JP2002127321A - Packaging bag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a packaging bag excellent in durability and an antistatic property, and suitable for packaging electronic parts and the like. SOLUTION: The packaging bag is made of an antistatic material having an intermediate layer formed on a surface of a film or a sheet which is a carrier, and an antistatic layer formed on a surface of the intermediate layer. The antistatic layer contains 10 to 40 wt.% of a photocatalyst powder and/or a photocatalyst sol, 10 to 30 wt.% of a silicone compound, and 50 to 65 wt.% of a metal oxide gel and/or a metal hydroxide gel.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a packaging bag made of an antistatic material having an antistatic layer formed on a film or sheet as a carrier via an intermediate layer.

[0002]

2. Description of the Related Art Synthetic resins (plastics) are excellent in mechanical properties, workability, moldability, coloring properties, chemical resistance, light weight, etc., and are used in daily goods, home appliances, office equipment,
It is used in many fields such as automobiles and packaging materials. However, since most plastics are electrically insulating, static electricity is easily charged, causing electric shock and spark discharge, and dirt is easily adsorbed on the surface. In addition, the electrostatic charge and its discharge may cause malfunction of the electronic device.

[0003] In order to solve such a problem, there has been proposed an antistatic function article formed by forming a coating film on the surface of an article made of plastic or the like with a paint having an antistatic function.

[0004] For example, Japanese Patent Application Laid-Open No. 9-232096 discloses that an electric conductivity of a surface is increased by forming a hydrophilic antistatic layer containing a photocatalyst (also referred to as an optical semiconductor) on the surface of an article. Antistatic articles are described.

Japanese Patent Application Laid-Open No. 10-237358 discloses that a solid content of an optical semiconductor converted into a total condensation compound in an inorganic coating containing silicone resin as a main component is 100 parts by weight in total with all the optical semiconductor components. On the other hand, there is described an antistatic paint containing from 2 to 80 parts by weight, and an antistatic paint product provided with a coating layer composed of a cured coating of the antistatic paint on the surface of a substrate.

Further, as a packaging film for preventing the inside of a packaging bag from being contaminated at the time of opening by the adsorption of dust and the like due to static electricity used for packaging electronic parts and the like, for example, a nylon film, On the surface of a synthetic resin film composed of two or more layers such as a polyester film, a polyacrylic acid derivative, a packaging film formed by coating an antistatic agent such as polyoxyethylene,
Packaging film with antistatic film made by dispersing carbon fiber in synthetic resin, quaternary ammonium salt, phosphate salt of fatty acid and polyhydric alcohol ester, sulfonate in synthetic resin such as polypropylene and polyethylene There is known a packaging film in which an antistatic agent such as described above is dispersed and kneaded and laminated on the surface of a synthetic resin film.

[0007] In these, an antistatic function is imparted to the surface of an article by forming a layer (antistatic layer) containing a photocatalytic component on the surface of the carrier.

[0008]

However, these antistatic articles have a problem that, depending on the type of the carrier, the adhesion between the carrier and the antistatic layer is poor, and the antistatic layer is easily peeled off. In the case of using, there is a problem in durability such that the synthetic resin itself undergoes photolysis by a photocatalyst.

A packaging bag having an antistatic layer manufactured for packaging electronic components and the like has an antistatic effect inside the packaging bag, but has a sufficient degree of cleanness inside the packaging bag. There was a problem that it could not be maintained.
Further, in the sealed bag, dew condensation easily occurs, and the dew comes into contact with electronic components and the like, which causes rust.

An object of the present invention is to provide a packaging bag which is excellent in durability and antistatic property and is particularly suitable for packaging electronic parts and the like in order to solve such a problem.

[0011]

SUMMARY OF THE INVENTION The present invention relates to a package made of an antistatic material having an intermediate layer formed on the surface of a film or sheet as a carrier and an antistatic layer formed on the surface of the intermediate layer. A bag, wherein the antistatic layer comprises 10 to 40% by weight of a photocatalyst powder and / or a photocatalyst sol, 10 to 30% by weight of a silicon compound, and 50 to 50% of a metal oxide gel and / or a metal hydroxide gel. Provided is a packaging bag characterized by containing 65% by weight.

In the packaging bag of the present invention, the antistatic layer
Has the general formula: SiR¹n₁
(OR^Two) 4-n₁[Wherein, R¹Is (amino group, chlorine atom
Or may be substituted with a carboxyl group)
To 8 alkyl groups, ^TwoIs substituted with an alkoxy group
Represents an alkyl group having 1 to 8 carbon atoms which may be
₁Represents an integer of 0 or 1 to 3. Alkoki represented by
It is preferably a polycondensate of silane.

