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JP2001151935A - Resin composition for circuit board - Google Patents

Resin composition for circuit board

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Publication number
JP2001151935A
JP2001151935A JP34124999A JP34124999A JP2001151935A JP 2001151935 A JP2001151935 A JP 2001151935A JP 34124999 A JP34124999 A JP 34124999A JP 34124999 A JP34124999 A JP 34124999A JP 2001151935 A JP2001151935 A JP 2001151935A
Authority
JP
Japan
Prior art keywords
circuit board
resin composition
loss tangent
resin
dielectric loss
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP34124999A
Other languages
Japanese (ja)
Inventor
Akiyoshi Kawaguchi
明義 河口
Yoshiaki Ishii
好明 石井
Hidesuke Tsutsumi
秀介 堤
Tomohiro Tanaka
智博 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Otsuka Chemical Co Ltd
Original Assignee
Otsuka Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otsuka Chemical Co Ltd filed Critical Otsuka Chemical Co Ltd
Priority to JP34124999A priority Critical patent/JP2001151935A/en
Publication of JP2001151935A publication Critical patent/JP2001151935A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide a preferable resin composition for a circuit board as a circuit board material of electronic equipment due to a low linear expansion coefficient, a low specific permittivity, a low dielectric dissipation factor, a high heat resistance, and high mechanical strengths. SOLUTION: The resin composition for a circuit board comprises compounding a scaly inorganic filler having a specific permittivity of <=8 at 1 MHz and a dielectric dissipation factor of <=0.004 with a synthetic resin having a melting temperature of 300 deg.C<=.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、回路基板用樹脂組
成物に関し、詳しくは、低線膨張係数、低比誘電率、低
誘電正接、高耐熱性、高機械的強度を兼備し、電子機器
の回路基板材料として好適な回路基板用樹脂組成物に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition for a circuit board, and more particularly to an electronic device having a low coefficient of linear expansion, a low dielectric constant, a low dielectric loss tangent, a high heat resistance, and a high mechanical strength. The present invention relates to a resin composition for a circuit board suitable as a material for a circuit board.

【0002】[0002]

【従来の技術】電子機器の回路基板材料には、比誘電率
や誘電正接等の誘電特性が低く、線膨張係数や耐熱性、
機械的強度等の物理的特性に優れることが要求される。
比誘電率(ε)とは、誘電体内の分極の程度を示すパラ
メーターであり、比誘電率が高い程電気信号の伝播遅延
が大きくなる(Td=3.3√ε、Td;電気信号伝播
遅延時間)。従って、信号の伝播速度を高め、高速演算
を可能にするためには、比誘電率は低い方が好ましい。
誘電正接(tanδ)とは、誘電体内に伝播する信号が
熱に変換されて失われる量を示すパラメーターであり、
誘電正接が低い程信号の損失が少なくなり、信号伝達率
が向上する。
2. Description of the Related Art Materials for circuit boards of electronic equipment have low dielectric properties such as relative permittivity and dielectric loss tangent, and have a coefficient of linear expansion, heat resistance, and the like.
It is required to have excellent physical properties such as mechanical strength.
The relative permittivity (ε) is a parameter indicating the degree of polarization in a dielectric, and the higher the relative permittivity, the larger the propagation delay of an electric signal (Td = 3.3√ε, Td; electrical signal propagation delay) time). Therefore, in order to increase the signal propagation speed and enable high-speed operation, it is preferable that the relative dielectric constant is low.
The dielectric loss tangent (tan δ) is a parameter indicating the amount of a signal propagating in a dielectric which is converted into heat and lost.
The lower the dielectric loss tangent, the smaller the signal loss and the higher the signal transmission rate.

【0003】従来、回路基板材料としては、ガラスクロ
スにエポキシ樹脂等の熱硬化性樹脂を含浸、硬化させて
なる通称“ガラエポ基板”が一般に用いられてきたが、
その比誘電率は4.5〜5.5と高く、誘電正接も0.
020〜0.035と大きいため、特にMHz帯以上の
高周波域における信号の伝達速度及び伝達率は満足でき
るものではない。
Conventionally, as a circuit board material, a so-called "glass epoxy board" obtained by impregnating and curing a thermosetting resin such as an epoxy resin in a glass cloth has been generally used.
Its dielectric constant is as high as 4.5 to 5.5, and its dielectric loss tangent is also 0.5.
Since it is as large as 020 to 0.035, the transmission speed and the transmission rate of the signal in a high frequency range of the MHz band or more are not satisfactory.

