JP2000251227A - Compound thin-film magnetic head and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To actualize the compound thin-film magnetic head, which can accurately detect the output signal of a magneto-resistance element without being affected by noise and has excellent insulation characteristics between the conductive layer and a shield layer, and the method for manufacturing the magnetic head in high yield by making the conductive layer thick and lowering its resistance. SOLUTION: Recessed parts are formed on the top surfaces of base bodies 21 and 22 and in the recessed parts, a lower shield layer 25, a thick insulating layer 26, a couple of thick conductive layers 27a and 27b for a magneto- resistance element, and a thick insulating layer 28, are formed. Then the magneto-resistance element 30 is formed at base body parts adjacent to the recessed parts while embedded in shield gap layers 29 and 32, and both the ends of the magneto-resistance element are connected to the conductive layers 27a and 27b through a couple of lead-out electrodes 31a and 31b having small film thickness. After the surfaces are made flat, a lower pole 33, a write gap layer 34, thin-film coils 37 and 39, and an upper pole 41 of an induction type thin-film magnetic head, are formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite thin film magnetic head in which a magnetoresistive thin film magnetic head for reading and an inductive thin film magnetic head for writing are supported by a substrate in a laminated state, and a method of manufacturing the same. It is about.

[0002]

2. Description of the Related Art In recent years, as the areal recording density of a hard disk drive has been improved, the performance of a composite thin-film magnetic head has also been required to be improved. As a composite type thin film magnetic head, an inductive type thin film magnetic head for the purpose of writing,
A type having a structure in which a magnetoresistive thin-film magnetic head for reading is stacked on a base has been proposed,
Has been put to practical use. As a reading magnetoresistive element, a normal anisotropic magnetoresistance (AMR) is used.
Conventionally, an AMR element using the resistive (effect) effect has been used. However, a giant magnetoresistive (GMR: Giant Magneto Resistive) which has a larger rate of change in resistance than that of the AMR element and can obtain an output three to five times larger than that of the AMR element GMR using the) effect
Devices have also been developed.

In this specification, these AMR elements and G
The MR elements are collectively referred to as a magnetoresistive thin-film magnetic head or simply an MR reproducing element.

By using an AMR element, a surface recording density of several gigabits / inch ² can be realized.
The use of the GMR element can further increase the areal recording density. By increasing the areal recording density in this way, a hard disk device having a large capacity of 10 Gbytes or more can be realized.

In general, the MR film is made of a magnetic material exhibiting a magnetoresistance effect and has a single-layer structure. On the other hand, many GMR films have a multilayer structure in which a plurality of films are combined. There are several types of mechanisms that cause the GMR effect, and the structure of the GMR film differs depending on the mechanism. Specifically, there are a superlattice GMR film, a granular film, and a spin valve film. In particular, the spin valve film has a relatively simple structure, is suitable for mass production, and is a GMR film showing a large change in resistance with a weak magnetic field.

As described above, a magnetoresistive thin film magnetic head for reading which can achieve a high areal recording density is A
It can be easily realized by employing a GMR film instead of the MR film. On the other hand, with the performance improvement of the read head,
There is also a demand for improved recording head performance. To increase the areal recording density, it is necessary to increase the track density in the magnetic recording medium. For this purpose, it is necessary to reduce the width of a write gap on the air bearing surface from a few microns to a submicron order, and semiconductor processing technology is used to achieve this.

1 to 11 show sequential steps of manufacturing a conventional standard composite type thin film magnetic head. In the drawings having A and B, A is a sectional view perpendicular to the air bearing surface of the thin film magnetic head. B is a cross-sectional view of the magnetic pole portion parallel to the air bearing surface. The composite thin-film magnetic head of this example has a structure in which a magnetoresistive thin-film magnetic head for reading is provided on a base, and an inductive thin-film magnetic head for writing is stacked thereon. Also, in actual manufacturing of a thin-film magnetic head, since many thin-film magnetic heads are simultaneously formed on one wafer, the end faces of the individual thin-film magnetic heads do not appear during the manufacturing, but the drawings are clarified. The end face is shown.

First, as shown in FIG. 1, for example, alumina (Al ₂ C) is formed on a substrate 1 made of, for example, AlTiC.
An insulating layer 2 made of O ₃ ) is deposited to a thickness of about 5 to 10 μm, and a first magnetic layer constituting one magnetic shield for protecting the reproducing GMR element from the influence of an external magnetic field. Layer 3 is formed with a thickness of 2-3 μm.

After that, as shown in FIG. 2, as a first shield gap layer 4, alumina is sputter-deposited to a thickness of 50 to 100 nm, and then a multi-layered magnetoresistive layer 5 constituting a GMR reproducing element is formed to a thickness of 10 nm. It is formed to the following thickness. FIG. 2 shows a state in which a photoresist film 6 is formed thereon to form the magnetoresistive layer 5 in a desired pattern. FIG. 3 shows a state where the photoresist film 6 is patterned into a desired shape. At this time, the photoresist film 6 has a shape such that lift-off can be easily performed.
For example, it is formed in a T shape. Next, ion milling is performed using the photoresist film 6 as a mask to form the magnetoresistive layer 5 in a predetermined pattern.

Next, FIGS. 3 and 4 show that the first and second conductive layers 7a and 7b are formed to a thickness of several tens nm using the same photoresist film 6 as a mask. As clearly shown in FIG. 4, one ends of these first and second conductive layers 7a and 7b are connected to both ends of the magnetoresistive layer 5, respectively. These conductive layers 7a and 7b are formed, for example, with a laminate of TiW / CoPt / TiW / Ta.

Next, FIG. 5 shows a state in which the photoresist film 6 has been removed by a lift-off process. continue,
As shown in FIG. 6, a second shield gap layer 8 made of alumina is formed to a thickness of 50 to 150 nm again, and the magnetoresistive layer 5 and the first and second conductive layers 7a and 7b are formed in the first layer. And second shield gap layers 4 and 8
And a second magnetic layer 9 made of permalloy.
Is formed to a thickness of 2 to 3 μm. This second magnetic layer 9
Has not only a function as the other shield for magnetically shielding the GMR reproducing element together with the above-described first magnetic layer 3, but also a function as one pole of the thin-film magnetic head for writing.

Next, as shown in FIG. 7, a write gap layer 10 made of a nonmagnetic material, for example, alumina is formed on the second magnetic layer 9 to a thickness of about 200 to 300 nm. An insulating layer 11 made of a photoresist is formed on a portion to be formed to a thickness of about 1 to 2 μm according to a predetermined pattern, and a first thin film coil 12 of a thickness of 3 μm is formed thereon. It is formed in a state where it is insulated and separated by the film 13. Further, the surface of the insulating layer 13 made of photoresist covering the first-layer thin-film coil 12 is flattened by performing a heat treatment.
The second-layer thin-film coil 14 having a thickness of m is formed so as to be insulated and supported by an insulating layer 15 made of photoresist.

Further, after performing a heat treatment to flatten the surface of the insulating layer 15 made of a photoresist covering the second thin-film coil 14, the third magnetic layer 16 is formed as shown in FIGS. It is formed according to a predetermined pattern. The third magnetic layer 16 is opposed to the second magnetic layer 9 via the write gap layer 10 in the vicinity of the air bearing surface and is magnetically separated from the second magnetic layer at a position distant from the air bearing surface. Are linked.

The write gap layer 10 is etched using the magnetic pole portion of the third magnetic layer 16 as a mask, and the second magnetic layer 9 under the write gap layer 10 is etched over a part of the film thickness to form a trim structure. To form

Further, as shown in FIG. 10, an overcoat layer 17 made of alumina is coated on the whole with a thickness of 20 to 30 μm.
To a film thickness of As described above, the third magnetic layer 16 constituting the magnetic pole portion is formed of a Hi-Bs magnetic material such as permalloy or FeN having a high saturation magnetic flux density.

