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JP2000307207A - Connecting part of printed wiring board - Google Patents

Connecting part of printed wiring board

Info

Publication number
JP2000307207A
JP2000307207A JP11113225A JP11322599A JP2000307207A JP 2000307207 A JP2000307207 A JP 2000307207A JP 11113225 A JP11113225 A JP 11113225A JP 11322599 A JP11322599 A JP 11322599A JP 2000307207 A JP2000307207 A JP 2000307207A
Authority
JP
Japan
Prior art keywords
layer
terminal
wiring board
printed wiring
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11113225A
Other languages
Japanese (ja)
Inventor
Ken Koyata
憲 小八田
Hiroyuki Yamazaki
広行 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP11113225A priority Critical patent/JP2000307207A/en
Publication of JP2000307207A publication Critical patent/JP2000307207A/en
Pending legal-status Critical Current

Links

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  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a connecting part of a printed wiring board where electrical connecting performance of contact with a terminal is improved. SOLUTION: In this connecting part 4, a conducting layer 2 where a printed layer 2b of conductive paste whose main component is carbon is stacked on a printed layer 2a of conductive paste whose main component is silver is connected with a terminal of a printed wiring board formed on an insulating film 1. In this case, the printed layer 2a of the conductive paste whose main component is silver is exposed in an electrical connecting part with the terminal.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、プラスチックフィ
ルム上に導電性ペーストを印刷して導電層を形成したプ
リント配線板の端子と接続する接続部に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection portion for connecting a terminal of a printed wiring board having a conductive layer formed by printing a conductive paste on a plastic film.

【0002】[0002]

【従来の技術】プリント配線板は、例えば図2に示すよ
うに、柔軟な絶縁性のプラスチックフィルム1(例えば
ポリエチレンテレフタレート:PET)の表面に導電性
ペーストを印刷して導電層2を形成し、導電層2を挟む
ようにプラスチックフィルム1上に被覆層3を積層した
ものである。上記導電層2は2層構造をなしており、下
地となる銀を主体とする導電性ペーストからなる銀ペー
スト層2aの上に、カーボンを主体とする導電性ペース
トからなるカーボンペースト層2bを重ねるように印刷
して形成されている。このように導電層2を2層構造に
する理由は以下の通りである。即ち、銀ペースト層2a
は体積抵抗及び表面抵抗がともに小さく、導電層として
良好な性質を有するが、高湿度中又は水滴が付着するよ
うな環境下で電圧が加わると、マイグレーションが発生
しやすいという欠点がある。そこで、マイグレーション
の起こりにくいカーボンペースト層2bで銀ペースト層
2aを覆い、銀のマイグレーションを防いでいる。ま
た、被覆層3は柔軟な絶縁性のプラスチックフィルム
(例えばPET)、あるいは適当な厚さに印刷した電気
絶縁性の接着剤層からなる。尚、被覆層3はプラスチッ
クフィルム1の全表面を覆うのではなく、必要に応じて
部分的に(例えば端子との接続部分)導電層2を露出さ
せるようにする。
2. Description of the Related Art As shown in FIG. 2, for example, a printed wiring board is formed by forming a conductive layer 2 by printing a conductive paste on the surface of a flexible insulating plastic film 1 (eg, polyethylene terephthalate: PET). The coating layer 3 is laminated on the plastic film 1 so as to sandwich the conductive layer 2. The conductive layer 2 has a two-layer structure, and a carbon paste layer 2b made of a conductive paste mainly containing carbon is superimposed on a silver paste layer 2a made of a conductive paste mainly containing silver serving as a base. It is formed by printing. The reason why the conductive layer 2 has the two-layer structure is as follows. That is, the silver paste layer 2a
Both have low volume resistance and low surface resistance, and have good properties as a conductive layer, but have the disadvantage that migration is likely to occur when a voltage is applied in high humidity or in an environment where water droplets adhere. Therefore, the silver paste layer 2a is covered with the carbon paste layer 2b in which migration hardly occurs, thereby preventing silver migration. The covering layer 3 is made of a flexible insulating plastic film (for example, PET) or an electrically insulating adhesive layer printed at an appropriate thickness. Note that the coating layer 3 does not cover the entire surface of the plastic film 1 but partially exposes the conductive layer 2 as needed (for example, a portion connected to a terminal).

