JP2000084481A - Method for producing inorganic film coated metal material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the subject method capable of thinly forming an inorg. film in a constant thickness. SOLUTION: A self-adhesive layer 2 is formed on the surface of a metal base material 1 by a self-adhesive being a liquid low in solid concn. and a powder material containing an inorg. powder is subsequently fixed on the surface of the self-adhesive layer to form a powder film layer and these layers are subsequently baked to remove an org. component to obtain the metal base material 1 coated with an inorg. film. The mean particle size of the inorg. material is 0.1-20 μm and the powder material pref. comprises the inorg. powder and a resin powder.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a metal material coated with an inorganic film, and more particularly to a method for producing a metal material coated with an inorganic film capable of making the thickness of an inorganic film thin and constant.

[0002] The metal material coated with an inorganic film obtained by the present invention is suitable as a rib material for a PDP (plasma display panel), a spacer or an insulating layer for an FED (field emission display), a dust filter, an electromagnetic wave filter, or the like. Things.

Hereinafter, the present invention will be described with reference to an example of a method for producing an inorganic film-coated metal material used for a rib material of a PDP.

[0004]

2. Description of the Related Art A PDP, which is one of the display devices characterized by a large screen, usually has a pair of substrates made of a low-strain-point glass such as transparent soda-lime glass or silicate glass or a ceramic such as alumina. A rib for forming a striped or lattice-shaped discharge space in an airtight space formed between the substrates and a conductor wiring for forming a discharge electrode for selectively discharging in a desired discharge space are provided. It is configured to comprise.

[0005] Among these components of the PDP, a rib is an inorganic film made of a paste material in which a predetermined amount of a filler made of ceramic particles such as alumina is mixed with glass constituting a substrate or glass having a softening point lower than that of ceramics. Often composed of This is because a high voltage is required to cause the phosphor formed on the surface of the rib to emit plasma, but a stable insulating property is required for the rib in order to eliminate power loss at that time. .

The rib is formed by forming an inorganic film having a predetermined pattern on at least one of the opposing surfaces of the pair of substrates by a thick film printing method, a sand blast method, or the like, and firing the inorganic film.

[0007] In the thick film printing method, it is repeated to form a screen by printing using a paste ink containing lead glass powder on the surface of a substrate disposed below the screen plate, and to dry the paste. Thus, an inorganic film having a predetermined pattern is formed to a predetermined thickness, and then fired to form a rib.

In the sand blasting method, an inorganic film having a predetermined thickness is entirely formed on one surface of a substrate.
A rib is formed by forming a resist film in a predetermined pattern, removing unnecessary portions by sandblasting according to the resist pattern, and baking.

[0009] In recent years, as the display of a PDP has become higher definition, a thinner rib width and a higher total pitch have been required.

Therefore, in the thick film printing method, a screen with a finer mesh is used in order to make the rib width narrower and the total pitch is more precise, and the viscosity is further increased in order to suppress the sag on the substrate surface. Higher paste materials tend to be used. However, this causes a problem that printing defects such as bleeding and chipping easily occur because the paste material acts in a direction that makes it difficult for the screen to pass through the screen. There is also a problem that the accuracy of the screen mesh is limited. In addition, 8 to 1
Since the ribs are formed by zero-time overprinting, it is difficult to ensure the accuracy of the film thickness and the rib width, and there is a problem that productivity is extremely poor.

Also, in the sandblasting method, as the rib width is reduced and the total pitch is made more precise, there is a problem that a defect in the resist film and a rib defect due to scattering of sandblast particles are more likely to occur. . In addition, this method has a problem that productivity is poor because it takes time to sandblast the entire surface of the substrate.
Further, this method has a problem that the utilization efficiency of the inorganic film is low and the material loss is large. In addition, there is also a problem that the production environment deteriorates because lead glass powder, which is a main component of the inorganic film, is scattered.

[0012]

2. Description of the Related Art As a method of solving the above-mentioned disadvantages of the thick film printing method and the sand blast method and increasing the productivity, an inorganic film is formed on a rib core material composed of a metal substrate to form a rib material. A method of bonding with a substrate has been considered. This is a coating method such as a spray coating method or a dip coating method.

[0013]

In order to secure a sufficient rib interval, it is necessary to form a protective film on the metal surface in a thickness of 5 to 20 μm and to form a highly resistant insulating film. However, it has been difficult to form the inorganic film thinly and uniformly by the coating method.

The present invention has been made in view of the above circumstances, and an object of the present invention is to manufacture an inorganic film-coated metal material capable of forming an inorganic film to have a small and constant thickness. It is to provide a method.

[0015]

Means for Solving the Problems The present invention has the following configuration to achieve the above object.

