JP2000216298A - Reinforcing structure of ic package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform inspection and maintenance, etc., after mounting and reinforcing by surely preventing peeling, etc., of a soldering part of an IC package due to mechanical loads, such as impacts and vibration. SOLUTION: In a reinforcing structure of a BGA-type IC package 1 mounted on a motherboard 6, a side surface part 11 enclosing the BGA-type IC package 1 mounted on the mother board 6 and a top surface part 12 comprise it, and the side surface part 11 is made into a box shape by bending four sides of the top surface part 12, and a reinforcing frame 10 having resin injecting side surface notches 11a and top surface notches 12a at the side surface part 11 and the top surface part 12, respectively is provided, and the reinforcing frame 10 is filled with a thermosetting resin 50 for reinforcing the BGA-type IC package.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reinforcing structure for reinforcing an IC package mounted on a motherboard, and more particularly to a reinforcing structure which covers the periphery and the upper surface of the IC package and has a reinforcing frame which can be filled with a resin. The IC package is fixed to the motherboard so that it cannot fall off without increasing the size, and the separation of the soldered portion due to mechanical loads such as shock and vibration can be easily and reliably prevented.
The present invention relates to a reinforcing structure for an IC package suitable for a ball grid array type IC package having solder balls in a matrix on the lower surface of the package, which can be freely inspected, maintained, and the like after mounting and reinforcing.

[0002]

2. Description of the Related Art In recent years, OA equipment has been reduced in size, and the importance of high-density mounting technology for electronic components such as IC chips has increased. Here, a ball grid array type IC package is known as an IC package that enables high-density mounting of electronic components. This ball grid array (hereinafter simply referred to as "BG
A ". ) Type IC package is a multi-pin IC
It has been developed as a package that can mount electronic components such as chips on a printed wiring board (motherboard) on the device side with a high yield. In particular, due to the recent demand for high-density mounting in OA equipment and the like, IC packages have become QFPs. (Qu
ad Flat Package) to BGA package.

Here, a conventional general BGA type IC package proposed so far will be described with reference to FIG. FIG. 7 shows a conventional general BGA type IC.
(A) shows a plan view, and (b) shows a front view in a state of being mounted on a motherboard. As shown in FIG. 1, a conventional BGA type IC package 101 is mounted and mounted on an upper surface of a mother board 106 formed of a printed wiring board provided on the device side.

[0004] The BGA type IC package 101 is
02, an IC chip 103 as an electronic component mounted and mounted on the upper surface side of the substrate 102, and a solder ball 104 disposed on the bottom surface side of the substrate 102. The IC chip 103 is mounted on the upper surface of the substrate 102, is connected to a wiring pattern on the substrate 102 via bonding wires (not shown), and is sealed with a mold resin 105.

[0005] The solder balls 104 are arranged in a matrix on the bottom surface of the substrate 102 opposite to the upper surface on which the IC chip 103 is mounted, and the wiring patterns on the mother board 106 are formed by a reflow soldering method. They are welded and connected. As described above, in the conventional BGA type IC package, the BGA type IC package 101 is connected to the motherboard 1 via the plurality of solder balls 104 arranged in a matrix on the bottom surface of the substrate.
06 and fixed, realizing high-density mounting.

[0006]

However, in such a conventional BGA type IC package, the package is fixed to the motherboard only by the matrix-shaped solder balls as described above, so that the crank-shaped leads are not provided. There is a problem that the soldered portion is easily peeled as compared with the QFP type package to be soldered.

For this reason, when mechanical shocks such as shocks and vibrations are applied to the motherboard and the package, the soldering is peeled off, resulting in poor connection of the package, misalignment, and dropout. In the case of the BGA type IC package mounted on the electronic device, if the mobile phone is accidentally dropped during carrying or use, the package may fall off the motherboard and the device may not be used.

Here, as a means for preventing such peeling and detachment of the IC package, there has been proposed a method of mounting the package on a motherboard and further sealing the entire package with resin. However, in the method of simply encapsulating the entire package with a resin, a required reinforcing strength may not be obtained due to a variation in the sealing resin.

In this regard, in order to obtain reliable strength by resin sealing, it is conceivable to increase the amount of resin.
However, if the amount of resin is increased, the entire package will be enlarged accordingly, and a large amount of resin will flow around the package, making it impossible to mount other IC packages and electronic components. There is a fear that it will hinder high-density mounting of the.

[0010] Furthermore, if the entire package is sealed with resin, there is a problem that maintenance of the IC package and the like thereafter become impossible. For this reason, such a method of reinforcing an IC package by resin sealing particularly requires high-density mounting, and it has been difficult to practically use such a method for small electronic devices or the like in which inspection and maintenance are indispensable.

