JP2004103609A - Concentric circular aligner - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a concentric circular aligner which is capable of protecting a wafer against chipping when the wafer is attached to the aligner, reducing misalignment or erroneous alignment, and more accurately aligning and attaching a circular wafer and a circular carrier. <P>SOLUTION: The concentric circular aligner which is used for attaching the semiconductor wafer is equipped with a first circular fixing part 21 for fixing the first circular substrate 24, a second circular fixing part 22 which is fitted to the first circular fixing part 21 through a concentric aligning system, and a plurality of fixing pieces 25 which are provided on the second circular fixing part 22 so as to fix a second circular substrate 23 as engaged with it and to align the center of the second circular substrate 23 with that of the first circular substrate 24. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a concentric aligner, and more particularly to a concentric aligner applied to semiconductor wafer adhesion.
[0002]
[Prior art]
Wafer alignment adhesion is a very important manufacturing flow in the semiconductor subsequent manufacturing process. Basically, it is stated that when a circular wafer and a circular carrier substrate are adhered, they can move to a so-called thermal adhesion process only after reaching concentric alignment. If there is a shift between the circular wafer and the circular carrier substrate due to the inability to align the circular wafer and the circular carrier substrate effectively, the manufacturing process will be performed in the subsequent processing. Misalignment occurs. Therefore, the alignment of the concentric circles is very important for the adhesion of the circular wafer and the circular carrier substrate.
[0003]
However, conventionally, the alignment stickiness of the wafer has been treated with a fixed concentric aligner. FIGS. 1A and 1B are views showing a conventional fixed concentric aligner. As shown in FIG. 1, the fixed concentric aligner includes two circular fixing portions 12 and 11 for aligning upper and lower concentric circles. The fixing radii of the circular fixing portions 12 and 11 for the vertical concentric alignment are set slightly larger than the circular wafer 13 and the circular carrier substrate (not shown), respectively. When the wafer is to be aligned and adhered, first, the circular carrier substrate is placed on the lower circular fixing portion 11 and fitted therewith. After that, the circular wafer 13 is placed on the upper circular fixing portion, so that the circular wafer 13 and the circular wafer 13 are rounded. The carrier substrate is aligned with the upper and lower concentric circles so as to contribute to the subsequent flow processing.
[0004]
[Problems to be solved by the invention]
However, although the radius of the circular fixed portion of this fixed concentric aligner is a fixed value, the radius is not a fixed value due to an error in the manufacturing process of the wafer material itself, and once the wafer radius fluctuates, The greater the variability, the greater the problem caused by traditional concentric aligners. When the radius of the circular wafer 13 is smaller than the radius of the upper circular fixing portion 12 when the traditional concentric aligner performs wafer adhesion (see FIG. 1A), the circular wafer 13 is placed on the upper circular fixing portion 12. However, the two cannot be brought into close contact with each other, and the center of the circular wafer 13 is always deviated from the center of the upper circular fixing part 12, so that the lower circular fixing part 11 cannot be effectively aligned with the circular carrier substrate, and the manufacturing process cannot be performed. An error will occur. Conversely, when the radius of the circular wafer 13 is larger than the radius of the upper circular fixing part 12 (see FIG. 1B), the circular wafer 13 cannot be placed on the upper circular fixing part 12 and the circular wafer 13 is circular in the operation process. The fragments of the wafer 13 are easily generated.
[0005]
In view of such disadvantages of the prior art, the present inventor has made extensive studies and tests, and has finally devised a novel concentric aligner applied to wafer adhesion.
[0006]
[Means for Solving the Problems]
The main object of the present invention is to apply to semiconductor wafer adhesion, to prevent the generation of debris at the time of wafer alignment adhesion, to reduce the misalignment and error of the alignment, and to more accurately align the circular wafer and the circular carrier substrate. It is to provide a sticky, concentric aligner.
[0007]
A concentric aligner according to a first aspect of the present invention (corresponding to claim 1) for achieving the above object includes a first circular fixing portion for fixing a first circular substrate, and a first circular fixing by a concentric alignment method. A second circular fixing portion fitted on the portion, and a second circular substrate installed on the second circular fixing portion for fixing and fixing the second circular substrate, and the center of the second circular substrate to the center of the first circular substrate. And a plurality of fixing pieces to be aligned, thereby preventing debris from being generated at the time of sticking the wafer, reducing misalignment and errors of the alignment, and more accurately positioning the circular wafer and the circular carrier substrate. The alignment can be sticky.
