JP2002329181A - Ic card and method for manufacturing ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method capable of exactly aligning IC cards successively stacked in a correct direction and surely carrying these IC cards without inviting any trouble. SOLUTION: An IC card consists of two layers or more by using a card material consisting of a plastic film made of modified polyester resin obtained by polymerizing at least three components, i.e., ethylene glycol, terephthalic acid 1,4-cychrohexanedimethanol, for both of a surface side card material 1 and a rear side card material. Since the warp direction of an IC card consisting of a major side of 84 to 86 mm and a minor side of 53 to 58 mm and having a gap of 0.05 to 0.8 mm between the approximately center part of the card and the plane of a surface board at the time of putting the card on the surface of the surface board so that the surface side is turned upward and observing the card from the side face of the major side direction of the card is always fixed and the quantity of warp is controlled, IC cards can be easily stacked.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC card and a method for manufacturing the same. In particular, the present invention is suitable for encoding or the like in which a pile of piles is stable in a state where many cards are piled up and a card is fed from the pile.

[0002]

2. Description of the Related Art A new information recording medium called an IC card is in the form of a card or a sheet such as a credit card, a bank card, a point card, a telephone card, etc., which are currently widely available on the market. IC inside
Has been incorporated. IC cards are roughly classified into three types: contact type, non-contact type, and combination type having both functions. In the contact type, a terminal is provided on the card surface, and signals are exchanged through the terminal. At present, disposable types are widely distributed as telephone cards in Europe and the like. In addition, experiments using various types of information rewritable types as money cards have been conducted in various countries, and are attracting attention as cards used in financial fields.

The contact type IC card has a simple structure in which a modularized IC chip is mounted on a plastic card. The plastic card includes a method in which a hole having a size and a depth in which the IC module is inserted is previously formed in a portion where the IC module is bonded, and a method in which the plastic card is formed by injection. There are two ways to make a hole: engraving a single plastic card with a counterbore machine, or attaching a through hole to one of two sheets. At present, the mainstream is the one with one chip, but there is also a contact type IC card that includes multiple components for each function, and circuit patterns are used for connection between components and connection with special terminals etc. I have. These cards are designed to meet the demands of the market, which is equipped with holograms for preventing forgery and rewrite display labels so that part of the contents can be visually displayed.
Thermoplastic resin sheets such as PVC (polyvinyl chloride) resin are used on both sides. However, since PVC resin affects the environment such as dioxin generated during incineration, movement to remove PVC has recently occurred.

[0004]

As a card base material of an IC card, a non-crystalline modified polyester resin which is a kind of thermoplastic resin, and a resin plastic sheet which is distributed on the market under the name of PETG have been noticed and used. I have. This resin is formally referred to as a modified polyester resin obtained by polymerizing at least three components of ethylene glycol, terephthalic acid, and 1,4-cyclohexanedimethanol, but is simply referred to as a modified polyester resin in the present specification. The card base material of the modified polyester resin is molded at a relatively low temperature compared to PVC or the like.
Using a film with a high heat shrinkage inside has the drawback that the card will be warped.To prevent thermal deformation, use a heat-treated content of a specific material or a thermoplastic film with an amorphous structure. Must be used. If the members are limited in order to suppress the warpage, the materials that can be used are limited. Further, even if the contents are not subjected to heat shrinkage by heat treatment or the like, the card is warped by a slight stress, so that it is difficult to manufacture a warped card. In addition, thermoplastic resins that can make cards other than modified polyester resins have a glass transition point, so that a volume change occurs around that temperature,
Therefore, in the manufacturing method in which heat is applied and pressed, stress is generated during cooling. Even if the ingenuity is devised so as to eliminate the warpage of the card, the warpage occurs unevenly due to a slight difference in the thickness of the constituent materials, a difference in the glass transition point, a difference in the filling material, and the like. Such a card cannot be neatly arranged when the prints are arranged or the front and back sides are arranged, and there is also a problem in conveyance. SUMMARY OF THE INVENTION An object of the present invention is to provide an IC card that can be neatly arranged when piled up on the front and back, and that can be transported without any problem and a method of manufacturing the same.