Japanese Patent Application Laid-Open No. 8-153824 discloses a method of forming a lead in contact with the motherboard from the viewpoint of preventing the package from being tilted due to the melting of the solder ball when mounting the BGA type IC package. "Grid array package" has been proposed. However, in the package described in this publication, it was possible to perform high-precision positioning by preventing the package from tilting. However, the above-described conventional problem of detachment of the solder ball and dropping of the package based on the separation is notable. Was not mentioned.

The present invention has been proposed in order to solve the problems of the prior art, and has a reinforcing frame which covers the periphery and the upper surface of the IC package and which can be filled with a resin. The IC package is fixed to the motherboard so that it does not fall off without increasing the size of the device, preventing the soldering portion from peeling off due to mechanical loads such as shocks and vibrations easily and reliably. Especially suitable for ball grid array type IC package with solder balls in a matrix on the lower surface of the package that can be freely maintained.
The purpose is to provide a package reinforcement structure.

[0013]

In order to achieve the above object, a reinforcing structure for an IC package according to claim 1 of the present invention comprises:
A reinforcing structure of an IC package mounted on a motherboard, wherein the IC package mounted on the motherboard is surrounded by a reinforcing frame formed by bending, and the reinforcing frame is filled with a resin for reinforcing the IC package. is there.

In particular, according to the present invention, the reinforcing frame has a housing shape having an upper surface portion which covers the upper surface of the IC package continuously from the side surface portion, and the housing-like side surface portion is provided with the reinforcing frame. Four sides of the upper surface are bent in the same direction, and a notch is provided in a part of the side surface and / or the upper surface, and the reinforcing frame is filled with a resin for reinforcing an IC package through the notch. There is a possible configuration.

According to a third aspect of the present invention, the IC comprises a ball grid array type package. According to a fourth aspect of the present invention, the resin filled in the reinforcing frame is made of a thermosetting resin. Further, in the present invention, the thermosetting resin filled in the reinforcing frame is filled in a state where an upper surface of the IC package is exposed.

According to the reinforcing structure for an IC package of the present invention having such a structure, the entire IC package is covered with a reinforcing frame formed by bending and filled with a thermosetting resin through a notch. The IC package can be integrated with the motherboard together with the reinforcing frame and the thermosetting resin, and the IC package can be firmly fixed to the motherboard.

With this, the reinforcing frame and the IC package can be integrally fixed only by injecting a minimum amount of resin into necessary portions of the frame, such as terminal portions of the package and solder ball portions. Without making the package, the IC package can be fixed to the motherboard by the same firm holding force as that of the QFP type package. Accordingly, the present invention is particularly applicable to a BGA-type IC package mounted on a small electronic device or the like that is required to be miniaturized and densely packed, without disturbing the high-density mounting. It is suitable for reliably preventing falling off.

Further, since the reinforcing frame is in the form of a housing, it can be mounted simply by mounting it over the IC package, so that positioning, mounting, and fixing work on the IC package side are extremely easy. It can be carried out. As a result, the mounting and fixing work of the reinforcing frame on the motherboard side can be performed by an automatic process together with the automatic mounting and reflow soldering process of the IC package, and the fixing work of the IC package by the reinforcing structure is easy and quick. , It is possible to improve the work efficiency.

Further, in the present reinforcing structure, except for the part where the reinforcing frame and the thermosetting resin are present, the reinforcing structure is exposed to the outside like a normal package. Inspection and maintenance can be performed freely. In addition, since the reinforcing frame is configured separately from the IC package, it is possible to additionally mount the reinforcing frame on an already mounted IC package, thereby realizing a more versatile IC package reinforcing structure. Can be.

Further, since the housing-like reinforcing frame covers the entire periphery of the IC package, the reinforcing frame also functions as a heat radiating plate of the IC package, and generates heat from electronic components in the package. Also, heat can be radiated to the outside via the reinforcing frame. Also, since the reinforcement frame covers the entire periphery of the IC package,
The reinforcement frame will also function as a shield,
Noise from electronic components in the package can also be cut off.

According to a sixth aspect of the present invention, the leg portion is formed by extending at least one of four side corners of the reinforcing frame downward. In particular, by providing a positioning leg, which is inserted and locked into a positioning hole provided on the motherboard side, at the lower end of the side surface of the reinforcing frame, the positioning and soldering of the reinforcing frame can be performed more easily, quickly, and more easily. Can be done accurately.

In the reinforcing structure for an IC package according to the present invention, the notch is formed on at least one of the side surfaces of the reinforcing frame. According to the IC package reinforcing structure of the present invention having such a configuration, a necessary resin can be injected and filled into a necessary portion according to the shape, size, degree of reinforcement, and the like of the IC package to be reinforced. As described above, the notches for resin injection can be formed in any number and size at any positions on the side surface of the reinforcing frame.