Finally, the side surface on which the magnetoresistive layer 5 and the write gap layer 10 are formed is polished to form an air bearing surface (ABS) 18 facing the magnetic recording medium. In the process of forming the air bearing surface 18, the magnetoresistive layer 5 is also polished, and the GMR reproducing element 19 is obtained.

In this way, a composite type thin film magnetic head in which the magnetoresistive effect type thin film magnetic head and the inductive type thin film magnetic head are laminated is obtained. The MR height MRH of the GMR reproducing element 19 is changed from the air bearing surface 18 to the magnetoresistive layer. Is defined as the distance to the edge opposite to the air bearing surface of the inductive thin-film magnetic head.
Is defined as a distance from the air bearing surface 18 to a side edge of the insulating layer 11 on the air bearing surface side. In an actual thin-film magnetic head, as shown in FIG. 11, pads Pa and Pb for connecting the thin-film coils 12 and 14 to the outside, and first and second conductive layers 7a connected to the GMR reproducing element 19, Pads Pc and Pd are formed on the side surface of the substrate for electrically connecting the semiconductor devices 7 and 7b to the outside.

[0018]

In the above-mentioned conventional composite type thin film magnetic head, the first and second conductive layers 7a and 7b connected to the magnetoresistive layer 5 have extremely thin first and second conductive layers. Since the first magnetic layer 3 constituting the lower shield and the second magnetic layer 9 constituting the upper shield are respectively opposed over a wide area via the shield gap layers 4 and 8, these conductive layers and There is a problem that it is difficult to maintain good electrical insulation between the magnetic layer and the magnetic layer. Because of the problem with the insulating properties of the shield gap layers 4 and 8 as described above, the production yield of the conventional composite type thin film magnetic head was low.

In order to improve the insulating properties of the shield gap layers 4 and 8, it is conceivable to increase the film thickness. However, the thickness of the shield gap layer is required to be as thin as possible from the viewpoint of thermal aspirity, which is a problem with the performance improvement of the magnetoresistive thin-film magnetic head, and the thickness of the shield gap layer must be increased. As a result, the problem of the insulation failure described above cannot be solved.

That is, in the magnetoresistive thin-film magnetic head, the first magnetic layer 3 constituting the lower shield is provided in order to overcome the problem of thermal aspirity, in which reproduction characteristics are deteriorated by self-heating during reproduction. The first and second shield gap layers 4 and 8 are formed of a magnetic material such as permalloy or sendust having excellent cooling efficiency, and the first and second shield gap layers 4 and 8 are formed by sputtering alumina to 50 to 1
It is necessary to form the shield gap layer with a very small thickness such as 00 nm, and the thickness of the shield gap layer cannot be increased.

Further, in the magnetoresistive read element such as the GMR read element 19, it is required to lower the resistance of the first and second conductive layers 7a and 7b in order to improve the output characteristics. However, reducing the resistance of the conductive layer in this way is also advantageous in solving the above-described problem of thermal aspirity. In order to lower the resistance of the first and second conductive layers 7a and 7b, it is conceivable to increase the film thickness. However, miniaturization is required to achieve high areal recording density and high efficiency, and there is a limit to increasing the thickness of the conductive layer from that viewpoint.

As described above, while solving the problem of thermal aspirity, the conductive layer 7a of the GMR read element 19
In order to improve the insulation failure between the first and second magnetic layers 3 and 9 and to further reduce the resistance of the conductive layer, FIG. It has been proposed that a conductive layer constituting a lead for an element be formed thinner in a magnetic pole portion near an air bearing surface and thicker in other regions.

However, if the conductive layer has such a stepped structure, the second shield gap layer formed thereon cannot be formed accurately, and good insulation cannot be obtained between the conductive layer and the upper shield. .

Further, in order to solve such a problem, the above publication discloses that a lower shield is provided only near the air bearing surface, a thick conductive layer is provided behind the lower shield, and the surface is flattened. Is connected to a magnetoresistive element via a thin conductive layer formed on a flat surface. According to such a structure, the steps described above are not formed in the conductive layer, and the surface thereof is substantially flat. Therefore, even if the thickness of the upper shield gap layer is reduced, the gap between the conductive layer and the upper shield is reduced. In this case, the insulation characteristics are not deteriorated, and the thickness of most of the conductive layer can be increased, so that the resistance can be reduced.

However, the above-mentioned Japanese Patent Application Laid-Open No. 9-312
In the composite type thin film magnetic head described in Japanese Patent Publication No. 006,
Since the lower shield is formed only near the air bearing surface, there is a problem that a sufficiently good magnetic shield effect cannot be obtained. In order to accurately read the output signal of the minute magnetoresistive element, it is necessary to reduce the noise due to the external magnetic field generated by the inductive coil or the hard disk motor as much as possible. In such a case, such noise cannot be sufficiently suppressed, and the reproduced signal cannot be accurately read.

Furthermore, since the magnetoresistive film and the thick conductive layer have a small thickness and are therefore electrically connected to each other through the conductive layer having a high resistance value, the portion of the conductive layer having the small thickness is The problem of fever at the site has not been solved. Since this thin conductive layer is adjacent to the magnetoresistive film,
The effect of the heat generation is great.

An object of the present invention is to solve or alleviate the various problems of the above-mentioned conventional composite type thin film magnetic head and its manufacturing method, and to reduce the thickness of the shield gap layer to solve the problem of thermal aspirity. At the same time, a composite thin-film magnetic head capable of improving the insulation characteristics between the conductive layer and the shield of the magnetoresistive element and reducing the resistance of the conductive layer to improve the reproduction characteristics, and such a composite thin-film magnetic head It is an object of the present invention to provide a method for efficiently manufacturing a thin film type magnetic head with a high yield.

[0028]

SUMMARY OF THE INVENTION A composite thin film magnetic head in which a reading magnetoresistive thin film magnetic head according to the present invention and an inductive thin film magnetic head for writing are supported by a substrate in a stacked state, And a first magnetic member having a first magnetic layer extending at least along the surface of the base from an end surface constituting an air bearing surface to a vicinity of an edge of the concave portion. This first
A magnetoresistive layer disposed on a surface of the first magnetic layer of the magnetic member opposite to the base, the magnetoresistive layer being buried in an insulating and nonmagnetic shield gap layer; First and second conductive layers extending insulated and separated along the inner surface and electrically connected to both ends of the magnetoresistive layer, respectively, and opposite sides of the shield gap layer to the base A second magnetic member having a first portion extending along a surface of the second magnetic member and having a second portion extending inside or above the concave portion, and at least the first magnetic member of the second magnetic member. A write gap layer formed on the surface opposite to the base, and a magnetic pole portion of the write gap layer formed on the surface opposite to the base, and the write gap layer is formed at a portion remote from the air bearing surface. Second part of magnetic member 2 A third magnetic member having a portion that is magnetically coupled; and a portion sandwiched between the second magnetic member and the third magnetic member, wherein the concave portion is viewed from a direction perpendicular to the surface of the base. And a thin-film coil formed so as to overlap.

