniaturized are reliably and highly accurate while eliminating the influence of expansion / contraction of each member due to heat. Can be implemented. In particular, such a mounting method is not limited to the case where the electronic component is mounted on the substrate, and each bump formed on the electronic component, and each bump formed on another electronic component, The present invention can also be effectively applied to a chip-on-chip mounting method that joins the two.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

  In the electronic component mounting method according to the present invention, a plurality of electrodes of an electronic component are brought into contact with a plurality of electrodes of a substrate with a joining member interposed therebetween, and each joining member is melted and solidified to interpose each joining member. The electronic component mounting method according to the embodiment of the present invention will be described in detail with reference to the drawings.

  First, a schematic perspective view showing a configuration of an electronic component mounting apparatus used in the electronic component mounting method of the present embodiment is shown in FIG. As shown in FIG. 1, in an electronic component mounting apparatus 201, a head tool 3 that is an example of a component holding member that mounts an electronic component is fixed to a nut portion of an X-direction moving device 22, and the X-direction moving device 22 rotates the ball screw shaft by a motor to move the head tool 3 fixed to the nut portion screwed to the ball screw shaft in the X1 direction to the right in the X direction in the drawing or the X2 direction to the left.

  Moreover, as shown in FIG. 2 which is a schematic cross-sectional view of the head tool 3 (schematic configuration diagram using a cross-sectional view), the electronic component mounting apparatus 201 is an elevating and lowering device that is an example of an elevating mechanism that lowers or raises the head tool 3 A portion 21 is provided. Further, the head tool 3 heats the suction nozzle 11 which is an example of a suction holding mechanism that sucks and holds the electronic component at the tip thereof, and the electronic component sucked and held by the suction nozzle 11 by heating the suction nozzle 11. A ceramic heater 12 as an example of a heating device, and a cooling blow nozzle 19 as an example of a cooling device for cooling an electronic component heated by the ceramic heater 12 are provided. Here, as an example, the heating device is the ceramic heater 12 provided in the head tool 3, but instead of the ceramic heater 12, heating is performed by blowing hot air on the electronic component and the substrate. The case where an electronic component mounting apparatus is provided with a heating part may be sufficient. A detailed description of the structure of the head tool 3 will be given later.

  In FIG. 1, the slide base 6 is fixed to the nut portion of the Y-direction moving device 23, and the Y-direction moving device 23 is fixed to the nut portion screwed to the ball screw shaft by rotating the ball screw shaft by a motor. The slide base 6 thus moved is moved in the Y1 direction facing right in the Y direction in the figure or the Y2 direction facing left. A plurality of electronic components 1 are supplied to a parts tray 5 fixed on the slide base 6, and the substrate 4 is positioned and fixed to a stage 7 which is an example of a substrate holding member fixed on the slide base 6. ing. Note that the X direction and the Y direction in FIG. 1 are orthogonal to each other. In the above description, the case where the head tool 3 is provided with the ceramic heater 12 as a heating device in the electronic component mounting apparatus 201 has been described, but instead of such a case, the stage 7 Alternatively, a case where a heating device is incorporated may be used.

  Furthermore, the electronic component mounting apparatus 201 includes a control device 9 that is a control device that controls each component in the electronic component mounting apparatus 201, and includes a moving operation of the elevating unit 21, a moving operation of the X-direction moving device 22, The movement operation of the Y-direction moving device 23, the suction holding operation of the suction nozzle 11 of the head tool 3, and the heating operation of the ceramic heater 12 of the head tool 3 are controlled by the control device 9.

  FIG. 3 is a diagram for explaining the electronic component mounting method according to the present embodiment, using schematic cross-sectional views of the electronic component 1 and the substrate 4. As shown in FIG. 3B, the rectangular plate-shaped electronic component 1 has a large number of electrodes 1a on the bonding surface, and each electrode 1a has a bump 1b as an example of a bonding member made of a metal material, for example, Pre-formed with a solder material. Further, as shown in FIG. 3A, the rectangular plate-like substrate 4 has pads 4a which are a large number of electrodes on the upper surface, and a solder portion 2 which is an example of a joining member is provided on each pad 4a. For example, it is formed by supplying cream solder in advance using means such as printing. Moreover, each pad 4a of the board | substrate 4 is arrange | positioned in the position corresponding to each electrode 1a of the electronic component 1 so that each electrode 1a of the electronic component 1 and each pad 4a of the board | substrate 4 can be joined. Here, the electronic component 1 has, for example, a bump pitch that is an interval pitch of the bumps 1b formed on each electrode 1a of 70 μm or less, a bump diameter of 30 μm, and a formation height of 20 μm. It is an electronic component that requires high bonding position accuracy, such as a high-end IC chip having a narrowed and miniaturized bump.

  Next, an outline of the procedure of a method for mounting the electronic component 1 on the substrate 4 using the electronic component mounting apparatus 201 will be described. The detailed mounting procedure will be described later.

  First, in FIG. 1, a slide base 6 to which a parts tray 5 on which a plurality of electronic components 1 are supplied and arranged is fixed is moved in the Y1 or Y2 direction by a Y direction moving device 23, and an X direction moving device. 22, the head tool 3 is moved in the X1 or X2 direction so that one electronic component 1 arranged in the parts tray 5 can be sucked by the suction nozzle 11 at the tip of the head tool 3. The tool 3 is aligned with the electronic component 1. Thereafter, the head tool 3 is lowered by the elevating unit 21, the back surface, which is a surface not having the electrodes 1 a of the electronic component 1, is sucked and held by the suction nozzle 11 of the head tool 3, and the head tool 3 is raised by the lifting unit 21 The electronic component 1 is taken out from the parts tray 5. Here, the case where the electronic component 1 is arranged on the parts tray 5 with the back side up has been described. However, even if the electronic component 1 is arranged with the back side down, the head of the electronic component 1 is arranged. By providing a reversing mechanism for reversing the electronic component 1 before sucking and holding the tool 3 to the suction nozzle 11, the suction nozzle 11 can suck and hold the back surface of the electronic component 1. In addition, it may replace with supply of each electronic component 1 from the parts tray 5, and the case where each electronic component 1 is supplied from a wafer by providing a wafer supply part may be sufficient.

