JP2005212229A - Transparent gas barrier film and electroluminescence element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transparent gas barrier film having a high gas barrier capacity and not deteriorated in its gas barrier capacity even if bent, and an electroluminescence element free from deterioration or the occurrence of a defect using the same. <P>SOLUTION: The transparent gas barrier film has a structure that at least one organic layer and at least one inorganic layer are laminated at least on one side of a resin substrate and is characterized in that the coefficient of linear expansion of the organic layer is 50 ppm/°C or below and the tensile modulus of elasticity thereof is 1,000 MPa or below. This transparent gas barrier film is used as the base material of the electroluminescence element. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a gas barrier film that is excellent in transparency and has a high barrier property against the permeation of oxygen and water vapor, and an electroluminescence device using the same.

Japanese Patent Publication No.53-12953 Japanese Patent Publication No. 58-217344.

  Conventionally, a gas barrier film in which a metal oxide thin film such as aluminum oxide, magnesium oxide, silicon oxide or the like is formed on the surface of a plastic substrate or film is used for wrapping articles, foods, industrial products and the like that need to block oxygen and water vapor. It is often used in packaging applications to prevent alteration of pharmaceuticals. In addition to packaging applications, it is used in liquid crystal display elements, solar cells, electroluminescence (EL) substrates, and the like. In particular, for transparent substrates that are being applied to liquid crystal display elements, EL elements, etc., in addition to demands for weight reduction and size increase, long-term reliability and high degree of freedom of shape are possible, and curved surface display is possible. As a result of such high demands, film base materials such as transparent plastics have begun to be used in place of glass substrates that are heavy, fragile and difficult to increase in area. In addition, the plastic film not only meets the above requirements, but also can be rolled-to-roll, so it has better productivity than a glass substrate and is advantageous in terms of cost reduction.

However, a film substrate such as a transparent plastic has a problem that gas barrier properties are inferior to a glass substrate. When such a base material having inferior gas barrier properties is used for the above-mentioned application, gas permeates and causes a problem. For example, the liquid crystal in the liquid crystal cell is deteriorated or the organic EL element is deteriorated to become a display defect and deteriorate the display quality. In order to solve such problems, it is known to form a metal oxide thin film on a film substrate to form a gas barrier film substrate. Gas barrier films used for packaging members and liquid crystal display elements are known in which silicon oxide is vapor-deposited on a plastic film (Patent Literature 1) and in which aluminum oxide is vapor-deposited (Patent Literature 2). A conventional gas barrier film has an oxygen permeability of about 1 cm ³ / m ² / day and a water vapor permeability of about 1 g / m ² / day.

  In recent years, further improvements in gas barrier performance to film substrates have been required due to the development of large-sized liquid crystal displays, high-definition displays, organic EL displays, and the like. Furthermore, there is a great demand for display devices that can be bent, and a barrier layer that does not deteriorate the gas barrier performance even when bent is required.

  The inorganic layer is brittle, and cracks are generated with respect to bending stress, resulting in a problem that gas barrier performance is deteriorated. Therefore, even when a crack is generated by laminating a plurality of inorganic layers, an attempt has been made to maintain the gas barrier performance by closing the crack portion with the upper layer, and extending the gas permeation path. Yes. However, the current situation is that it is not durable against bending.

  The present invention has been made for the purpose of providing a transparent gas barrier film having the high gas barrier performance required in the above-described conventional technology and which does not deteriorate even when bent.

  That is, an object of the present invention is to provide a transparent gas barrier film that has a higher gas barrier performance than before by optimizing the linear expansion coefficient and elastic modulus of the organic layer, is transparent, and does not deteriorate its barrier properties even when bent. It is to provide.

  The transparent gas barrier film of the present invention is a transparent gas barrier film having a structure in which one or more organic layers and inorganic layers are laminated on at least one surface of a resin substrate, and the first aspect is the organic layer. The linear expansion coefficient is 50 ppm / ° C. or less. In the second aspect, the organic layer has a tensile elastic modulus of 1000 MPa or less. Further, the third aspect is characterized in that the organic layer has a linear expansion coefficient of 50 ppm / ° C. or less and a tensile elastic modulus of 1000 MPa or less.

  In the present invention, the inorganic layer is composed mainly of silicon oxide, silicon nitride, or silicon nitride oxide.