Further, the composite type thin film magnetic head in which the magnetoresistive effect type thin film magnetic head for reading and the inductive type thin film magnetic head for writing according to the present invention are supported by a substrate in a laminated state, has an air surface on one side. A first magnetic member having a concave portion extending from the bearing surface, a first magnetic member formed along the inner surface of the concave portion and having a rising portion extending to the concave opening surface on the air bearing surface; A state in which the magnetic member is disposed on the surface of the rising portion so as to be embedded in an insulating and non-magnetic shield gap layer, and is insulated and separated along the inner surface of the concave portion; And a first and a second conductive layer electrically connected to both ends of the magnetoresistive layer, respectively, and a second conductive layer extending along a surface of the shield gap layer opposite to the base. 1 A second magnetic member having a portion and a second portion extending inside or above the recess, and at least a surface of the first portion of the second magnetic member opposite the base. A write gap layer formed, and a magnetic pole portion formed on a surface of the write gap layer opposite to the base and having a magnetic portion at a portion remote from the air bearing surface with the second portion of the second magnetic member. A third magnetic member having a portion that is permanently coupled;
A thin-film coil having a second portion of the second magnetic member and a portion sandwiched between the third magnetic member is provided.

In the above-described composite type thin film magnetic head according to the present invention, the first and second conductive layers constituting most of the electrical connection members for connecting the magnetoresistive layer to an external circuit are made of insulating material. Since a thick insulating layer is interposed between the first magnetic member and the second magnetic portion in the concave portion formed on the surface of the base, a problem of poor insulation does not occur, and the conductive layers of these conductive layers are not formed. Since the film thickness can be made sufficiently large, the resistance can be reduced, and a minute output signal of the magnetoresistive layer can be accurately read. Further, since the magnetoresistive layer is buried in the first and second shield gap layers having a small thickness, there is no problem of thermal aspirity.

In a preferred embodiment of the composite thin-film magnetic head according to the present invention, the first magnetic member is connected to the first magnetic layer in addition to the first magnetic layer, A second magnetic layer extending along the inner surface of the second magnetic layer. In addition, the second magnetic layer of the first magnetic member, the end surfaces of the first and second conductive layers and the insulating layer covering these conductive layers, which appear on the opening surface of the concave portion, or the first and second conductive layers The end surfaces of the layer and the insulating layer covering these conductive layers, which appear on the opening surface of the recess, are made to be the same flat surface, and both ends of the magnetoresistive layer are flattened on the opening surface of the recess of the first and second conductive layers, respectively. It is particularly preferable to electrically connect the end faces via the first and second extraction electrodes, respectively. With this configuration, the first and second extraction electrodes can be formed on a flat surface, so that fine processing can be performed easily and accurately, and further downsizing can be achieved.

Further, in another preferred embodiment of the composite type thin film magnetic head according to the present invention, an insulating layer covering the first and second conductive layers formed inside the concave portion is provided on the opening surface of the concave portion and the shield is provided. The second magnetic member is formed so as to have the same flat surface as the gap layer, the second portion of the second magnetic member is formed flat along the same flat surface of the shield gap layer and the insulating layer, and the write gap layer is formed. Second
And the thin film coil is formed on the flat surface of the write gap layer opposite to the substrate. In this case, since the thin-film coil can be formed on a flat plane, further miniaturization becomes possible.

In still another preferred embodiment of the composite thin-film magnetic head according to the present invention, a second portion of the second magnetic member is formed inside the recess along the inner surface thereof, and A first-layer thin-film coil of the thin-film coil is formed on a surface of the second portion of the second magnetic member opposite to the base such that at least a portion is embedded in the recess.
In such an embodiment, the surface of the first-layer thin-film coil opposite to the base is flattened, and the first-layer thin-film coil is provided on the first portion of the second magnetic member. A first pole tip formed so as to be flush with the flat face of the coil, and the write gap layer is formed on the same flat face of the first layer thin-film coil and the first pole tip; Then, a second-layer thin-film coil can be formed on the flat surface of the write gap layer opposite to the base.

Further, in the above-described embodiment, the third magnetic member has at least a portion of the write gap layer, which is opposed to the first pole tip, formed on a flat surface opposite to the base. It is particularly preferable to provide two pole tips and a magnetic layer formed so as to be in contact with the second pole tip. In such a case, the track width can be defined by the first and second pole chips, and a track width of 1 micron or less can be realized with high accuracy.

In another preferred embodiment of the composite type thin film magnetic head according to the present invention, the front end surface of the magnetic layer of the third magnetic member is set back from the air bearing surface. With such a configuration, it is possible to effectively prevent the sidelight due to the magnetic flux leaking from the end face of the third magnetic member.

Further, in the composite thin-film magnetic head according to the present invention, the first and second conductive layers have first and second ends connected to the magnetoresistive layer, respectively, connected to both ends of the magnetoresistive layer. Change the extraction electrode layer to TiW / CoPt / TiW / Ta /
It is preferable to form it with a laminate of Au.

Further, the first and second portions formed in the concave portion
The conductive layer is formed of, for example, copper, which is easy to form and process and has low resistivity, and has a thickness of 2 to 3 μm.
It is preferable that

Further, according to the present invention, there is provided a method of manufacturing a composite type thin film magnetic head in which a magnetoresistive thin film magnetic head for reading and an inductive thin film magnetic head for writing are laminated on a substrate. A first magnetic layer extending at least from an air bearing surface formed later to an edge of a concave portion formed on the surface; and a second magnetic layer extending on an inner surface of the concave portion. Forming a first magnetic member, forming first and second conductive layers on the surface of the first magnetic member via a first insulating layer,
Forming a second insulating layer so as to cover the first and second conductive layers and bury the concave portion; and forming a surface of the second insulating layer, the first insulating layer and the first insulating layer.
And a part of the second conductive layer, the surface of the first part and the end face of the second part of the first magnetic member, and the first magnetic member.
The end faces of the insulating layer and the first and second conductive layers are
Polishing so as to have the same flat surface as the surface of the insulating layer, and burying the insulating and non-magnetic shield gap layer on the surface of the first magnetic member appearing on the flat surface. Forming a magnetoresistive layer; forming first and second extraction electrodes connecting both ends of the magnetoresistive layer to the first and second conductive layers, respectively; Forming a second magnetic member, forming a write gap layer on the surface of the second magnetic member, and forming a thin film supported on the surface of the write gap layer by an insulating material. Forming a coil, and in the vicinity of the air bearing surface, facing the second magnetic member via the write gap layer and covering the thin-film coil; Method of manufacturing a composite thin film magnetic head is characterized in that it comprises a step of forming a third magnetic member that is Oite the second magnetically coupled to the magnetic member.

In a preferred embodiment of the method for manufacturing a composite thin-film magnetic head according to the present invention, the step of forming the first magnetic member includes forming an opening corresponding to the recess on the surface of the base. Forming the first magnetic layer acting as a mask for etching, forming the concave portion on the substrate surface by performing etching using the first magnetic layer as a mask, and forming the concave portion on the inner surface of the concave portion. Forming the second magnetic layer so as to be connected to the first magnetic layer.

Further, according to the present invention, a method of manufacturing a composite thin film magnetic head in which a magnetoresistive thin film magnetic head for reading and an inductive thin film magnetic head for writing are laminated on a substrate is provided. Forming a first magnetic member so as to have a side wall extending along the inner surface of the concave portion and at least a portion where an air bearing surface is formed later to the surface of the base body, Forming a first and a second conductive layer along the inner surface of the recess through a first insulating layer so as to cover the first magnetic member; and covering the first and the second conductive layer. Forming the second insulating layer along the inner surface of the recess as described above, and burying the insulating and non-magnetic shield gap layer at the end surface of the side wall of the first magnetic member that appears on the substrate surface. And Forming a magnetoresistive layer such that both ends are connected to the first and second conductive layers via first and second lead electrodes, respectively, and a second magnetic member on the shield gap layer Forming a light gap layer, forming a write gap layer on the surface of the second magnetic member, and forming a thin film coil supported on the surface of the write gap layer while being insulated and separated by an insulating material. In the vicinity of the air bearing surface, it faces the second magnetic member via the write gap layer and covers the thin-film coil, and is magnetically connected to the second magnetic member at a position far from the air bearing surface. Forming the formed third magnetic member, and polishing the base, the first, second and third magnetic members, and the write gap layer to form the first magnetoresistive layer. Is characterized in that it comprises a step of forming an air bearing surface side wall of the sexual member was polished so as to expose.