[0013] The metal oxide gel and metal hydroxide gel may be selected from the group consisting of silicon, aluminum, germanium, magnesium, niobium, tantalum, tungsten and tin. It is preferably a gel of a substance and / or a gel of a metal hydroxide.

Further, the intermediate layer of the antistatic material is
A silicon modified resin containing 2 to 60% by weight of silicon,
It is preferable to use a resin containing 5 to 40% by weight of colloidal silica or a resin containing 3 to 60% by weight of polysiloxane. The packaging bag of the present invention can be preferably used for packaging electronic components.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION The packaging bag of the present invention comprises an antistatic material having an antistatic layer formed on a film or sheet serving as a carrier via an intermediate layer. (1) Film or sheet serving as a carrier The carrier film or sheet of the antistatic material used in the packaging bag of the present invention can be made of a bag and can carry an antistatic layer via an intermediate layer. It is not particularly limited. Also, the shape of the film or sheet surface is not particularly limited. The thickness is 1 from the point that the adhesive layer and the antistatic layer can be firmly supported on the surface.
Those having a size of 0 μm or more are preferred.

As the material of the carrier film or sheet,
For example, cellophane, paper, aluminum foil, nonwoven fabric, low-density polyethylene, medium-density polyethylene, high-density polyethylene, linear low-density polyethylene, metallocene-catalyzed linear low-density polyethylene, ethylene-vinyl acetate copolymer, ionomer, Unstretched polypropylene, biaxially stretched polypropylene, nylon-6, nylon-11, nylon66, nylon-610, nylon-7, nylon6
12, a copolymer of nylon 6 and nylon 66, a copolymer of nylon 66 and nylon 610, non-stretched nylon, biaxially stretched nylon, polyester, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, ethylene-vinyl alcohol Copolymer, polycarbonate,
Examples include polystyrene and polyacrylonitrile. These can be used alone or in combination of two or more.

(2) Intermediate layer The intermediate layer is provided between the carrier and the antistatic layer. The intermediate layer has a function of protecting the underlying carrier from deterioration due to the photocatalytic function contained in the antistatic layer and a function of firmly adhering the antistatic layer to the carrier, and the intermediate layer itself has a photocatalytic function. It has the characteristic that it is not easily deteriorated.

As the resin constituting the intermediate layer, a silicon-modified resin having a silicon content of 2 to 60% by weight in terms of silicon dioxide (oxide), and a polysiloxane having a content of 3 to 60% by weight in terms of oxide. A resin contained therein or a resin containing colloidal silica in an amount of 5 to 40% by weight in terms of oxide can be preferably used. These resins adhere well to the photocatalyst and are suitable for protecting the carrier from the photocatalyst.

A silicon-modified resin having a silicon content of less than 2% by weight in terms of oxide, a resin having a polysiloxane content of less than 3% by weight in terms of oxide, and a colloidal silica content in terms of oxide. When less than 5% by weight of the resin is used, the adhesion to the antistatic layer is deteriorated, and the adhesive layer is deteriorated by the photocatalyst, and the antistatic layer is easily peeled. On the other hand, a silicon-modified resin having a silicon content exceeding 60% by weight in terms of oxide, a resin having a polysiloxane content exceeding 60% by weight in terms of oxide, and a colloidal silica content in terms of oxide When the resin exceeds 40% by weight, the durability against a strong alkali such as a 1% by weight aqueous sodium hydroxide solution is reduced.

The method for obtaining the silicon-modified resin is not particularly limited as long as a silicon-modified resin containing a predetermined amount of silicon can be obtained. For example, a transesterification reaction, a graft reaction using a silicon macromer or a reactive silicon monomer, a hydrosilylation reaction, a block copolymerization method and the like can be mentioned.

Examples of the resin into which silicon is introduced (modified with silicon) include acrylic resin, epoxy resin, polyester resin, alkyd resin and urethane resin.
Among these, acrylic resin, epoxy resin, and polyester resin are the most excellent in terms of film formability, toughness, and adhesion to a carrier.

When a resin containing a polysiloxane is used, when the polysiloxane to be used is a hydrolyzate of a silicon alkoxide having an alkoxy group having 1 to 5 carbon atoms or a hydrolyzate thereof, the adhesiveness and durability are high. Thus, a photocatalyst-carrying structure with improved properties can be obtained.
Silicon alkoxides having an alkoxy group having more than 6 carbon atoms are expensive and have a low hydrolysis rate.
It becomes difficult to cure in the resin, and the adhesiveness and durability decrease.