[0008]
A second invention based on the above idea is characterized in that, in the concentric aligner according to the first invention, a plurality of fixing pieces fix the second circular substrate by a three-point fixing method.
[0009]
A third invention based on the above idea (corresponding to claim 3) is that, in the concentric aligner according to the first invention, the first circular fixed portion and the second circular fixed portion can be rotated alternately. , A plurality of fixing pieces each including a rotation axis provided on the second circular fixing portion and an operating shaft connected to the first circular fixing portion, whereby the first circular fixing portion and the second circular fixing portion are provided. When the circular fixing portions rotate alternately, the plurality of fixing pieces fix and fix the second circular substrate, and the center of the second circular substrate is aligned with the center of the first circular substrate. The part is further provided with a plurality of grooves for guiding the directions of movement of the plurality of operating shafts.
[0010]
A fourth invention (corresponding to claim 4) based on the above idea is the concentric aligner according to the first invention, wherein the first circular fixing portion is completely in close contact with the first circular substrate, and The inner diameter of the second circular fixing portion is set to be larger than the inner diameter of the second circular substrate.
[0011]
A fifth invention based on the above idea (corresponding to claim 5) is the concentric aligner according to the first invention, wherein the first circular substrate and / or the second circular substrate is a single crystal, a polycrystal, or a non-crystal. It is characterized by being selected from fixed silicon, gallium arsenide or other semiconductor circular substrates.
[0012]
Further, a concentric aligner according to a sixth aspect of the present invention (corresponding to claim 6) for achieving the above object includes a base, a first circular fixing portion fitted and placed on the base, and a first circular fixing portion. A plurality of first fixing pieces, which are mounted on the portion, fix and fix the first circular substrate, and align the center of the circle with the center of the first circular fixing portion; A plurality of second circular fixing portions fitted and fixed to the first circular fixing portion, and a second circular substrate fixedly engaged with the second circular substrate and having its center aligned with the center of the first circular substrate. To prevent the generation of debris when the wafer is adhered, reduce the misalignment and error of the alignment, and more accurately align and adhere the circular wafer and the circular carrier substrate. Can be.
[0013]
A seventh invention based on the above idea (corresponding to claim 7) is the concentric aligner of the sixth invention, wherein the plurality of first fixing pieces and the plurality of second fixing pieces are each fixed to the first point by a three-point fixing method. And fixing the second circular substrate and the second circular substrate.
[0014]
An eighth invention based on the idea (corresponding to claim 8) is the concentric aligner according to the sixth invention, wherein the first circular fixed portion and the second circular fixed portion are rotatable on the base in the past. Wherein each of the plurality of first fixing pieces includes a rotation axis provided on the first circular fixing part and an operating shaft connected to the base, whereby the first circular fixing part is provided on the base. When rotating at the position, the plurality of fixing pieces engage and fix the first circular substrate inward, and the center of the circle is aligned with the center of the first circular fixing portion. Each of the plurality of first fixing pieces includes a plurality of concave grooves for guiding the directions of movement of the plurality of operating shafts on the plurality of first fixing pieces, and the plurality of second fixing pieces each include a rotating shaft provided on the second circular fixing portion A heart and an actuation shaft connected to the first circular fixed part, Thus, when the first circular fixing portion and the second circular fixing portion alternately rotate, the plurality of second fixing pieces engage and fix the second circular substrate inward and change the center of the circle. A plurality of grooves for aligning with the center of the first circular substrate and for guiding the directions of movement of the plurality of operating shafts on the plurality of second fixing pieces are further provided on the first circular fixing portion. It is characterized by having.
[0015]
A ninth invention based on the above idea (corresponding to claim 9) is the concentric aligner according to the sixth invention, wherein the inner diameters of the first circular fixed portion and the second circular fixed portion are each the first circular substrate. And is set to be larger than the inner diameter of the second circular substrate.