  In the present invention, the resin substrate is preferably a polyethylene naphthalate film. The transparent gas barrier film of the present invention preferably has a total light transmittance of 80% or more.

  The electroluminescent device of the present invention is a laminate in which at least a transparent electrode layer, a light emitting layer, and a cathode layer are sequentially laminated on a base material, arranged in a sealed space. The transparent gas barrier film according to any one of the first to third aspects is used.

  First, each constituent layer and production method of the transparent gas barrier film of the present invention will be described. FIG. 1 is a schematic cross-sectional view of an example of the gas barrier film of the present invention. The gas barrier film is provided by sequentially laminating an organic layer 2 and an inorganic layer 3 on a resin substrate 1. In the present invention, a plurality of organic layers and inorganic layers may be present, and the stacking order is not particularly limited, and any of them may be provided so as to be in direct contact with the resin substrate. For example, a layer configuration in which a plurality of organic layers and inorganic layers are alternately stacked on a resin substrate, a layer configuration in which organic layers made of different materials are stacked adjacent to each other, and inorganic layers made of different materials are adjacent to each other. And a laminated layer structure. In particular, a layer structure in which an organic layer, an inorganic layer, and an organic layer are sequentially provided on a resin substrate is preferable.

  The resin substrate of the transparent gas barrier film of the present invention is not particularly limited as long as it is a film formed of an organic material capable of holding a film having a barrier property. Specifically, homopolymers such as ethylene, propylene, butene, or polyolefin resins such as copolymers or copolymers, amorphous polyolefin resins such as cyclic polyolefin, polyethylene terephthalate resin, polyethylene-2,6-naphthalate, etc. Polyester resins, nylon 6, nylon 12, polyamide resins such as copolymer nylon, polyvinyl alcohol resins, polyvinyl alcohol resins such as ethylene-vinyl alcohol copolymer, polyimide resins, polyetherimide resins, polysulfone resins, poly Ether sulfone resin, polyether ether ketone resin, polycarbonate resin, polyvinyl butyrate resin, polyarylate resin, fluorine-based resin, and the like can be used. Among these, polyethylene naphthalate resins such as polyethylene-2,6-naphthalate resin have good gas barrier properties, and particularly low oxygen permeability and water vapor permeability. Therefore, in the present invention, a polyethylene naphthalate film is used as the resin substrate. It is preferable to use it. The thickness of these resin films is preferably 12 to 500 μm. Moreover, it is necessary for transparency to be high.

  The organic layer provided on the resin substrate can be formed using a resin such as an acrylic resin, a urethane resin, an epoxy resin, a polyester resin, an olefin resin, a fluorine resin, or a silicone resin. The organic layer must have a linear expansion coefficient of 50 ppm / ° C. or lower, or a tensile modulus of 1000 MPa or lower, and a physical property with a linear expansion coefficient of 50 ppm / ° C. or lower and a tensile elastic modulus of 1000 MPa or lower. It is particularly preferred to have By using a material having these characteristics, it is possible to absorb stress such as stress that the inorganic layer receives from the base material, particularly stress received during bending, and to prevent the inorganic layer from causing defects such as cracks.

When the linear expansion coefficient of the organic layer is larger than 50 ppm / ° C., the linear expansion coefficient of silicon oxide (SiO ₂ ) that is an inorganic layer is generally 6 to 7 ppm / ° C. When the organic layer and the inorganic layer are laminated, peeling and warping are likely to occur due to the difference in linear expansion coefficient between the two layers, resulting in a problem that the gas barrier performance is deteriorated. The linear expansion coefficient of the organic layer is preferably as close as possible to the linear expansion coefficient of the inorganic layer.

  Further, if the tensile elastic modulus of the organic layer is larger than 1000 MPa, the inorganic layer is brittle, so that it is stressed when bent and defects such as cracks are generated, which may deteriorate the gas barrier performance. When the tensile modulus is 1000 MPa or less, it is possible to absorb the stress applied to the inorganic layer when bent and to suppress the occurrence of defects such as cracks. That is, when the laminate of the organic layer and the inorganic layer is bent, if the tensile elastic modulus of the organic layer above and below the inorganic layer is 1000 MPa or less, the difference between the extension at the outside and the compression at the inside when bending is reduced, The stress acting on the intermediate inorganic layer can be suppressed, and the occurrence of cracks and cracks can be prevented. More preferably, the one of 500 MPa or less is used.