[0005]

According to the first aspect of the present invention, there is provided an IC card comprising a plastic film of a modified polyester resin obtained by polymerizing at least three components of ethylene glycol, terephthalic acid and 1,4-cyclohexanedimethanol. ICs with two or more layers used on both sides
When placing the card on a surface plate with its front side facing up, when viewed from the side in the long side direction of the card, the structure has a gap of 0.05 to 0.8 mm between the approximate center of the card and the plane of the surface plate. ing. The IC card according to the second aspect has a structure in which the card substrate on the back surface is thicker than the card substrate on the front surface. Claim 3
Is characterized in that an intermediate layer of a thermoplastic resin having a Vicat softening point of 100 ° C. or lower is interposed between an inlet on which an electronic component is mounted and the front card substrate and / or the back card substrate. . The IC card according to claim 4, wherein the inlet on which the electronic component is mounted uses an inlet film made of a modified polyester resin obtained by polymerizing at least three components of ethylene glycol, terephthalic acid and 1,4-cyclohexanedimethanol. An intermediate layer of a thermoplastic resin having a Vicat softening point of 100 ° C. or less is interposed between the front card base material and the front card base material, and the inlet film and the back card base material are substantially integrated. The method of manufacturing an IC card according to claim 5, wherein the front and back card base materials are sandwiched between a pair of pressed metal plates for press using a hot press device, and the temperature of both card base materials is 100 ° C. or higher. 5. An IC card manufacturing method for manufacturing the IC card according to claim 1 by heating the IC card.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The present inventors have considered the size and directionality of the warpage of a card. It has been found that it is quite difficult to control the manufacturing conditions and the like in order to completely control the warpage to zero due to variations between materials lots and various other fluctuation factors. Therefore, as a result of repeated studies, controlling the direction of the warp by controlling the warp completely to zero, in short, by controlling the direction and magnitude of the warp to some extent to generate the warp, We paid attention to the fact that when the front and back are aligned, they can be neatly organized and can be transported reliably.
Limit warpage to some extent. That is, as described in JIS X 6301, the size of the warp should not exceed 1.5 mm including the thickness of the card when placed on a surface plate. By observing this limit, it is possible to eliminate the appearance problem that occurs when the warpage is too large. As a result, it has been found that if the IC card has an appropriate amount of warpage in a uniform direction, it can be neatly arranged when the front and back are aligned, and the conveyance can be performed without any problem. Furthermore, repeated attempts were made to intentionally generate such a moderately large warp in a uniform direction, and the conditions were established. The present invention can be applied to a non-contact IC card, a contact type IC card, and a combination card. The following are non-contact ICs that are typical examples of them.
An embodiment of the present invention will be described with reference to the drawings.

[0007] In the present invention, the front and back of the card,
One side is called the table, and put on the surface plate,
When viewed from the side in the long side direction of the card, the upper side is placed so that there is a gap of 0.05 to 0.8 mm between the approximate center of the card and the plane of the surface plate. It is assumed that no judgment has been made. Further, when arranging the constituent substance, the fact that the center of gravity of the cross section of the constituent substance is on the back side from the center in the thickness direction of the card is defined as the arrangement of the constituent substance on the back side. Figure 1 shows the configuration of an IC card
It was shown to. FIG. 1 is a sectional view of an example of the IC card of the present invention. It is composed of a front card base 1, a back card base 2, and an inlet 3 on which electronic components are mounted. An antenna circuit 5 and an IC chip 6 are mounted on the inlet. The structure constituted by being sandwiched between the front-side card base material 1 and the back-side card base material 2 is mounted on a hot press described below, heated to 100 ° C. or higher, cooled after fusion bonding. By cooling, the film of the front and back card base material undergoes thermal shrinkage, and the stress of the back card base material 2 which is the thicker card base material becomes larger, so that the thin front side of the card base material becomes slightly convex as a whole card. Become like Hereinafter, in the present invention, an inlet film on which an electronic component is mounted is generally referred to as an inlet. Further, an intermediate layer made of a thermoplastic resin may be present between the card substrate and the inlet.