The polysiloxane has the general formula:
_{SiCln 2 (OH) n 3 R} 3 n 4 (OR 4) can be preferably used a compound represented by n _5. Here, R ³ is a methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl, hexyl, octyl, aminomethyl, aminoethyl, carboxymethyl, carboxyethyl, chloromethyl, chloroethyl, chloropropyl group, etc. Represents an alkyl group having 1 to 8 carbon atoms (which may be substituted with an amino group, a carboxyl group or a chlorine atom).

R ⁴ is an alkyl group having 1 to 8 carbon atoms such as methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl, hexyl group, methoxymethyl, ethoxymethyl, propoxymethyl, isopropoxymethyl , Butoxymethyl, methoxyethyl, ethoxymethyl, propoxyethyl, methoxypropyl, methoxybutyl and the like. Also, n ₂ , n ₃ and n
₄ are each independently a 0,1 or 2, n ₅ is 2
Represents an integer of 4, and n ₂ + n ₃ + n ₄ + n ₅ = 4.

The silicon alkoxy represented by the above general formula
Preferred examples of the compound include Si (OCH_Three)_Four, Si
(OC_TwoH_Five)_Four, Si (OC_ThreeH₇)_Four, Si (OC_FourH₉)
_Four, Si (OC_FiveH₁₁)_Four, Si (OC₆H₁₃)_Four, SiC
H_Three(OCH_Three)_Three, SiCH_Three(OC_TwoH_Five)_Three, SiCH_Three
(OC_ThreeH₇)_Three, SiCH_Three(OC_ThreeH₇)_Three, SiCH
_Three(OC_FourH₉)_Three, SiCl (OCH_Three)_Three, SiCl (O
C_TwoH_Five)_Three, SiCl (OC_ThreeH₇)_Three, SiCl (OC_Four
H₉)_Three, SiCl (OC₆H₁₃)_Three, SiCl (OH)
(OCH_Three)_Two, SiCl (OH) (OC_TwoH_Five)_Two, Si
Cl (OH) (OC_ThreeH ₇)_Two, SiCl (OH) (OC_Four
H₉)_Two, SiCl_Two(OCH_Three)_Two, SiCl_Two(OC
_TwoH_Five)_TwoAnd the like.

The method of incorporating the polysiloxane into the resin is not particularly limited. For example, a method of mixing the resin in the form of a silicon alkoxide monomer with a resin solution and hydrolyzing with water in the air at the time of forming the adhesive layer, or a method of preliminarily adding silicon A method in which a partial hydrolyzate of an alkoxide and a resin are mixed, and the mixture is further hydrolyzed with moisture in the air at the time of forming an adhesive layer. Also, a small amount of an acid or base catalyst can be added to change the hydrolysis rate of silicon alkoxide.

The addition amount of the polysiloxane is 3 to 3 in terms of oxide in order to firmly adhere the antistatic layer to the carrier.
The content is preferably 60% by weight, but more preferably 3 to 40% by weight for improving alkali resistance.

Examples of the resin containing polysiloxane include silicone modified resins such as acrylic resin, acrylic silicone resin, epoxy silicone resin and polyester silicone resin, as well as any resin such as urethane resin, epoxy resin, polyester resin and alkyd resin. But can be used. Among these, an acrylic silicone resin, an epoxy silicone resin, a polyester silicone resin, or a silicon-modified resin containing a mixed resin thereof is particularly preferable in terms of durability and alkali resistance.

The simplest method of incorporating colloidal silica into a resin is to form a bonding layer by mixing a resin solution and a colloidal silica solution, and then applying and drying the mixture. In addition, those obtained by polymerizing a resin in a state where colloidal silica is dispersed can also be used. The colloidal silica used is not particularly limited, and for example, silica sol obtained by cation exchange of an aqueous solution of sodium silicate, silica sol obtained by hydrolyzing silicon alkoxide, and the like can be used. Also,
In order to improve the adhesion and dispersibility between the colloidal silica and the resin, it is also preferable to use colloidal silica treated with a silane coupling agent.

The amount of colloidal silica added to the resin is preferably in the range of 5 to 40% by weight, more preferably 5 to 30% by weight in terms of oxide. When the amount of colloidal silica is in this range, the antistatic layer can be firmly adhered to the carrier.

As the resin into which colloidal silica is introduced, any resin such as an acrylic resin, an acrylic silicon resin, an epoxy silicon resin, a silicon-modified resin, a urethane resin, an epoxy resin, a polyester resin, and an alkyd resin can be used. Among them, silicone-modified resins including acrylic silicone resin, epoxy silicone resin, and polyester silicone resin are preferable in terms of durability and alkali resistance, and resins containing both polysiloxane and colloidal silica have durability and alkali resistance, It is particularly preferable because the interlayer adhesion with the antistatic layer is excellent.