【0004】線膨張係数や耐熱性、機械的強度等の改良
を目的として、電子部材用の合成樹脂に各種のウィスカ
ーや繊維状物等の強化繊維を添加することは、一般に行
われている。例えば、特開平3−35585号公報によ
れば、このような強化繊維として、ガラス繊維やチタン
酸カリウムウィスカー等が提案されている。
[0004] For the purpose of improving the linear expansion coefficient, heat resistance, mechanical strength, and the like, it is common practice to add various whiskers or reinforcing fibers such as fibrous materials to synthetic resins for electronic members. For example, according to JP-A-3-35585, glass fibers, potassium titanate whiskers and the like are proposed as such reinforcing fibers.

【0005】しかし、ガラス繊維を合成樹脂に添加する
と、比誘電率の上昇は比較的小さく抑えられるものの、
誘電正接が著しく増大する。また、ガラス繊維は、繊維
径5〜15μmと太く、繊維長100μm以上と長いた
め、成形品の表面平滑性が損なわれ、該成形品の表面に
微細回路をメッキするのが困難になることがあり、更に
ワイヤーボンダーで回路を接続する際に、ワイヤーボン
ダーの先端部を傷めることがある。
However, when glass fiber is added to a synthetic resin, the rise in relative dielectric constant can be suppressed relatively small,
The dielectric loss tangent increases significantly. Further, the glass fiber is as thick as 5 to 15 μm in fiber diameter and as long as 100 μm or more in fiber length, so that the surface smoothness of the molded product is impaired and it becomes difficult to plate a fine circuit on the surface of the molded product. In addition, when connecting circuits with a wire bonder, the tip of the wire bonder may be damaged.

【0006】チタン酸カリウムウィスカーは、繊維径
0.05〜2μm、繊維長2〜50μmとミクロな繊維
であり、耐熱性や機械的強度の向上、線膨張係数の低下
等には有効であるが、比誘電率及び誘電正接を著しく上
昇させ、信号伝達速度の遅延、伝達率の低下をもたら
す。しかも、該ウィスカーに含まれるカリウム等のアル
カリ成分は、電子機器の電極や配線を腐食させたり、断
線や電流の漏れ等を引き起こしたりする。
[0006] Potassium titanate whiskers are microfibers having a fiber diameter of 0.05 to 2 µm and a fiber length of 2 to 50 µm, and are effective in improving heat resistance, mechanical strength, and decreasing the linear expansion coefficient. , The relative dielectric constant and the dielectric loss tangent are significantly increased, resulting in a delay in signal transmission speed and a decrease in transmission efficiency. In addition, the alkaline components such as potassium contained in the whiskers corrode the electrodes and wirings of the electronic device, cause disconnection, current leakage, and the like.

【0007】一方、耐熱性樹脂、及び無機充填剤からな
り、良好な耐熱性、機械的強度、電気絶縁性、成形性を
有し、電子部材の材料として好適な熱可塑性樹脂組成物
が提案されている(特開昭62−149436号公報
等)。ただし、一般的な無機充填材は粒度分布が安定し
ておらず、また形状も不規則であるため、フィルム等の
薄い基板を作製した場合は、表面性が粗化したり、極端
に脆い材料になってしまう。
On the other hand, a thermoplastic resin composition comprising a heat-resistant resin and an inorganic filler, having good heat resistance, mechanical strength, electric insulation and moldability, and suitable as a material for electronic members has been proposed. (Japanese Patent Application Laid-Open No. 62-149436, etc.). However, general inorganic fillers do not have a stable particle size distribution and irregular shape, so when a thin substrate such as a film is manufactured, the surface properties may be roughened or extremely brittle. turn into.

【0008】[0008]

【発明が解決しようとする課題】本発明は、以上のよう
な問題がなく、低比誘電率、低線膨張係数、高耐熱性、
高機械的強度を兼備し、電子機器の回路基板材料として
好適な回路基板用樹脂組成物を提供することを目的とす
る。
DISCLOSURE OF THE INVENTION The present invention does not have the above problems, and has a low relative dielectric constant, a low coefficient of linear expansion, a high heat resistance,
It is an object of the present invention to provide a resin composition for a circuit board which has both high mechanical strength and is suitable as a circuit board material for an electronic device.

