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JP2001327045A - Wiring board - Google Patents

Wiring board

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Publication number
JP2001327045A
JP2001327045A JP2000140693A JP2000140693A JP2001327045A JP 2001327045 A JP2001327045 A JP 2001327045A JP 2000140693 A JP2000140693 A JP 2000140693A JP 2000140693 A JP2000140693 A JP 2000140693A JP 2001327045 A JP2001327045 A JP 2001327045A
Authority
JP
Japan
Prior art keywords
wiring board
bus bar
insulating substrate
electric wire
electric wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000140693A
Other languages
Japanese (ja)
Inventor
Hiroyuki Murakoshi
洋行 村越
Hajime Takebe
肇 武部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP2000140693A priority Critical patent/JP2001327045A/en
Publication of JP2001327045A publication Critical patent/JP2001327045A/en
Pending legal-status Critical Current

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  • Connection Or Junction Boxes (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board the warpage of which can be prevented. SOLUTION: A plurality of bus bars 26 are buried in an insulating board 24 in a prescribed direction, and a plurality of electric wires 37 are installed on the insulating board 24 in the direction which crosses the specified direction to form a wiring board 22. The insulating board 24 is cut out at a place, where neither the bus bars 26 nor the electric wires 37 are installed. More specifically, the bus bars 26 and the electric wire 37 are installed on the insulating board 24 at places other than its substantially central portion, and the substantially central portion of the insulating board 24 is cut out to form a hole 35 in a prescribed shape. Warpage in the insulating board 24 is effectively prevented by the hole 35 in this prescribed shape.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、複数のブスバーと
複数の電線とがマトリックス的に配索された配線板に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board on which a plurality of bus bars and a plurality of electric wires are arranged in a matrix.

【0002】[0002]

【従来の技術】この種の配線板を上下に重ね合わせて成
る積層配線板組立体として、図10〜図12に示すもの
がある。この積層配線板組立体1は、図11に示すよう
に、幅方向に複数のブスバー4を所定間隔毎にインサー
ト成形して成る一対の絶縁基板2,3を所定距離隔てて
略一平面上に並列に配置し、この一対の絶縁基板2,3
間に複数の電線5を掛け渡すように布線して該一対の絶
縁基板2,3の各表面2a,3a上に該複数の電線5を
各ブスバー4と略直交する長手方向にそれぞれ直線的に
配索し、次に、一対の絶縁基板2,3間の複数の電線5
の各渡し部6を図11中矢印X方向に折り曲げて該一対
の絶縁基板2,3の各裏面2b,3b同士を重ね合わせ
ることにより組み立てられるようになっている。
2. Description of the Related Art FIGS. 10 to 12 show a laminated wiring board assembly in which such wiring boards are vertically stacked. As shown in FIG. 11, the laminated wiring board assembly 1 has a pair of insulating substrates 2 and 3 formed by insert molding a plurality of bus bars 4 at predetermined intervals in the width direction on a substantially flat surface at a predetermined distance. These insulating substrates 2 and 3 are arranged in parallel.
A plurality of electric wires 5 are laid so as to be bridged therebetween, and the plurality of electric wires 5 are linearly formed on the respective surfaces 2a, 3a of the pair of insulating substrates 2, 3 in the longitudinal direction substantially orthogonal to the bus bars 4. And a plurality of electric wires 5 between the pair of insulating substrates 2 and 3
11 are bent in the direction of arrow X in FIG. 11 and the back surfaces 2b and 3b of the pair of insulating substrates 2 and 3 are overlapped with each other.

【0003】また、電線5の布線時に、図12に示すよ
うに、一対の絶縁基板2,3より露出した所定位置のブ
スバー4の露出部4aと該ブスバー4の露出部4aにク
ロスするように配索された所定位置の電線5の一部5a
は、抵抗溶接用の一対の電極7,8間に挾まれて接合さ
れるようになっている。
As shown in FIG. 12, when the electric wire 5 is wired, the exposed portion 4a of the bus bar 4 at a predetermined position exposed from the pair of insulating substrates 2 and 3 crosses the exposed portion 4a of the bus bar 4. 5a of the wire 5 at a predetermined position routed in
Are joined between a pair of electrodes 7 and 8 for resistance welding.

【0004】尚、電線5として絶縁被覆のない裸電線が
用いられている。また、上記積層配線板組立体1に関す
る類似技術は、特願平10−308424号等に開示さ
れている。
As the electric wire 5, a bare electric wire without an insulating coating is used. A similar technique relating to the laminated wiring board assembly 1 is disclosed in Japanese Patent Application No. 10-308424.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、前記従
来の積層配線板組立体1を構成する絶縁基板2,3は、
幅方向の一方向にのみ複数のブスバー4が所定間隔毎に
インサート成形されているので、反りが発生し易く、組
み付け作業に支障をきたした。
However, the insulating substrates 2 and 3 constituting the conventional laminated wiring board assembly 1 are:
Since the plurality of bus bars 4 are insert-molded at predetermined intervals only in one direction in the width direction, the bus bars 4 easily warp, which hinders the assembling work.