  Next, in FIG. 1, the slide base 6 fixing the stage 7 to which the substrate 4 is fixed is moved in the Y1 or Y2 direction by the Y-direction moving device 23, and the electronic component 1 is held by suction. The head tool 3 is moved in the X1 or X2 direction by the X-direction moving device 22, and each bump 1b formed on each electrode 1a of the electronic component 1 is replaced with each pad 4a on the substrate 4 as shown in FIG. The electronic component 1 and the substrate 4 are aligned so that they can be joined to the solder parts 2 above.

  Thereafter, as shown in FIG. 3C, the head tool 3 is lowered by the elevating unit 21, and the bumps 1 b of the electronic component 1 held by the suction nozzle 11 are fixed to the stage 4. Are brought into contact with each solder part 2.

  After this contact, as shown in FIG. 3D, the suction nozzle 11 is heated by the ceramic heater 12 of the head tool 3, and each bump 1b of the electronic component 1 held by the suction nozzle 11 is held. The solder portions 2 of the substrate 4 that are in contact with the bumps 1b are heated. Further, the heating temperature of the suction nozzle 11 by the ceramic heater 12 is raised to a temperature equal to or higher than the melting point of the solder forming each bump 1b and equal to or higher than the melting point of the solder forming each solder portion 2. 1b and each solder part 2 are melted.

  Thereafter, as shown in FIG. 3E, after the heating by the ceramic heater 12 is stopped, the molten solder is cooled by blowing from the cooling blow nozzle 19, so that the solder is solidified and the electronic component 1 is Each electrode 1a and each pad 4a of the board | substrate 4 are joined in the state which interposed solder. Instead of forced cooling by the cooling blow nozzle 19 to the molten solder, the solder may be solidified by naturally cooling the molten solder.

  Thereafter, as shown in FIG. 3F, the suction holding of the electronic tool 1 by the suction nozzle 11 at the tip of the head tool 3 is released, and the head tool 3 is raised by the elevating part 21. When a plurality of electronic components 1 are mounted on the substrate 4, these operations are repeated for each electronic component 1, and each electronic component 1 is individually mounted on the substrate 4.

  In the above description, the case where the bonding members are the bumps 1b formed in advance on the electrodes 1a of the electronic component 1 and the solder portions 2 formed in advance on the pads 4a of the substrate 4 has been described. The bonding member may be only the bumps 1b formed in advance on the electrodes 1a of the electronic component 1.

  Furthermore, the oxide film on the surface of each joint portion is removed on each electrode 1a of the electronic component 1 or each pad 4a of the substrate 4 or each bump 1b or each solder portion 2 which is a joining member, and the molten solder You may supply the flux which can make wettability favorable by application | coating previously. Depending on the type of flux supplied and supplied, the electronic component 1 may be mounted on the substrate 4 and then the supplied and supplied flux may be removed by washing.

  Next, the structure of the head tool 3 in the electronic component mounting apparatus 201 will be described in detail with reference to FIG. 2 which is a cross-sectional view schematically showing the structure of the head tool 3.

  In FIG. 2, the head tool 3 supports a head tool tip 3 a that performs operations such as suction holding and heating to the electronic component 1, and a head that supports the head tool tip 3 a and is moved up and down with respect to the head tool 3. It is comprised by the tool main-body part 3b.

  From the tip side, the head tool tip portion 3 a is provided with a suction nozzle 11 capable of sucking and holding the electronic component 1, a ceramic heater 12 for heating the electronic component 1 sucked and held by the suction nozzle 11, and the ceramic heater 12. The water jacket 13 is a cooling unit that cuts off heat so that the heat is not transmitted to the head tool body 3b, and the shaft 17 is an example of a shaft portion attached to the upper portion of the water jacket 13. A cooling blow nozzle 19 for cooling the electronic component 1 heated by the ceramic heater 12 by blowing is attached around the lower portion of the shaft 17.

  The head tool main body 3b includes a frame 16 that is an example of a support that supports the head tool tip 3a, and a load cell 14 that is an example of a load detection unit attached to the frame 16.

  The frame 16 has a substantially U-shape formed by a rigid body, and an upper frame 16a that supports the load cell 14 and a shaft 17 of the head tool tip 3a are arranged on a side of the shaft 17. A lower frame 16b that supports a self-weight canceling spring 15 as an example of an elastic body attached to the lower portion of the projecting spring receiving portion 18 so as to wind the outer periphery of the shaft 17 and guides the vertical movement of the shaft 17; It is constituted by a cylindrical intermediate frame 16c that supports the upper frame 16a and the lower frame 16b.

  The shaft 17 has a step portion 17c near the middle in the axial direction, and the shaft lower portion 17b of the shaft 17 has a smaller diameter than the shaft upper portion 17a with the step portion 17c as a boundary. Further, the shaft lower portion 17b passes through a hole 16d formed in the lower frame 16b that supports the shaft 17 via a self-weight canceling spring 15, and the hole 16d of the lower frame 16b moves up and down the shaft 17. Is formed so as to be smaller than the diameter of the shaft upper portion 17a of the shaft 17. Thus, the shaft 17 can be moved up and down while being supported by the lower frame 16b via the self-weight canceling spring 15 and guided by the hole 16d of the lower frame 16b. Even when it becomes impossible to support 17, the periphery of the hole 16 d of the lower frame 16 b can support the shaft 17 by the stepped portion 17 c of the shaft 17, and the shaft 17 does not fall. .

  Further, the shaft lower portion 17b includes a ball spline outer ring and a shaft, the lower frame 16b includes a bearing inside the hole 16d, and the ball spline outer ring is attached to the inside of the bearing, whereby the shaft 17 While being supported by 16b, it is possible to rotate about the axis and to move up and down in the axial direction.