【0003】上記プリント配線板の接続部への端子の接
続は、例えば以下のようにして行う。即ち、図3(a)
に示すように、カーボンペースト層2bを露出させ、端
子内部に挿入できるように外形を舌片状に整形して接続
部4を形成する。この接続部4を、図3(b)に示すよ
うに、端子10に挿入し、端子10の弾性舌片11の略
半球面状の突出部13と端子底部12に穿たれた円孔1
4の間に弾性的に挟持し、電気的接続は、前記突出部1
3とカーボンペースト層2bの接触により行なう。な
お、15はストッパーであって、弾性舌片11先端の両
側に張り出した突出部(図示されず)を係止して、弾性
舌片11による接続部4の押圧状態を保持する。
The connection of the terminal to the connection portion of the printed wiring board is performed, for example, as follows. That is, FIG.
As shown in (1), the connecting portion 4 is formed by exposing the carbon paste layer 2b and shaping the outer shape into a tongue shape so that the carbon paste layer 2b can be inserted into the terminal. As shown in FIG. 3B, the connecting portion 4 is inserted into the terminal 10, and the substantially semispherical projection 13 of the elastic tongue 11 of the terminal 10 and the circular hole 1 formed in the terminal bottom 12.
4 and is electrically connected between the protrusions 1.
3 and the carbon paste layer 2b. Reference numeral 15 denotes a stopper that locks a protruding portion (not shown) that protrudes on both sides of the tip of the elastic tongue 11 to maintain a state in which the elastic tongue 11 presses the connecting portion 4.

【0004】[0004]

【発明が解決しようとする課題】上述のように、端子1
0とプリント配線板の接続部4との電気的接続は、端子
10の弾性舌片11の突出部13とプリント配線板のカ
ーボンペースト層2bとの接触で行なわれる。しかしな
がら、カーボンペースト層2bは、銀ペースト層2aに
比べて電気抵抗が大きく、特に表面抵抗が大幅に大きく
なる。このため、接触抵抗及び接触抵抗の経時変化など
の電気的な接続性能が、突出部13が銀ペースト層2a
に接触する場合に比べて低下するという問題があった。
As described above, the terminal 1
The electrical connection between 0 and the connection portion 4 of the printed wiring board is made by contact between the projection 13 of the elastic tongue 11 of the terminal 10 and the carbon paste layer 2b of the printed wiring board. However, the carbon paste layer 2b has a higher electric resistance than the silver paste layer 2a, and particularly has a significantly higher surface resistance. For this reason, the electrical connection performance such as the contact resistance and the change with time of the contact resistance is different from the silver paste layer 2a.
There is a problem that it is reduced as compared with the case where the contact is made.

【0005】本発明は、プリント配線板の接続部におけ
る電気的な接続性能を向上させたプリント配線板の接続
部を提供することを目的とするものである。
An object of the present invention is to provide a connection portion of a printed wiring board with improved electrical connection performance at the connection portion of the printed wiring board.

【0006】[0006]

【課題を解決するための手段】本発明は上記問題点を解
決すべくなされたもので、絶縁フィルム上に銀を主体と
する導電性ペーストの印刷層、その上にカーボンを主体
とする導電性ペーストの印刷層が重ねられた導電層が形
成されたプリント配線板と端子との接続する接続部にお
いて、プリント配線板の端子との電気的接続部は銀を主
体とする導電性ペーストの印刷層が露出していることを
特徴とするものである。
DISCLOSURE OF THE INVENTION The present invention has been made to solve the above problems, and has a printing layer of a conductive paste mainly composed of silver on an insulating film and a conductive layer mainly composed of carbon on the printed layer. In the connection portion between the printed wiring board on which the conductive layer on which the paste printed layer is formed and the terminal is connected, the electrical connection portion with the terminal of the printed wiring board is a printed layer of conductive paste mainly composed of silver. Are exposed.