That is, according to the method for producing a metal material coated with an inorganic film of the present invention, a pressure-sensitive adhesive layer is formed on the surface of a metal substrate with a pressure-sensitive adhesive having a low solid content, and then a powder containing an inorganic powder is formed. The material was fixed on the surface of the pressure-sensitive adhesive layer to form a powder film layer, and then calcined to remove an organic component to obtain a metal substrate coated with an inorganic film.

In the above invention, the inorganic material may have a mean particle size of 0.1 to 20 μm.

Further, in the above invention, the powder material may be composed of an inorganic powder and a resin powder.

Further, in the above invention, the powder material may be constituted by wrapping an inorganic powder with an organic binder material.

Further, in the above-mentioned invention, the powder material may be composed of a material obtained by wrapping an inorganic powder with an organic binder material and a resin powder.

Further, in the above invention, the powder material may be configured to contain a coloring component.

In the above invention, the pressure-sensitive adhesive may be configured to contain a metal alkoxide.

In the above invention, the pressure-sensitive adhesive may have a solid content of 0.1 to 50% by weight.

In the above invention, the metal substrate may have a fine pattern of perforations.

Further, in the above invention, the metal substrate may be configured to be a rib core material of a plasma display panel.

In the above invention, the metal base material may be a spacer core material or an insulating layer core material of a field emission display.

Further, in the above invention, the metal substrate may be configured to be a core material of a dust filter.

Further, in the above invention, the metal base material may be configured to be the core material of the electromagnetic wave shielding filter.

[0029]

Embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view showing one embodiment of a method for producing a metal material coated with an inorganic film according to the present invention. FIG. 2 is a cross-sectional view showing one embodiment of an inorganic film-coated metal material obtained by the method for producing an inorganic film-coated metal material of the present invention. FIG. 3 is a plan view showing one embodiment of a mesh-like rib material obtained by the method for producing a metal material coated with an inorganic film of the present invention. FIG.
FIG. 4 is a partially enlarged cross-sectional view of FIG. 3.

In the figure, 1 is a metal substrate, 2 is an adhesive layer, 3 is a powder film layer, 4 is an inorganic film, 5 is a metal oxide layer, and 6 is a perforation.

The method for producing a metal material coated with an inorganic film of the present invention comprises:
The pressure-sensitive adhesive layer 2 is formed on the surface of the metal substrate 1 by the pressure-sensitive adhesive which is a liquid having a low solid content, and then a powder material containing an inorganic powder is fixed on the surface of the pressure-sensitive adhesive layer 2 to form a powder film layer 3. Is formed (see FIG. 1), followed by baking to remove organic components to obtain a metal substrate 1 covered with an inorganic film 4 (see FIG. 2).

Examples of the material of the metal substrate 1 used in the present invention include stainless steel, iron, nickel, chromium, molybdenum, magnesium, aluminum, copper, and alloy metals thereof. Among the metal substrates 1 of such a material, stainless steel, iron, nickel,
An alloy such as copper is a desirable material for a rib core material of a PDP because it is easy to form a pattern with high precision by etching. The metal substrate 1 may be a laminate of a substrate made of the metal or the alloy. Also,
The substrate may be ceramics or glass.

The thickness of the metal substrate depends on the height of the rib to be formed, but usually 50 to 150 μm is sufficient.

The form of the metal substrate 1 may be a plate. As the rib core material of the PDP, perforations 6 of a fine pattern obtained by processing a plate-shaped metal substrate 1 into a mesh shape or the like.
(See FIG. 3). The fine pattern according to the present invention means that the line width, the gap, and the like are 5 to 50.
This is a pattern including lines and gaps in a range of 0 μm, which is within a pattern accuracy range that can be processed by ordinary photoetching. As the type of fine pattern,
Besides a mesh, a stripe, a grid, and the like can be given.

An adhesive layer 2 is formed on the surface of the metal substrate 1 with an adhesive which is a liquid having a low solid content (see FIG. 1).

It is necessary to use an adhesive which is a liquid having a low solid content. The reason why the pressure-sensitive adhesive is a liquid having a low solid content concentration is that the solid content is desirably the minimum necessary amount since the organic component of the pressure-sensitive adhesive is removed by subsequent baking. In addition, by lowering the solid content concentration, the variation in the wet film thickness when the adhesive is applied becomes smaller when the solvent is dried, and the film thickness of the adhesive layer 2 can be made more uniform. In particular, the solid content concentration is 0.1.
It is preferably from 1 to 50% by weight. If the amount is less than 0.1% by weight, the adhesiveness for adhering the powder material is insufficient, and the holding amount of the powder material is reduced. Has low mechanical strength, and the inorganic film 4 is easily damaged by bending or rubbing. On the other hand, when the content exceeds 50% by weight, it takes a long time for sintering, and cracks, cavities, voids and the like are easily generated in the inorganic film 4. By changing the solid content concentration within the above range, the thickness of the powder film layer 3 can be controlled.
For the above reasons, the solid content concentration of the pressure-sensitive adhesive is preferably in the above range, but more preferably 0.1 to 20% by weight.