[0016]
Furthermore, a tenth invention (corresponding to claim 10) provided to achieve the above object, a concentric aligner is provided with a first circular fixing portion for fixing a first circular substrate and a concentric circular alignment method. A second circular fixing portion fitted on the first circular fixing portion; and a second circular substrate installed on the second circular fixing portion, for fixing and fixing the second circular substrate and for setting the center of the circle to the first circular shape. A centering member for aligning the center of the substrate with the center of the substrate, thereby preventing debris from being generated at the time of sticking the wafer, reducing misalignment and errors in the alignment, and making the circular wafer and the circular carrier more compact. Accurate alignment can be achieved.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 2 is a side sectional view showing the first embodiment of the concentric aligner according to the present invention. As shown in this figure, a concentric aligner applied to the adhesion of a semiconductor wafer includes a first circular fixing portion 21 for fixing a first circular substrate 24 and a first circular fixing portion 21 on a first circular fixing portion 21 in a concentric alignment method. The second circular fixing portion 22 fitted in the second circular fixing portion 22 is fixed to the second circular fixing portion 22, and the second circular fixing portion 22 is fixed to the second circular fixing portion 22. And a plurality of fixing pieces 25 to be aligned with the center of the circle. Among them, the plurality of fixing pieces 25 fix the second circular substrate 23 by a three-point fixing method. Each fixing piece 25 includes a rotation axis 252 installed on the second circular fixing part 22 and an operating shaft 251 connected on the first circular fixing part 21, whereby the first circular fixing part When the second circular fixing portion 21 and the second circular fixing portion 22 rotate alternately, the plurality of fixing pieces 25 engage and fix the second circular substrate 23 inward, and the center of the second circular substrate 23 is fixed to the first circular substrate 24. And the center of the circle. Further, in the present embodiment, the first circular fixing portion 21 is completely in close contact with the first circular substrate 24.
[0018]
FIGS. 3A and 3B are diagrams for explaining processes before and after the operation in the first embodiment. As shown in FIG. 3A, after the first circular substrate 24 is first placed on the first circular fixing portion 21, the second circular substrate 23 is placed on the first circular substrate 24 and the second circular substrate 24. Of the circular fixed portion 22 and waits. At this time, since the plurality of fixing pieces 25 have not yet been operated and the radius of the second circular substrate 23 is smaller than the inner diameter of the second circular fixing portion 22, the second circular substrate 23 is 2 can freely move inside the circular fixed portion 22. However, when the first circular fixing part 21 and the second circular fixing part 22 rotate alternately, the plurality of grooves 211 on the first circular fixing part 21 respectively pull the operation of the plural fixing pieces 25. Each fixing piece 25 engages and fixes the second circular substrate 23 inward by the rotation of the central shaft 252.
[0019]
FIG. 4 is a side sectional view showing a second embodiment of the concentric aligner according to the present invention. As shown in this figure, a concentric aligner applied to the adhesion of a semiconductor includes a base 46, a first circular fixing portion 41 fitted on the base 46, and a mounting member on the first circular fixing portion 41. A plurality of first fixing pieces 48 for fixing and fixing the first circular substrate 44 and aligning the center of the first circular substrate 44 with the center of the first circular fixing portion 41 are provided. The second circular fixing portion 42 fitted on the circular fixing portion 41 and the second circular substrate 43 are engaged and fixed, and the center of the circle is aligned with the center of the first circular substrate 44. And a plurality of second fixing pieces 45. Among them, the inner diameters of the first circular fixing portion 41 and the second circular fixing portion 42 are larger than the radii of the first circular substrate 44 and the second circular substrate 43, respectively. The second circular fixing portion 42 and the second circular fixing portion 42 can be rotated on the base 46 alternately. Further, each of the plurality of first fixing pieces includes a rotation axis 482 installed on the first circular fixing part 41 and an operating shaft 481 connected on the base 46. Are rotated on the base 46, the plurality of grooves on the base 46 respectively pull the operation of the plurality of operating shafts 481 on the plurality of first fixing pieces 48, and the plurality of first fixing pieces 48 The first circular substrate 44 is engaged and fixed in the direction, and the center of the circle is aligned with the center of the first circular fixing portion 41. Similarly, the plurality of second fixing pieces 45 each include a rotation axis 452 installed on the second circular fixing part 42 and an operating shaft 451 connected on the first circular fixing part 41, When the first circular fixing portion 41 and the second circular fixing portion 42 rotate alternately, the plurality of concave grooves on the first circular fixing portion 41 form the plurality of operating shafts 451 on the plurality of second fixing pieces 45. , The plurality of second fixing pieces 45 engage and fix the second circular substrate 43 inward, and the center of the second circular substrate 43 is aligned with the center of the first circular substrate 44. . Similarly, the plurality of first fixing pieces 48 and the plurality of second fixing pieces 45 respectively fix and fix the first circular substrate 44 and the second circular substrate 43 by a three-point fixing method.
[0020]
In other words, the above-described embodiment has been given as an example in order to more specifically explain the technical means of the present invention, and the technical idea of the present invention should not be limited to this. Simple design changes, additions, and modifications by those skilled in the art all belong to the technical scope of the present invention, without departing from the scope of the claims.