  Moreover, the both ends of the cylindrical shape of the intermediate frame 16c are fixed to the nut part 21b of the elevating part 21, and the ball screw shaft 21a screwed to the nut part 21b in the elevating part 21 is rotated by the motor 21m. The intermediate frame 16c is moved up and down, whereby the frame 16 is moved up and down, and the entire head tool 3 is moved up and down.

  The centers of the suction nozzle 11, the ceramic heater 12, the water jacket 13, the shaft 17, and the load cell 14 are arranged on the same axis, and this shaft is arranged to be parallel to the lifting operation axis of the lifting unit 21. Therefore, the suction nozzle 11, the ceramic heater 12, the water jacket 13, the shaft 17, and the load cell 14 can be moved up and down on the same axis by the lifting operation by the lifting unit 21.

  Further, an upper end of the shaft 17 at the head tool tip 3a is attached to the lower surface 16b of the load cell 14 by a self-weight canceling spring 15 attached to the lower frame 16b and supporting the shaft 17 via a spring receiving portion 18. The load acting on the shaft 17 of the head tool tip 3 a can be detected by the load cell 14.

  Moreover, the cooling blow nozzle 19 attached to the periphery of the lower shaft portion 17b that is the lower periphery of the shaft 17 is formed so as to go around both sides of the water jacket 13 and the ceramic heater 12 positioned under the shaft 17, The tip of the cooling blow nozzle 19 is directed to the electronic component suction holding surface which is the lower surface of the suction nozzle 11, and the electronic component 1 sucked and held by the suction nozzle 11 can be cooled by the blow from the cooling blow nozzle 19. Yes.

  Further, the control device 9 controls the suction operation of the suction nozzle 11, the heating operation of the ceramic heater 12, and the movement operation of the elevating unit 21 so that the load detected by the load cell 14 is output to the control device 9. It is configured.

  Here, a block diagram showing a configuration of the control device 9 provided in the electronic component mounting apparatus 201 is shown in FIG. As shown in FIG. 4, the control device 9 is a motor that performs operation control (that is, motor control) of the elevating unit 21, the X-direction moving device 22, and the Y-direction moving device 23 that are drive systems in the electronic component mounting apparatus 201. A control unit 94, a load control unit 95 that controls the operation of load detection by the load cell 14, and a temperature control unit 96 that controls the heating operation by the ceramic heater 12 are provided. A thermocouple 12 a that is a temperature detection unit is provided in the vicinity of the ceramic heater 12, and a temperature detection result by the thermocouple 12 a is input to the temperature control unit 96. Note that only the main control unit included in the control device 9 will be described here. Besides, for example, a control unit that controls the operation of the cooling blow nozzle 19 and an adsorption holding operation by the adsorption nozzle 11. A control unit for controlling the above is provided.

  As shown in FIG. 4, the control device 9 includes a processing unit 91 that performs overall control while associating control operations in the plurality of control units 94, 95, and 96 with each other. Further, the control device 9 includes a memory unit 93 that is an example of a storage unit that stores the control programs and control data that are the basis of these control operations, and the detected and measured data in a readable manner, and is necessary for the control operations. An operation / display unit 92 for displaying various operations and driving information is provided.

  The memory unit 93 in the control device 9 includes, for example, a mounting program for determining the driving amount and timing of each driving device, preset contact load data described later, a temperature profile of heating or cooling temperature, and the like. Is held readable. In addition, when the lifting / lowering unit 21 is controlled by the motor control unit 94 and the suction nozzle 11 equipped with the head tool tip 3a is raised or lowered, data on the height position of the tip of the suction nozzle 11 is obtained. It can be acquired and stored in the memory unit 93.

  Next, a control method in which the load cell 14 is controlled by the load control unit 95 of the control device 9 to detect a contact load generated when the electronic component 1 and the substrate 4 are in contact will be described.

  After alignment of the electronic component 1 and the substrate 4, the head tool 3 is lowered by the elevating unit 21 while the electronic component 1 is sucked and held by the suction nozzle 11, and each bump 1 b of the electronic component 1 is moved to each solder portion 2 of the substrate 4. Abut. At this time, a contact load is generated between each bump 1b of the electronic component 1 and each solder portion 2 of the substrate 4, and the contact load is in contact with the load detection surface of the load cell 14 of the head tool 3. The upper end of the shaft 17 of the head tool tip 3 a pushes up the load detection surface of the load cell 14, and this contact load is detected by the load cell 14.

  The load data detected in this way is input to the load control unit 95 of the control device 9, and preset contact load data held in the memory unit 93 is read by the processing unit 91 to load the load data. The load is input to the control unit 95, and the load control unit 95 compares the detected load data with preset contact load data. Based on the comparison result, the lifting / lowering unit 21 is controlled by the motor control unit 94 via the processing unit 91, and the head tool 3 is lowered by a minute amount by the lifting / lowering unit 21 so as to obtain a preset contact load. Or raise. Thereby, the contact load detected by the load cell 14 can be set to a preset contact load. Such a detected load control method can be referred to as a constant load control method.

  Next, using the electronic component mounting apparatus 201 having such a configuration, the electronic component 1 having the miniaturized bumps 1b is mounted on the substrate while taking into account the amount of expansion and contraction of the head tool 3 and the stage 7 due to heat. A mounting method for mounting with a high mounting position accuracy of 4 will be specifically described below.

  In the electronic component mounting method of this embodiment, the amount of expansion and contraction due to heat of the head tool 3, the stage 7, and the electronic component 1 itself as a mounting preparation step before actually mounting the electronic component on the substrate. Get the data. However, since it is actually difficult to measure the data of the amount of expansion and contraction due to heat individually for each component member, the amount of expansion and contraction is aggregated. As the data, the amount of displacement data of the distance between the component holding surface of the suction nozzle 11 and the substrate holding surface of the stage 7 associated with the expansion or contraction is acquired.