FIG. 2 shows the configuration of such an IC card. FIG. 2 is a sectional view of another example of the IC card of the present invention. According to FIG. 2, it is composed of a front card base 21, a back card base 22, an inlet 23 on which electronic components are mounted, and intermediate layers 24a and 24b made of thermoplastic resin. Antenna circuit 25 and IC chip 2
6 is installed. The laminate constituted by being sandwiched between the front-side card base 21 and the back-side card base 22 is mounted on a hot press described below, heated to 100 ° C. or higher, cooled after fusion bonding. By cooling, the inlet side of the film of the front and back card base material causes thermal shrinkage, and the stress of the back side card base material 22, which is the thicker card base material, becomes larger,
The front side becomes slightly convex as a whole card. FIG. 3 shows another configuration of the IC card. FIG. 3 is a sectional view of another example of the IC card of the present invention. The structure having the intermediate layer 33 and using the modified polyester film for the inlet 34 is shown. If the modified polyester backing substrate 32 and the inlet 34 that are in close contact with the inlet when assembled by the hot press machine are melt-bonded, the two layers are of the same material, so they are almost completely joined to form substantially one layer. Therefore, the total thickness of the two layers is the thickness of the backing substrate.
If the total thickness is larger than the thickness of 31 of the front substrate, the back substrate and the inlet are bonded and then cooled during molding, so that the two layers of the bonded back substrate and the inlet are more visible. It is stronger than the heat shrink force of the base material, and the front side becomes slightly convex as a whole card. An electric wire antenna 35 is embedded in the inlet and is welded to the IC chip module 36.

Although there are various methods for measuring the warpage, a simple method is described in JIS X 6301 (1998).
Size of ID-1 type specified in the standard: long side 85.7
2mm ~ 85.47mm, short side 54.03mm ~ 53.92mm or standard length of Cybernetec Council long side 85.5mm ~ 84.8mm, short side 57.5
A method of measuring the space created between a card and a table by punching it to a size of 5 to 57.3 mm, placing the card on a flat table, pressing one side of the card, and forming the opposite side and the table There is a method of measuring a space, and a method of measuring a space generated between the card and the table is generally used. Also in this specification, the warpage of the card was measured by this method. The modified polyester resin used for the front and back card base material is a modified polyester resin obtained by polymerizing at least three components of ethylene glycol, terephthalic acid and 1,4-cyclohexanedimethanol. There are several types of grades, such as those imparting some crystallinity by imparting properties or changing the ratio of ethylene glycol and 1,4-cyclohexanedimethanol, but the modified polyester used in the present invention It is preferable to use a modified polyester resin having the same composition on both sides. When a modified polyester resin having a different composition is used, the control of warpage is not easy, and the control becomes difficult due to a slight difference in shrinkage.

The modified polyester resin of the card substrate shrinks upon cooling. Since the press plate side of the card substrate is in close contact with the press plate, shrinkage is hindered to some extent,
Almost no volumetric shrinkage occurs. Conversely, the inner side of the card substrate opposite to the press plate undergoes thermal shrinkage, and the stress increases as the card substrate becomes thicker. Further, the layer farther from the press plate becomes stronger. However, the heat shrinkage of the modified polyester resin is weak due to its non-crystallinity, and is easily affected by the strong heat shrinkage inside. For this reason, the resin used inside is subjected to a heat treatment to make it difficult for heat shrinkage to occur at around 120 ° C.
It is more preferable to use a material having a temperature of not more than ° C. This is to prevent the glass from passing through the glass transition point at the time of molding the card, because the volume change is large around the glass transition point.

The modified polyester resin of the card base material may be a varnish for imparting releasability to the metal plate for compression, a varnish for giving gloss, or a varnish for improving abrasion resistance alone or , Mixed and printed or coated to a thickness of 0.050 mm or less. In addition, by using a varnish that shows a higher melting point and Vicat softening point than the card substrate, a card with a smooth surface can be obtained without being affected by the flow of printing or the built-in antenna or chip. It is a thing that can be done. The varnish is UV (ultraviolet) curing varnish or EB
An (electron beam) curable varnish can be cured without applying heat, and an IC card with excellent surface properties can be obtained. To explain the UV-curable varnish, as the resin blended in the ink, for example, monomers such as acrylic acid, methyl acrylate, ethyl acrylate, n-butyl acrylate, isodecyl acrylate, phenoxy acrylate, stearyl acrylate, n- Mono-acrylate such as hexyl acrylate, lauryl acrylate ethoxy ethyl acrylate, glycidyl acrylate, cyclohexyl acrylate, 1,3-butanediol diacrylate, polyethylene glycol diacrylate, trimethylolpropane triacrylate, tripentaerythritol, triacrylate or more such as hexaacrylate Acrylates, methacrylic acid, lauryl methacrylate, glycidyl methacrylate and other methacrylates, Acid, itaconic acid, N- methylol acrylamide, vinyl toluene, vinyl acetate, acrylonitrile. Other polymers and oligomers that can be polymerized by ultraviolet rays can be used. For example, there are polyacrylate, polyester acrylate, urethane acrylate, epoxy acrylate, silicone acrylate, polyether acrylate, polybutadiene acrylate, thiol / polyene, and the like.