【0009】[0009]

【課題を解決するための手段】本発明者らは、上記目的
を達成するために、鋭意検討した結果、溶融温度が300
℃以上である合成樹脂からなる樹脂組成物に、特定の鱗
片状無機化合物を配合することにより、高周波域での使
用に支障をきたす程の比誘電率の上昇を伴うことなく、
併せて耐熱性及び機械的強度をも向上させることがで
き、回路用基板として金属箔とラミネートしたときにカ
ールしないこと、従って電子部材用材料として極めて望
ましい組成物が得られることを見出し、本発明を完成す
るに至った。
Means for Solving the Problems The present inventors have conducted intensive studies to achieve the above object, and as a result, have found that the melting temperature is 300 ° C.
By mixing a specific flaky inorganic compound with a resin composition composed of a synthetic resin having a temperature of not less than ℃, without an increase in the relative dielectric constant that hinders use in a high-frequency range,
In addition, the present invention has found that heat resistance and mechanical strength can be improved, and that it does not curl when laminated with a metal foil as a circuit board, and that a highly desirable composition as a material for electronic members can be obtained. Was completed.

【0010】すなわち、本発明は、溶融温度が300℃
以上である合成樹脂に、1MHzで比誘電率が8以下で
あり、誘電正接が0.004以下である鱗片状無機化合
物を配合してなることを特徴とする回路基板用樹脂組成
物を要旨とする。なお、本明細書における比誘電率及び
誘電正接の数値は、特に断りのない限り、1MHz、2
5℃の条件下で測定した値とする。
That is, according to the present invention, the melting temperature is 300 ° C.
The gist of the present invention is a resin composition for a circuit board, characterized in that a flake-like inorganic compound having a relative dielectric constant of 8 or less at 1 MHz and a dielectric loss tangent of 0.004 or less is mixed with the above synthetic resin. I do. The values of the relative permittivity and the dielectric loss tangent in this specification are 1 MHz, 2
The value is measured under the condition of 5 ° C.

【0011】本発明で用いられる溶融温度が300℃以
上である合成樹脂としては、特に制限はなく使用でき、
例えばポリアリルエーテルケトン、ポリエーテルサルフ
ォン、ポリサルフォン、ポリエーテルイミド、液晶ポリ
マー、熱可塑性ポリイミド、ポリアリレート、ポリエー
テルニトリル、ポリフェニレンサルファイド、ポリフェ
ニレンエーテル、ポリアミドイミド等がある。好ましく
は、ポリアリルエーテルケトン、ポリエーテルイミド、
液晶ポリマー、熱可塑性ポリイミドが良い。また、これ
らの樹脂は単独で、若しくは1種又は2種以上の他の樹
脂と混合して用いることができる。
The synthetic resin used in the present invention having a melting temperature of 300 ° C. or higher can be used without any particular limitation.
For example, there are polyallyl ether ketone, polyether sulfone, polysulfone, polyether imide, liquid crystal polymer, thermoplastic polyimide, polyarylate, polyether nitrile, polyphenylene sulfide, polyphenylene ether, polyamide imide and the like. Preferably, polyallyl ether ketone, polyether imide,
Liquid crystal polymer and thermoplastic polyimide are good. These resins can be used alone or in combination with one or more other resins.

【0012】本発明で用いられる鱗片状無機化合物は、
合成雲母、マイカ、セリサイト、イライト、タルク、カ
オリナイト、モンモリロナイト、スメクタイト、バーミ
キュライト等がある。より好ましくは、合成雲母、マイ
カが良い。これらの鱗片状無機化合物は各種カップリン
グ剤による表面処理が行われていても差し支えない。
The scaly inorganic compound used in the present invention comprises:
Examples include synthetic mica, mica, sericite, illite, talc, kaolinite, montmorillonite, smectite, and vermiculite. More preferably, synthetic mica and mica are good. These flaky inorganic compounds may be subjected to surface treatment with various coupling agents.

【0013】本発明組成物における鱗片状無機化合物の
配合量は、得られる本発明組成物を適用する回路基板の
タイプ等に応じて広い範囲から適宜選択できるが、通常
溶融温度が300℃以上である合成樹脂100重量部に
対して5〜100重量部程度、好ましくは10〜50重
量部程度とすればよい。
The amount of the flaky inorganic compound in the composition of the present invention can be appropriately selected from a wide range according to the type of a circuit board to which the obtained composition of the present invention is applied. The amount may be about 5 to 100 parts by weight, preferably about 10 to 50 parts by weight, per 100 parts by weight of a certain synthetic resin.