【0007】上述のように、本発明によれば、端子との
電気的接続部は銀を主体とする導電性ペーストの印刷層
が露出しているので、端子とは銀を主体とする導電性ペ
ーストの印刷層が電気的に接触する。従って、従来のよ
うにカーボンを主体とする導電性ペーストの印刷層が端
子と接触する場合に比して、接触抵抗及び接触抵抗の経
時変化などの電気的な接続性能が向上する。この際、銀
を主体とする導電性ペーストの印刷層が露出した領域を
端子と接触する領域に局在化させると、この露出した領
域は、端子と接触した状態では、外気に曝されることが
なく、マイグレーションを防ぐことができる。
As described above, according to the present invention, the terminal is electrically connected to the terminal because the printed layer of the conductive paste mainly composed of silver is exposed. The printed layer of the paste makes electrical contact. Therefore, the electrical connection performance such as the contact resistance and the change over time of the contact resistance is improved as compared with the conventional case where the printed layer of the conductive paste mainly composed of carbon contacts the terminal. At this time, when the region where the printed layer of the conductive paste mainly composed of silver is exposed is localized in the region that contacts the terminal, the exposed region is exposed to the outside air in the state of contact with the terminal. And migration can be prevented.

【0008】[0008]

【発明の実施の形態】以下、図面に基づいて本発明の実
施の形態を詳細に説明する。図1(a)、(b)はそれ
ぞれ、本発明にかかるプリント配線板の接続部の一実施
形態の斜視図および前記実施形態を端子に接続した状態
の部分断面図である。図1は、図3に関して説明した部
分と同部分は同符号で指示してある。図1(a)に示す
ように、本実施形態のプリント配線板は、柔軟な絶縁性
のプラスチックフィルム1(例えばポリエチレンテレフ
タレート:PET)の表面に導電性ペーストを印刷して
導電層2を形成し、導電層2を挟むようにプラスチック
フィルム1上に被覆層3を積層したものである。この導
電層2は、銀を主体とする導電性ペーストが印刷された
銀ペースト層2aの上に、カーボンを主体とする導電性
ペーストが重なるように印刷してカーボンペースト層2
bを形成したものである。また、端子を接続する接続部
4は被覆層3で被われず、カーボンペースト層2bが露
出し、端子内部に挿入できるように外形が舌片状をなし
ている。本実施形態が従来例と異なる特徴的なことは、
接続部4の端子と接触する部分4aに、円形状に銀ペー
スト層2aが露出していることである。このように銀ペ
ースト層2aが部分的に露出するようにカーボンペース
ト層2bを銀ペースト層2a上に印刷することは、スク
リーン印刷技術では容易に行うことができる。
Embodiments of the present invention will be described below in detail with reference to the drawings. 1A and 1B are a perspective view of an embodiment of a connection portion of a printed wiring board according to the present invention and a partial cross-sectional view of a state where the embodiment is connected to a terminal. In FIG. 1, the same parts as those described with reference to FIG. 3 are indicated by the same reference numerals. As shown in FIG. 1A, in the printed wiring board of the present embodiment, a conductive paste is printed on the surface of a flexible insulating plastic film 1 (for example, polyethylene terephthalate: PET) to form a conductive layer 2. A coating layer 3 is laminated on a plastic film 1 so as to sandwich the conductive layer 2. The conductive layer 2 is formed by printing a conductive paste mainly composed of carbon on a silver paste layer 2a on which a conductive paste mainly composed of silver is printed, so as to overlap the carbon paste layer 2a.
b is formed. In addition, the connecting portion 4 for connecting the terminal is not covered with the coating layer 3, the carbon paste layer 2 b is exposed, and the outer shape has a tongue shape so that it can be inserted into the terminal. This embodiment is different from the conventional example in that
The silver paste layer 2a is exposed in a circular shape at a portion 4a of the connection portion 4 which contacts the terminal. Printing the carbon paste layer 2b on the silver paste layer 2a so that the silver paste layer 2a is partially exposed as described above can be easily performed by a screen printing technique.

【0009】図1(b)は、上記接続部4に端子の弾性
舌片11が押圧した状態の断面図である。接続部4は、
弾性舌片11の略半球面状の突出部13と端子底部12
に穿たれた円孔14の間に弾性的に挟持され、電気的接
続は、前記突出部13と露出している銀ペースト層2a
の接触により行なわれている。従って、本実施形態の接
続部での電気的接続は、従来の突出部13とカーボンペ
ースト層2bが接触している場合に比して、接触抵抗が
低下するなど、電気的接続性能が向上する。また、接続
部4の露出している銀ペースト層2aは、弾性舌片11
の突出部13と接触して、外気に曝されないので、マイ
グレーションが起こる恐れはない。
FIG. 1B is a sectional view showing a state in which the elastic tongue 11 of the terminal is pressed against the connecting portion 4. The connection unit 4
A substantially hemispherical protrusion 13 of the elastic tongue 11 and a terminal bottom 12
Elastically sandwiched between the holes 14 formed in the silver paste layer 2a.
The contact is made. Therefore, in the electrical connection at the connection portion of the present embodiment, the electrical connection performance is improved, for example, the contact resistance is reduced, as compared with the conventional case where the protrusion 13 and the carbon paste layer 2b are in contact with each other. . The exposed silver paste layer 2a of the connection portion 4 is formed by the elastic tongue 11
Is not exposed to the outside air in contact with the protrusions 13 of the above, there is no risk of migration occurring.