  More specifically, as the data acquisition electronic component 20 formed of substantially the same material as that of the electronic component 1, an electronic component in which the bump 1b is not formed on each electrode 20a is used. While the electronic component 20 is sucked and held by the head tool 3 and brought into contact with the substrate 4, the electronic component 1 is heated and cooled with the same temperature profile as when the electronic component 1 is mounted on the substrate 4. The suction nozzle in the case where the contact load detected by the load cell 14 of the head tool 3 becomes a predetermined load (for example, a constant contact load) during each process. The displacement amount data is obtained by measuring the displacement state (trajectory) of the height position of the component holding surface 11. Further, the electronic component 1 in which the bumps 1b are not formed is used as the data acquisition electronic component 20, because when the bumps 1b exist, the load cell 14 melts the bumps 1b by heating. This is because the detected load is lost and it is difficult to continue the constant load control. A method for acquiring the displacement amount data using the electronic component 20 for data acquisition will be described below with reference to a schematic explanatory diagram shown in FIG. 5 and a flowchart shown in FIG.

  First, as shown in the schematic explanatory view of FIG. 5A, the substrate 4 is placed and held on the substrate holding surface 7 a of the stage 7 in the electronic component mounting apparatus 201. As the substrate 4, it is preferable to use the substrate 4 used in actual electronic component mounting as it is. However, in the case where a data acquisition substrate configured with the same shape and the same material is used. There may be. In the present embodiment, the actual substrate 4 is used as it is. In addition, although the several pad 4a is formed in the illustration upper surface of the board | substrate 4, the board | substrate 4 in which the solder part 2 is not formed is used.

  Next, as shown in FIG. 5B, the data acquisition electronic component 20 is sucked and held by the suction nozzle 11 of the head tool 3 (step S1 in FIG. 6). Thereafter, in the electronic component mounting apparatus 201, the head tool 3 is moved in the X1 direction or X2 direction by the X-axis direction moving device 22, and the stage 7 is moved in the Y1 direction or Y2 direction by the Y-axis direction moving device 23. As a result, alignment between the respective electrodes 20a formed on the mounting surface of the data acquisition electronic component 20 and the respective pads 4a formed on the substrate 4 is performed.

  When such alignment is completed, the head tool 3 starts to be lowered by the elevating unit 21 in step S2 of FIG. 5C, the mounting-side surface (lower surface in the drawing) of the data acquisition electronic component 20 held by suction by the suction nozzle 11 and the surface (upper surface in the drawing) of the substrate 4 are mutually connected. Contact. When the contact is made, the load is detected by the load cell 14 in the head tool 3. The load detected in this way is input to the load control unit 95 of the control device 9, and the preset contact load read from the memory unit 93 by the load control unit 95 and the input load. Comparison is performed, load monitoring is performed until the detected load reaches the contact load, and the descent of the head tool 3 is continued (step S3). When it is determined in step S3 that the detected load has reached the preset contact load, the descent of the head tool 3 is stopped in step S4. This state is a contact state between the data acquisition electronic component 20 and the substrate 4.

  Thereafter, in order to make such a contact state more reliable, the head tool 3 is further lowered slightly to perform component pressing (step S5). The descending of the head tool 3 for pressing the component is monitored until the load detected by the load cell 14 reaches a predetermined load for pressing the component, which is a load larger than the contact load. Is continued (step S6). When it is confirmed in step S6 that the detected load has reached the predetermined load, the descent of the head tool 3 is stopped and the state is maintained (step S7).

  Thereafter, temperature profile data for mounting the electronic component 1 on the substrate 4 held in the memory unit 93 of the control device 9 is read, and the temperature control unit 96 performs heating / cooling control based on the temperature profile data. Is started (step S10). Such temperature profile data is created, for example, as temperature change data for each time section. For each time section, the first heating / cooling step, the second heating / cooling step, the third heating / cooling data, and the like. As the cooling step,..., The nth heating / cooling step (where n is an integer), the cooling step is composed of subdivided steps. For example, in the second heating / cooling step, each step includes a required time of 8 seconds, a start temperature of 240 ° C., and an end temperature of 380 ° C. Therefore, the heating / cooling control based on such temperature profile data is sequentially performed from the first heating / cooling step until the final n-th heating / cooling step is completed. Specifically, if the heating / cooling step requires a temperature increase (or maintaining a heated state), heating by the ceramic heater 12 is performed, and the data acquisition electronic component 20 and the substrate 4 are heated. Heating is performed (see FIG. 5D). Conversely, if the heating / cooling step requires a temperature drop, heating by the ceramic heater 12 is stopped and cooling by the cooling blow nozzle 19 is performed (see FIG. 5E).

  In addition, during the heating / cooling control in step S10, a constant load control by the head tool 3 is performed. Specifically, in step S8, it is determined whether or not the load detected by the load cell 14 is within the predetermined load range in a state where the lowering and raising of the head tool 3 are stopped. If it is determined that it is within the predetermined load range, it is determined whether all heating / cooling steps performed in step S10 have been completed (step S12), and in step S8 until all are completed. The operation for confirming the predetermined load is repeated.

  On the other hand, when heating or cooling is performed by the head tool 3, the head tool 3, the stage 7, and the data acquisition electronic component 20 or the substrate 4 itself are stretched or shrunk by the heat as the heat enters or exits. It will be. Due to the occurrence of each of such expansion and contraction, a displacement amount is generated in the distance between the component holding surface 11a of the suction nozzle 11 of the head tool 3 and the substrate holding surface 7a of the stage 7. In this case, since the data acquisition electronic component 20 is disposed between the component holding surface 11a and the substrate holding surface 7a, the displacement amount of the distance is the change amount of the load detected by the load cell 14. Will appear. Therefore, when such expansion or contraction occurs, the load detected by the load cell 14 increases or decreases in step S8. Depending on the degree, the detected load exceeds the predetermined load range. There are cases where this happens. When the excess occurs, in step S9, the head tool 3 is raised or lowered by the elevating unit 21 in accordance with the excess load (that is, the excess difference). The load detected by the load cell 14 by this ascent or descent is kept within the predetermined range. That is, the displacement generated by the expansion or contraction is removed by the movement of the head tool 3.