In the intermediate layer, a light stabilizer and / or an ultraviolet absorber can be mixed for the purpose of suppressing light deterioration. As the light stabilizer, a hindered amine is preferable, but other substances can also be used. Further, a triazole-based ultraviolet absorber or the like can be used as the ultraviolet absorber. The light stabilizer and the ultraviolet absorber are added in an amount of 0.005 to 10% by weight, preferably 0.01 to 10% by weight, based on the resin.
% By weight to 5% by weight.

The thickness of the intermediate layer is preferably 0.1 μm or more and 20 μm or less from the viewpoint of obtaining good adhesion to the antistatic layer. When the thickness of the intermediate layer is 0.1 μm or less, the function of firmly bonding the antistatic layer becomes weak. When the thickness is 20 μm or more, while the effect of firmly bonding the antistatic layer is saturated, the thickness is 20 μm in consideration of the coating efficiency.
There is little merit to do above.

(3) Antistatic Layer The antistatic layer can be formed from a composition for forming an antistatic layer containing a photocatalyst, a silicon compound, and a metal oxide gel and / or a metal hydroxide gel. .

The photocatalyst has a property of being activated by irradiation with light to increase conductivity. Once light activated by light irradiation, the enhanced conductivity is maintained for a certain period of time even if light irradiation is stopped. Therefore, as a result of maintaining the conductive state for a long time, the surface can be effectively prevented from being charged with static electricity or the like.

The shape of the photocatalyst to be used may be any as long as it is fixed to the intermediate layer and exhibits photocatalytic activity when dried at the drying temperature of the antistatic layer.
Sol-form, solution-form, etc. are mentioned.

As such a photocatalyst, for example, Ti
O_Two, ZnO, SrTiO_Three, CdS, GaP, InP,
GaAs, BaTiO_Three, KNbO_Three, Fe_TwoO_Three, Ta_Two
O_Five, WO _Three, SnO_Two, Bi_TwoO_Three, NiO, Cu_TwoO, S
iC, SiO_Two, MoS_Two, InPb, RuO_Two, CeO_Two
And Pt, Rh, RuO_Two, N
Metal such as b, Cu, Sn, Ni, Fe or metal oxidation
What added the thing can be used. These are simply
Can be used alone or in combination of two or more
No.

Among them, those containing titanium oxide as a main component are particularly preferable in terms of durability, cost, and excellent antistatic function. When the content of the photocatalyst in the antistatic layer is less than 5% by weight in terms of oxide, the photocatalytic activity is remarkably reduced. Also,
Although the photocatalyst activity increases as the amount of the photocatalyst increases, in order to obtain good adhesiveness with the intermediate layer, the amount of the photocatalyst is 6%.
It is preferably 0% by weight or less.

The silicon compound is a composition for forming an antistatic layer.
Prevents viscosity increase and particle sedimentation due to aging of the material
Added to control. Examples of silicon compounds
For example, the general formula: SiR¹n₁(OR^Two) 4-n₁[Wherein, R¹
Is substituted with an amino group, a chlorine atom or a carboxyl group.
Represents an alkyl group having 1 to 8 carbon atoms; ^Two
Has 1 to 8 carbon atoms which may be substituted by an alkoxy group
Represents an alkyl group, n₁Is 0, 1, 2 or 3
Represents Or an alkoxysilane represented by
Using one or a mixture of two or more hydrolysis products of
be able to.

R ¹ is a methyl group, an ethyl group,
Vinyl group, γ-glycidoxypropyl group, γ-methacryloxypropyl group, γ- (2-aminoethyl) aminopropyl group, γ-chloropropyl group, γ-mercaptopropyl group, γ-aminopropyl group, 1- An acroxypropyl group is exemplified. Examples of the group represented by OR ² include a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, a 2-methoxyethoxy group, and a 2-ethylhexyloxy group. it can.

Specific examples of the silicon compound represented by the above general formula include tetramethoxysilane, tetraethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, and a mixture of one or more of these hydrolysates. Are preferred.

The content of the silicon compound in the composition for forming an antistatic layer is preferably in the range of 0.001 to 5% by weight. If the amount is less than 0.001% by weight, the long-term storage stability of the composition for forming an antistatic layer is reduced, and if it exceeds 5% by weight, the catalytic activity of the photocatalyst is significantly reduced.

The metal oxide gel and the metal hydroxide gel have an effect of fixing the photocatalyst powder and firmly adhering the intermediate layer and the antistatic layer. Further, since the metal oxide gel and the metal hydroxide gel are porous, they have an adsorptive property and also have an effect of enhancing photocatalytic activity.

Examples of the metal component in such metal oxides and metal hydroxides include aluminum, titanium, zirconium, magnesium, niobium, tantalum, tungsten, tin and the like.