【0006】そこで、本発明は、前記した課題を解決す
べくなされたものであり、反りの発生を防止することが
できる配線板を提供することを目的とする。
Accordingly, the present invention has been made to solve the above-mentioned problem, and has as its object to provide a wiring board capable of preventing the occurrence of warpage.

【0007】[0007]

【課題を解決するための手段】請求項1の発明は、絶縁
基板に複数のブスバーを所定方向にそれぞれ埋設すると
共に、該絶縁基板上に複数の電線を前記所定方向と交差
する方向にそれぞれ配索して成る配線板において、前記
絶縁基板の前記各ブスバー及び前記各電線がそれぞれ配
索されていない箇所を肉抜き形成したことを特徴とす
る。
According to a first aspect of the present invention, a plurality of bus bars are respectively buried in an insulating substrate in a predetermined direction, and a plurality of electric wires are respectively arranged on the insulating substrate in a direction intersecting the predetermined direction. In the wiring board formed by the cable, portions where the bus bars and the electric wires of the insulating substrate are not respectively routed are formed to be lightened.

【0008】この配線板では、絶縁基板の複数のブスバ
ー及び複数の電線がそれぞれ配索されていない箇所を肉
抜き形成したので、この肉抜き部分により絶縁基板の反
りが効果的に抑えられ、絶縁基板の反りの発生が防止さ
れる。
In this wiring board, the portions of the insulating substrate where the plurality of bus bars and the plurality of electric wires are not respectively routed are lightened and formed. The occurrence of substrate warpage is prevented.

【0009】請求項2の発明は、請求項1記載の配線板
であって、前記絶縁基板の略中央を避けて前記各ブスバ
ー及び前記各電線をそれぞれ配索し、この絶縁基板の略
中央部に前記肉抜きとして所定形状の孔を形成したこと
を特徴とする。
According to a second aspect of the present invention, there is provided the wiring board according to the first aspect, wherein each of the bus bars and each of the electric wires are routed so as to avoid a substantial center of the insulating substrate, and a substantially central portion of the insulating substrate is provided. A hole having a predetermined shape is formed as the lightening.

【0010】この配線板では、絶縁基板の略中央を避け
て複数のブスバー及び複数の電線をそれぞれ配索し、こ
の絶縁基板の略中央部に肉抜きとして所定形状の孔を形
成したので、この所定形状の孔により絶縁基板の軽量化
及び材料費の低コスト化が図れ、かつ成形サイクルが短
縮化される。
In this wiring board, a plurality of bus bars and a plurality of electric wires are respectively routed around a substantially center of the insulating substrate, and a hole having a predetermined shape is formed at a substantially central portion of the insulating substrate. The holes having a predetermined shape can reduce the weight of the insulating substrate and the cost of materials, and shorten the molding cycle.

【0011】[0011]

【発明の実施の形態】以下、本発明の一実施形態を図面
に基づいて説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

【0012】図1は本発明の一実施形態の積層配線板組
立体の組立前の状態を示す斜視図、図2は同組立体の組
立後の状態を示す平面図、図3は同組立体の組立後の状
態を裏側から見た斜視図、図4は同組立体に用いられる
ブスバー配線板のブスバーと電線の接合状態を示す部分
横断面図、図5は同ブスバーと電線の接合状態を示す部
分縦断面図、図6は同ブスバーと電線の接合状態を示す
部分平面図、図7は同ブスバーと電線の接合状態を示す
部分底面図、図8(a)〜図8(e)は同組立体の組立
過程を順を追って示す部分断面図、図9は同組立体を収
容する電気接続箱の分解斜視図である。
FIG. 1 is a perspective view showing a state before assembly of a laminated wiring board assembly according to an embodiment of the present invention, FIG. 2 is a plan view showing a state after assembly of the assembly, and FIG. FIG. 4 is a perspective view of the assembled state of the bus bar viewed from the back, FIG. 4 is a partial cross-sectional view showing the joined state of a bus bar and an electric wire of a bus bar wiring board used in the assembly, and FIG. FIG. 6 is a partial plan view showing a joint state between the bus bar and the electric wire, FIG. 7 is a partial bottom view showing a joint state between the bus bar and the electric wire, and FIGS. 8 (a) to 8 (e) FIG. 9 is a partial cross-sectional view showing the assembling process of the assembly in order, and FIG. 9 is an exploded perspective view of an electric junction box accommodating the assembly.