As described above, by using a liquid having a low solid content as an adhesive, an inorganic film 4 excellent in uniformity and sinterability can be obtained. As the material of the adhesive, an acrylic resin, a vinyl resin, a urethane resin, an epoxy resin, a rubber-based resin, a xylene resin, a polyvinyl alcohol resin, or the like, or a mixture thereof having a melting point lower than room temperature can be used. In particular, when the pressure-sensitive adhesive contains a metal alkoxide, the metal oxide layer 5 can be formed by a subsequent baking step, and the reliability of the insulating properties of the inorganic film 4 can be improved, and The metal oxide film layer also functions as a protective film for the metal substrate 1. The method of forming the pressure-sensitive adhesive layer 2 includes spraying, dipping, roll coating, screen printing, letterpress printing, gravure offset, ultrasonic atomization, ball leveling, roller leveling, and electrodeposition. And the like.

Next, a powder material containing an inorganic powder is fixed to the surface of the pressure-sensitive adhesive layer 2 to form a powder film layer 3 (FIG. 1).
reference).

The powder material contains an inorganic powder. As the inorganic powder, specifically, lead oxide / silicate glass, lead oxide / borosilicate glass, zinc oxide / lead oxide / borate glass,
Examples include zinc oxide, lead oxide, and borosilicate glass.

The average particle size of the inorganic powder is 0.1 μm to 20 μm.
μm. If the thickness is less than 0.1 μm, powder agglomeration occurs and it is difficult to obtain a uniform film, or it is difficult to obtain a sufficient film thickness. On the other hand, if it exceeds 20 μm, it is difficult to obtain a uniform film, or the film lacks in denseness.

The powder material may be an inorganic powder alone, or may be an inorganic powder and a resin powder. In the latter case, by melting and solidifying the resin powder, the generated inorganic film 4 is strengthened, and the risk of breakage is reduced, and the resin film is easy to handle. Also, temporary storage is easy. further,
The film thickness can be increased by re-coating. As the resin powder, an acrylic resin, a vinyl resin, a urethane resin, an epoxy resin, a polyvinyl alcohol resin, or the like can be used.

The powder material may be one obtained by wrapping an inorganic powder with an organic binder material. As the organic binder material, an acrylic resin, a vinyl resin, a urethane resin, an epoxy resin, a polyvinyl alcohol resin, or the like can be used. As a method of wrapping the inorganic powder with the organic binder material, there is a method of dissolving the binder, mixing the inorganic powder with the binder, drying, solidifying, and then pulverizing.
By using a material obtained by wrapping an inorganic powder with an organic binder material as the powder material, the voids of the inorganic film 4 can be reduced and the density can be increased. Further, the smoothness of the inorganic film 4 is also high.

Further, the powder material may be composed of an inorganic powder wrapped with an organic binder material and the resin powder.

The powder material may contain a coloring component. As the coloring component, a coloring agent composed of copper or chromium oxide or sulfide can be used. As a method for incorporating a coloring component, there are methods such as melt mixing and dry blending. By using a powder material containing a coloring component, the light reflectance on the surface of the inorganic film 4 can be reduced and the contrast of the display can be improved.

As a method of fixing the powder material to the surface of the metal substrate 1, there are a spraying method, a dipping method, a roll pressing method, a ball pressing method, a vibration method, an electrodeposition method and the like.

Next, the inorganic film 4 is fired to remove organic components.

The method of firing the inorganic film 4 may be in accordance with a normal firing method.
What is necessary is just to hold | maintain at 600 degreeC for about 10 minutes, and to bake under oxidizing atmosphere.

By this firing step, organic components in the pressure-sensitive adhesive layer 2 and the powder film layer 3 can be removed.

As described above, the inorganic film 4 can be easily formed on the surface of the metal substrate with a highly reliable film thickness accuracy.

As an embodiment of the present invention, PDP
Although described based on the method of manufacturing an inorganic film-coated metal material used for the rib material, the present invention is not limited to this, for example, FED spacers or insulating layers, dust filters and electromagnetic wave shield filters and the like Can be applied. The dust filter and the electromagnetic wave filter are usually formed of a metal substrate 1 having a grid pattern or a mesh pattern. Although the surface of the metal substrate 1 is easily corroded, the inorganic film 4 is useful because the corrosion resistance can be enhanced. In addition, when the surface is conductive, static electricity is generated and dust easily adheres, but it is useful because the inorganic film 4 can impart insulation. Further, as another embodiment of the present invention, the present invention can be applied to all cases where the formation of the inorganic film 4 is required, such as the case where the inorganic film 4 is formed for the purpose of decorating the surface of the metal substrate 1. is there.