Further, by using an oxide gel or a hydroxide gel containing two or more metals selected from silicon, aluminum, titanium, zirconium and niobium as metal components, the antistatic layer can be used. Adhesion can be increased.

Examples of such metal oxides and metal hydroxides include alumina, titania, zirconia, magnesia, and niobium oxide. Among these, it is particularly preferable to use alumina and zirconia.

The content of the metal oxide and the metal hydroxide in the composition for forming an antistatic layer is usually 25
９５95% by weight, preferably 50-65% by weight. If it is less than 25% by weight, the adhesion to the intermediate layer is poor, and if it exceeds 95% by weight, the photocatalytic activity becomes insufficient.

It is also preferable that a silicon-modified resin or a silane coupling agent is added to the composition for forming an antistatic layer in an amount of 10 to 50% by weight based on the composition for forming an antistatic layer. When a silane coupling agent is added, an antistatic layer having higher adhesiveness can be obtained while maintaining high catalytic activity.

The thickness of the antistatic layer is not particularly limited, but is preferably in the range of 0.1 to 5 μm. If the thickness is 0.1 μm or less, sufficient photocatalytic activity cannot be obtained, and
When the particle size is not less than μm, the photocatalytic activity is improved, but the thickness of the whole antistatic material is increased, so that the working efficiency is inferior when making a bag.

(4) Production of Antistatic Material The antistatic material used for producing the packaging bag of the present invention is preferably in the form of a film or a sheet. The film or sheet of the antistatic material is formed, for example, by (1) first forming an intermediate layer by applying a composition for forming an intermediate layer on the surface of a film serving as a carrier, and (2) then forming a film on the surface of the intermediate layer. The antistatic layer can be produced by applying the composition for forming an antistatic layer to form an antistatic layer.

The method for forming the intermediate layer is not particularly limited. For example, a method in which the resin listed as a constituent of the intermediate layer is used as it is, and the resin is formed on the carrier surface by a printing method, a sheet forming method, or the like. Spray spraying method, dip coating method, Meyer bar method, spin coating method, flow using resin organic solvent solution, organic solvent suspension or aqueous dispersion emulsion (hereinafter referred to as “composition for forming intermediate layer”). A method of forming by coating with a coating method or the like, followed by drying can be used. The drying temperature during the formation of the intermediate layer is usually from room temperature to 20
It is in the range of 0 ° C.

The composition for forming an intermediate layer comprises one or more of the resins (or monomers or oligomers of the resin) listed as constituents of the intermediate layer, and if desired, a polysiloxane, a metal oxide sol, It can be prepared in the form of a solution or an emulsion containing a metal hydroxide sol and other additives. In this case, when used as a resin monomer or oligomer, a curing catalyst (polymerization catalyst) can be added.

The solvent used is preferably a solvent having a low boiling point, for example, water; alcohols such as methyl alcohol, ethyl alcohol, isopropyl alcohol and butanol; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, acetylacetone and cyclohexanone. Esters; esters such as ethyl acetate and butyl acetate; aromatic hydrocarbons such as benzene, toluene and xylene; aliphatic hydrocarbons such as pentane, hexane, heptane and cyclohexane; and a mixed solvent of two or more of these. No.

When a polysiloxane is contained in the intermediate layer, the composition for forming the intermediate layer may be, for example,
A predetermined amount of tetraalkoxysilane is dissolved in a solvent such as water, methanol, ethanol, or ethyl acetate and heated as it is, or a tetraalkoxy obtained by adding a predetermined amount of an acid or a base and partially hydrolyzing. What added the partial hydrolysis product of silane can also be used.

The antistatic layer is formed by spray coating, flow coating, spin coating, Meyer bar method on the surface of the intermediate layer.
By a known coating method such as a dip coating method and a roll coating method, coating is performed at a predetermined coating amount,
By drying, it can be formed with a predetermined thickness.

The composition for forming an antistatic layer is prepared by dissolving or suspending a photocatalyst, a silicon compound, and a metal oxide sol and / or metal hydroxide sol in a predetermined ratio in an appropriate solvent. Can be prepared.

The solvent used is preferably a solvent having a low boiling point, for example, water; alcohols such as methyl alcohol, ethyl alcohol, isopropyl alcohol and butanol; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, acetylacetone and cyclohexanone. Esters; esters such as ethyl acetate and butyl acetate; aromatic hydrocarbons such as benzene, toluene and xylene; aliphatic hydrocarbons such as pentane, hexane, heptane and cyclohexane; and a mixed solvent of two or more of these. No.