More specifically, according to the present invention, the notch formed in the side surface of the reinforcing frame is formed so as to open at the lower end edge of the side surface.

According to the reinforcing structure for an IC package of the present invention having such a structure, a notch opening is formed at the lower end of the side surface of the reinforcing frame, and the inside of the reinforcing frame is thermoset through the notch. The resin can be filled and sealed. Thereby, the IC connected to the motherboard
The lower surface of the package can be filled with resin from the periphery, and the connection between the IC package and the motherboard can be firmly fixed.

In particular, in a BGA type IC package in which a large number of solder balls are provided and welded on the lower surface of the package, the resin can be directly filled and sealed in the solder ball portion where peeling or the like is a problem, so that an external impact It is suitable for securely and firmly holding and fixing the BGA type IC package without causing the peeling of the solder ball, the displacement of the package, the falling off, etc., even if vibrations are applied.

In the reinforcing structure for an IC package according to the ninth aspect, the notch is formed in an upper surface of the reinforcing frame. And, specifically,
The reinforcing structure of the IC package according to the tenth aspect is configured such that the notch is formed in all or a part of four corners of an upper surface portion of the reinforcing frame. Further, in the reinforcing structure for an IC package according to claim 11, the notch formed in the upper surface of the reinforcing frame includes a first upper notch formed in a corner of the upper surface, and a notch formed in four corners of the upper surface. And a second upper surface notch.

According to the IC package reinforcing structure of the present invention having such a configuration, the thermosetting resin can be filled and sealed in the frame through the notch formed in the upper corner of the reinforcing frame. . Thereby, the corners of the IC package housed in the frame can be fixed by the resin, and the IC package can be securely held and fixed. In particular, the four corners of the rectangular BGA type package substrate are made of resin. Can be fixed by impact,
It is suitable for effectively preventing the peeling of the solder balls of the BGA type IC package and the falling off of the package due to vibration or the like.

Further, in the reinforcing structure for an IC package according to the twelfth aspect, at least a part of the side surface or the upper surface of the reinforcing frame is provided with a hole for reducing the weight. According to the IC package reinforcing structure of the present invention having such a configuration, by appropriately providing holes in the reinforcing frame, the weight of the reinforcing frame can be reduced. This makes it possible to reduce the weight of the entire reinforcing structure. In particular, an IC mounted on an electronic device that requires a reduction in weight, such as a small portable electronic device such as a mobile phone.
It is suitable as a package reinforcement structure.

Further, in the reinforcing structure for an IC package according to the present invention, at least one corner of the IC package is fixed by the thermosetting resin.

[0030]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an embodiment of a reinforcing structure of an IC package according to the present invention. First Embodiment First, a first embodiment of a reinforcing structure for an IC package according to the present invention will be described with reference to FIGS. 1A and 1B show a reinforcement structure of an IC package according to a first embodiment of the present invention, wherein FIG.
(B) is a bottom view, (c) is a front view mounted on a motherboard, and (d) is a cross-sectional view of the reinforcing frame in (c). 2 and 3 are perspective views showing a mounting process of the reinforcing structure of the IC package according to the present embodiment.
FIG. 3 shows a state in which a reinforcing frame is mounted on a motherboard on which an IC is mounted, and FIG. 3 shows a state in which a reinforcing resin is injected and filled in the reinforcing frame mounted and mounted on the motherboard.

As shown in these figures, the reinforcing structure of the IC package according to the present embodiment is such that a BGA type IC package 1 having solder balls in a matrix on the lower surface of the package is used as an IC package to be reinforced. It is a reinforcement structure fixed to the side. The BGA type IC package 1 has a ball grid in which solder balls 4 to be welded to a mother board 6 are arranged in a matrix on the lower surface of a substrate (interposer substrate) 2 on which an IC chip 3 is mounted as an electronic component on the upper surface. An array-type package having a resin-fillable reinforcing frame 10 for fixing the BGA-type IC package 1 to the motherboard 6 so as not to fall off. This effectively prevents the package 1 from falling off or the connection failure due to the peeling of the solder balls 4.

More specifically, as shown in FIG. 1, a BGA type IC package 1 includes a substrate 2, an IC chip 3 as an electronic component mounted and mounted on the upper surface side of the substrate 2, Solder balls 4 are provided and welded to the bottom surface. The IC chip 3 mounted on the substrate 2 has electrode pads (not shown) connected to the electrode pads on the substrate 2 by bonding wires (not shown).
The C chip 3 is connected to a wiring pattern on the substrate 2 via a bonding wire. The entire IC chip 3 including the bonding wires is sealed and protected by the mold resin 5.

The solder balls 4 include a plurality of solder balls 4,
4. . . Are arranged and welded on the lower surface of the substrate 2 opposite to the surface on which the IC chip 3 is mounted so as to surround the IC chip 3, and are welded to the wiring pattern on the motherboard 6 by a reflow soldering method. , Are connected.