【0010】なお、上記実施形態では、接続部4におけ
る銀ペースト層2aの露出部分の形状は円形であった
が、円形に限定されることはなく、端子の弾性舌片11
の接触部分の形状により変化させることができる。
In the above-described embodiment, the shape of the exposed portion of the silver paste layer 2a in the connection portion 4 is circular. However, the shape is not limited to a circle, and the elastic tongue piece 11 of the terminal may be used.
Can be changed depending on the shape of the contact portion.

【0011】[0011]

【発明の効果】以上説明したように本発明によれば、端
子との接触による電気的接続性能が大幅に向上するとい
う優れた効果がある。
As described above, according to the present invention, there is an excellent effect that the electrical connection performance by contact with the terminal is greatly improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】(a)、(b)はそれぞれ、本発明にかかるプ
リント配線板の接続部の一実施形態の斜視図および前記
実施形態を端子に接続した状態の部分断面図である。
FIGS. 1 (a) and 1 (b) are a perspective view of an embodiment of a connection portion of a printed wiring board according to the present invention and a partial cross-sectional view of a state where the embodiment is connected to a terminal.

【図2】プリント配線板の断面図である。FIG. 2 is a sectional view of a printed wiring board.

【図3】(a)、(b)はそれぞれ、従来のプリント配
線板の接続部の斜視図および前記接続部を端子に接続し
た状態の部分断面図である。
FIGS. 3 (a) and 3 (b) are a perspective view of a connection portion of a conventional printed wiring board and a partial cross-sectional view of a state where the connection portion is connected to a terminal.

【符号の説明】[Explanation of symbols]

1 プラスチックフィルム 2 導電層 2a 銀ペースト層 2b カーボンペースト層 3 被覆層 4 接続部 4a 接触する部分 10 端子 11 弾性舌片 12 端子底部 13 突出部 14 円孔 DESCRIPTION OF SYMBOLS 1 Plastic film 2 Conductive layer 2a Silver paste layer 2b Carbon paste layer 3 Coating layer 4 Connection part 4a Contact part 10 Terminal 11 Elastic tongue piece 12 Terminal bottom part 13 Projection part 14 Round hole

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 絶縁フィルム上に銀を主体とする導電性
ペーストの印刷層、その上にカーボンを主体とする導電
性ペーストの印刷層が重ねられた導電層が形成されたプ
リント配線板と端子との接続する接続部において、プリ
ント配線板の端子との電気的接続部は銀を主体とする導
電性ペーストの印刷層が露出していることを特徴とする
プリント配線板の接続部。
1. A printed wiring board and a terminal having a conductive layer formed by superposing a printed layer of a conductive paste mainly composed of silver on an insulating film and a printed layer of a conductive paste mainly composed of carbon on the insulating film. A printed circuit board made of a conductive paste mainly composed of silver is exposed at an electric connection part with a terminal of the printed wiring board.
JP11113225A 1999-04-21 1999-04-21 Connecting part of printed wiring board Pending JP2000307207A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11113225A JP2000307207A (en) 1999-04-21 1999-04-21 Connecting part of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11113225A JP2000307207A (en) 1999-04-21 1999-04-21 Connecting part of printed wiring board

Publications (1)

Publication Number Publication Date
JP2000307207A true JP2000307207A (en) 2000-11-02

Family

ID=14606748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11113225A Pending JP2000307207A (en) 1999-04-21 1999-04-21 Connecting part of printed wiring board

Country Status (1)

Country Link
JP (1) JP2000307207A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7381902B2 (en) 2003-10-01 2008-06-03 Matsushita Electric Industrial Co., Ltd. Wiring board and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7381902B2 (en) 2003-10-01 2008-06-03 Matsushita Electric Industrial Co., Ltd. Wiring board and method of manufacturing the same

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