【0014】本発明組成物には、その好ましい特性を損
なわない範囲で、通常の合成樹脂用の添加剤が含まれて
いてもよい。該添加剤の具体例としては、例えば、難燃
剤、難燃助剤、紫外線吸収剤、酸化防止剤、固体又は液
体潤滑剤、耐衝撃性付与剤、染料、顔料等を挙げること
ができる。
The composition of the present invention may contain ordinary additives for synthetic resins as long as the preferable properties are not impaired. Specific examples of the additive include a flame retardant, a flame retardant auxiliary, an ultraviolet absorber, an antioxidant, a solid or liquid lubricant, an impact resistance agent, a dye, a pigment, and the like.

【0015】本発明組成物は、各成分の所定量を、例え
ば、加熱機能と混合機能を備えた混合ミキサー、一軸又
は二軸のスクリュー押出機等の通常の混合装置で混合す
ることにより製造できる。
The composition of the present invention can be produced by mixing a predetermined amount of each component with a usual mixing device such as a mixing mixer having a heating function and a mixing function, a single-screw or twin-screw extruder, or the like. .

【0016】[0016]

【実施例】以下に実施例及び比較例を挙げ、本発明を具
体的に説明する。 (実施例1〜9及び比較例1〜7)各成分を表1及び2
に示す所定の割合(重量部)にて2軸押出機(株式会社
神戸製鋼所;KTX46)に供給しペレット状樹脂組成
物を得た。
The present invention will be specifically described below with reference to examples and comparative examples. (Examples 1 to 9 and Comparative Examples 1 to 7) Each component is shown in Tables 1 and 2.
At a predetermined ratio (parts by weight) as shown in the following table, and supplied to a twin-screw extruder (Kobe Steel, Ltd .; KTX46) to obtain a pellet-shaped resin composition.

【0017】得られたペレット状組成物を射出成形にて
テストピースを作製した。得られたテストピースの1M
hz及び3Ghzにおける比誘電率及び誘電正接を測定
した。1Mhzにおける比誘電率及び誘電正接はJIS
K6911により、3Ghzにおける比誘電率及び誘
電正接はネットワークアナライザー8719C(ヒュー
レットパッカード社製)を用い、空洞共振法により測定
した。結果を表1に併記する。
A test piece was prepared from the obtained pellet composition by injection molding. 1M of the obtained test piece
The relative permittivity and the dielectric loss tangent at hz and 3 Ghz were measured. The relative permittivity and dielectric loss tangent at 1 MHz are JIS
According to K6911, the relative permittivity and the dielectric loss tangent at 3 Ghz were measured by a cavity resonance method using a network analyzer 8719C (manufactured by Hewlett-Packard Company). The results are also shown in Table 1.

【0018】1.PEEK(ポリエーテルエーテルケトン);
ビクトレックス社製;450G 2.PEI(ポリエーテルイミド);日本GEプラスチック
ス社製;ウルテム1000-1000 3.PAR(ポリアリレート);ユニチカ社製 4.合成雲母;トピー工業社製;PDM-9WA;比誘電率=
6.2、誘電正接=0.0008 5.板状酸化チタン;商品名:ルクセレン、住友化学
(株)製、比誘電率=45、誘電正接=0.0005
1. PEEK (polyetheretherketone);
Victrex; 450G 2.PEI (polyetherimide); GE Plastics Japan; Ultem 1000-1000 3.PAR (polyarylate); Unitika; 4. Synthetic mica; Topy Industries; PDM-9WA ; Relative permittivity =
6.2, dielectric loss tangent = 0.0008 5. Plate-like titanium oxide; trade name: luxelene, manufactured by Sumitomo Chemical Co., Ltd., relative dielectric constant = 45, dielectric loss tangent = 0.0005

【0019】[0019]

【表1】 [Table 1]

【0020】[0020]

【表2】 [Table 2]