In a preferred embodiment of the method of manufacturing a composite thin film magnetic head according to the present invention, the step of forming the second magnetic member includes the step of forming a first magnetic layer on the shield gap layer. Forming and forming a lower pole tip on the first magnetic layer.

In another preferred embodiment of the method of manufacturing a composite thin film magnetic head according to the present invention, the step of forming the third magnetic member includes the step of forming an upper pole tip on the shield gap layer. And forming a second magnetic layer on the upper pole tip.

[0043]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a composite thin-film magnetic head and a method of manufacturing the same according to the present invention will be described below with reference to FIGS. 12, 13, 14,
In 16, 17, 19, 20, 21 and 23,
A cross section taken along a plane perpendicular to the air bearing surface is indicated by A, and a cross section taken along a plane parallel to the air bearing surface is indicated by B. FIGS. 15, 18 and 22 are plan views.

First, an insulating layer 22 made of alumina having a thickness of about 5 μm is formed on one surface of a base body 21 made of AlTiC (AlTiC), and a lower shield layer (first layer) made of permalloy is further formed thereon. FIG. 12 shows a state in which a seed layer 23 made of permalloy is formed to a thickness of about 2 to 3 μm for forming the (magnetic member) by electrolytic plating. The base body 21 and the insulating layer 22 may be referred to as a base or a wafer in this specification. In this specification, an insulating layer means a film having at least electrical insulating properties, and may or may not have nonmagnetic properties. However, in general, a material having both electric insulating properties and non-magnetic properties, such as alumina, is used, so that the insulating layer and the non-magnetic layer may be used interchangeably.

In actual production, a large number of composite type thin film magnetic heads are formed in a matrix on a single wafer, and then the wafer is cut into a plurality of bars, and the end surfaces of the bars are polished. Since the air bearing surface is formed and the bar is cut at the end to obtain individual composite type thin film magnetic heads, an end face does not appear at this stage, but for convenience of explanation, this end face is shown in the drawings. I have.

Next, FIG. 13 shows a state in which the recesses 24 are formed by performing dry etching using the seed layer as a mask after forming the openings 23a by patterning the seed layer 23 described above. In this embodiment, the concave portion 24 is formed in the insulating layer 22. However, the concave portion 24 may be formed to penetrate the insulating layer and reach the Altic base body 21.

Next, a lower shield layer 25 is formed to a thickness of 2 to 3 μm on the inner surface of the concave portion 24 and the surface of the insulating layer 22 using the above-described seed layer 23 by electrolytic plating of permalloy. After forming the alumina insulating layer 26 having a thickness of 0.3 to 0.8 .mu.m, the first and second conductive layers 27a constituting most of the leads for connecting the magnetoresistive layer formed later to the external circuit. FIGS. 14 and 15 show a state in which layers 27b and 27b are formed to a thickness of about 0.5 to 1.0 μm by electrolytic plating of copper.

As shown in the plan view of FIG. 15, most of the first and second conductive layers 27a and 27b are formed inside the recess 24. Further, as shown in FIG. 15, the first and second conductive layers 27a and 27b are opposed to each other with the center line CC interposed therebetween. Therefore, the cross-sectional view of A is not cut along this center line, but is cut along a straight line slightly toward the first conductive layer 27a.

Next, as shown in FIG.
After an insulating layer 28 made of alumina is formed on the conductive layers 27a and 27b to a thickness of 2 to 3 .mu.m, chemical-mechanical polishing is performed as shown in FIG. 17 to form a flat surface. On this flat surface, the surface of the seed layer 23, the end surfaces of the side walls rising along the side surfaces of the lower shield layer 25, the alumina insulating layer 26, and the concave portions 24 of the first and second conductive layers 27a and 27b are formed. , Alumina insulating layer 28
And the surface is exposed. This situation is also shown in the plan view of FIG. This flattening treatment can be performed by mechanical polishing instead of chemical-mechanical polishing.

In the present invention, between the first and second conductive layers 27a and 27b and the lower shield layer 25, the alumina insulating layer 2 having a thickness of 0.3 to 0.8 μm is provided.
6 and covered with a thicker alumina insulating layer 28, the insulating properties of these conductive layers are extremely high, and no electrical short circuit due to particles or pinholes occurs. . Further, the thickness of the first and second conductive layers 27a and 27b can be made sufficiently large, so that the resistance value can be made sufficiently low.

Next, as shown in FIG. 19, a lower shield gap layer 29 made of aluminum nitride or aluminum oxide is provided on the flat surface except for the end surfaces of the first and second conductive layers 27a and 27b. After forming the GMR layer 30 by sputtering to a thickness of several tens of nm to form a shape that is easy to lift off, for example, a T-type resist pattern, argon-based ion milling is performed. To form a pattern for the magnetoresistive element, and then, using the same photomask, the GMR layer 3
The first and second lead electrode layers 31a and 31b connecting both ends of the first and second conductive layers 27a and 27b to the above-described first and second conductive layers 27a and 27b are formed to a thickness of 80 to 150 nm. An upper shield gap layer 32 made of aluminum nitride or aluminum oxide is formed to a thickness of 50 to 100 nm by sputtering.

Here, in order to enhance the uniaxial anisotropy of the GMR film 30 to reduce Barkhausen noise and lower the resistance value, at least one of the extraction electrode layers 31a and 31b must be formed of at least one magnetic layer. It is preferable that a material layer and at least one conductive material layer are stacked. In the present example, it is formed of a laminated film of TiW / CoPt / TiW / Ta / Au. Further, the first and second conductive layers 27a and 27a
7b extends to the vicinity of the GMR film 30, so that the first and second extraction electrode layers 31a and 31b
The length of b can be shortened, so that the resistance value of the entire lead to the magnetoresistive element can be further reduced. As a result, a very small output signal of the GMR layer 30 can be detected with extremely high accuracy and sensitivity. Such an effect is particularly advantageous when the areal recording density is increased.

Next, as shown in FIG. 19, the upper shield layer of the magnetoresistive thin film magnetic head and the lower pole of the inductive thin film magnetic head are formed on the second shield gap layer 32. A magnetic layer (second magnetic member) 33 made of permalloy is formed to a thickness of 2 to 3.5 μm. This magnetic layer 33 is hereinafter referred to as a lower pole.

Further, on the lower pole 33, a write gap layer 34 made of alumina or silicon oxide is formed with a thickness of 0.2 to 0.3 μm according to a predetermined pattern, and an insulating layer 35 is formed thereon. It is formed according to a predetermined pattern with a thickness of about 2 μm. The edge on the air bearing surface side of the insulating layer 35 defines a reference position of zero throat height.

An opening 36 is provided substantially at the center of the write gap layer 34 and the insulating layer 35 to expose the surface of the lower pole 33. The opening 36 is for connecting an upper pole and a lower pole 33 to be formed later. At the same time that the lower pole 33 is formed, the first and second lead portions 33a and 33b are connected to the rear ends of the first and second conductive layers 27a and 27b, respectively, and are connected to contact pads. To form

Next, a first-layer thin-film coil 37 having a thickness of 2 to 3 μm is formed on the insulating layer 35 formed on the surface of the light gap layer 34 made of alumina or silicon oxide by plating. Simultaneously with forming the first-layer thin-film coil 37, the third thin-film coil 37 connected to the above-described first and second lead portions 33a and 33b, respectively.
Then, fourth lead portions 37a and 37b are formed.