As additives, antistatic agents and slip agents such as fatty acids, stearic acid and fatty acid esters, alkyl resins and aliphatic resins, silicone-alkylene oxide copolymers, silicone oil-containing aliphatic epoxides,
A necessary amount of a silicone oil-based additive such as a fluorocarbon surfactant may be included based on required physical properties. As the polymerization initiator blended in the varnish to be used, known materials, for example, acetophenone-based, benzophenone-based, quinone derivatives and the like can be mentioned. Note that sensitizers such as n-butylamine and tri-n-butylphosphine can also be used. On the other hand, in the case of the EB-curable varnish, a UV-curable resin can be used as it is as the resin contained in the ink. The same additives as the UV-curable varnish can be used for the additives.

As the thermoplastic resin used for the intermediate layer used in the present invention, if a non-crystalline resin having a fluidity at around 100 ° C. and a heat shrinkage force smaller than that of the modified polyester resin is selected, the shrinkage of the modified polyester resin is reduced. Is relatively large, and warpage can be easily controlled.
As the thermoplastic resin, in addition to the above-mentioned modified polyester resin, for example, olefin resin, ionomer, polyvinyl chloride, ABS (acrylonitrile-butadiene-styrene) resin, AS (acrylonitrile-styrene) resin, polystyrene, acrylic resin, methacrylic resin , Polyvinyl acetate, vinyl butyral resin, EVAC (ethylene
-Vinyl acetate resin), cellulose derivative resin, urethane resin, polyester resin, polyamide resin, nylon, polyacetal, polycarbonate, fluorine resin, polyester resin, polyetherimide, polyimide, etc. , Etc. The Vicat softening temperature of the thermoplastic resin used for the intermediate layer of the present invention is 100 ° C. or lower, preferably 75 ° C. or lower. When the temperature is 75 ° C. or lower, the adhesion to the modified polyester resin becomes stronger. In order to firmly melt-bond the front and back card base material and the inlet sheet, it is desirable that the thermoplastic resin of the card base material and the inlet sheet be hot-pressed under a flowing state, but the surface card base material, or the inlet sheet An IC card can be obtained by pressing either one of them in a molten state and pressing. The lower limit is preferably 45 ° C. or higher. This is because if the Vicat softening temperature of the thermoplastic resin is low, the normal card operating temperature range becomes narrow, which makes it unsuitable for practical use. When the Vicat softening point of the thermoplastic resin used for the intermediate layer is high, the Vicat softening point can be lowered by using a plasticizer, another thermoplastic resin, oil or the like. If the Vicat softening point of the thermoplastic resin is too low, by blending other thermoplastic resins, or by using a curing agent to increase the Vicat softening point, or by adding a pigment or the like to improve the cohesive force Can be improved. In the case of a modified polyester resin, another thermoplastic resin may be blended in order to improve heat resistance and impact resistance.

The inlet film is an electrically insulating and thermoplastic film-like support, for example, generally PET (polyethylene terephthalate), PEN (polynaphthalene terephthalate), PPS (polyphenylene sulfide), PBT (polybutylene terephthalate), polyimide film Etc. are used as supports, adhesives, heat,
It is used by bonding to metal foil such as copper or aluminum by pressure. After a part of the metal foil of the circuit base material obtained by bonding the support and the metal foil is removed by etching to form a necessary circuit pattern, an IC chip or an IC module is mounted and used as an inlet. . The inlet film is preferably subjected to heat treatment,
It is preferable to use one having a heat shrinkage of 0.5% or less, preferably 0.2% or less in 30 minutes. Since such an inlet film hardly shrinks at 100 ° C., the influence of the warpage of the inlet film on the warpage of the card is smaller than that of the front and back card base materials.