The motherboard 6 on which the BGA type IC package 1 is mounted is generally constituted by a printed wiring board, and also in this embodiment is constituted by various printed wiring boards such as a multilayer board and a double-sided board. In the present embodiment, a positioning hole 7 is formed on the surface of the motherboard 6 so that a leg 13 of a reinforcing frame 10 described later is inserted and locked.

A reinforcing frame 10 for fixing the BGA type IC package 1 to the motherboard 6 so as not to fall off is provided. As shown in FIG. 1, the reinforcing frame 10 includes a square-shaped thin plate-shaped side portion 11 surrounding the side surface of the BGA type IC package 1 mounted on the motherboard 6 and is continuous with the side portion 11. Thus, the housing structure has a thin plate-shaped upper surface portion 12 that covers the upper surface of the BGA type IC package 1.

In the present embodiment, the reinforcing frame 10 is formed by cutting and bending a thin sheet metal, and the side surface portion 11 and the upper surface portion 12 are integrally formed. By forming the reinforcing frame 10 by integrally forming such a sheet metal thin plate member by cutting and bending, manufacturing and processing operations are facilitated, durability is improved, and the weight of the entire frame is reduced. it can.

However, the reinforcing frame 10 may be formed by cutting and bending a member other than a sheet metal as long as the frame can cover the periphery of the IC package.

Further, in the reinforcing frame 10 having such a housing shape, a side notch 11a and an upper surface notch 12a are formed in the side surface portion 11 and the upper surface portion 12, respectively.
The reinforcing frame 1 is inserted through the notches 11a and 12a.
It is designed so that the resin for reinforcing the IC can be filled in the area 0.

The resin to be injected and filled into the reinforcing frame 10 through the notches 11a and 12a is a thermosetting resin 50 in the present embodiment.
The nozzle 51 is inserted into the reinforcing frame 10 by the nozzle 51 inserted into the reinforcing frame 10 (see FIG. 3). Thermosetting resin 50 as resin for fixing package
By adopting, there is an effect that the curing time can be shortened and the curing conditions can be easily controlled. In addition, as the resin for fixing the package, for example, an adhesive or the like can be used in addition to the thermosetting resin 50 of the present embodiment.

The side notches 11a provided in the side portions 11 of the reinforcing frame 10 are formed on the four sides of the square side portions 11, respectively, and are located substantially at the centers of the side portions 11 and open to the lower edge of the frame. So as to form. In this manner, by forming the side notch 11a so as to open at the lower end of the side surface of the reinforcing frame 10, the resin filled and sealed in the frame via the side notch 11a is sealed on the lower surface side of the package. be able to.

As a result, the resin can be filled in the solder balls 4 on the lower surface of the package connected to the motherboard 6 from all sides. Since the resin can be directly filled and sealed in the connection portion of the solder ball, even if an external impact or vibration is applied, the solder ball 4
It is possible to effectively prevent peeling of the package, displacement of the package, and dropping.

On the other hand, the upper surface notch 12 provided in the upper surface
“a” is formed in four corners of the upper surface portion 12 in a substantially quarter circle shape. By forming the upper surface cutouts 12a at the four corners of the upper surface portion 12, the four corners of the IC package housed in the frame can be fixed by the resin filled in the frame. Thus, since the four corners of the substrate 2 of the BGA-type IC package 1 having a square shape can be fixed by the resin, the BGA-type IC package 1 can be more firmly held against impact, vibration and the like.

In the present embodiment, the notches 11a and 12a are formed by cutting off and punching when forming the reinforcing frame 10 made of sheet metal. Thereby, the notches 11a, 1
2a can also be formed at the same time, and the efficiency of the manufacturing operation can be increased.

The notch provided in the reinforcing frame 10 according to the present invention is formed in at least one of the side surface 11 or the upper surface 12 of the reinforcing frame 10 so that the resin can be injected into the frame. It is possible to arbitrarily select and provide the shape, size, and the like of the formation location and the notch.

That is, the notch indicates the IC to be reinforced.
Depending on the shape, size, degree of reinforcement, etc., of the package, cutouts for resin injection can be placed at arbitrary locations on the side and top of the reinforcement frame so that the required resin can be injected and filled into the required locations. Any number and size can be formed. Therefore, not only the side cutout 11a and the top cutout 12a in the present embodiment but also the side face 1
1, can be formed on a part or all of the upper surface portion 12.