【0013】図9に示すように、積層配線板組立体20
は、電気接続箱10の外形を成す合成樹脂製で箱形の
上,下ケース11,12内に収容されている。即ち、
上,下ケース11,12内に積層配線板組立体20を中
心にその上下に対称になるように複数のブスバー14の
端子14a,14bを突設させたブスバー配線板15,
16と複数の電線17を布線した布線シート18,19
をそれぞれ配置することにより収容してある。尚、上,
下ケース11,12にはコネクタ装着部13A,13B
等を一体突出形成してある。
As shown in FIG. 9, the laminated wiring board assembly 20
Are made of a synthetic resin that forms the outer shape of the electric connection box 10 and are housed in box-shaped upper and lower cases 11 and 12. That is,
A busbar wiring board 15, in which terminals 14a, 14b of a plurality of busbars 14 are protruded in the upper and lower cases 11, 12 so as to be vertically symmetrical with respect to the laminated wiring board assembly 20,
16 and wiring sheets 18 and 19 in which a plurality of electric wires 17 are laid.
Are accommodated by arranging them. In addition,
Connector mounting parts 13A, 13B are provided in lower cases 11, 12, respectively.
Etc. are integrally formed.

【0014】図1,図8(a)に示すように、積層配線
板組立体20は、隣接する各端部21c,22c同士を
突き合わせて略一平面上に並列に配置された一対のブス
バー配線板(配線板)21,22と、この一対のブスバ
ー配線板21,22間に掛け渡すように布線されて該一
対のブスバー配線板21,22の各表面21a,22a
にそれぞれ配索された複数の電線37とを備えている。
この複数の電線37として絶縁被覆のない裸電線が用い
られている。
As shown in FIGS. 1 and 8 (a), the laminated wiring board assembly 20 has a pair of busbar wirings arranged in parallel on substantially one plane with adjacent ends 21c and 22c abutting each other. Boards (wiring boards) 21 and 22 and the surfaces 21a and 22a of the pair of bus bar wiring boards 21 and 22 are laid so as to extend between the pair of bus bar wiring boards 21 and 22.
And a plurality of electric wires 37 routed respectively.
A bare electric wire without an insulating coating is used as the plurality of electric wires 37.

【0015】各ブスバー配線板21,22は絶縁基板2
3,24の幅方向に複数のブスバー25,26を直線的
かつ並列にインサート成形して成り、各ブスバー25,
26の両端には上向きのタブ端子(端子)25a,25
a、26a,26aをともに同一高さに起立させてい
る。さらに、各絶縁基板23,24の表面の各ブスバー
25,26と略直交する方向には断面凹溝状の電線収容
部27,28をそれぞれ一体形成してある。この各電線
収容部27,28は絶縁基板23,24の表面からその
隣接する各端部の表面側から裏面側にかけて形成されて
いて、各端部側の各電線収容部27,28の両側には絶
縁リブ29,30をそれぞれ一体突出形成してある。さ
らに、各電線収容部27,28の相対向する内面にはス
トッパとしての一対の突起27a,27a、28a,2
8aを所定間隔毎に一体突出形成してあり、各電線収容
部27,28に収容される電線37が相対向する各一対
の突起27a,27a、28a,28a間で挾持される
ようにその収容状態が保持されるようになっている。
Each of the bus bar wiring boards 21 and 22 is an insulating substrate 2
A plurality of bus bars 25, 26 are formed by linear and parallel insert molding in the width direction of the
Tab terminals (terminals) 25a, 25
a, 26a, 26a are erected at the same height. Further, in the direction substantially orthogonal to the bus bars 25 and 26 on the surfaces of the insulating substrates 23 and 24, wire receiving portions 27 and 28 having a groove-shaped cross section are integrally formed. The electric wire housings 27 and 28 are formed from the surface of the insulating substrates 23 and 24 to the front and back surfaces of the adjacent ends, and are provided on both sides of the electric wire housings 27 and 28 at each end. Have insulating ribs 29 and 30 formed integrally with each other. Further, a pair of protrusions 27a, 27a, 28a, 2 as stoppers are provided on the opposing inner surfaces of the respective wire housings 27, 28.
8a are integrally formed at predetermined intervals so that the electric wires 37 accommodated in the electric wire accommodating portions 27, 28 are accommodated so as to be clamped between the pair of opposing projections 27a, 27a, 28a, 28a. The state is maintained.