Next, as shown in FIG. 20, the first thin-film coil 37 is supported in a state where it is insulated and separated by an insulating layer 38 made of a photoresist, and then cured at a temperature of about 200 ° C. to flatten the upper surface. And Subsequently, a second-layer thin-film coil 39 is formed so as to be insulated and supported by an insulating layer 40 made of a photoresist.
The upper surface of the thin film coil is flattened by curing at a temperature of 0 ° C.

At the same time when the second-layer thin-film coil 39 is formed, the third and fourth lead portions 3 are formed.
Fifth and sixth lead portions 39a and 39b are formed to be electrically connected to 7a and 37b, respectively. The aforementioned third to sixth lead portions 37a, 37b, 3
9a and 39b extend to the contact pads and connect the contact pads to an external circuit. Since these lead portions are formed of copper having a high conductivity like the thin film coils 37 and 39, the resistance value of the entire lead can be reduced.

The above-mentioned insulating layers 35, 38 and 40
Although it was formed of an organic insulating material such as a photoresist film,
It can be formed of an inorganic insulating material such as alumina, silicon oxide, or silicon nitride. For example, in the case of forming with an inorganic insulating material, a desired pattern can be selectively etched by photolithography. At this time, the pattern edge is tapered, and the reference position of zero throat height is determined by this edge. You. In the case of using an organic insulating material, the reference position of zero throat height is determined at the pattern edge.

Next, an upper pole 41 made of NiFe (50%, 50%) or FeN, which is a magnetic material having a magnetic pole portion for determining the track width of the recording head and having a high saturation magnetic flux density, is plated to a thickness of approximately 3 μm by plating. The magnetic pole portion is used as a mask to dry-etch the surrounding write gap layer 34, and the exposed lower pole 33 is exposed to a portion of the film thickness, e.g.
FIGS. 21 and 22 show a trim structure formed by ion milling over a depth of 0.5 μm. In the plan view of FIG. 22, the thin film coils are shown as concentric circles to simplify the drawing.

In this example, the upper pole 41 made of NiFe (50%, 50%) or FeN, which is a magnetic material having a high saturation magnetic flux density, is formed in a predetermined pattern by plating.
After sputtering, a predetermined pattern can be formed by dry etching. Further, since the width of the recording track is determined by the width of the magnetic pole portion of the upper pole 41, the width is preferably narrowed to 0.5 to 1.2 μm.

The rear portion of the upper pole 41 is connected to the rear portion of the lower pole 33 through the opening 36 described above, thereby forming a closed magnetic path. Is passing through.

Next, as shown in FIG. 23, an overcoat layer 42 made of alumina is formed so as to cover the whole.
In the actual manufacturing process, the wafer is cut into a plurality of bars each having a plurality of thin-film magnetic head units aligned, and one side of the bar is polished to remove the air bearing surfaces of the plurality of thin-film magnetic head units. Form at the same time. During this polishing, the insulating layers 35, 38 and 40
By grinding the edge of the side surface as a reference position for zero throat height, it is possible to obtain a throat height according to a desired design value. In addition, the tip edge of the GMR layer 30 is also polished by this polishing, and a desired MR height is obtained. Thereafter, the bars are divided into individual thin-film magnetic heads.

FIGS. 24 to 30 show sequential manufacturing steps of a second embodiment of the composite type thin film magnetic head according to the present invention. In this example, the same parts as those in the previous example are denoted by the same reference numerals. Among the steps of this example, the steps shown in FIGS. 24 and 25 are the same as the steps shown in FIGS. 12 and 13 of the previous example.

As shown in FIG. 26, a lower shield layer 25, an alumina insulating layer 26, and first and second conductive layers 27a are formed in a concave portion 24 formed in the insulating layer 22 on the base 21.
And 27b, the alumina insulating layer 51 is
It is formed to a thickness of μm.

Next, after exposing the surface of the seed layer 23 for forming the lower shield layer 25 by chemical-mechanical polishing, it is buried by the lower shield gap layer 29 and the upper shield gap layer 32, Second
Forming the GMR layer 30 connected to the first and second conductive layers 27a and 27b by the lead electrodes 31a and 31b, and further forming the upper shield of the magnetoresistive thin-film magnetic head on the second shield gap layer 32. Lower pole 33 of inductive thin film magnetic head also acting as a layer
FIG. 27 shows a state in which the film was formed by Permalloy to a thickness of 2 to 3.5 μm.

Next, FIG. 28 shows a state in which a lower pole tip 52 made of a magnetic material having a high saturation magnetic flux density is formed on the lower pole 33 in accordance with a predetermined pattern.
The throat height is determined by the length of the lower pole tip 52. In this example, the lower pole tip 52 is formed of NiFe (50%; 50%), but may be formed of a magnetic material having a high saturation magnetic flux density such as iron nitride or its compound or amorphous Fe-Co-Zr. It is also possible to use layers of these materials in layers. Of course, these magnetic materials having a high saturation magnetic flux density may be used for the lower and upper poles.

Further, after an insulating layer 53 made of alumina or silicon oxide is formed on the surface of the lower pole 33 in the concave portion 24 to a thickness of 0.5 to 0.8 μm, the first thin film coil 37 is made of copper. Formed by plating, and 3-4
After forming the alumina insulating layer 54 having a thickness of μm,
A flat surface is formed by mechanical polishing.

Next, as shown in FIG. 30, a write gap layer 34 is formed on the polished surface, and an upper pole tip 55 is formed on this write gap layer by a permalloy having a high saturation magnetic flux density to a thickness of about 3 μm. It is formed thick. The upper pole tip 55 can be formed into a desired pattern by etching after permalloy is sputtered. Further, using the upper pole tip 55 as a mask, the write gap layer 34 therearound is removed by dry etching such as reactive ion etching to expose the surface of the lower lower pole tip 52, and then ion milling is performed. By such ion beam etching, the lower pole tip is removed over a part of its film thickness to form a trim structure.

Next, a second-layer thin-film coil 39 having a thickness of 2 to 3 μm is formed on the surface of the write gap layer 34 made of alumina or silicon oxide.
Cover with 0. Subsequently, an upper pole 56 is formed on the insulating layer 40 by permalloy so as to partially contact the upper pole tip 55. In this case, the upper pole 5
The tip surface on the air bearing surface side of No. 6 is retreated from the air bearing surface. By retreating the tip surface of the upper pole 56 from the air bearing surface in this way, it is possible to effectively prevent a side light due to leakage of magnetic flux from the tip surface. The rear portion of the upper pole 56 is magnetically coupled to the rear portion of the lower pole 33 via a magnetic layer formed together with the pole tips 52 and 55, thereby forming a closed magnetic path. You.

Finally, after forming an overcoat layer 42 of alumina to a thickness of 20 to 30 μm so as to cover the whole, the wafer is cut into a plurality of bars, and one side of the bar is polished to form a plurality of bars. After the air bearing surfaces of the thin film magnetic head unit are formed simultaneously, the bar is divided into individual thin film magnetic heads.

FIGS. 31 to 38 show the structure of a third embodiment of the composite type thin film magnetic head according to the present invention. The steps of FIGS. 31 to 36 of the present embodiment are the same as those of FIG.
To 29 are the same as the steps.