  Further, while the heating / cooling control in step S <b> 10 is performed, for example, the position coordinate (position data) of the height position of the component holding surface 11 a of the suction nozzle 11 is used as the elevation position of the head tool 3. Is input to the motor control unit 94 through the lifting unit 21 and stored in the memory unit 93 by the processing unit 91 (step S11). That is, data on the movement locus of the height position of the head tool 3 is stored. Such position data is the displacement amount data, and is data for removing the amount of expansion or contraction due to the heat.

  After that, if it is determined in step S12 that all heating / cooling steps have been completed, as shown in FIG. 5 (F), suction holding of the data acquisition electronic component 20 by the suction nozzle 11 of the head tool 3 is performed. The head tool 3 is lifted by the lifting unit 21 (step S14). Thereby, acquisition of data for removing the amount of expansion and contraction of each member due to the heat, that is, acquisition of the position data of the suction nozzle 11 is completed.

  Here, the “displacement amount” of the distance between the component holding surface 11a of the suction nozzle 11 and the substrate holding surface 7a of the stage 7 accompanying heating or cooling in this specification will be described in detail. In the description, schematic explanatory views are shown in FIGS.

First, as shown in FIG. 7 (A), the suction nozzle 11 and the stage 7 in a state where the distance between the component holding face 11a and the substrate holding surface 7a is kept at d ₀ (indicated by shown solid line) is heated Then, both members are stretched by heat, and the distance is reduced to d ₁ (indicated by a two-dot chain line in the drawing). Therefore, the displacement amount of the distance accompanying the heating becomes Δd ₁ = d ₀ −d ₁ , and in order to remove the displacement amount, the suction nozzle 11 is raised by Δd ₁ as shown in FIG. 7B. You can do it. For the sake of convenience, the amount of displacement is expressed as negative for the sake of convenience. Further, in FIG. 7A, for example, when the data acquisition electronic component 20 is disposed between the two members, the displacement amount of the above distance does not actually appear, and instead, This appears as an increase in the load detected by the load cell 14. In addition, although the displacement amount is intended for the distance between the component holding surface 11a and the substrate holding surface 7a, instead of such a case, the distance between the mounting side surface of the electronic component 1 and the surface of the substrate is used. It may be a case where the distance is targeted.

Further, as shown in FIG. 8 (A), if the shrinkage in both members with the cooling occurs, the distance is, (indicated by illustrated two-dot chain line) enlarged by the d ₀ to d _2. In this case, the displacement amount of the distance accompanying the cooling is Δd ₂ = d ₀ −d ₂ , and in order to remove the displacement amount, the suction nozzle 11 is moved by Δd ₂ as shown in FIG. Just lower it.

Further, as shown in FIG. 9A, when the data acquisition electronic component 20 is stretched due to heating, the height dimension of the electronic component 20 is expanded from d ₀ to d ₃ (illustrated). (Indicated by a two-dot chain line). In this case, the displacement amount of the distance due to the heating is Δd ₃ = d ₃ −d _{0. In} order to remove the displacement amount, n is set to Δd ₃ as shown in FIG. 9B. Just raise it. Actually, as shown in FIG. 9A, the distance between the suction nozzle 11 and the stage 7 is maintained at the distance d ₀ regardless of the occurrence of elongation to the electronic component 20. The displacement amount does not appear as an actual distance displacement amount, but is detected as an increase in load detected by the load cell 14. As shown in FIG. 9B, by moving up the suction nozzle 11, the displacement amount of the distance that appears as an increase in load can be removed.

  Here, the position data of the component holding surface 11a of the suction nozzle 11 for removing the displacement amount of the distance due to the expansion and contraction due to heat of each member acquired using the electronic component 20 for data acquisition described above. A schematic explanatory diagram schematically showing the profile 81 in relation to a load profile 82 detected by the load cell 14 and a temperature profile 83 used for heating / cooling control is shown in FIG. In FIG. 10, the profiles are plotted on the same graph in order to make the relationship between the profiles easy to understand. Therefore, the vertical coordinate (nozzle height position, load, temperature) represents the relative change in each profile, whereas the horizontal axis represents the time common to all profiles. Yes.

  As shown in profiles 81, 82, and 83 of FIG. 10, contact between the data acquisition electronic component 20 and the substrate 4 is detected at time T1, and a predetermined load for pressing the component is reached at time T2. Is done. Thereafter, heating by the ceramic heater 12 is performed from time T2 to T3. Along with this heating, each member is stretched by heat, but the detected load is kept constant by raising the height position of the suction nozzle 11. The temperature rise is stopped at time T3 and constant temperature control is started. However, since each member continues to grow for a while after that, the load is kept constant by further raising the height position of the suction nozzle 11 over time T4. Kept.

  From time T4 to T5, the height position, load, and temperature of the suction nozzle 11 are stabilized. When the time T5 is reached, the cooling is started and the respective members are shrunk, but the detected load is kept constant by lowering the height position of the suction nozzle 11 over the time T6. Thereafter, the suction holding of the electronic component 20 by the suction nozzle 11 is released at time T7.

  Next, the height position data of the suction nozzle 11 which is data for removing the displacement amount of the distance between the suction nozzle 11 and the stage 7 due to the expansion / contraction of each member due to the heat thus obtained is obtained. A procedure for actually mounting the electronic component 1 on the substrate 4 will be described. In the description, a flowchart for explaining the mounting procedure is shown in FIG. 11 and will be described below with reference to schematic explanatory views of FIGS.

  First, as a preparatory operation before starting the mounting operation of the electronic component 1, the profile data of the nozzle height position held in the memory unit 93 is read and input to the motor control unit 94 in the control device 9. At the same time, temperature profile data is read and input to the temperature control unit 96. In addition, load profile data (for example, preset contact load data or predetermined load data for pressing parts) held in the memory unit 93 is read out and input to the load control unit 95. Thereby, the preparatory operation before mounting is completed.