【0016】また、一対のブスバー配線板21,22の
突き合わされる各端部21c,22cの裏面側の角部
分、即ち、各絶縁基板23,24の隣接する各端部に一
体突出形成された各絶縁リブ29,30の下側には略円
弧面状のアール部31,32をそれぞれ形成してあり、
この隣接する各アール部31,32同士は一対の絶縁基
板23,24間に掛け渡された複数の電線37の渡し部
37aを折り曲げて該一対の絶縁基板23,24を上下
に重ね合わせる際に当接自在になっている。
Further, the end portions 21c and 22c of the pair of bus bar wiring boards 21 and 22 are integrally formed so as to protrude at the corners on the back surface side of the end portions 21c and 22c, that is, at the adjacent end portions of the insulating substrates 23 and 24. On the lower side of each of the insulating ribs 29 and 30, rounded portions 31 and 32 having a substantially arc-shaped surface are formed, respectively.
The adjacent round portions 31 and 32 are used to bend the connecting portion 37a of the plurality of electric wires 37 bridged between the pair of insulating substrates 23 and 24 to overlap the pair of insulating substrates 23 and 24 vertically. The contact is free.

【0017】さらに、所定のブスバー25,26の一部
は各絶縁基板23,24から露出している。即ち、図4
〜図7に示すように、各絶縁基板23,24の各ブスバ
ー25,26の一部は露出部25b,26bとなって表
裏面側に露出しており、その周りには該各ブスバー2
5,26の露出部25b,26bと各電線37の接続部
37bとを挾んで接合させる抵抗溶接用の一対の電極3
8,39の径より大径の接続用孔33,34を形成して
ある。この接続用孔33,34は矩形に形成されてい
て、該矩形の接続用孔33,34の各辺の略中央に各ブ
スバー25,26の露出部25b,26bと各電線37
の接続部37bが位置するようにそれぞれ配置されてい
る。これにより、各接続用孔33,34内において各ブ
スバー25,26の露出部25b,26bと電線37の
接続部37bとが略直交するようにそれぞれ配索され、
かつ、各ブスバー25,26の露出部25b,26bは
完全に露出されるようになっている。尚、図4に示すよ
うに、電線収容部27,28と接続用孔33,34の境
部分には円弧状に湾曲した曲面部27b,28bをそれ
ぞれ形成してあり、該各曲面部27b,27b、28
b,28bに電線37が隙間なく当接するようになって
いる。
Further, a part of the predetermined bus bars 25, 26 is exposed from each of the insulating substrates 23, 24. That is, FIG.
As shown in FIG. 7, a part of each bus bar 25, 26 of each insulating substrate 23, 24 becomes exposed portions 25b, 26b and is exposed on the front and back sides, and around each bus bar 2,
A pair of electrodes 3 for resistance welding which are joined by sandwiching the exposed portions 25b and 26b of the wires 5 and 26 and the connecting portion 37b of each electric wire 37.
Connection holes 33 and 34 having diameters larger than the diameters 8 and 39 are formed. The connection holes 33 and 34 are formed in a rectangular shape, and the exposed portions 25 b and 26 b of the bus bars 25 and 26 and the electric wires 37 are provided substantially at the centers of the sides of the rectangular connection holes 33 and 34.
Are arranged such that the connection portions 37b are located. As a result, the exposed portions 25b, 26b of the bus bars 25, 26 and the connecting portion 37b of the electric wire 37 are routed in the respective connecting holes 33, 34 so as to be substantially orthogonal to each other.
The exposed portions 25b and 26b of the bus bars 25 and 26 are completely exposed. As shown in FIG. 4, curved surface portions 27b and 28b curved in an arc shape are formed at the boundaries between the electric wire accommodating portions 27 and 28 and the connection holes 33 and 34, respectively. 27b, 28
The wires 37 abut on the b and 28b without any gap.

【0018】さらに、図1,図3に示すように、組立完
了時に裏側に位置する絶縁基板24に配索される各ブス
バー26及び電線37は該絶縁基板24の略中央を避け
てそれぞれ配索されている。そして、この絶縁基板24
の各ブスバー26及び各電線37がそれぞれ配索されて
いない箇所である略中央部には肉抜きとしての略矩形の
孔35を形成してある。
Further, as shown in FIGS. 1 and 3, the bus bars 26 and the electric wires 37 routed to the insulating substrate 24 located on the back side when the assembly is completed are routed so as to avoid substantially the center of the insulating substrate 24. Have been. Then, the insulating substrate 24
A substantially rectangular hole 35 is formed at a substantially central portion where the bus bars 26 and the electric wires 37 are not routed.