  Moreover, when arrange | positioning an organic layer on the upper and lower sides of an inorganic layer, it is preferable that it is the structure which pinches | interposes an inorganic layer with two organic layers with the same linear expansion coefficient, tensile elasticity modulus, and thickness. The organic layers above and below the inorganic layer have the same linear expansion coefficient, tensile modulus, and thickness to absorb bending stress, stress due to expansion and contraction during heating, and suppress the generation of defects in the inorganic layer. Can do.

  In order to reduce the linear expansion coefficient of the organic layer to 50 ppm / ° C. or less, the degree of crosslinking of the resin such as acrylic resin, urethane resin, epoxy resin, polyester resin, olefin resin, fluorine resin, silicone resin, crystal The linear expansion coefficient may be adjusted by adding inorganic fine particles of an inorganic filler. Generally, the linear expansion coefficient decreases as the degree of crosslinking and crystallization of the resin increases, and the linear expansion coefficient decreases as the amount of inorganic fine particles added increases.

  Moreover, in order to make the tensile modulus of the organic layer 1000 MPa or less, the degree of crosslinking of the resin such as acrylic resin, urethane resin, epoxy resin, polyester resin, olefin resin, fluorine resin, silicone resin, crystal The tensile modulus can be adjusted by adding various thermoplastic elastomers. Generally, the tensile modulus increases as the degree of cross-linking and crystallization of the resin increases, and the tensile modulus decreases as the amount of elastomer added increases. In addition, the amount of the aromatic component or the aliphatic component in the resin also affects the magnitude of the tensile elastic modulus. In general, the more the former component, the larger the tensile elastic modulus.

  In addition, the measurement of a linear expansion coefficient can be calculated | required according to ASTM-D696, and the measurement of a tensile elasticity modulus can be calculated | required according to ASTM-638M.

  The organic layer provided on the resin substrate is a base material by a known method such as roll coating, gravure coating, knife coating, dip coating, spray coating, etc., using a coating solution in which the above materials are dissolved or dispersed in an appropriate medium. Can be coated on top. The thickness of the organic layer is preferably in the range of 0.1 to 10 μm.

  The organic layer smoothes the surface of the resin substrate, etc., prevents the occurrence of cracks in the inorganic layer due to surface irregularities when forming the inorganic layer, and improves the adhesion between the inorganic layer and the substrate. Also plays a role.

  When further laminating an organic layer on the inorganic layer, an additive such as a silane coupling agent can be added to the organic layer in order to increase the adhesion with the inorganic layer.

  The final gas barrier film laminated has transparency. For example, as a measure of transparency, the total light transmittance is preferably 80% or more. More preferably, it is 88% or more. The total light transmittance is measured according to JIS K7136-1.

Next, the structure and manufacturing method of the electroluminescence element of the present invention will be described.
FIG. 2 is a schematic cross-sectional view of the electroluminescence element of the present invention. In the figure, an electroluminescent element is formed by sequentially laminating a transparent electrode layer 4, a light emitting layer 5, and a cathode layer 6 on a substrate 10, and the laminated body is sealed with a sealing material and disposed in a sealed space. It has a structure. In FIG. 2a, this laminate is sealed with a sealing material 7a formed of a metal material, plastic, or the like, and in FIG. 2b, it is sealed with a sealing material 7b made of a resin material such as a transparent gas barrier film. Shows the case.

  As the substrate, the transparent gas barrier film described above is used.

  The transparent electrode layer has a function as an anode for supplying holes to the light emitting layer. For example, tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), indium zinc oxide (IZO), etc. Metals such as conductive metal oxides, gold, silver, and aluminum can be used, and the shape, structure, size, and the like are not particularly limited. The method for producing the transparent electrode layer may be appropriately selected from the vacuum deposition method, the sputtering method, the ion plating method, the CVD method, the plasma CVD method and the like in consideration of suitability with the material. The patterning of the transparent electrode layer can be performed by a chemical etching method using photolithography, a physical etching method using a laser, a vacuum evaporation method using a mask, a sputtering method, a lift-off method, a printing method, or the like. The thickness is suitably in the range of 10 nm to 5 μm.