[0052]

EXAMPLE As a metal substrate, a stainless steel plate having a thickness of 200 μm was prepared by length 100 μm, width 40 μm, and pitch 100 μm.
Using a rib core material processed into a mesh pattern of m
1) epoxy resin 1% by weight, ethyl alcohol 99
After applying the solution of a weight% by a spray method, it was dried at 50 ° C. for about 10 minutes to form an adhesive layer.

Next, the substrate is immersed in a powder material obtained by mixing lead oxide and borosilicate glass with an inorganic powder and an acrylic resin powder at a ratio of 5: 1. After being blown off, they were pressed and fixed by a rubber roll. Thereafter, the powder material that clogged the perforations of the mesh due to excessive adhesion was blown off by air.

Then, the mixture is baked at 500 ° C. for 10 minutes to remove the organic components of the pressure-sensitive adhesive layer and the powder film layer, and at the same time, melt the inorganic components of the powder film layer, and then gradually cool down. Thus, the inorganic component was solidified to form an inorganic film (see FIG. 4).

The inorganic film formed on the metal substrate in this way had a thickness of 10 ± 1 μm with good uniformity and was a strong film.

[0056]

The method for producing a metal material coated with an inorganic film according to the present invention employs the above-described structure, and thus has the following effects.

That is, since the adhesive is a liquid having a low solid content and the powder material is fixed by the adhesiveness of the pressure-sensitive adhesive layer, the fixed amount of the powder material can be controlled to be constant. As a result, a thin and uniform inorganic film can be obtained.

Further, only by forming the pressure-sensitive adhesive layer and the powder material layer on the surface of the metal base material and removing the organic components in the pressure-sensitive adhesive layer and the powder material layer by baking, the thickness of the inorganic film is thin and uniform. It is possible to easily obtain a metal material coated with an inorganic film.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a method for producing a metal material coated with an inorganic film of the present invention.

FIG. 2 is a cross-sectional view showing one embodiment of an inorganic film-coated metal material obtained by the method for producing an inorganic film-coated metal material of the present invention.

FIG. 3 is a plan view showing one embodiment of a mesh-like rib material obtained by the method for producing a metal material coated with an inorganic film of the present invention.

FIG. 4 is a partially enlarged cross-sectional view of FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal base material 2 Adhesive layer 3 Powder film layer 4 Inorganic film 5 Metal oxide layer 6 Perforation

 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 4D075 AE03 AE06 BB28Z DA06 DB02 DB04 DB13 DB14 DC19 EA02 EA05 EA35 EB01 EB57 4F100 AA00B AB01A AH00B AH06G AH08G AK01B AS00B BA02 CB00 DC11A DD32EEBEBEBH 182GBH

Claims (13)

[Claims] An adhesive layer is formed on the surface of a metal substrate with an adhesive which is a liquid having a low solid content, and then a powder material containing an inorganic powder is fixed to the surface of the adhesive layer to form a powder film. A method for producing a metal material coated with an inorganic film, comprising forming a layer and then baking to remove an organic component to obtain a metal substrate coated with an inorganic film. 2. The inorganic material has an average particle size of 0.1 μm to 20 μm.
The method for producing a metal material coated with an inorganic film according to claim 1, wherein the thickness is μm. 3. The method according to claim 1, wherein the powder material comprises an inorganic powder and a resin powder. 4. The method for producing a metal material coated with an inorganic film according to claim 1, wherein the powder material is obtained by wrapping an inorganic powder with an organic binder material. 5. The method for producing a metal material coated with an inorganic film according to claim 1, wherein the powder material comprises an inorganic powder wrapped with an organic binder material and a resin powder. 6. The powder material according to claim 1, wherein the powder material contains a coloring component.
6. The method for producing a metal material coated with an inorganic film according to any one of items 1 to 5. 7. The method for producing a metal material coated with an inorganic film according to claim 1, wherein the pressure-sensitive adhesive contains a metal alkoxide. 8. The method for producing a metal material coated with an inorganic film according to claim 1, wherein the solid content of the pressure-sensitive adhesive is 0.1 to 50% by weight. 9. The method for producing a metal material coated with an inorganic film according to claim 1, wherein the metal substrate has perforations in a fine pattern. 10. The method for producing a metal material coated with an inorganic film according to claim 1, wherein the metal substrate is a rib core material of a plasma display panel. 11. The method for producing a metal material coated with an inorganic film according to claim 1, wherein the metal substrate is a spacer core material or an insulating layer core material of a field emission display. 12. The method for producing a metal material coated with an inorganic film according to claim 1, wherein the metal substrate is a core material of a dust filter. 13. The method for producing a metal material coated with an inorganic film according to claim 1, wherein the metal substrate is a core material of an electromagnetic wave shielding filter.