  Next, as shown in FIG. 3A, the substrate 4 is held on the substrate holding surface 7a of the stage 7, and the electronic component 1 is held by suction on the component holding surface 11a of the suction nozzle 11 of the head tool 3 (step). S21). Note that a solder portion 2 is formed on each pad 4 a of the substrate 4. Thereafter, as shown in FIG. 3B, the electronic component 1 held by suction and the substrate 4 are aligned. After the alignment, the head tool 3 starts to descend by the elevating unit 21 (step S22), and the descent continues until a preset contact load is detected in the load cell 14 (step S23). When the contact load is detected in step S23, the descent of the head tool 3 is stopped (step S24). Thereafter, the head tool 3 is lowered until a predetermined load for pressing the component is detected (steps S25 and S26). When the predetermined load is detected, the descent of the head tool 3 is stopped (step S27). As shown in FIG. 3C, the bump 1b formed on each electrode 1a of the electronic component 1, and the substrate The respective solder parts 2 of 4 are brought into contact with each other reliably.

  When the electronic component 1 and the substrate 4 are brought into contact with each other in this way, in step S29, heating of the ceramic heater 12 is started by the temperature control unit 96, and the respective bumps 1b and based on the temperature profile data are started. Temperature control of the solder part 2 is started (see FIG. 3D). Specifically, the first heating / cooling step based on the temperature profile data is performed, and the second heating / cooling step, the third heating / cooling step,..., The nth heating / cooling step are sequentially performed. To be implemented.

  On the other hand, along with the start of heating / cooling control based on such temperature profile data, in step S28, the control of the elevating unit 21 is started by the motor control unit 94, and the suction nozzle 11 based on the profile data of the nozzle height position. The movement control of the height position of the component holding surface 11a is started. Specifically, the movement control to the height position corresponding to the first heating / cooling step based on the profile data of the nozzle height position is performed using the height position of the contact state as a base point, and sequentially Movement control corresponding to the second step, the third step, and the nth step is performed. Thereby, the amount of expansion of each member due to heating and the amount of contraction of each member due to cooling can be removed. In addition, while these heating / cooling control and nozzle height position control are performed, monitoring (process monitoring) of the change state of temperature, nozzle height position, and load is performed (step S30).

  Thereafter, when all the heating / cooling steps are completed in step S29, the suction holding of the electronic component 1 by the suction nozzle 11 is released (step S31), and the head tool 3 is raised by the elevating unit 21 (step S32). ). As a result, as shown in FIG. 3F, each electrode 1a of the electronic component 1 is bonded to each pad 4a of the substrate 4 via the bump 1b and the solder portion 2 which are melted and then solidified. Thus, the electronic component 1 is mounted on the substrate 4.

  Here, when the electronic component 1 is mounted on the substrate 4 based on such an operation procedure, the actual position data 71 of the suction nozzle 11 obtained by process monitoring and the detected load data 72 are obtained. The change state of the temperature data 73 is schematically shown in the graph of FIG. In the graph of FIG. 12, the vertical axis indicates the nozzle height position, load, and temperature relative to each data, and the horizontal axis indicates time. These times T1 to T7 correspond to the times shown in FIG.

  The change state of each data shown in FIG. 12 basically has substantially the same waveform as each of the profiles 81 to 83 shown in FIG. However, as shown in FIG. 12, the load data 72 at time T2 ′ between the times T2 and T3 is different from the profile data shown in FIG. 10 in that the load data 72 rapidly decreases from the load W2 to W1. . This is a load loss phenomenon that occurs when the bumps 1b and the solder portions 2 are brought into a molten state by heating, and does not occur when the data acquisition electronic component 20 that does not have the bumps 1b is used. It is.

  However, in the mounting of the electronic component 1 based on the nozzle height position data, as shown in the flowchart of FIG. 11, after the contact state is established in step S27, the nozzle height position control (step S28) is performed after load control. Therefore, the mounting operation can be continued while reliably removing the expansion and contraction of each member due to heat, even if the load loss phenomenon occurs in this way. Can do.

  Next, some optional controls that can be applied in the present embodiment as described above will be described below as modified examples of the present embodiment.

  First, as a diagram for explaining the electronic component mounting method according to the first modified example, a schematic graph showing the relationship among nozzle height position data, load data, and temperature data corresponding to FIG. Is shown in FIG. The nozzle height position data shown in FIG. 12 is based on profile data acquired using the data acquisition electronic component 20. However, since the electronic component 20 for data acquisition does not include the respective bumps 1b, it may have thermal characteristics that are slightly different from those of the actual electronic component 1. In such a case, even if the height position control of the suction nozzle 11 is performed based on the profile data, there may be a case where the influence of the expansion / contraction due to heat cannot be completely eliminated.

  In such a case, for example, when the load W3 that should not be detected at the time T5 ′ in the load data in FIG. 13 is detected, that is, the contraction of each member than in the case assumed in the profile data. In the case where the amount is large (or the shrinkage speed is high), there is a possibility that the respective bumps 1b and solder portions 2 to be cooled and solidified are peeled off from the electrodes 1a and the pads 4a. In such a case, as shown in the nozzle height position data in FIG. 13, the height position of the suction nozzle 11 is lowered by ΔH so that the load W3 is returned to W1, and thereafter the original profile is obtained. The nozzle height position is controlled using the same locus as that in the data. That is, by changing the nozzle height position based on the detected load change amount, it is possible to perform feedback control so as to remove the load change amount.

  Such feedback control can be applied to a case where an increase in load is detected in addition to a case where a decrease in load is detected, as described with reference to FIG. It can be applied both during heating and during cooling. In particular, when the melted bump 1b and the solder portion 2 are cooled and solidified, the reproducibility of the temperature profile is poor compared with the case of heating (that is, cooling by cooling blow). However, it is possible to reliably prevent the occurrence of bump crushing or peeling off by performing such feedback control.