Further, in the reinforcing frame 10 of the present embodiment, as shown in FIG. 2, at the four lower corners of the side surface portion 11, there are positioning leg portions 13 to be inserted and locked into the positioning holes 7 on the motherboard 6 side. Are provided integrally. This leg 13
In the present embodiment, the lower end edge four corners of the side surface portion 11 are formed integrally with the reinforcing frame 10 by extending the four corners. As described above, the motherboard 6 is mounted on the reinforcing frame 10.
By providing the legs 13 to be inserted and locked in the positioning holes 7 on the side, positioning and soldering of the reinforcing frame 10 to the motherboard 6 can be performed easily, quickly and accurately.

The legs 13 are not limited to the four legs 13 as long as the reinforcing frame 10 can be fixed to the motherboard 6 so as to be positionable, and can be appropriately increased or decreased. That is, at least one leg 13 for positioning is formed, and preferably two or more legs are formed.

In the present embodiment, the leg 13 is formed at each of the four corners of the reinforcing frame 10. However, various modifications can be made. For example, the four legs 13 may be formed so as to project from substantially the center of the side surface of the reinforcing frame 10 (the center of the side notch 11a). Further, the leg portion 13 may be formed of a convex member separate from the reinforcing frame 10 and may be fixedly provided at an arbitrary position on the lower edge of the reinforcing frame.

Further, instead of the legs 13 inserted into the motherboard 6, it is also possible to provide legs that contact the surface of the motherboard 6. In this case, the positioning hole 7 on the motherboard 6 can be omitted. in this way,
The leg 13 provided on the reinforcing frame 10 is
As long as it is a means that can easily and surely position and fix the 0 on the motherboard 6 side, it can be appropriately changed and implemented.

Next, a procedure for reinforcing a package by the IC package reinforcing structure of the present embodiment having the above-described configuration will be described. First, the BGA type IC package 1 is mounted and mounted on the upper surface of the motherboard 6. The BGA type IC package 1 mounted at a predetermined position on the motherboard 6 includes a plurality of solder balls 4 on the lower surface side of the substrate 2.
4. . . Are arranged in contact with the upper surface of the motherboard 6, the motherboard 6 on which the BGA type IC package 1 is mounted is subjected to a reflow process,
Is welded and connected to the electrode on the motherboard 6 side. Thus, the mounting of the BGA type IC package 1 on the motherboard 6 is completed.

In this state, the reinforcing frame 10 is provided from above the BGA type IC package 1 and mounted and fixed on the motherboard 6. At this time, since the reinforcing frame 10 has a housing shape, the reinforcing frame 10 can be mounted simply by being mounted so as to cover the BGA type IC package 1, and the positioning, mounting, and fixing work to the BGA type IC package 1 can be performed. Easy to do.

In particular, in this embodiment, the reinforcing frame 10
Into the positioning hole 7 on the motherboard 6 side,
By locking, the reinforcing frame 10 can be easily mounted at a predetermined position. Then, the reinforcing frame 10 is fixed by soldering the legs 13 inserted into the positioning holes 7. In the present embodiment, the mounting and fixing work of the reinforcing frame 10 on the motherboard 6 side is performed by an automatic process together with the automatic mounting of the BGA type IC package 1 and the soldering process by reflow.

After the mounting and fixing work of the reinforcing frame 10 is completed, as shown in FIG. 3, the nozzle 51 is inserted into the side cutout 11a and the upper cutout 12a of the reinforcing frame 10, and the thermosetting resin 50 is removed. Inject and fill. At this time, the thermosetting resin 50 is filled without covering the upper surface of the IC package 1 as shown in FIG. Here, the side notch 11 provided in the side part 11 of the reinforcing frame 10
Since the thermosetting resin 50 filled and sealed via a is sealed on the lower surface side of the package, the resin is filled from all four sides around the solder balls 4 on the lower surface of the package connected to the motherboard 6, and the BGA type resin is filled. Resin is directly filled and sealed in a connection portion of the IC package and the motherboard 6 where peeling or the like poses a problem.

The thermosetting resin 50 filled in the frame via the upper surface cutouts 12a at the four corners of the upper surface 12 of the reinforcing frame 10 is sealed in the four corners of the substrate of the BGA type IC package 1 in the frame. The four corners of the substrate 2 of the square BGA type IC package 1 are fixed.

At this time, the filled thermosetting resin 50
Is regulated by the inner wall of the reinforcing frame 10,
As in the conventional case, the reinforcing strength cannot be obtained due to the variation in the resin, and unnecessary resin does not flow around the package. Then, by enclosing and curing the thermosetting resin 50, the BGA type IC package 1 is fixed integrally with the reinforcing frame 10 and the motherboard 6.

As described above, according to the IC package reinforcing structure according to the present embodiment, the entire BGA type IC package 1 is covered with the reinforcing frame 10 and the thermosetting resin is inserted through the notches 11a and 12a. 50, the BGA type IC package 1 is
0, can be integrated with the motherboard 6 together with the thermosetting resin 50, and the BGA type IC package 1 can be firmly fixed to the motherboard 6.