  The light emitting layer contains at least one kind of light emitting material, and if necessary, a hole injecting material, a hole transporting material, an electron injecting material, and an electron transport that facilitate the generation and movement of holes and electrons. Materials and the like may be included. Further, a hole injecting material, a hole transporting material, an electron injecting material, an electron transporting material, or the like may be stacked on the light emitting layer as a layer different from the light emitting layer.

  Examples of luminescent materials include benzoxazole derivatives, benzimidazole derivatives, benzothiazole derivatives, styrylbenzene derivatives, polyphenyl derivatives, diphenylbutadiene derivatives, tetraphenylbutadiene derivatives, naphthalimide derivatives, coumarin derivatives, perylene derivatives, perinone derivatives, oxadiazoles. Derivatives, aldazine derivatives, pyralidine derivatives, cyclopentadiene derivatives, bisstyrylanthracene derivatives, quinacridone derivatives, pyrrolopyridine derivatives, thiadiazolopyridine derivatives, styrylamine derivatives, aromatic dimethylidene derivatives, 8-quinolyl derivatives metal complexes and rare earth complexes Representative metal complexes, polythiophene derivatives, polyphenylene derivatives, polyphenylene vinylene derivatives, polyfluorene derivatives Molecular compound, and the like. These can be used alone or in combination of two or more.

  As the hole injecting material and the hole transporting material, both a low molecular hole transporting material and a polymer hole transporting material can be used, a function of injecting holes from the anode, a function of transporting holes, and There is no limitation as long as it has one of the functions of blocking electrons injected from the cathode. Examples of hole transport materials include carbazole derivatives, triazole derivatives, oxazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives, pyrazolone derivatives, phenylenediamine derivatives, arylamine derivatives, amino-substituted chalcone derivatives, Styrylanthracene derivatives, fluorenone derivatives, hydrazone derivatives, stilbene derivatives, silazane derivatives, aromatic tertiary amine compounds, styrylamine compounds, aromatic dimethylidene compounds, porphyrin compounds, polysilane compounds, poly (N-vinylcarbazole) derivatives, Conductive polymer oligomer such as aniline copolymer, thiophene oligomer, polythiophene, polythiophene derivative, polyphenylene derivative, polyphenylene Vinylene derivatives, polymer compounds such as polyfluorene derivatives, and the like. These may be used alone or in combination of two or more.

  The electron injecting material and the electron transporting material are not limited as long as they have either a function of transporting electrons or a function of blocking holes injected from the anode. For example, triazole derivatives , Oxazole derivatives, oxadiazole derivatives, fluorenone derivatives, anthraquinodimethane derivatives, anthrone derivatives, diphenylquinone derivatives, thiopyrandioxide derivatives, carbodiimide derivatives, fluorenylidenemethane derivatives, distyrylpyrazine derivatives, naphthaleneperylene, etc. Metal complexes of cyclic tetracarboxylic acid anhydrides, phthalocyanine derivatives, 8-quinolinol derivatives, metal phthalocyanines, metal complexes represented by benzoxazole and benzodiazole ligands, aniline copolymers, Thiofenori Mer, polythiophene derivatives, polyphenylene derivatives, polyphenylene vinylene derivatives, polymer compounds such as polyfluorene derivatives. These may be used alone or in combination of two or more.

  The light emitting layer can be suitably formed by a dry method such as vapor deposition or sputtering, or a wet method such as dipping, spin coating, dip coating, casting, die coating, roll coating, bar coating, or gravure coating. These film forming methods can be appropriately selected according to the material of the light emitting layer. The film thickness is generally set in the range of 1 nm to 10 μm, preferably 10 nm to 1 μm. A hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer can also be produced in the same manner as in the case of the light emitting layer.

  The cathode layer is not particularly limited in shape, structure, size and the like, and may function as an electrode for injecting electrons into the light emitting layer. The shape, structure, size, etc. are not particularly limited, but the thickness is suitably in the range of 10 nm to 5 μm. Examples of the cathode material include alkali metals (eg, Li, Na, K, Cs, etc.), alkaline earth metals (eg, Mg, Ca, etc.), gold, silver, lead, aluminum, sodium-potassium alloy, lithium-aluminum alloy, Examples include magnesium-silver alloys, rare earth metals such as indium and ytterbium. Among these, two or more kinds may be used in combination.