  Further, when such a load change is detected in the process of mounting the electronic component 1, the profile data of the nozzle height position is corrected based on the load change, and the corrected It may be a case where the mounting operation of the next electronic component 1 is performed based on the profile data.

  Next, an electronic component mounting method according to a second modification of the present embodiment will be described below. The mounting method according to the second modified example uses the data acquisition electronic component 20 to acquire the height position data of the suction nozzle 11 for removing the elongation amount or the like of each member due to heat. The control time difference data (time lag) included in the processed data is removed. Such control time difference data will be described with reference to a schematic explanatory diagram shown in FIG.

  In FIG. 14, the coordinate data of the elevation position in the height direction of the head tool 3, the actual height position of the component holding surface 11a which is the tip of the suction nozzle 11, the load detected by the load cell 14, and the temperature change The relative relationship is shown when the relationship is viewed at a minute time. The vertical axis shows the change of each data with time, and the horizontal axis shows time.

  As shown in FIG. 14, when the temperature starts to be increased by the temperature T1 at the time Ta, the heat nozzle generates an elongation at the time Tb slightly later than the temperature T1. The height position of the component holding surface 11a is lowered.

  On the other hand, an increase in load starts at time Tc slightly later than time Tb, and an increase in load W0 is detected by load cell 14 at time Te. When an increase in the load is detected in this way, the lifting of the head tool 3 by the elevating unit 21 is started at time Tf in order to keep the load constant. When the head tool 3 is raised by H1, the component holding surface 11a of the suction nozzle 11 is also raised by H1, and the extension amount of the suction nozzle 11 is removed (time Tg). At the same time, the load detected by the load cell 14 is reduced, and the increased load is removed at time Th.

  In such constant load control, a control time difference (from the occurrence of the extension of the suction nozzle 11 at time Tb until the removal of the extension is started by the rise of the head tool 3 at time Tf ( (Control time difference) ΔT occurs. When such control time difference data is acquired together with the nozzle height position profile data and actual electronic components are mounted, the profile data is controlled so that the nozzle height position is controlled earlier by the control time difference data. By correcting the above, more accurate and reliable control can be performed.

  In addition to the case described above, various mounting methods can be handled by further processing the profile data of the nozzle height position acquired using the data acquisition electronic component 20. . For example, bump pressing control can be performed by increasing the pressing amount of each bump 1b by the suction nozzle 11, and by slightly raising the height position of the suction nozzle 11 during the melting of the bump 1b. It is possible to control the extension of the bumps.

  In the above description, the case where the profile data is acquired using the data acquisition electronic component 20 that is the electronic component 1 on which the bump 1b is not formed has been described. A case where a dedicated jig component having the same shape as the electronic component 1 is used may be used.

  According to the above-described embodiment, when the electronic component 1 is mounted on the substrate 4, the suction nozzle 11 generated when the head tool 3, the stage 7, and the electronic component 1 itself or the substrate 4 itself are stretched / shrinked by heat. The displacement amount of the distance between the component holding surface 11a and the substrate holding surface 7a of the stage 7 can be reliably removed.

  In particular, the amount of displacement generated in a composite manner due to the expansion / contraction of each member is due to the fact that the electronic component 1 is disposed between the component holding surface 11a and the board holding surface 7a in the actual mounting process. Although it is difficult to measure using a displacement measuring device, and it is difficult to measure due to load loss in the load detected by the load cell 14 by heating and melting of the bump 1b, the above embodiment The displacement amount can be measured by using the data acquisition electronic component 20 as described above.

  That is, the electronic component 1 without the bump 1b that does not contain a material that is melted by heating at the time of mounting is used as the data acquisition electronic component 20, and the electronic component 20 is heated / heated using the temperature profile at the time of mounting. While performing the cooling control, the movement locus of the height position of the head tool 3 when the constant load control is performed is acquired as profile data, and while the movement control of the head tool 3 is performed based on the acquired profile data, By mounting the actual electronic component 1 on the substrate 4, it is possible to remove the influence of the heat caused by the expansion / contraction of each member.

  Therefore, in particular, the electronic component 1 having the bump 1b whose bump pitch is narrowed and whose diameter is further miniaturized can be mounted surely and accurately while eliminating the influence of expansion / contraction of each member due to heat. can do. In particular, such a mounting method is not limited to the case where the electronic component 1 is mounted on the substrate 4, but each bump 1b formed on the electronic component 1 and each bump formed on another electronic component. It can also be effectively applied to a chip-on-chip mounting method that joins the two.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