In this manner, a minimal amount of resin is injected into the reinforcing frame 10 at a portion required as a package reinforcing structure, such as a connection portion of the solder ball 4 where peeling due to impact, vibration or the like is likely to occur. 10 and BGA
The IC package 1 can be integrally fixed, and the BGA IC package 1 can be fixed to the motherboard 6 with the same firm holding force as the QFP package without increasing the size of the entire reinforcing structure as in the related art. Becomes Therefore, especially for a BGA type IC package mounted on a small electronic device or the like which is required to be miniaturized and high-density mounting, it is possible to prevent the package from falling off due to the peeling of the solder ball without hindering the high-density mounting. It is suitable for sure prevention.

In the present reinforcing structure, the reinforcing frame 10
Except for the part where the thermosetting resin 50 is present, the package is the same as a normal package. Therefore, even after fixing to the motherboard 6, the inspection and maintenance of the BGA type IC package 1 can be performed freely. Further, since the reinforcing frame 10 is formed separately from the BGA type IC package 1, the reinforcing frame 10 can be additionally mounted on an already mounted IC package.

Further, the housing-shaped reinforcing frame 10 is
Since the entire periphery of the GA type IC package 1 is covered,
The reinforcing frame 10 also functions as a heat radiating plate of the BGA type IC package 1, and heat generated from electronic components in the package can be radiated to the outside through the reinforcing frame 10.

As a result, the heat generated by the IC chip 3 can be radiated to the space outside the package. Therefore, even if the reinforcing structure is provided, the effective heat radiation effect of the BGA type IC package 1 can be improved. Also, the reinforcing frame 10
Covers the entire periphery of the BGA type IC package 1, so that the reinforcing frame 10 also functions as a shield, and can block noise from the IC chip 3 in the package.

[Second Embodiment] Next, a second embodiment of the IC package reinforcing structure of the present invention will be described with reference to FIG. FIG. 4 is a diagram showing an I-mode according to the second embodiment of the present invention.
3A and 3B show a reinforcement structure of a C package, wherein FIG. 3A is a plan view, FIG.
(C) is a sectional view of the reinforcing frame in (b).

Here, the reinforcing structure of the IC package according to the present embodiment is a modified embodiment of the above-described first embodiment, in which a hole for reducing the weight is provided in the reinforcing frame. The parts are configured in the same manner as in the first embodiment. Therefore, the same components as those of the first embodiment are denoted by the same reference numerals, and the detailed description is omitted.

That is, in this embodiment shown in FIG. 4, a hole 24 for reducing the weight is provided in the upper surface portion 22 of the reinforcing frame 20 having the side surface portion 21 and the upper surface portion 22. The holes 24 are provided with upper surface notches 22 a provided at four corners of the upper surface portion 22.
Are formed inside, and in the present embodiment, eight perfect circular holes arranged on a coaxial circle are formed.

According to the IC package reinforcing structure of the present invention having such a configuration, the reinforcing frame 20 can be reduced in weight by appropriately providing the holes 24 for reducing the weight. This makes it possible to reduce the weight of the entire reinforcing structure, and is particularly suitable for a reinforcing structure of an IC package to be mounted on an electronic device whose weight is required to be reduced, such as a small portable electronic device such as a mobile phone. It is.

In this embodiment, the hole 24 for reducing the weight is provided only on the upper surface portion 22. However, the hole 24 can be provided on the side surface portion 21 or provided only on the side surface portion 21. Can also. When provided on the side surface portion 21, for example,
A hole can be formed near the side notch 21a.

The shape, size, and number of the lightening holes 24 are not particularly limited, and any holes 24 may be arbitrarily formed within a range necessary for reducing the weight of the reinforcing frame 20. be able to. Therefore, when a sufficient weight reduction is achieved by the side notch 21a formed in the side part 21 and the top notch 22a of the top part 22 for resin intrusion,
The hole 24 for reducing the weight can be omitted. That is, the notch for injecting the resin can also function as a hole for reducing the weight of the reinforcing frame.

Third Embodiment Next, a third embodiment of the IC package reinforcing structure of the present invention will be described with reference to FIG. FIG. 5 is a diagram showing an I-mode according to a third embodiment of the present invention.
3A and 3B show a reinforcement structure of a C package, wherein FIG. 3A is a plan view, FIG.
(C) is a sectional view of the reinforcing frame in (b).

Here, the reinforcing structure of the IC package according to the present embodiment is a modified embodiment of the above-described first embodiment, in which the form of the notch provided on the upper surface of the reinforcing frame is changed. The components are the same as those in the first embodiment. Therefore, the same components as those of the first embodiment are denoted by the same reference numerals, and the detailed description is omitted.