【0019】このように、絶縁基板24に配索される複
数のブスバー26及び複数の電線37は該絶縁基板24
の略中央を避けてそれぞれ配索され、かつ該絶縁基板2
4の各ブスバー26及び各電線37がそれぞれ配索され
ていない箇所である略中央部に略矩形の孔35を形成し
たので、この略矩形の孔35により、絶縁基板24の反
りを効果的に抑制することができて該絶縁基板24の反
りの発生を防止することができる。これにより、絶縁基
板24を絶縁基板23側に容易に組み付けて積層配線板
組立体20を完成させることができる。また、絶縁基板
24の略中央部に形成された略矩形の孔35により、絶
縁基板24の軽量化及び材料費の低コスト化を図ること
ができ、かつ成形サイクルの短縮化を図ることができ
る。
As described above, the plurality of bus bars 26 and the plurality of electric wires 37 routed on the insulating substrate 24 are
Are routed so as to avoid substantially the center of the
Since the substantially rectangular holes 35 are formed in the substantially central portions where the busbars 26 and the electric wires 37 of No. 4 are not routed, the warpage of the insulating substrate 24 is effectively reduced by the substantially rectangular holes 35. It is possible to suppress the occurrence of warpage of the insulating substrate 24. Thus, the laminated wiring board assembly 20 can be completed by easily assembling the insulating substrate 24 to the insulating substrate 23 side. In addition, the substantially rectangular hole 35 formed at the substantially central portion of the insulating substrate 24 can reduce the weight and material cost of the insulating substrate 24 and shorten the molding cycle. .

【0020】以上実施形態の積層配線板組立体20を組
み立てる場合には、まず、図1及び図8(a)に示すよ
うに、一対のブスバー配線板21,22を隣接する各端
部21c,22c同士を突き合わせた状態で略一平面上
に並列に配置し、この一対のブスバー配線板21,22
間に複数の電線37を掛け渡すように布線して該一対の
ブスバー配線板21,22の各表面21a,22aに直
線的に連なるように形成された各電線収容部27,28
に電線37をそれぞれ収容する。この際、各電線収容部
27,28に収容される電線37は相対向する各一対の
突起27a,27a,28a,28a間でそれぞれ挾持
される。また、一方のブスバー配線板21の電線収容部
27のみに収容されて、他方のブスバー配線板22の表
面22aには配索されない電線37もあるが、全ての電
線37は各電線収容部27,28に完全に収容されるの
で、各ブスバー配線板21,22の各表面21a,22
aより突出することがない。
When assembling the laminated wiring board assembly 20 of the above embodiment, first, as shown in FIGS. 1 and 8 (a), a pair of busbar wiring boards 21 and 22 are connected to each adjacent end 21c, The pair of busbar wiring boards 21 and 22 are arranged in parallel on substantially one plane in a state where the pair of busbars 22c are abutted with each other.
Each wire accommodating portion 27, 28 formed so as to be laid so that a plurality of wires 37 are bridged therebetween and linearly connected to the surfaces 21 a, 22 a of the pair of bus bar wiring boards 21, 22.
Accommodate the electric wires 37 respectively. At this time, the electric wires 37 accommodated in the electric wire accommodating portions 27 and 28 are clamped between the pair of opposing projections 27a, 27a, 28a and 28a, respectively. In addition, there is an electric wire 37 that is accommodated only in the electric wire accommodating portion 27 of the one bus bar wiring board 21 and is not routed on the surface 22a of the other bus bar wiring board 22. 28, each surface 21a, 22 of each bus bar wiring board 21, 22
It does not protrude from a.

【0021】次に、図4〜図7に示すように、一対のブ
スバー配線板21,22の隣接する各端部21c,22
c同士を突き合わせた状態で該一対のブスバー配線板2
1,22を成す各絶縁基板23,24より一部が露出し
た各ブスバー25,26の露出部25b,26bと各電
線37の接続部37bとを抵抗溶接用の一対の電極3
8,39を介して接合する。これにより、各電線収容部
27,28内に電線37は確実に保持され、図1に示す
ように、各端部21c,22cが突き合われた一対のブ
スバー配線板21,22は略平板状になる。
Next, as shown in FIGS. 4 to 7, adjacent ends 21c and 22 of the pair of bus bar wiring boards 21 and 22 are connected.
c with the busbar wiring boards 2
A pair of electrodes 3 for resistance welding are formed by connecting the exposed portions 25b, 26b of the bus bars 25, 26, which are partially exposed from the insulating substrates 23, 24 forming the first and second 22, and the connection portions 37b of the electric wires 37.
Join through 8,39. As a result, the electric wires 37 are securely held in the electric wire housings 27 and 28, and as shown in FIG. 1, the pair of bus bar wiring boards 21 and 22 having the ends 21c and 22c abutted are substantially flat. become.