When the card is pressed in a vacuum state at the time of hot pressing, no air remains on the card surface, so that the appearance is beautifully finished. At this time, if the compression metal plate and the card base material come into close contact with each other, extra air may remain between the card base material and the compression metal plate even in a vacuum state, which may impair the appearance. In order to prevent this, if a card base material whose surface is matted is used, the metal plate for compression and the card base material do not come into close contact with each other when vacuum is applied, so that the appearance is beautifully finished. The same can be said for the case where the metal plate for compression is matted. This card is manufactured by hot pressing. Press machines are roughly divided into mechanical press machines and hydraulic press machines. Further, hydraulic presses are classified into hydraulic presses and hydraulic presses depending on the liquid used. Some hydraulic presses use air pressure instead of liquid. Because the pressing force and press speed can be adjusted,
Although a hydraulic press is preferable, it is difficult to adjust the pressing force and the press speed with a mechanical press, but the press speed is high and suitable for mass production.

The heat press has a pressure of 0.001 to 980 kP.
a, It has the ability to heat press under the conditions of pressurization time of about 50-5000 seconds. FIG. 4 is a cross-sectional view showing a schematic configuration of such a heat press device. The part where the hot press is performed for the molding pressurization is installed in a vacuum device indicated by a dashed line in FIG. 4 and is degassed by the vacuum pump 14 so that a vacuum atmosphere can be maintained. By evacuating the inside of the vacuum apparatus before performing the heat press, air in the card member of the laminate 13 and other members and between members is eliminated, and a card having good surface properties can be formed. This vacuum atmosphere is 0.8kPa abs
It is sufficient if the pressure is of the order of magnitude. It is more preferable to maintain this vacuum atmosphere from the time of subsequent heating to the time of cooling, but it may be at atmospheric pressure during cooling. The thermo oil is heated by an electric heater (not shown), introduced into the thermo oil circulation passages 10a and 10b, and heats the upper and lower tables 11a and 11b and the compression metal plates 12a and 12b directly connected to the tables. When the compression metal plates 12a and 12b sandwich the IC card member laminate 13 and reach a predetermined temperature, hot pressing is started. By performing a deaeration operation during the hot pressing, it is also possible to prevent entrapment of bubbles.

Due to the deaeration operation, the card forming hot press is pressed in a vacuum state. When pressed in a vacuum, the appearance is clean because no air remains on the surface of the card. At this time, if the compression metal plate and the card base material come into close contact with each other, extra air may remain between the card base material and the compression metal plate even in a vacuum state. That is, degassing may be insufficient. This may impair the appearance. In order to prevent this, it is more preferable to use a surface card base material whose surface is matted. That is, when a vacuum is applied, the compression metal plate and the card base material do not come into close contact with each other, so that degassing can be performed satisfactorily and the appearance is beautifully finished. In the present application, the matte tone refers to a considerably fine uneven surface, and the surface unevenness of the surface card base material is made into a surface roughness, Ra is 0.01 to 0.3 μm, Rmax is 0.02 to 3.00 μm, Rz
Is preferably in the range of 0.02 to 2.00 μm. Within this range, there are advantages in production, such as good deaeration and easy operation conditions. If it is larger than this range, the roughness is too large, and printing and the like are hindered. Further, when the size is reduced, the above-mentioned effects are hardly exhibited. Similar effects can be obtained when the compression metal plate is matted. In this case, the metal plate for compression is similarly made surface roughness, Ra is 0.01 to 0.3 μm, Rma
It is appropriate that x is 0.02 to 3.00 μm and Rz is 0.02 to 2.00 μm.
At this time, the matte tone of the compression metal plate is transferred to the surface card base material surface with almost the same roughness. When the surface roughness and the surface roughness of the card base material of the metal plate for compression are within this range, irregularities in the outer shape of the internal electronic components and the like are less likely to appear on the surface of the surface card base material. Of course, good degassing can be performed, and operational advantages can be obtained, such as easy operation conditions. If the surface irregularities of the front card substrate deviate from the above range to a larger one, it may be difficult to determine the details of printing.
If it deviates from the smaller range, it is too smoothed, and if it is too glossy, there is a possibility that the position of components inside the card may be inferred or it may be difficult to peel off the metal plate for compression.
In such a case, the effect as described above can be obtained.