  The cathode layer can be formed by vacuum deposition, sputtering, ion plating, CVD, plasma CVD, or the like, and may be selected as appropriate in consideration of suitability with the cathode material. For the patterning of the cathode, physical etching using photolithography, laser, etc., vacuum deposition method using a mask, sputtering method, lift-off method, printing method, or the like can be employed.

  A known material such as an aluminum tube is used as the sealing material, but the transparent gas barrier film in the present invention may be used as the sealing material.

  In a transparent gas barrier film having a structure in which one or more organic layers and inorganic layers are laminated on at least one surface of a resin substrate, by adjusting the linear expansion coefficient or tensile elastic modulus of the organic layer to the above range, It is possible to obtain a transparent gas barrier film having high gas barrier performance, being transparent and not deteriorating its barrier property even when bent. Then, by using the transparent gas barrier film, an electroluminescence element free from deterioration and defects can be obtained.

  Next, a more preferable embodiment for carrying out the present invention will be described. A preferred transparent gas barrier film of the present invention is composed of a polyethylene naphthalate film as a resin substrate, an acrylic resin as an organic layer, and silicon oxide, silicon nitride, or silicon nitride oxide as an inorganic layer. And having a structure in which one or more organic layers and inorganic layers are laminated on a resin substrate, and the linear expansion coefficient of the organic layer is 50 ppm / ° C. or less, and tensile The elastic modulus is 1000 MPa or less.

  EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention further more concretely, this invention is not limited to a following example.

  A polyethylene naphthalate film (100 μm) is used as the resin substrate, and a thickness of 1 μm is obtained by adding a photopolymerization initiator to an epoxy resin having a linear expansion coefficient after curing of 46 ppm / ° C. and a tensile modulus of 960 MPa. The organic layer was formed by applying and curing with ultraviolet light. Next, silicon oxide was laminated as an inorganic layer. As a stacking method, a plasma CVD method was used, and a silicon oxide film having a thickness of 100 nm was stacked using tetramethoxysilane and oxygen gas as starting materials. Furthermore, an epoxy resin layer was formed on the outermost layer by coating to produce a transparent gas barrier film.

  A polyethylene naphthalate film (100 μm) was used as the resin substrate, a silica filler having an average particle diameter of 0.1 μm was added to the epoxy resin used in Example 1, the linear expansion coefficient was 31 ppm / ° C., and the tensile elastic modulus An epoxy resin adjusted to 940 MPa was applied to a thickness of 1 μm and cured by applying ultraviolet light to form an organic layer. Next, silicon oxide was laminated as an inorganic layer. As a stacking method, a plasma CVD method was used, and a silicon oxide film having a thickness of 100 nm was stacked using tetramethoxysilane and oxygen gas as starting materials. Furthermore, an epoxy resin layer was formed on the outermost layer by coating to produce a transparent gas barrier film.

  Epoxy with a polyethylene naphthalate film (100 μm) as the resin substrate, a thermoplastic elastomer added to the epoxy resin used in Example 1, a linear expansion coefficient of 49 ppm / ° C., and a tensile modulus adjusted to 480 MPa. The resin was applied to a thickness of 1 μm and cured by applying ultraviolet rays to form an organic layer. Next, silicon oxide was laminated as an inorganic layer. As a stacking method, a plasma CVD method was used, and a silicon oxide film having a thickness of 100 nm was stacked using tetramethoxysilane and oxygen gas as starting materials. Furthermore, an epoxy resin layer was formed on the outermost layer by coating to produce a transparent gas barrier film.

  In place of the epoxy resin of the organic layer (including the outermost layer) used in Example 1, a photocurable epoxy resin having a large aromatic component and a large tensile elastic modulus (tensile elastic modulus: 1300 MPa, linear expansion coefficient: 45 ppm / ° C. ) Was used. Example of coating process of organic layer on polyethylene naphthalate film (100μm), organic layer thickness, UV curing process, silicon oxide film lamination process, silicon oxide film thickness, outermost layer coating process In the same manner as in No. 1, a transparent gas barrier film was produced.

  In place of the epoxy resin of the organic layer (including the outermost layer) used in Example 1, a photocurable epoxy resin having a large aliphatic component and a small tensile elastic modulus (tensile elastic modulus: 900 MPa, linear expansion coefficient: 56 ppm / ° C. ) Was used. Example of coating process of organic layer on polyethylene naphthalate film (100μm), organic layer thickness, UV curing process, silicon oxide film lamination process, silicon oxide film thickness, outermost layer coating process In the same manner as in No. 1, a transparent gas barrier film was produced.