That is, in the present embodiment shown in FIG. 5, first upper notches 32a provided at four corners of the upper surface are formed on the upper surface portion 22 of the reinforcing frame 30 having the side surface portion 31 and the upper surface portion 32.
And a second upper surface notch 32 opening in a larger area inside the upper surface.
Two types of notches b are provided. The first upper surface notches 32a at the four corners of the upper surface are opened only in a small area as compared with the upper surface notches of the first and second embodiments described above. On the other hand, the second upper surface notch 32 b is a notch that opens from the inner central portion of the upper surface portion 32 to the side surface portion 31 and opens in a diagonally partitioned fan shape, and has a large area of the upper surface portion 22. Are opened by the second upper surface notch 32b.

According to the IC package reinforcing structure of the present invention having such a configuration, the upper surface portion 32 is largely opened except for the inner central portion and the diagonal portion by the second upper surface notch 32b. The side surface of the substrate of the BGA type IC package 1 located in the reinforcing frame 30 is largely exposed through the second upper cutout 32b. Therefore, by injecting the thermosetting resin 50 through the second upper notch 32b, the thermosetting resin 5 is focused on the outer four sides of the side surface of the BGA type IC package 1.
0 can be enclosed. As a result, a larger amount of the thermosetting resin 50 can be sealed and fixed to the side surface of the package.

As described above, according to the present invention, the notch formed in the reinforcing frame is formed by injecting necessary resin into a necessary portion according to the shape, size, degree of reinforcement, etc. of the IC package to be reinforced. Notches for resin injection can be formed in any number and size at any positions on the side surface and top surface of the reinforcing frame so that the resin can be filled. Therefore, in the present embodiment, it is of course possible to change the shape and size of the side notch 31a provided in the side surface portion 31 and to provide another notch.

[Fourth Embodiment] Further, a fourth embodiment of the IC package reinforcing structure of the present invention will be described with reference to FIG. 6A and 6B show a reinforcement structure of an IC package according to a fourth embodiment of the present invention, wherein FIG. 6A is a plan view, FIG. 6B is a front view of a state mounted on a motherboard,
(C) is a sectional view of the reinforcing frame in (b).

Here, the reinforcing structure of the IC package according to the present embodiment is a modified embodiment of the above-described first embodiment, in which the notch provided on the side surface of the reinforcing frame in the first embodiment is omitted. The other components are the same as those in the first embodiment. Therefore, the same components as those of the first embodiment are denoted by the same reference numerals, and the detailed description is omitted.

That is, in the present embodiment shown in FIG. 6, unlike the first to third embodiments described above, the side face 41 of the reinforcing frame 40 having the side face part 41 and the top face part 42 has No cutout is provided, and the cutout for resin injection is only the upper cutout 41a provided at the four corners of the upper surface portion 42.

Depending on the size of the BGA type IC package 1, the wiring of the motherboard 6, or the number of solder balls 4 on the bottom surface, etc., the BGA type package 1 can be provided without providing the side cutout and enclosing the fixing resin 50. In some cases, sufficient connection strength between the motherboard 6 and the motherboard 6 can be ensured. In such a case, the reinforcing frame 40 of the present embodiment shown in FIG.
Upper surface notches 42a provided at the four corners of the upper surface portion 42 as shown in FIG.
Only with this, the notch in the side surface portion 41 can be omitted.

Therefore, it is of course possible to provide a notch in the side surface portion 41 and omit the upper surface notch 42a of the upper surface portion 42. As described above, by making it possible to omit some of the notches, the production of the reinforcing frame itself becomes easier, the work of enclosing the resin is simplified, and the production cost can be reduced as a whole.

The reinforcing structure of the IC package according to the present invention is not limited to the above-described embodiment.
It goes without saying that various modifications can be made within the scope of the present invention. For example, the upper surface of the reinforcing frame can be omitted as appropriate depending on the strength required for reinforcement and the like. That is, as long as the reinforcing frame is formed by cutting and bending at least the side surface surrounding the IC package, the reinforcing frame can be filled with the resin for package reinforcement, and the reinforcing structure according to the present invention can be realized.

In each of the above-described embodiments, the reinforcing frame has a rectangular shape, but the reinforcing frame may have a shape other than the rectangular shape. That is, as long as it forms a frame that surrounds the IC package to be reinforced and forms a space that can be filled with resin, it is reinforced according to the package or mounting space, such as rectangular, polygonal, circular, or elliptical. It is possible to change the shape of the frame.

It is needless to say that the IC package reinforcing structure of the present invention can be applied to packages other than the BGA type package. That is, the reinforcement structure of the present invention can be applied to all types of IC packages as long as reinforcement is required by the frame and resin sealing.