When the antistatic layer is formed on the intermediate layer, the photocatalyst is dispersed in the state of a precursor solution of a metal oxide sol or a metal hydroxide sol, and is hydrolyzed or neutralized and decomposed during coating. It may be formed into a sol or a gel.
When such a sol is used, an acid or alkali peptizer may be added for stabilization. The drying temperature at the time of forming the antistatic layer varies depending on the carrier material and the resin material in the intermediate layer, but is usually in the range of 50 to 200 ° C.

Further, in the present invention, it is preferable that the surface of the intermediate layer is subjected to an easy adhesion treatment before forming the antistatic layer. By subjecting the surface of the intermediate layer to an easy adhesion treatment, the interlayer adhesion between the intermediate layer and the antistatic layer can be significantly increased. Examples of such easy adhesion treatment include a method of subjecting the surface of the intermediate layer to a corona discharge treatment or a UV-ozone treatment.

In the present invention, one or two or more resins (or resin films) are provided on the side opposite to the surface on which the antistatic layer is carried in order to impart heat sealing properties and the like during bag making.
It is preferable to use an antistatic material obtained by laminating the above. As a method of laminating, a method of laminating using an adhesive, a method of coating a molten resin on a carrier, a method of laminating two carriers via a molten resin, and the like, can be performed by any method,
A plurality of layers can be laminated.

Examples of the resin used for laminating include low-density polyethylene, high-density polyethylene, linear low-density polyethylene, metallocene-catalyzed linear low-density polyethylene, polypropylene, ethylene-vinyl acetate copolymer, and ionomer. , Ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, ethylene-methyl acrylate copolymer, ethylene-methyl methacrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-vinyl alcohol copolymer, poly Examples thereof include methylpentene and saturated polyester.

(6) Production of Packaging Bag A packaging bag of a predetermined form (size and shape) can be produced using the antistatic material obtained as described above. Since the antistatic material used exhibits an excellent antistatic function and antifogging function, the surface on which the antistatic layer is formed may be either inside or outside when the packaging bag is manufactured.

The form of the packaging bag of the present invention is not particularly limited. For example, as shown in FIG. 1 (a), a three-sided antistatic agent sheet 1, 1 is heat sealed at both side edges and a lower end. As shown in FIG. 1 (b), the front sheet portion 2 and the rear sheet portion 3 facing each other are connected by a pair of gussets 4, 4 at both side edges of both sheets 2, 3, respectively. The lower end portions of the front seat portion 2, the rear seat portion 3, and the both gusset portions 4, 4 are adhered to form a bottom portion 5.
And a gusset bag formed with a.

When the packaging bag of the present invention is used for packaging electronic parts, it is preferable that the inside is dust-free. Examples of the production method include (i) a method in which a film or a sheet of an antistatic material formed in a clean environment is continuously formed into a bag in a clean environment, and (ii) a method in which the film or sheet is temporarily formed in a clean environment. A method of winding a film or sheet of the formed antistatic material and making the bag off-line, (iii)
A method in which both surfaces of a film or sheet of an antistatic material formed in a clean environment are washed with dust-free water, dried, and then made into a bag.

[0065]

(Preparation of antistatic film)

(1) Preparation of Composition for Forming Intermediate Layer An acrylic silicone resin having a silicon content of 3% by weight (in terms of oxide) and a partial hydrolysis product of tetramethoxysilane having a degree of polymerization of 3 to 6, Oligomer having a monomer content of 5% by weight or less and colloidal silica (trade name: IPA-ST, Ishihara Sangyo Co., Ltd.)
Was mixed so as to have a solid content weight ratio of 50:40:10. The obtained mixture is mixed with an ethanol-butanol-ethyl acetate mixed solvent (mixing ratio: 25 to 35/15 to 25/4).
5 to 55) to dilute the solid content to 10% by weight, and further added 2 equivalents of water (molar ratio in terms of oxide of tetramethoxysilane oligomer) to prepare a composition for forming an intermediate layer.

(2) Preparation of Antistatic Layer Forming Composition On the other hand, titanium oxide sol [trade name: STS-01,
Solid content concentration 30% by weight, average crystal particle diameter 7 nm, manufactured by Ishihara Sangyo Co., Ltd.], an oligomer having a degree of polymerization of 3 to 6 which is a partial hydrolysis product of tetramethoxysilane, colloidal silica (trade name: Cataloid) SI-350, particle diameter 7 to 9 nm, manufactured by Catalyst Chemicals, Inc.), aluminum oxide hydroxide (boehmite) fine particles (trade name: alumina sol-10, crystal particle diameter 2-20 nm, manufactured by Kawaken Fine Chemical Co., Ltd.), And, a zirconium oxynitrate solution is prepared by adding a solid content ratio (in terms of oxide) = (titanium oxide):
(Silica sol): (polysiloxane): (alumina sol): (zirconia sol) = 30: 10: 35:
The mixture was mixed at a ratio of 1: 4, and diluted with ethanol and water to a solid content of 3% by weight to prepare a composition for forming an antistatic layer.