It is a model perspective view of the electronic component mounting apparatus with which the mounting method of the electronic component concerning one Embodiment of this invention is performed. It is a schematic block diagram which shows the structure of the head tool with which the said electronic component mounting apparatus is provided. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic explanatory diagram for explaining a procedure of a method for mounting an electronic component according to the embodiment, wherein (A) is a diagram illustrating a state where a solder portion is formed on a substrate, and (B) is an electronic component. (C) is a diagram showing a contact state between each bump and a solder part, and (D) is a diagram showing a state where each bump and solder part are in contact with each other. It is a figure which shows the state currently heated and melted, (E) is a figure which shows the state by which each bump and solder part are cooled and solidified, (F) shows the state by which the electronic component was mounted in the board | substrate. FIG. It is a control block diagram which shows the structure of the control apparatus with which the said electronic component mounting apparatus is provided. In the electronic component mounting method of the above embodiment, as a mounting preparation process, a schematic explanatory diagram illustrating a procedure for acquiring profile data of a nozzle height position using an electronic component for data acquisition, (A) is on a stage (B) is a diagram showing a state in which the electronic component for data acquisition and the substrate are aligned, and (C) is a diagram showing the electronic component for data acquisition. It is a figure which shows the contact state with a board | substrate, (D) is a figure which shows the state in which the electronic component for data acquisition is heated, (E) shows the state in which the electronic component for data acquisition is cooled It is a figure and (F) is a figure which shows the state which mounting operation was completed. It is a flowchart which shows the procedure which acquires the profile data of the nozzle height position of FIG. It is a schematic explanatory diagram for explaining the displacement amount of the distance between the suction nozzle and the stage accompanying the elongation of each member by heating, (A) is a diagram showing the displacement amount of the distance, (B) These are figures which show the state which performed the removal of the said displacement amount. It is a schematic explanatory diagram for explaining the displacement amount of the distance between the suction nozzle and the stage due to the contraction of each member by cooling, (A) is a diagram showing the displacement amount of the distance, (B) These are figures which show the state which performed the removal of the said displacement amount. It is a schematic explanatory diagram for explaining the amount of displacement of the distance between the suction nozzle and the stage accompanying the elongation of the electronic component itself by heating, (A) is a diagram showing the amount of displacement of the distance, (B ) Is a diagram showing a state in which the displacement amount is removed. FIG. 7 is a schematic explanatory diagram in the form of a graph showing the relationship between the profile data of the nozzle height position obtained by the procedure of FIG. 6, the load profile data, and the temperature profile data. It is a flowchart which shows the procedure which mounts an electronic component using the profile data of the nozzle height position obtained by the procedure of FIG. FIG. 12 is a schematic explanatory diagram in a graph format showing a relationship among nozzle height position data, load data, and temperature data monitored in the mounting operation of the electronic component of FIG. 11. It is a figure which shows the mounting method of the electronic component concerning the 1st modification of the said embodiment, Comprising: It is a schematic explanatory drawing for demonstrating the feedback control by a load change detection. It is a figure which shows the mounting method of the electronic component concerning the 2nd modification of the said embodiment, Comprising: It is a schematic explanatory drawing for demonstrating that a control time difference arises at the time of acquiring the profile data of a nozzle height position. is there.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 1a Electrode 1b Bump 2 Solder part 3 Head tool 4 Substrate 4a Pad 7 Stage 7a Substrate holding surface 9 Controller 11 Adsorption nozzle 11a Component holding surface 12 Ceramic heater 14 Load cell 20 Data acquisition electronic component 21 Elevating part 91 Processing part 92 Operation / Display Unit 93 Memory Unit 94 Motor Control Unit 95 Load Control Unit 96 Temperature Control Unit 201 Electronic Component Mounting Device

Claims (8)

While each of the plurality of electrodes in the electronic component held by the component holding member is brought into contact with the plurality of electrodes in the substrate held by the substrate holding member with the bonding member interposed therebetween, the respective bonding members are heated. In the method of mounting an electronic component, after melting, cooling and solidifying each of the melted joining members, releasing the holding of the electronic component by the component holding member and mounting the electronic component on the substrate ,
Data on the amount of displacement of the distance between the component holding member and the substrate holding member, which is generated when the component holding member and the substrate holding member are expanded or contracted, which can be generated when the respective bonding members are heated and cooled. Get
The relative position of the component holding member with respect to the substrate holding member so as to remove the displacement amount based on the acquired displacement amount data of the distance when the respective bonding members are heated and cooled. A method for mounting an electronic component, comprising: performing control and mounting the electronic component on the substrate.   The distance displacement data includes the component holding surface of the component holding member and the substrate holding member accompanying the expansion or contraction caused by the change in the amount of heat transmitted to the component holding member and the substrate holding member by the heating or cooling. Position data of a movement position of the component holding member for moving the component holding surface close to or away from the substrate holding surface so as to remove the displacement amount of the distance between the component holding surface and the substrate holding surface. Item 2. The electronic component mounting method according to Item 1. The distance displacement amount data includes the distance displacement amount associated with the expansion or contraction occurring in the substrate and the electronic component in the direction orthogonal to the component holding surface when the respective joining members are heated or cooled. Data included,
The electronic component mounting method according to claim 2, wherein the component holding member is moved so as to further remove expansion and contraction of the substrate and the electronic component. The electronic component for data acquisition formed of substantially the same material as the electronic component is held by the component holding member, and the electronic component for data acquisition is directly attached to the surface of the substrate held by the substrate holding member. The electronic components for data acquisition are heated and cooled on the basis of the same temperature profile as the temperature profile for heating and cooling for each of the joining members, and the heating and cooling are performed. As the data of the displacement amount of the distance between the component holding member and the substrate holding member in the above, a load applied to the data acquisition electronic component held by the component holding member during the heating and cooling So that the position data of the component holding member in the case where the position control of the component holding member is performed so that is substantially constant,
When the electronic component is mounted on the substrate using the bonding members, the substrate holding member is controlled by controlling the position of the component holding member based on the acquired position data of the component holding member. The electronic component mounting method according to claim 1, wherein the displacement amount of the distance between the component holding member and the component holding member is removed. In the position control of the component holding member such that the load is substantially constant, the load generated by the generation of the displacement amount is generated from the generation of the displacement amount of the distance between the substrate holding member and the component holding member. Get the control time difference data required to complete the removal of the change amount,
When the electronic component is mounted on the substrate using each of the bonding members, a distance between the substrate holding member and the component holding member based on the acquired position data and the control time difference data. The electronic component mounting method according to claim 4, wherein position control of the component holding member is performed so as to remove the displacement amount. When mounting the electronic component on the substrate using the respective joining members,
In the process of cooling and solidifying the melted joining member, the amount of change in load applied to the electronic component is detected,
In accordance with the detected change amount of the load, the position data of the component holding member is corrected so that the change amount of the load is removed,
The electronic component mounting method according to claim 4, wherein the position control of the component holding member is performed based on the corrected position data. Observe the load applied to the electronic component from the component holding member between the contact of the electronic component to the substrate and the solidification of the respective joining members,
When it is detected that the observed load exceeds or is insufficient with respect to the load profile, the position data of the component holding member is corrected so as to suppress the occurrence of the excess or deficiency,
The electronic component mounting method according to claim 4, wherein the position control of the component holding member is performed based on the corrected position data. The joining member is a bump formed on each of the electrodes of the electronic component,
The electronic component mounting method according to claim 4, wherein the data acquisition electronic component is an electronic component in a state where the bumps are not formed.

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