[0080]

As described above, according to the reinforcing structure of the IC package of the present invention, the IC package is provided without covering the periphery of the IC package, and is provided with the reinforcing frame which can be filled with resin. Is fixed to the motherboard so that it does not fall off, preventing the soldered part from peeling off due to mechanical loads such as shocks and vibrations, etc. easily and reliably, and also allows free inspection and maintenance after mounting and reinforcement. . This is particularly suitable for reinforcing the fixation of the motherboard to a ball grid array type IC package having solder balls in a matrix on the lower surface of the package.

[Brief description of the drawings]

1A and 1B show a reinforcing structure of an IC package according to a first embodiment of the present invention, wherein FIG. 1A is a plan view, FIG. 1B is a bottom view, and FIG.
(D) is a sectional view of the reinforcing frame in (c).

FIG. 2 is a perspective view showing a mounting step of a reinforcing structure of the IC package according to the first embodiment of the present invention, and shows a state where a reinforcing frame is mounted on a motherboard on which the IC is mounted.

FIG. 3 is a perspective view showing a mounting process of a reinforcing structure of the IC package according to the first embodiment of the present invention, in which a reinforcing resin is injected into a reinforcing frame mounted on and mounted on a motherboard;
The state of filling is shown.

FIG. 4 shows a reinforcing structure of an IC package according to a second embodiment of the present invention, wherein (a) is a plan view,
(B) is a front view of a state mounted on the motherboard, (c).
FIG. 4 is a cross-sectional view of the reinforcing frame in (b).

FIG. 5 shows a reinforcing structure of an IC package according to a third embodiment of the present invention, wherein (a) is a plan view,
(B) is a front view of a state mounted on the motherboard, (c).
FIG. 4 is a cross-sectional view of the reinforcing frame in (b).

FIG. 6 shows a reinforcing structure of an IC package according to a fourth embodiment of the present invention, wherein (a) is a plan view,
(B) is a front view of a state mounted on the motherboard, (c).
FIG. 4 is a cross-sectional view of the reinforcing frame in (b).

7A is a plan view showing a conventional general ball grid array type package, and FIG. 7B is a front view showing a state where the package is mounted on a motherboard shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ball grid array type IC package 2 Substrate 3 IC chip 4 Solder ball 5 Mold resin 6 Motherboard 10 Reinforcement frame 20 Reinforcement frame 30 Reinforcement frame 40 Reinforcement frame 50 Thermosetting resin

Claims (13)

[Claims] 1. A reinforcing structure for an IC package mounted on a motherboard, wherein the IC package mounted on the motherboard is surrounded by a reinforcing frame formed by bending, and a resin for reinforcing the IC package is provided in the reinforcing frame. A reinforcing structure for an IC package, characterized by being filled. 2. The method according to claim 1, wherein the reinforcing frame has a housing shape provided with an upper surface portion that covers an upper surface of the IC package continuously from the side surface portion. 2. A resin for reinforcing an IC package can be filled in the reinforcing frame through the notch formed by bending in the same direction and having a cutout in a part of the side surface and / or the upper surface. A reinforcing structure for the described IC package. 3. The IC according to claim 1, wherein said IC package comprises a ball grid array type package.
Reinforcement structure of C package. 4. The method according to claim 1, wherein the resin filled in the reinforcing frame is made of a thermosetting resin.
Reinforcement structure of C package. 5. The IC package reinforcing structure according to claim 4, wherein the thermosetting resin filled in the reinforcing frame is filled in a state where an upper surface of the IC package is exposed. 6. The positioning frame according to claim 2, wherein a positioning leg for inserting and engaging with the motherboard is integrally provided at a lower end of the side surface formed by bending the reinforcing frame. IC package reinforcement structure. 7. The notch is formed in at least one of the side portions of the reinforcing frame.
7. The reinforcing structure for an IC package according to any one of claims 1 to 6. 8. The reinforcing structure for an IC package according to claim 7, wherein a notch formed in a side surface of the reinforcing frame is formed to open at a lower end edge of the side surface. 9. The IC package reinforcing structure according to claim 2, wherein said notch is formed in an upper surface of said reinforcing frame. 10. The IC according to claim 2, wherein the notch formed in the upper surface of the reinforcing frame is formed in at least one of four corners of the upper surface.
Package reinforcement structure. 11. A notch formed on the upper surface of the reinforcing frame includes a first upper notch formed at four corners of the upper surface and a second upper notch formed at four corners of the upper surface. A reinforcing structure for an IC package according to claim 2. 12. The reinforcing structure for an IC package according to claim 2, wherein a hole for reducing the weight is provided on at least a part of the side surface and / or the upper surface of the reinforcing frame. 13. The IC according to claim 1, wherein the thermosetting resin is
13. The reinforcing structure for an IC package according to claim 4, wherein at least one corner of the package is fixed.