【0022】この状態から、図8(b)〜図8(d)に
示すように、一対のブスバー配線板21,22間に位置
する各電線37の渡し部37aを折り曲げる。この際
に、一対のブスバー配線板21,22の突き合わされた
各端部21c,22cの裏面21b,22b側の角部
分、即ち、各絶縁リブ29,30の下側の円弧面状の各
アール部31,32同士が当接しながら各電線37の渡
し部37aがヒンジとなって他方のブスバー配線板22
を一方のブスバー配線板21に対して反転させることが
できると共に、図8(a)〜図8(e)に示すように、
一対のブスバー配線板21,22の各裏面21b,22
b同士が重ね合わされるまで各電線37の渡し部37a
が各端部21c,22cの表面側から裏面側にかけて形
成された各電線収容部27,28に収容されながら折り
曲げられるため、各電線37の渡し部37aを折り曲げ
る際に、該各電線37の渡し部37aの伸びが抑えられ
て各電線37に余分なテンションが発生することがな
く、また、各ブスバー25,26の露出部25b,26
bと各電線37の接続部37bとの接合部分に負荷がか
かることがない。これにより、各ブスバー25,26の
露出部25b,26bと各電線37の接続部37bとの
接合状態を安定させることができ、ブスバー25,26
と電線37の接続不良の発生を確実に防ぐことができ
る。
From this state, as shown in FIGS. 8 (b) to 8 (d), the bridging portion 37a of each electric wire 37 located between the pair of bus bar wiring boards 21 and 22 is bent. At this time, the corners on the back surfaces 21b, 22b side of the butted ends 21c, 22c of the pair of bus bar wiring boards 21, 22, that is, the respective arc-shaped rounds under the insulating ribs 29, 30. While the portions 31, 32 contact each other, the crossover portion 37a of each electric wire 37 becomes a hinge and the other busbar wiring board 22
Can be inverted with respect to one bus bar wiring board 21, and as shown in FIGS. 8 (a) to 8 (e),
Back surfaces 21b and 22 of a pair of bus bar wiring boards 21 and 22
b, the transfer portion 37a of each electric wire 37 until they are superimposed.
Is bent while being housed in the wire housings 27, 28 formed from the front side to the back side of the end portions 21c, 22c, so that when the bridge 37a of the wire 37 is bent, the wire 37 The extension of the portion 37a is suppressed, so that no extra tension is generated in each electric wire 37, and the exposed portions 25b, 26 of the bus bars 25, 26 are not generated.
No load is applied to the joint between the wire b and the connecting portion 37b of each electric wire 37. Thereby, the joining state between the exposed portions 25b, 26b of the bus bars 25, 26 and the connecting portions 37b of the electric wires 37 can be stabilized, and the bus bars 25, 26 can be stabilized.
It is possible to reliably prevent the occurrence of connection failure between the cable and the electric wire 37.

【0023】そして、図3,図8(e)に示すように、
一対のブスバー配線板21,22間の各電線37の渡し
部37aを略180度折り曲げて該一対のブスバー配線
板21,22の各裏面21b,22b同士を重ね合わせ
ることで積層配線板組立体20の組立が完成する。この
際、各電線37のU字状に折り曲げられた渡し部37a
は、突き合わされた各端部21c,22cの各電線収容
部27,28内に完全に収容される。また、各電線37
の隣接するU字状に折り曲げられた渡し部37aは各端
部21c,22c側の各電線収容部27,28の両側に
突設された各絶縁リブ29,29,30,30により沿
面距離が十分に確保される。これらにより、各電線37
のU字状に折り曲げられて隣接する各渡し部37a,3
7a間のショート及びリークを確実に防止することがで
きる。
Then, as shown in FIGS. 3 and 8 (e),
The crossover portion 37a of each electric wire 37 between the pair of busbar wiring boards 21 and 22 is bent substantially 180 degrees, and the back surfaces 21b and 22b of the pair of busbar wiring boards 21 and 22 are overlapped with each other to form the laminated wiring board assembly 20. Is completed. At this time, the crossover portion 37a of each electric wire 37 bent into a U-shape
Are completely accommodated in the respective wire accommodating portions 27, 28 of the butted ends 21c, 22c. In addition, each electric wire 37
The creeping distance of the crossover portion 37a bent into a U-shape by the insulating ribs 29, 29, 30, and 30 protruding on both sides of the wire housing portions 27 and 28 on the end portions 21c and 22c side, respectively. Sufficiently secured. With these, each electric wire 37
Each of the crossover portions 37a, 3b which are bent into a U-shape
Short circuit and leak between 7a can be reliably prevented.