It is common to control the pressure during hot pressing. The pressure is measured and controlled by a pressure sensor and a pressure control device (not shown) attached to the shafts of the tables 11a and 11b. The maximum applied pressure is 98
0 kPa, which is determined as a level at which destruction of the IC chip does not occur. The method of applying the pressure is preferably a method in which the pressure is increased in a multi-step manner starting from a low pressure. IC that is built-in when pressing from low pressure
The irregularities of electronic components such as chips and antennas are well absorbed,
It is easy to obtain a flat card surface. At this time, it is preferable to use a pressure higher than a low pressure of about 0.5 kPa as a low pressure which can be relatively easily controlled. Next, cooling water or the like is circulated through the cooling passages 9a and 9b to cool the heated laminate 13. If the cooling paths 9a and 9b can be installed as close as possible to the upper and lower compression metal plates 12a and 12b, it is better to divide the cooling channels 9a and 9b into two in the upper and lower tables 11a and 11b so that the temperatures of the compression metal plates are even. It is preferable because it can be easily controlled. For temperature control such as cooling speed, it is more efficient to control the temperature of the compression metal plate by opening and closing the cooling path bubbles 8a and 8b and controlling the temperature of the electric heater of thermo oil, but the control method etc. are particularly specified. It does not do.

On the surface of the front and back card base material used in the present invention, desired patterns, explanatory characters, etc. are printed by offset printing or silk screen printing. After molding, the card is punched and made into a card, but printing is performed before and after punching.
Also, the varnish of the overcoat may be printed and printed after printing a pattern or a description, and then molded, or the varnish may be printed and coated after forming the card. Furthermore, laminating of transparent over sheet, counterbore processing,
Multi-function I through hybrid IC processing, bar code, numbering processing, magnetic stripe processing, photo pasting, rewrite film pasting, embossing, etc.
Processed into C card.

[0020]

EXAMPLES Examples of the present invention will be shown below, but the present invention is not limited to these examples. Example 1 A 1C card having the cross-sectional structure shown in FIG. 1 was manufactured. (1) Heat-treated shrinkage at 120 ° C is 0.1% thick
35 μm thick copper foil antenna circuit 5 on 188 μm polyethylene terephthalate film (product name: SGA Teijin)
Was formed by an etching method. Furthermore, an IC chip 6 (4 mm × 4 mm, 250 μm
Inlet 3 was connected to the antenna terminal using a 50 μm-thick anisotropic conductive film adhesive (product name: FC161A, manufactured by Hitachi Chemical Co., Ltd.) (not shown). (2) Modified polyester resin film made by Mitsubishi Plastics (product name: PG-WHI thickness 200 μm, TG 60 ° C, Vicat softening temperature 70 ° C) on the front card substrate 1 and modified polyester resin made by Mitsubishi Plastics on the back card substrate 2 Film (Product name: PG-WHI thickness 35
0 μm, TG 60 ° C., Vicat softening temperature 70 ° C.), and a laminated metal sheet sandwiching the inlet 3 is compressed into a metal plate for compression (thickness 2 mm, SUS301, No. 6 finished surface roughness Ra).
= 0.10 μm, Rmax = 1.20 μm, Rz = 1.00 μm, manufactured by Nisshin Steel Co., Ltd.), and heated to 120 ° C. using a hot press machine.
After the card base material is in a molten state, press in speed 0.
Pressing was performed at a pressure of 196 kPa at a pressure of 196 kPa. (3) After compression and cooling, the card was punched out by a punching machine to obtain an IC card sample. The obtained card is
An excellent card that has a thickness of 710 μm, the card is warped on the front side, and a 0.1 mm gap is created when placed on a flat table with the face up, so that even if the number of sheets is stacked, it can be neatly organized It was a thing with uniformity.