The zirconium oxynitrate solution is
Zirconium nitrate hexahydrate (special grade reagent, Wako Pure Chemical Industries, Ltd.)
Was dissolved in water to obtain a 10% aqueous solution, and the mixture was heated for 12 hours, and one half of water was distilled off under reduced pressure.

(3) Preparation of Antistatic Material Film A coating liquid for the composition for forming an intermediate layer prepared previously by the Meyer bar method is applied to the surface of a weather-resistant PET (polyethylene terephthalate) film 6a, and dried at room temperature for 2 hours. do it,
An intermediate layer 6b having a thickness of 3 μm was formed on the PET film. Then, the previously prepared composition for forming an antistatic layer is applied to the surface of the intermediate layer in the same manner and dried at room temperature for 24 hours to form a 0.5 μm-thick antistatic layer 6c on the intermediate layer. By forming, a film 6 of an antistatic material having an overall thickness of 50 μm was produced (see FIG. 2A).

[Production of Packaging-Like Film] PET film 6 of antistatic material film 6 obtained as described above
After the anchor coating (hereinafter referred to as AC) 7a is applied to the a surface, a 30 μm-thick polyethylene resin 7b and a 20 μm-thick ionomer resin 7c are laminated by extrusion lamination (the laminate of 7a, 7b and 7c is laminated with the laminate layer 7). Do), antistatic layer coat PET / AC /
A packaging film 8 composed of a laminate of polyethylene / ionomer was prepared (see FIG. 2B).

(Example 1) The above-mentioned packaging film 8 was set to a width 1
After cutting to 20 mm and 400 mm in length, the sheet was folded in two with the antistatic layer surface inside, and using the separately prepared packaging film 8 having a width of 20 mm and a length of 200 mm, FIG.
As shown in (b), the surface of the ionomer resin 7c, which is the surface of the packaging film 8, was heat-sealed to form a side seal portion 9 to form a bag. Further, from both sides of the opening of the bag, separately prepared width 60 mm, length 120 mm
The ionomer resin 7c surface of the packaging film 8 is overlapped, and a portion overlapping with the packaging film 8 and an extended portion of the side seal portion 9 are heat-sealed as shown in FIG. An antistatic packaging bag C as shown in FIG.

(Example 2) The packaging film 8 was set to a width 1
After cutting to 20 mm and a length of 400 mm, the antistatic layer 6c was folded in two with the surface facing outward, and a side seal portion 11 having a width of 10 mm was formed by heat sealing to prepare an antistatic packaging bag D as shown in FIG. .

(Comparative Example 1) P having no antistatic layer
Using the ET film, a comparative packaging film manufactured in the same manner as the above packaging film was obtained. Using this comparative packaging film, a packaging bag was prepared in the same manner as in Example 1.
A comparative packaging bag was used.

[Evaluation of performance of packaging bag] (1) Measurement of surface resistivity of antistatic layer Antistatic layer 6c of packaging film 8 used in the above example
The sheet resistivity of the surface on which was formed was measured and evaluated. The sheet resistivity was measured according to JIS K6911. The calculation of sheet resistivity is based on Hiresta IPMCP-
By using HT250 (manufactured by Mitsubishi Chemical Corporation),
Calculated automatically. Temperature 25 ° C, Humidity 90% and 50%
Table 1 shows the results of measurements on the packaging film 8 under the environment described above.

[0074]

[Table 1]

As is clear from Table 1, it was found that the packaging film 8 used in Examples 1 and 2 had a sufficient antistatic effect. Further, even when the tobacco ash was brought close to the packaging film 8, the ash hardly adhered.

(2) Degree of cleanness inside the packaging bag Using the antistatic packaging bags C and D prepared in Examples 1 and 2, the electronic components were wrapped and sealed, and the same vibration as in transportation was applied for about 1 hour. Was. The packaging bag was opened, the electronic components were taken out, and the contamination inside the packaging bag was evaluated. As a result, it was found that the inside of the packaging bag was not contaminated and the cleanness was maintained at a high level.

On the other hand, the electronic parts were similarly packaged and sealed in the packaging bag manufactured in Comparative Example 1, and the same test as in the packaging bags of Examples 1 and 2 was performed. Was found inside the bag, confirming that it was contaminated.