【0024】このように、一対のブスバー配線板21,
22の隣接する各端部21c,22cを突き合わせた状
態で、該各端部21c,22cの各アール部31,32
同士を当接させながら複数の電線37の各渡し部37a
を折り曲げて一対のブスバー配線板21,22を上下に
折り畳むだけの作業により、各電線37,37間のショ
ートやリークがない高品質の積層配線板組立体20を簡
単かつ短時間で大量に組み立てることができる。特に、
一対のブスバー配線板21,22の隣接する各端部21
c,22c同士を突き合わせた状態でその各絶縁基板2
3,24より露出した各ブスバー25,26の露出部2
5b,26bと各電線37の接続部37bとを抵抗溶接
により接合し、その後で、各電線37の渡し部37aを
折り曲げながら各電線収容部27,28に完全に収容す
るようにしたので、ブスバー25,26と電線37の接
続不良がない高品質の積層配線板組立体20を簡単かつ
短時間で大量に組み立てることができる。
As described above, the pair of bus bar wiring boards 21,
In a state where the adjacent end portions 21c, 22c of the 22 are abutted, each of the round portions 31, 32 of the end portions 21c, 22c.
Each connecting portion 37a of the plurality of electric wires 37 while abutting each other
By simply folding the pair of bus bar wiring boards 21 and 22 up and down, a high-quality multilayer wiring board assembly 20 having no short circuit or leak between the electric wires 37 and 37 can be assembled easily and in a large amount in a short time. be able to. In particular,
Adjacent ends 21 of a pair of bus bar wiring boards 21 and 22
c, 22c, each insulating substrate 2
Exposed portion 2 of each bus bar 25, 26 exposed from 3, 24
5b, 26b and the connecting portion 37b of each electric wire 37 are joined by resistance welding, and thereafter, the bridging portion 37a of each electric wire 37 is bent and completely accommodated in each electric wire housing portion 27, 28. A high-quality multilayer wiring board assembly 20 having no poor connection between the wires 25 and 26 and the electric wires 37 can be assembled in a large amount simply and in a short time.

【0025】尚、前記実施形態によれば、裏面側のブス
バー配線板にのみ反り防止用の肉抜き孔を形成したが、
表面側のブスバー配線板にも反り防止用の肉抜き孔を形
成しても良い。また、肉抜き形成は貫通しない穴状でも
良いことは勿論である。さらに、抵抗溶接用の電極が挿
入されるブスバーの露出部と電線の接続部の接続用孔は
方形に限らず円形や楕円形等でも良いことは勿論であ
る。
According to the above-described embodiment, a lightening hole for preventing warpage is formed only in the bus bar wiring board on the back side.
A lightening hole for preventing warpage may also be formed in the busbar wiring board on the front side. In addition, it is a matter of course that the lightening formation may be a hole shape that does not penetrate. Further, the connection hole between the exposed portion of the bus bar into which the electrode for resistance welding is inserted and the connection portion of the electric wire is not limited to a square but may be a circle or an ellipse.

【0026】[0026]

【発明の効果】以上説明したように、請求項1の発明に
よれば、絶縁基板の複数のブスバー及び複数の電線がそ
れぞれ配索されていない箇所を肉抜き形成したので、こ
の肉抜き部分により絶縁基板の反りを効果的に抑制する
ことができて該絶縁基板の反りの発生を防止することが
できる。
As described above, according to the first aspect of the present invention, portions where the plurality of bus bars and the plurality of electric wires are not routed are formed in the insulating substrate. The warpage of the insulating substrate can be effectively suppressed, and the warpage of the insulating substrate can be prevented.

【0027】請求項2の発明によれば、絶縁基板の略中
央を避けて複数のブスバー及び複数の電線をそれぞれ配
索し、この絶縁基板の略中央部に肉抜きとして所定形状
の孔を形成したので、この所定形状の孔により絶縁基板
の軽量化及び材料費の低コスト化を図ることができ、か
つ成形サイクルを短縮化することができる。
According to the second aspect of the present invention, a plurality of bus bars and a plurality of electric wires are respectively routed around the substantially central portion of the insulating substrate, and a hole having a predetermined shape is formed at a substantially central portion of the insulating substrate. Thus, the holes having the predetermined shape can reduce the weight of the insulating substrate and the cost of material, and can shorten the molding cycle.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態の積層配線板組立体の組立
前の状態を示す斜視図である。
FIG. 1 is a perspective view showing a state before assembling a laminated wiring board assembly according to an embodiment of the present invention.

【図2】上記積層配線板組立体の組立後の状態を示す平
面図である。
FIG. 2 is a plan view showing a state after assembly of the laminated wiring board assembly.

【図3】上記積層配線板組立体の組立後の状態を裏側か
ら見た斜視図である。
FIG. 3 is a perspective view of a state after assembling the laminated wiring board assembly as viewed from the back side.

【図4】上記積層配線板組立体に用いられるブスバー配
線板のブスバーと電線の接合状態を示す部分横断面図で
ある。
FIG. 4 is a partial cross-sectional view showing a joining state of a bus bar and an electric wire of a bus bar wiring board used in the laminated wiring board assembly.