[Brief description of the drawings]
The above disclosure of the present invention will be more clearly understood from the following description of embodiments given with reference to the accompanying drawings.
FIG. 1 is a diagram illustrating a conventional fixed concentric aligner.
FIG. 2 is a side sectional view showing a first embodiment of a concentric aligner according to the present invention.
FIG. 3 is a view showing an operation relationship of the concentric aligner according to the first embodiment of the present invention.
FIG. 4 is a side sectional view showing a second embodiment of a concentric aligner according to the present invention.
[Explanation of symbols]
21 first circular fixing part 22 second circular fixing part 23 second circular substrate 24 first circular substrate 25 fixing piece

Claims (10)

A first circular fixing portion for fixing the first circular substrate;
A second circular fixing portion fitted and placed on the first circular fixing portion in a concentric alignment manner;
A plurality of fixing pieces installed on the second circular fixing portion, for fixing and fixing the second circular substrate, and for aligning the center of the circle with the center of the first circular substrate;
A concentric aligner comprising: 2. The concentric aligner according to claim 1, wherein the plurality of fixing pieces fix the second circular substrate in a three-point fixing method. The first circular fixing part and the second circular fixing part are rotatable alternately, and the plurality of fixing pieces are respectively provided with a rotation axis provided on the second circular fixing part and the first circular fixing part. And an operating shaft connected to the circular fixed portion of the second circular fixed portion. When the first circular fixed portion and the second circular fixed portion rotate alternately, the plurality of fixing pieces are formed in the second circular shape. While fixing and fixing the substrate, the center of the substrate is aligned with the center of the first circular substrate,
2. The concentric aligner according to claim 1, wherein a plurality of grooves are further provided on the first circular fixing portion to guide operation directions of a plurality of operating shafts. The first circular fixing portion is completely in close contact with the first circular substrate, and the inner diameter of the second circular fixing portion is set to be larger than the inner diameter of the second circular substrate. The concentric aligner of claim 1, wherein: 2. The method according to claim 1, wherein the first circular substrate and / or the second circular substrate are selected from a single crystal, polycrystal, amorphous silicon, gallium arsenide or other semiconductor circular substrates. Concentric aligner. Base and
A first circular fixing portion fitted on the base;
A plurality of first fixing pieces installed on the first circular fixing portion, for fixing and fixing the first circular substrate, and aligning the center of the circle with the center of the first circular fixing portion; ,
A second circular fixing portion fitted and placed on the first circular fixing portion in a concentric alignment manner;
A plurality of second fixing pieces for securing and fixing the second circular substrate and aligning the center of the second circular substrate with the center of the first circular substrate;
A concentric aligner comprising: The concentric aligner according to claim 6, wherein the plurality of first fixing pieces and the plurality of second fixing pieces respectively fix the first circular substrate and the second circular substrate in a three-point system. . The first circular fixing portion and the second circular fixing portion are alternately rotatable on the base,
The plurality of first fixing pieces each include a rotation axis installed on the first circular fixing part and an operating shaft connected on the base, whereby the first circular fixing part is When rotating on the base, the plurality of fixing pieces engage and fix the first circular substrate inward, and the center of the circle is aligned with the center of the first circular fixing portion,
The base further includes a plurality of grooves for guiding the directions of movement of the plurality of operating shafts on the plurality of first fixing pieces, respectively.
The plurality of second fixing pieces each include a rotation axis installed on the second circular fixing portion and an operating shaft connected to the first circular fixing portion. When the first circular fixing portion and the second circular fixing portion rotate alternately, the second fixing piece fixes and fixes the second circular substrate inward while moving the center of the second circular substrate inward. Aligned with the center of the first circular substrate,
7. The device according to claim 6, wherein the first circular fixing portion further includes a plurality of grooves for guiding the directions of movement of the plurality of operating shafts on the plurality of second fixing pieces. Concentric aligner. 7. The inner diameter of the first circular fixed part and the second circular fixed part is set to be larger than the inner diameter of the first circular substrate and the second circular substrate, respectively. Concentric circle aligner described. A first circular fixing part for fixing the first circular substrate;
A second circular fixing portion fitted and placed on the first circular fixing portion in a concentric alignment manner;
A centering member installed on the second circular fixing portion, for fixing and fixing the second circular substrate and aligning the center of the circular substrate with the center of the first circular substrate;
A concentric aligner comprising:

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