Example 2 A 1C card having the sectional structure shown in FIG. 2 was manufactured. (1) Heat-treated shrinkage at 120 ° C is 0.1% thick
35μm thick copper foil antenna circuit 2 on 100μm polyethylene terephthalate film (product name: SGA Teijin)
5 was formed by an etching method. Further, an IC chip 26 (4 mm × 4 mm, 250 mm) on which a connection bump having a height of 20 μm is printed.
was connected to the antenna terminal using an anisotropic conductive film adhesive having a thickness of 50 μm (product name: FC161A, manufactured by Hitachi Chemical Co., Ltd.) (not shown), and an inlet 23 was obtained. (2) The inlet 23 is made of a thermoplastic resin film (Polyester adhesive film manufactured by Toagosei Co., Ltd.
Intermediate layer made of PES-111EES thickness 100μm Vicat softening point 65 ℃)
Sandwiched between 24a and 24b, and a modified polyester resin film (product name: PG-WHI thickness 20
0 μm, TG 60 ° C., Vicat softening temperature 70 ° C.), a modified polyester resin film (product name: PG-WHI thickness 300 μm, TG 60 ° C., Vicat softening temperature 70 ° C.) manufactured by Mitsubishi Plastics Co., Ltd. The laminated material is stacked on a metal plate for compression (thickness: 2 mm, SUS301, No. 6 finish surface roughness Ra).
= 0.10 μm, Rmax = 1.20 μm, Rz = 1.00 μm, manufactured by Nisshin Steel Co., Ltd.), and heated to 120 ° C. using a hot press machine.
After the card base material and the thermoplastic resin were in a molten state, they were pressed at a press-in speed of 0.01 mm / min and a pressure of 196 KPa. (3) After compression and cooling, the card was punched out by a punching machine to obtain an IC card sample. The obtained card is
An excellent card that has a thickness of 780 μm, the card is warped on the front side, and a 0.5 mm gap is created when placed on a flat table with the face up, so that even if the number of sheets is stacked, it can be neatly organized It was a thing with uniformity.

Comparative Example 1 A 1C card having the cross-sectional structure shown in FIG. 1 was produced in the same manner as in Example 1. (1) 2% heat shrinkage at 120 ° C without heat treatment
A 35 μm thick copper foil antenna circuit was formed by etching on a 188 μm thick polyethylene terephthalate film (product name: manufactured by SGA Teijin Limited). Further, an IC chip 6 (4 mm × 4 mm, 250 μm) on which a connection bump having a height of 20 μm is printed.
m) was connected to the antenna terminal using an anisotropic conductive film adhesive having a thickness of 50 μm (product name: FC161A, manufactured by Hitachi Chemical Co., Ltd.) to form an inlet 3. (2) Modified polyester resin film (product name: PG-WHI thickness: 300 μm, TG60 ° C, Vicat softening temperature: 70 ° C) on the front card substrate 1 and modified by Mitsubishi Plastics on the back card substrate 2 Using a polyester resin film (product name: PG-WHI thickness 300μm, TG 60 ° C, Vicat softening temperature 70 ° C), laminates laminated like a sheet are compressed into a metal plate (thickness 2mm, SU
S301, No. 6 finish surface roughness Ra = 0.10 μm, Rmax =
1.20 μm, Rz = 1.00 μm, manufactured by Nissin Steel Co., Ltd.), and heated to 120 ° C. using a hot press machine. After the card base material and the thermoplastic resin are in a molten state, the press-in speed is 0.01 mm.
/ Min at a pressure of 196 KPa. (3) After compression and cooling, the card was punched out by a punching machine to obtain an IC card sample. The obtained card is
With a thickness of 780 μm, the card is unevenly warped on the front side, and a gap of 1 mm to 2 mm occurs when placed on a flat table with the face up, so even if the number of sheets is stacked, it is neatly organized The card has an unusable card alignment property, and causes inconvenience in card transport.