【図5】上記ブスバー配線板のブスバーと電線の接合状
態を示す部分縦断面図である。
FIG. 5 is a partial longitudinal sectional view showing a joining state of a bus bar and an electric wire of the bus bar wiring board.

【図6】上記ブスバー配線板のブスバーと電線の接合状
態を示す部分平面図である。
FIG. 6 is a partial plan view showing a joining state of a bus bar and an electric wire of the bus bar wiring board.

【図7】上記ブスバー配線板のブスバーと電線の接合状
態を示す部分底面図である。
FIG. 7 is a partial bottom view showing a joining state of a bus bar and an electric wire of the bus bar wiring board.

【図8】(a)〜(e)は上記積層配線板組立体の組立
過程を順を追って示す部分断面図である。
FIGS. 8A to 8E are partial cross-sectional views sequentially showing an assembling process of the laminated wiring board assembly.

【図9】上記積層配線板組立体を収容する電気接続箱の
分解斜視図である。
FIG. 9 is an exploded perspective view of an electric junction box accommodating the laminated wiring board assembly.

【図10】従来の積層配線板組立体の斜視図である。FIG. 10 is a perspective view of a conventional laminated wiring board assembly.

【図11】上記従来の積層配線板組立体の組立前の状態
を示す斜視図である。
FIG. 11 is a perspective view showing a state before assembly of the conventional laminated wiring board assembly.

【図12】上記従来の積層配線板組立体に用いられるブ
スバー配線板のブスバーと電線の接合状態を示す部分横
断面図である。
FIG. 12 is a partial cross-sectional view showing a joining state of a bus bar and an electric wire of a bus bar wiring board used in the conventional laminated wiring board assembly.

【符号の説明】[Explanation of symbols]

22 ブスバー配線板(配線板) 24 絶縁基板 26 ブスバー 35 所定形状の孔(肉抜き) 37 電線 Reference Signs List 22 busbar wiring board (wiring board) 24 insulating board 26 busbar 35 hole of predetermined shape (lightening) 37 electric wire

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 絶縁基板に複数のブスバーを所定方向に
それぞれ埋設すると共に、該絶縁基板上に複数の電線を
前記所定方向と交差する方向にそれぞれ配索して成る配
線板において、 前記絶縁基板の前記各ブスバー及び前記各電線がそれぞ
れ配索されていない箇所を肉抜き形成したことを特徴と
する配線板。
1. A wiring board comprising a plurality of bus bars embedded in an insulating substrate in a predetermined direction and a plurality of electric wires routed on the insulating substrate in a direction intersecting the predetermined direction. A wiring board, wherein portions where the busbars and the electric wires are not routed are cut out.
【請求項2】 請求項1記載の配線板であって、 前記絶縁基板の略中央を避けて前記各ブスバー及び前記
各電線をそれぞれ配索し、この絶縁基板の略中央部に前
記肉抜きとして所定形状の孔を形成したことを特徴とす
る配線板。
2. The wiring board according to claim 1, wherein each of the busbars and each of the electric wires are routed around a substantially center of the insulating substrate, and the hollow is formed at a substantially central portion of the insulating substrate. A wiring board, wherein a hole having a predetermined shape is formed.
JP2000140693A 2000-05-12 2000-05-12 Wiring board Pending JP2001327045A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000140693A JP2001327045A (en) 2000-05-12 2000-05-12 Wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000140693A JP2001327045A (en) 2000-05-12 2000-05-12 Wiring board

Publications (1)

Publication Number Publication Date
JP2001327045A true JP2001327045A (en) 2001-11-22

Family

ID=18647943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000140693A Pending JP2001327045A (en) 2000-05-12 2000-05-12 Wiring board

Country Status (1)

Country Link
JP (1) JP2001327045A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61126783A (en) * 1984-11-21 1986-06-14 トヨタ自動車株式会社 Connector for circuit board
JPH05228956A (en) * 1992-02-20 1993-09-07 Polyplastics Co Manufacture of slender article
JPH07312816A (en) * 1994-05-16 1995-11-28 Yazaki Corp Fixation structure of electric wire connected to branch connection sheet
JPH11215650A (en) * 1998-01-29 1999-08-06 Yazaki Corp Indoor wiring junction box

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61126783A (en) * 1984-11-21 1986-06-14 トヨタ自動車株式会社 Connector for circuit board
JPH05228956A (en) * 1992-02-20 1993-09-07 Polyplastics Co Manufacture of slender article
JPH07312816A (en) * 1994-05-16 1995-11-28 Yazaki Corp Fixation structure of electric wire connected to branch connection sheet
JPH11215650A (en) * 1998-01-29 1999-08-06 Yazaki Corp Indoor wiring junction box

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