(Comparative Example 1)
A polyethylene naphthalate film (100 μm) is used as a resin substrate, and a thickness of 1 μm is obtained by adding a photopolymerization initiator to an epoxy resin having a linear expansion coefficient after curing of 65 ppm / ° C. and a tensile modulus of 3100 MPa. The organic layer was formed by applying and curing with ultraviolet light. Next, silicon oxide was laminated as an inorganic layer. As a stacking method, a plasma CVD method was used, and a silicon oxide film having a thickness of 100 nm was stacked using tetramethoxysilane and oxygen gas as starting materials. Furthermore, an epoxy resin layer was formed on the outermost layer by coating to produce a transparent gas barrier film.

(Evaluation)
The oxygen permeability of the films prepared in the above examples and comparative examples was measured using an oxygen permeability measuring device (manufactured by MOKON, OX-TRAN 2/21 ML) at a temperature of 23 ° C./humidity of 90%. Further, the water vapor transmission rate was measured using a water vapor transmission rate measuring device (manufactured by MOKON, PERMATRAN 3/31) under the conditions of temperature 40 ° C./humidity 90%. The total light transmittance was measured with a haze meter (Haze Meter NDH2000, manufactured by Nippon Denshoku). Further, the oxygen transmission rate and the water vapor transmission rate after the transparent gas barrier film of the present invention was wound around a cylindrical rod having a diameter of 2 cm were measured, and the change in gas transmission before and after bending was investigated. The results are shown in Table 1 below.

The typical sectional view of the transparent gas barrier film of the present invention. 1 is a schematic cross-sectional view of an electroluminescence element of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Resin substrate, 2 ... Organic layer, 3 ... Inorganic layer, 4 ... Transparent electrode layer, 5 ... Light emitting layer, 6 ... Cathode layer, 7a, 7b ... Sealing material, 10 ... Base material (transparent gas barrier film).

Claims (9)

  A transparent gas barrier film having a structure in which at least one organic layer and an inorganic layer are laminated on at least one surface of a resin substrate, wherein the organic layer has a linear expansion coefficient of 50 ppm / ° C. or less. Gas barrier film.   A transparent gas barrier film having a structure in which at least one organic layer and an inorganic layer are laminated on at least one surface of a resin substrate, wherein the organic layer has a tensile elastic modulus of 1000 MPa or less. .   In a transparent gas barrier film having a structure in which one or more organic layers and inorganic layers are laminated on at least one surface of a resin substrate, the organic layer has a linear expansion coefficient of 50 ppm / ° C. or less and a tensile modulus of elasticity. A transparent gas barrier film characterized by being 1000 MPa or less.   4. The transparent gas barrier film according to claim 1, wherein the inorganic layer contains silicon oxide, silicon nitride, or silicon nitride oxide as a main component.   The transparent gas barrier film according to claim 1, wherein the resin substrate is a polyethylene naphthalate film. 6. The transparent gas barrier film according to claim 1, wherein the total light transmittance is 80% or more.   In an electroluminescent device in which a laminate in which at least a transparent electrode layer, a light emitting layer, and a cathode layer are sequentially laminated on a base material is disposed in a sealed space, the base material is organic on at least one surface of a resin substrate. A transparent gas barrier film having a structure in which one or more layers and one or more inorganic layers are laminated, wherein the organic layer has a linear expansion coefficient of 50 ppm / ° C. or less.   In an electroluminescent device in which a laminate in which at least a transparent electrode layer, a light emitting layer, and a cathode layer are sequentially laminated on a base material is disposed in a sealed space, the base material is organic on at least one surface of a resin substrate. An electroluminescent device comprising a transparent gas barrier film having a structure in which one or more layers and an inorganic layer are laminated, wherein the organic layer has a tensile elastic modulus of 1000 MPa or less. In an electroluminescent device in which a laminate in which at least a transparent electrode layer, a light emitting layer, and a cathode layer are sequentially laminated on a base material is disposed in a sealed space, the base material is organic on at least one surface of a resin substrate. A transparent gas barrier film having a structure in which at least one layer and an inorganic layer are laminated, wherein the organic layer has a linear expansion coefficient of 50 ppm / ° C. or less and a tensile modulus of 1000 MPa or less. An electroluminescence element.

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