Comparative Example 2 A 1C card having the cross-sectional structure shown in FIG. 2 was produced in the same manner as in Example 2. (1) Heat-treated shrink at 120 ° C with a thickness of 0.5%
A 35 μm thick copper foil antenna circuit was formed on a 100 μm polyethylene terephthalate film (product name: manufactured by SGA Teijin Limited) by an etching method. Furthermore, an IC chip 26 (4 mm × 4 mm, 250 μm thickness) on which connection bumps having a height of 20 μm are printed using an anisotropic conductive film adhesive (product name: FC161A, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 50 μm. Inlet 23 was obtained by connecting to the antenna terminal. (2) The inlet 23 is made of a thermoplastic resin film (a polyester-based adhesive film manufactured by Toa Gosei Co., Ltd., Aron Melt PE).
Intermediate layer 24 made of S-111EES 100μm thick Vicat softening point 65 ℃)
a, 24b, and a modified polyester resin film made by Mitsubishi Plastics (product name: PG-WHI thickness 250)
μm, TG60 ° C, Vicat softening temperature 70 ° C), and using a modified polyester resin film (product name: PG-WHI thickness 250 µm, TG60 ° C, Vicat softening temperature 70 ° C) manufactured by Mitsubishi Plastics, Ltd. The laminated material is stacked on a metal plate for compression (thickness: 2 mm, SUS301, No. 6 finish surface roughness Ra).
= 0.10 μm, Rmax = 1.20 μm, Rz = 1.00 μm, manufactured by Nisshin Steel Co., Ltd.), and heated to 120 ° C. using a hot press machine.
After the card base material and the thermoplastic resin were in a molten state, they were pressed at a press-in speed of 0.01 mm / min and a pressure of 196 KPa. (3) After compression and cooling, the card was punched out by a punching machine to obtain an IC card sample. The obtained card is
Although the thickness is 780 μm, the warpage of the card is small, but the direction of the warp is not constant, and if the number of cards is stacked with the table facing up, it can not be neatly organized, causing problems in card transport .

[0024]

The IC card of the present invention has at least two layers of a card substrate of a plastic film of a modified polyester resin obtained by polymerizing at least three components of ethylene glycol, terephthalic acid and 1,4-cyclohexanedimethanol. An IC card consisting of: placed on a surface plate with the front side facing up, when viewed from the long side of the card, 0.05 to 0.8 mm between a substantially central portion of the card and the surface of the surface plate.
84 mm ~ 86 mm long side, 53 short side characterized by having a gap of
It is an IC card with a size of mm to 58 mm, and can provide good card alignment and excellent transportability.

[Brief description of the drawings]

FIG. 1 is a sectional view showing the structure of an example of an IC card according to the present invention.

FIG. 2 is a sectional view showing the structure of another example of the IC card of the present invention.

FIG. 3 is a sectional view showing the structure of another example of the IC card of the present invention.

FIG. 4 is a cross-sectional view illustrating a schematic configuration of a heat press device used in the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Front card base material 2 Back card base material 3 Inlet 6 IC chip

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C005 NA08 NA31 PA18 RA04 RA09 RA10 RA11 RA15 TA21 TA22 4F100 AK01B AK41A AK41C AK41J AL06A AL06C BA03 BA06 BA10A BA10C BA13 GB71 JA04B JB16B JC00 JL04 YY00B 5B035 A03

Claims (5)

[Claims] 1. An IC card comprising two or more layers of a card substrate of a plastic film of a modified polyester resin obtained by polymerizing at least three components of ethylene glycol, terephthalic acid and 1,4-cyclohexanedimethanol. It is characterized by having a gap of 0.05 to 0.8 mm between the approximate center of the card and the plane of the surface plate when placed on the surface plate with the front side up and viewed from the side in the long side direction of the card. IC card with long side 84mm ~ 86mm and short side 53mm ~ 58mm. 2. The IC card according to claim 1, wherein the thickness of the back card base is larger than that of the front card base. 3. An intermediate layer of a thermoplastic resin having a Vicat softening point of 100 ° C. or less between an inlet on which an electronic component is mounted and the front card base and / or the back card base. The IC card according to claim 1. 4. An inlet, on which electronic components are mounted, uses an inlet film made of a modified polyester resin obtained by polymerizing at least three components of ethylene glycol, terephthalic acid and 1,4-cyclohexanedimethanol. Vicat softening point is 1 between base material
3. The IC card according to claim 1, wherein an intermediate layer of a thermoplastic resin having a temperature of 00 ° C. or lower is interposed, and the inlet film and the back card substrate are substantially integrated. 5. A heating press device, wherein said front and back card base materials are sandwiched between a pair of pressed metal plates for pressing, and heated so that the temperature of both card base materials becomes 100 ° C. or higher. An IC card manufacturing method for manufacturing the IC card according to any one of 1 to 4.