In this embodiment, as shown in FIG. 37, an alumina insulating layer 54 for supporting the surface of the lower pole tip 52 and the first layer thin-film coil 37 in an insulated state.
Is flattened by chemical-mechanical polishing, a write gap layer 34 is formed, and an upper pole tip 55 is formed on the write gap layer according to a desired pattern. Next, using the upper pole tip 55 as a mask, the surrounding write gap layer 34 is removed by dry etching such as reactive ion etching to expose the surface of the lower lower pole tip 52, and then ion milling is performed. The lower pole tip is removed over a part of its film thickness by ion beam etching as described above to form a trim structure.

Next, 0.3 μm is formed on the exposed surface of the light gap layer 34 made of alumina or silicon oxide.
After the alumina insulating layer 57 having a thickness of about 0.6 μm is formed, a second-layer thin-film coil 39 having a thickness of about 2 μm to 3 μm is formed. Polishing is performed until the surface of the upper pole tip 55 is exposed by polishing, so that a flat surface is obtained.

Next, as shown in FIG. 38, an upper pole 59 is formed by permalloy on the polished surface so as to be in partial contact with the surface of the upper pole tip 55. Also in this example, the tip surface on the air bearing surface side of the upper pole 59 is retracted from the air bearing surface. In this example, since the upper pole 59 is formed flat on a flat surface, the upper pole can be finely processed easily and accurately. Next, the whole is covered with an overcoat layer 42 made of alumina, and thereafter, the same processing as in the above-described embodiment is performed.

FIGS. 39 to 45 show the structure of a composite thin film magnetic head according to a fourth embodiment of the present invention. The steps from FIG. 39 to FIG. 40 in this example are almost the same as the steps shown in FIG.

As shown in FIG. 40, a lower shield layer 25 having a thickness of 2 to 3 μm and an alumina insulating film having a thickness of 0.3 to 0.8 μm are formed in a concave portion 24 formed in an insulating layer 22 on a substrate 21. After forming the layer 26 and the first and second conductive layers 27a and 27b having a thickness of 0.5 to 1.0 μm, the alumina insulating layer 51 is formed to a thickness of about 1 to 3 μm. However, in this example, the side surface of the concave portion 24 is closer to vertical.

Next, as shown in FIG. 41, polishing is performed by chemical-mechanical polishing until the surface of the alumina insulating layer 22 is exposed. By this polishing, the end face of the side wall of the lower shield layer 25 is exposed on a flat surface, and this end face provides a surface for forming a magnetoresistive layer.

That is, as shown in FIG. 42, a GMR layer 30 is formed on the end face of the side wall of the lower shield layer 25 so as to be buried by the lower shield gap layer and the upper shield gap layer. And first and second lead electrodes 31a and 31b for connection to the second conductive layers 27a and 27b are formed. In order to simplify the drawing, the lower shield gap layer and the upper shield gap layer are collectively shown as a single shield gap layer 61. Next, a lower pole 33 which also functions as an upper shield is formed on the flat surface of the shield gap layer 61.

Next, as shown in FIG.
A lower pole tip 52 made of a magnetic material having a high saturation magnetic flux density is formed in a thickness of 1 to 2 .mu.m according to a predetermined pattern on the flat surface of the third insulating layer 3. 62 is formed and etched back until the surface of the lower pole tip 52 is exposed by chemical-mechanical polishing.

Further, a light gap layer 34 is formed on the surface polished flat by the chemical-mechanical polishing.
After being formed to a thickness of 15 to 0.3 μm, the upper pole 55
Is formed in a predetermined pattern. This upper pole tip 5
Using the mask 5 as a mask, the surrounding write gap layer 34 is removed by dry etching such as reactive ion etching to expose the surface of the lower lower pole tip 52, and then ion beam etching such as ion milling is performed. The point that the lower pole tip is removed over a part of the film thickness to form a trim structure is the same as in the above-described embodiment.

Next, a first-layer thin-film coil 37 having a thickness of 2 to 3 μm is formed on the surface of the write gap layer 34 made of alumina or silicon oxide, and the first thin-film coil 37 is covered with an alumina insulating layer 54 to form -Polishing flat so that the surface of the upper pole tip 55 is exposed by mechanical polishing.
Next, as shown in FIG. 44, a second-layer thin-film coil 39 is formed on the surface of the alumina insulating layer 54 polished flat as described above.
To form

Next, as shown in FIG. 45, after covering the second thin-film coil 39 with an insulating layer 40 made of a photoresist, the upper pole 56 is formed so as to be in contact with the upper pole tip 55. Also in this example, the tip end surface of the upper pole 56 on the air bearing surface side is retracted from the air bearing surface, so that the writing characteristics can be improved. Further, the rear portion of the upper pole 56 is connected to the lower pole 33 via connecting portions 52a and 55a formed simultaneously with the lower pole tip 52 and the upper pole tip 55, respectively.
And are magnetically coupled. Further, the first and second conductive layers 27 a and 27 b are formed of lead portions 33 a and 33 b formed simultaneously with the lower pole 33 and the lower pole chip 5.
2, the lead portions 52a and 52b formed simultaneously with the first thin film coil 37
These are electrically connected to the contact pads via the lead portions 39a and 39b formed simultaneously with the a and 37b and the second layer thin film coil 39.

Finally, after an overcoat layer 42 made of alumina is formed so as to cover the whole, the wafer is divided into a plurality of bars, and the side surfaces of the bars are polished to form an air bearing surface. The polishing is performed so that the side wall of the lower shield 25 on the air bearing surface side is exposed on the air bearing surface. Therefore, the throat height and the MR height are determined by the polishing of the air bearing surface.

The present invention is not limited to the above-described embodiment, and many modifications and variations are possible. For example, in the above-described embodiment, the composite type thin film magnetic head is formed by laminating the inductive type thin film magnetic head on the magnetoresistive effect type thin film magnetic head. In the above-described embodiment, the magnetoresistive element is a GMR element, but may be an AMR element. further,
The dimensions, materials, and manufacturing processes of each part described above are merely examples, and it is needless to say that various modifications are possible.

[0086]

According to the above-described thin film magnetic head and the method of manufacturing the same according to the present invention, the size of the electric connection member for connecting the magnetoresistive layer constituting the read magnetoresistive thin film magnetic head to an external circuit is large. Since the first and second conductive layers forming the portion are formed in the concave portions formed on the surface of the base, the thickness of these conductive layers can be sufficiently increased to reduce the resistance. As a result, a very small output signal of the magnetoresistive element can be accurately read without being affected by noise.

In addition, these first and second conductive layers,
Since an insulating layer having a sufficient film thickness can be interposed between the lower shield and the upper shield, the insulation characteristics between them can be improved. A decrease in yield due to insulation failure can be effectively suppressed.

Further, since the shield gap layer sandwiching the magnetoresistive layer can be made thin, the problem of thermal aspirity can be solved, and the performance of the magnetoresistive element can be improved.

Further, the first and second conductive layers described above are extended to the vicinity of the magnetoresistive element, and via a lead electrode film formed of a laminate for improving the operating characteristics of the magnetoresistive layer. In the embodiment that is connected to the magnetoresistive element, even if a lead electrode film having a relatively high resistance is used,
Since the length can be shortened, the overall resistance of the lead to the magnetoresistive element can be reduced.

Further, the magnetic layer constituting the upper pole is
When the tip surface is formed to recede from the air bearing surface, the problem of side light at the upper pole does not occur, the track width can be reduced, and the areal recording density can be improved.

As shown in the third embodiment, when the first-layer thin-film coil is formed so as to be accommodated in the recess, the height of the thin-film coil can be reduced, and The upper surface of the thin-film coil of the layer and the upper surface of the upper pole tip can be formed flat, so that the upper pole can be easily and accurately formed on this flat surface according to a desired pattern.