(3) Accelerated Weathering Test The packaging film used in Examples 1 and 2 and Comparative Example 1 was a sunshine carbon arc weathermeter (WEL-SUN-HCH type, manufactured by Suga Test Instruments Co., Ltd.). Accelerated weather resistance test. As a result, no cracks were observed in the antistatic layer even after 500 hours in both the packaging films used in Examples 1 and 2. In addition, the sheet resistivity of the antistatic layer after the accelerated weathering test for 500 hours was not significantly different from the initial sheet resistivity in both Examples 1 and 2, and a sufficient antistatic effect was maintained. I understood.

[0079]

As described above, when the packaging bag of the present invention is used as a packaging bag for electronic parts, the antistatic layer has antifogging properties, so that the electronic parts due to dew condensation inside the bag can be rusted. Does not occur. Further, the packaging bag of the present invention is provided with an intermediate layer made of a specific material between the carrier and the antistatic layer, and is excellent in durability and antistatic properties.

[Brief description of the drawings]

FIGS. 1A and 1B are diagrams illustrating one embodiment of a packaging bag.

FIG. 2A is a cross-sectional view of a film carrying an antistatic layer of Example 1, and FIG. 2B is a cross-sectional view of a packaging film.

FIG. 3A is an overall view of a packaging bag according to a first embodiment, and FIG. 3B is a cross-sectional view taken along line YY in FIG.
(C) is sectional drawing of XX in (a).

FIG. 4 is an overall view of a packaging bag according to a second embodiment.

[Explanation of symbols]

 A: three-sided bag B: gusset bag C: packaging bag using an antistatic layer inside D: packaging bag using an antistatic layer outside 1: carrying an antistatic layer Sheet 2 ... Sheet carrying antistatic layer 3 ... Sheet carrying antistatic layer 4 ... Match part 5 ... Bottom 6 ... Film carrying antistatic layer 6a ... Film 6b ・ ・ ・ Intermediate layer 6c ・ ・ ・ Antistatic layer 7 ・ ・ ・ Laminate layer 7a ・ ・ ・ Anchor coating 7b ・ ・ ・ Polyethylene resin 7c ・ ・ ・ Ionomer resin 8 ・ ・ ・ Packing film 9 ・ ・ ・ Side seal Part 10: Seal part 11: Side seal part

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuo Ono 12-54 Goi-Minamikaigan, Ichihara-shi, Chiba Japan Functional Products Research Laboratories (72) Inventor Matsutaro Ono 1-4-16 Nihombashi Bakurocho, Chuo-ku, Tokyo Fujimori Kogyo Co., Ltd. (72) Inventor Kazuhiro Ikeda 1-4-16 Nihombashi Bakurocho, Chuo-ku, Tokyo Fujimori Kogyo Co., Ltd. F term (reference) 3E064 AA05 AA13 BA01 BA17 BA22 BB01 BB03 BC20 EA30 FA01 GA02 GA04 HM01 4F100 AA17C AA18C AA19C AA20B AA20C AA26C AA28C AH06C AK04 AK42 AK52B AK52C AK70 AR00B AT00A BA03 BA07 BA10A BA10C CA22C DA01 DA20 DE01C EC08 EH20 EH46 GB15 GB41 JG11 JG01CJJJL00 JL03

Claims (5)

[Claims] 1. A packaging bag made of an antistatic material having an intermediate layer formed on the surface of a film or sheet as a carrier and an antistatic layer formed on the surface of the intermediate layer, The prevention layer contains 10 to 40% by weight of a photocatalyst powder and / or a photocatalyst sol, 10 to 30% by weight of a silicon compound, and 50 to 65% by weight of a metal oxide gel and / or a metal hydroxide gel. A packaging bag characterized by: 2. The method according to claim 1, wherein the silicon compound has a general formula: SiR ^{1
_{n 1 (OR 2) 4-}} n 1 wherein, R ¹ represents a (amino group, may be substituted by a chlorine atom or a carboxyl group) an alkyl group having 1 to 8 carbon atoms, R ² is Represents an alkyl group having 1 to 8 carbon atoms which may be substituted with an alkoxy group, and n ₁ represents an integer of 0 or 1 to 3. The packaging bag according to claim 1, which is a polycondensate of an alkoxysilane represented by the formula: 3. The metal oxide gel or metal hydroxide gel is an oxide of one or more metals selected from the group consisting of silicon, aluminum, germanium, magnesium, niobium, tantalum, tungsten and tin. The packaging bag according to claim 1 or 2, which is a gel and / or a metal hydroxide gel. 4. The intermediate layer contains silicon in an amount of 2 to 60% by weight.
Contain silicon modified resin, colloidal silica of 5-4
0-60% by weight of resin or polysiloxane
The packaging bag according to any one of claims 1 to 3, wherein the packaging bag is made of a resin containing the resin by weight. 5. The packaging bag according to claim 1, wherein the packaging bag is for packaging electronic parts.