フロントページの続き (72)発明者 堤 秀介 徳島県徳島市川内町加賀須野463 大塚化 学株式会社徳島研究所内 (72)発明者 田中 智博 徳島県徳島市川内町加賀須野463 大塚化 学株式会社徳島研究所内 Fターム(参考) 4J002 CF161 CH071 CH091 CM041 CN011 CN031 CN051 DJ006 DJ036 DJ046 DJ056 FA016 GQ01 Continued on the front page (72) Inventor Shusuke Tsutsumi 463 Kagasuno, Kawauchi-cho, Tokushima City, Tokushima Prefecture Inside the Tokushima Research Institute (72) Inventor Tomohiro Tanaka 463 Kasuno, Kawauchi-cho, Tokushima City, Tokushima Prefecture Tokushima Laboratory F-term (reference) 4J002 CF161 CH071 CH091 CM041 CN011 CN031 CN051 DJ006 DJ036 DJ046 DJ056 FA016 GQ01

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 溶融温度が300℃以上である合成樹脂
に、1MHzで比誘電率が8以下であり、誘電正接が
0.004以下である鱗片状無機充填材を配合してなる
ことを特徴とする回路基板用樹脂組成物。
1. A synthetic resin having a melting temperature of 300 ° C. or higher and a flaky inorganic filler having a relative dielectric constant of 8 or lower at 1 MHz and a dielectric loss tangent of 0.004 or lower are compounded. And a resin composition for a circuit board.
【請求項2】 1MHzで比誘電率が8以下であり、誘
電正接が0.004以下である鱗片状無機充填材が、合
成雲母であることを特徴とする請求項1記載の回路基板
用樹脂組成物。
2. The resin for a circuit board according to claim 1, wherein the scale-like inorganic filler having a relative dielectric constant of 8 or less at 1 MHz and a dielectric loss tangent of 0.004 or less is synthetic mica. Composition.
【請求項3】 溶融温度が300℃以上である合成樹脂
がポリアリルエーテルケトン、ポリエーテルイミド、熱
可塑性ポリイミド及び液晶ポリマーからなる群から選択
される1種又は2種以上であることを特徴とする請求項
1または2記載の回路基板用樹脂組成物。
3. The synthetic resin having a melting temperature of 300 ° C. or higher is one or more selected from the group consisting of polyallyl ether ketone, polyetherimide, thermoplastic polyimide, and liquid crystal polymer. The resin composition for a circuit board according to claim 1 or 2, wherein
JP34124999A 1999-11-30 1999-11-30 Resin composition for circuit board Pending JP2001151935A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34124999A JP2001151935A (en) 1999-11-30 1999-11-30 Resin composition for circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34124999A JP2001151935A (en) 1999-11-30 1999-11-30 Resin composition for circuit board

Publications (1)

Publication Number Publication Date
JP2001151935A true JP2001151935A (en) 2001-06-05

Family

ID=18344574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34124999A Pending JP2001151935A (en) 1999-11-30 1999-11-30 Resin composition for circuit board

Country Status (1)

Country Link
JP (1) JP2001151935A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003292803A (en) * 2002-02-01 2003-10-15 Sekisui Chem Co Ltd Material for insulated-substrate, printed board, laminated board, copper foil with resin, copper-clad laminated board, polyimide film and film for tab and pre-preg
JP2005220335A (en) * 2004-01-09 2005-08-18 Mitsubishi Plastics Ind Ltd Resin composition and molded product using the same
US7074882B2 (en) 2003-07-04 2006-07-11 Nitto Denko Corporation Polyimide resin for electrical insulating material
JP2021103757A (en) * 2019-12-26 2021-07-15 信越ポリマー株式会社 High frequency circuit board and manufacturing method thereof
WO2023047914A1 (en) * 2021-09-22 2023-03-30 ポリプラ・エボニック株式会社 Foamed body, foamed film, and laminated film

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003292803A (en) * 2002-02-01 2003-10-15 Sekisui Chem Co Ltd Material for insulated-substrate, printed board, laminated board, copper foil with resin, copper-clad laminated board, polyimide film and film for tab and pre-preg
US7074882B2 (en) 2003-07-04 2006-07-11 Nitto Denko Corporation Polyimide resin for electrical insulating material
JP2005220335A (en) * 2004-01-09 2005-08-18 Mitsubishi Plastics Ind Ltd Resin composition and molded product using the same
JP2021103757A (en) * 2019-12-26 2021-07-15 信越ポリマー株式会社 High frequency circuit board and manufacturing method thereof
JP7344789B2 (en) 2019-12-26 2023-09-14 信越ポリマー株式会社 High frequency circuit board and its manufacturing method
WO2023047914A1 (en) * 2021-09-22 2023-03-30 ポリプラ・エボニック株式会社 Foamed body, foamed film, and laminated film

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