Further, when the thin-film coil is formed on a flat surface as described above, the coil winding can be miniaturized, and the area occupied by the coil with respect to the entire head can be reduced. As a result, the magnetic path length from the lower pole to the upper pole can be shortened, and the performance of the recording magnetic head can be improved.

[Brief description of the drawings]

FIGS. 1A and 1B are cross-sectional views showing the first step of a method of manufacturing a conventional composite type thin film magnetic head.

FIGS. 2A and 2B are cross-sectional views showing the next step.

FIGS. 3A and 3B are cross-sectional views showing the next step.

FIG. 4 is a plan view showing a state at that time.

FIGS. 5A and 5B are cross-sectional views showing the next step.

FIGS. 6A and 6B are cross-sectional views showing the next step.

FIGS. 7A and 7B are cross-sectional views showing the next step.

8A and 8B are cross-sectional views showing the next step.

FIG. 9 is a plan view showing the state at that time.

FIGS. 10A and 10B are cross-sectional views showing the next step.

FIG. 11 is a plan view showing contact pads connected to a magnetoresistive layer and a thin-film coil.

FIGS. 12A and 12B are sectional views showing the first step in the first embodiment of the method of manufacturing the composite thin film magnetic head according to the present invention.

13A and 13B are cross-sectional views showing the next step.

14A and 14B are cross-sectional views showing the next step.

FIG. 15 is a plan view showing the state at that time.

16A and 16B are cross-sectional views showing the next step.

17A and 17B are cross-sectional views showing the next step.

FIG. 18 is a plan view showing the state at that time.

FIGS. 19A and 19B are cross-sectional views showing the next step.

FIG. 20A and FIG. 20B are cross-sectional views showing the next step.

21A and 21B are cross-sectional views showing the next step.

FIG. 22 is a plan view showing the state at that time.

23A and 23B are cross-sectional views showing the next step.

FIGS. 24A and 24B are cross-sectional views showing the first step of the method of manufacturing the second embodiment of the thin-film magnetic head according to the present invention.

FIG. 25A and FIG. 25B are cross-sectional views showing the next step.

26A and 26B are cross-sectional views showing the next step.

FIG. 27A and FIG. 27B are cross-sectional views showing the next step.

FIG. 28A and FIG. 28B are cross-sectional views showing the next step.

29A and 29B are cross-sectional views showing the next step.

30A and 30B are cross-sectional views showing the next step.

FIGS. 31A and 31B are sectional views showing the first step of the method of manufacturing the third embodiment of the thin-film magnetic head according to the present invention.

FIGS. 32A and 32B are cross-sectional views showing the next step.

FIGS. 33A and 33B are cross-sectional views showing the next step.

34A and 34B are cross-sectional views showing the next step.

35A and 35B are cross-sectional views showing the next step.

36A and 36B are cross-sectional views showing the next step.

FIG. 37A and FIG. 37B are cross-sectional views showing the next step.

38A and 38B are cross-sectional views showing the next step.

39A and 39B are cross-sectional views showing the first step of the method of manufacturing the thin-film magnetic head according to the fourth embodiment of the present invention.

FIGS. 40A and 40B are cross-sectional views showing the next step.

41A and 41B are cross-sectional views showing the next step.

42A and 42B are cross-sectional views showing the next step.

43A and 43B are cross-sectional views showing the next step.

44A and 44B are cross-sectional views showing the next step.

FIGS. 45A and 45B are cross-sectional views showing the next step.

[Explanation of symbols]

21 base body, 22 insulating layer, 23 seed layer,
24 recess, 25 lower shield layer (first magnetic member), 26, insulating layer, 27a, 27b first and second conductive layers, 28 insulating layer, 29 lower shield gap layer, 30 GMR layer, 31a, 31b first And second extraction electrode layer, 32 upper shield gap layer, 33 lower pole (second magnetic member), 3
4 write gap layer, 35 insulating layer, 36 opening, 37 first layer thin film coil, 38 insulating layer,
39 second-layer thin-film coil, 40 insulating layer, 4
1 upper pole (third magnetic member), 42 overcoat layer, 51 insulating layer, 52 lower pole tip, 5
3 insulating layer, 54 insulating layer, 55 upper pole chip, 56 upper pole, 57 insulating layer, 58 magnetic layer, 59 upper pole, 61 shield gap layer, 62 insulating layer

Claims (21)

[Claims] 1. A composite type thin film magnetic head in which a magnetoresistive thin film magnetic head for reading and an inductive thin film magnetic head for writing are stacked and supported by a substrate, and a concave portion is formed on one surface. A first magnetic member having at least a first magnetic layer extending from an end surface forming an air bearing surface to a vicinity of an edge of the recess along the surface of the base; A magnetoresistive layer disposed on a surface of the first magnetic layer of the magnetic member opposite to the base, so as to be embedded in an insulating and nonmagnetic shield gap layer; and an inner surface of the concave portion Extends in an isolated state along
First and second conductive layers electrically connected to both ends of the magnetoresistive layer, respectively, and a first portion of the shield gap layer extending along a surface of the shield gap layer opposite to the base. A second magnetic member having a second portion extending inside or above the concave portion, and formed on a surface of at least the first portion of the second magnetic member opposite to the base. A write gap layer; and a magnetic pole portion formed on a surface of the write gap layer opposite to the base and magnetically coupled to the second portion of the second magnetic member at a portion far from the air bearing surface. A third magnetic member having a portion to be formed, and a portion sandwiched between the second magnetic member and the third magnetic member so as to overlap the concave portion when viewed from a direction perpendicular to the surface of the base. A formed thin-film coil; A composite type thin-film magnetic head comprising: 2. The device according to claim 1, wherein the first magnetic member has a second magnetic layer connected to the first magnetic layer and extending along an inner surface of the recess. Composite thin film magnetic head. 3. An end face of the second magnetic layer of the first magnetic member, the first and second conductive layers, and an insulating layer covering these conductive layers, which appears on the opening surface of the concave portion, is made the same flat surface,
Both ends of the magnetoresistive layer are respectively placed on the flat end faces of the first and second conductive layers, which appear at the opening face of the recess, respectively.
3. The composite type thin-film magnetic head according to claim 2, wherein the head is electrically connected via a second lead electrode. 4. An insulating layer covering the first and second conductive layers formed inside the concave portion on an opening surface of the concave portion.
Forming a second portion of the second magnetic member to be flat along the same flat surface of the shield gap layer and the insulating layer; 2. The structure according to claim 1, wherein the layer is formed on a flat surface of the second magnetic member opposite to the substrate, and the thin film coil is formed on a flat surface of the write gap layer opposite to the substrate. 4. The composite thin-film magnetic head according to any one of items 1 to 3, 5. A second portion of the second magnetic member is formed inside the recess along an inner surface thereof, and the second portion of the second magnetic member is provided on a side opposite to the base. 4. The composite thin-film magnetic head according to claim 1, wherein a first-layer thin-film coil of the thin-film coil is formed on the surface such that at least a part thereof is buried in the concave portion. 6. A flat surface of the first-layer thin-film coil on a side opposite to a base and a flat portion of the first-layer thin-film coil on a first portion of the second magnetic member. A first pole tip formed so as to be on the same plane as the first plane, and the write gap layer is formed on the same flat surface of the first layer thin-film coil and the first pole tip. 6. The composite thin-film magnetic head according to claim 5, wherein a second-layer thin-film coil is formed on a flat surface of the write gap layer opposite to the base. 7. A second pole tip, wherein the third magnetic member is formed on a flat surface of at least a portion of the write gap layer facing the first pole tip, opposite to a base, and 7. The composite thin-film magnetic head according to claim 6, further comprising a magnetic layer formed to be in contact with said second pole tip. 8. The composite thin-film magnetic head according to claim 7, wherein the tip surface of the magnetic layer of the third magnetic member is set back from the air bearing surface. 9. A composite thin-film magnetic head in which a magnetoresistive thin-film magnetic head for reading and an inductive thin-film magnetic head for writing are stacked and supported by a substrate, and an air bearing is provided on one surface. A first magnetic member formed along an inner surface of the concave portion and having a rising portion extending to an opening surface of the concave portion on the air bearing surface; A magnetic member, on the surface of the rising portion, a magnetoresistive layer disposed so as to be buried in an insulating and non-magnetic shield gap layer, and in a state of being insulated and separated along the inner surface of the concave portion. Extend,
First and second conductive layers electrically connected to both ends of the magnetoresistive layer, respectively, and a first portion of the shield gap layer extending along a surface of the shield gap layer opposite to the base. A second magnetic member having a second portion extending inside or above the concave portion, and formed on a surface of at least the first portion of the second magnetic member opposite to the base. A write gap layer; and a magnetic pole portion formed on a surface of the write gap layer opposite to the base and magnetically coupled to the second portion of the second magnetic member at a portion far from the air bearing surface. A third magnetic member having a portion to be formed; a thin film coil having a portion sandwiched between the second portion of the second magnetic member and the third magnetic member. Composite type thin film magnetic head. 10. The rising portion of the first magnetic member,
10. The composite thin-film magnetic head according to claim 9, wherein the composite thin-film magnetic head extends to an opening surface of the recess. 11. An end face of the first and second conductive layers and an insulating layer covering these conductive layers, which appears at an opening face of the concave portion, is flush with an end face of a rising portion of the first magnetic member, The two ends of the magnetoresistive layer are electrically connected to the flat end surfaces of the first and second conductive layers, respectively, which appear at the opening surfaces of the recesses, via the first and second lead electrodes, respectively. Item 11. The composite thin-film magnetic head according to Item 10. 12. The method according to claim 1, wherein the first portion is formed inside the concave portion.
And an insulating layer covering the second conductive layer is formed so as to have the same flat surface as the shield gap layer at the opening surface of the concave portion, and the second part of the second magnetic member is formed by the shield gap layer and the insulating layer. The write gap layer is formed on the flat surface of the second magnetic member on the side opposite to the substrate, and the thin film coil is formed on the same flat surface along the same flat surface of the layer. The composite thin-film magnetic head according to claim 9, wherein the composite thin-film magnetic head is formed on the opposite flat surface. 13. A second part of the second magnetic member,
A second portion of the second magnetic member is formed on the surface of the second magnetic member opposite to the base so as to be at least partially embedded in the recess. 12. The composite thin-film magnetic head according to claim 9, wherein a first-layer thin-film coil is formed. 14. A flat surface of the first layer thin film coil on a side opposite to the base and a flat portion of the first layer thin film coil on a first portion of the second magnetic member. A first pole tip formed so as to be flush with the first surface, and forming the write gap layer on the flat surfaces of the first layer thin film coil and the first pole tip; 14. The composite thin-film magnetic head according to claim 13, wherein a second-layer thin-film coil is formed on the flat surface of the write gap layer opposite to the base. 15. A second pole tip formed on a flat surface of at least a portion of the write gap layer facing the first pole tip opposite to the base, wherein the third magnetic member includes: 15. The composite thin-film magnetic head according to claim 14, further comprising a magnetic layer formed to be in contact with the second pole tip. 16. The composite thin-film magnetic head according to claim 15, wherein the tip surface of the magnetic layer of the third magnetic member is recessed from the air bearing surface. 17. A method for manufacturing a composite thin-film magnetic head in which a magnetoresistive thin-film magnetic head for reading and an inductive thin-film magnetic head for writing are laminated on a substrate, wherein the surface of the substrate is A first magnetic layer extending from at least an air bearing surface formed later to an edge of a concave portion formed on the surface, and a second magnetic layer extending on an inner surface of the concave portion. Forming a magnetic member; forming first and second conductive layers on the surface of the first magnetic member via a first insulating layer; and forming the first and second conductive layers on the surface of the first magnetic member. Forming a second insulating layer so as to cover and bury the concave portion, and forming a surface of the second insulating layer and a part of the first insulating layer and the first and second conductive layers, The surface of the first part of the first magnetic member and the second part End surface and the first insulating layer and the end faces of the first and second conductive layer portions,
Polishing the surface to be the same as the surface of the second insulating layer, and burying the insulating and non-magnetic shield gap layer on the surface of the first magnetic member appearing on the flat surface. Forming a magnetoresistive layer as described above, and connecting both ends of the magnetoresistive layer to the first and second
Forming a first and a second extraction electrode connected to the conductive layer, forming a second magnetic member on the shield gap layer, and forming a write gap layer on a surface of the second magnetic member. Forming a thin-film coil supported on the surface of the write gap layer in a state of being insulated and separated by an insulating material; and near the air bearing surface, the second layer through the write gap layer. Forming a third magnetic member that faces the magnetic member and covers the thin-film coil, and is magnetically connected to the second magnetic member at a position far from the air bearing surface. Of manufacturing a composite type thin film magnetic head. 18. The step of forming the first magnetic member, the step of forming the first magnetic layer having an opening corresponding to the concave portion on the surface of the base and acting as a mask for etching. Etching the first magnetic layer as a mask to form the concave portion on the surface of the base; and forming the second magnetic layer on the inner surface of the concave portion so as to be connected to the first magnetic layer. The method of manufacturing a composite type thin-film magnetic head according to claim 17, further comprising: forming. 19. A method of manufacturing a composite thin-film magnetic head in which a magnetoresistive thin-film magnetic head for reading and an inductive thin-film magnetic head for writing are laminated on a substrate, wherein a concave portion is formed on the surface of the substrate. Forming a first magnetic member so as to have a side wall extending along the inner surface of the concave portion and at least in a portion where the air bearing surface is to be formed later to the surface of the base; Forming a first and a second conductive layer along the inner surface of the recess via a first insulating layer so as to cover the first magnetic member; Forming a second insulating layer along the inner surface of the concave portion, and forming an end surface on a base surface of a side wall of the first magnetic member,
A magnetoresistive layer is formed so as to be buried in an insulating and nonmagnetic shield gap layer and to be connected to the first and second conductive layers at both ends via first and second extraction electrodes. Forming a second magnetic member on the shield gap layer; forming a write gap layer on the surface of the second magnetic member; insulating material on the surface of the write gap layer Forming a thin-film coil supported in a state in which the thin-film coil is insulated and separated by the air bearing in the vicinity of the air bearing surface while facing the second magnetic member via the write gap layer and covering the thin-film coil; Forming a third magnetic member magnetically coupled to the second magnetic member at a position remote from the surface; and the base, the first, second, and third magnetic units. Polishing the write gap layer so as to expose the side wall of the first magnetic member on which the magnetoresistive layer is formed, thereby forming an air bearing surface. A method for manufacturing a magnetic head. 20. The step of forming the second magnetic member, comprising: forming a first magnetic layer on the shield gap layer; and forming a lower pole tip on the first magnetic layer. 20. The method of manufacturing a composite thin film magnetic head according to claim 19, comprising the steps of: 21. A step of forming the third magnetic member, comprising: forming an upper pole tip on the shield gap layer; and forming a second magnetic layer on the upper pole tip. 21. The method according to claim 19, further comprising:
3. The method for manufacturing a composite thin film magnetic head according to item 1.