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HK1185850A1 - 電子零件搬送裝置及包帶單元 - Google Patents

電子零件搬送裝置及包帶單元

Info

Publication number
HK1185850A1
HK1185850A1 HK13113419.1A HK13113419A HK1185850A1 HK 1185850 A1 HK1185850 A1 HK 1185850A1 HK 13113419 A HK13113419 A HK 13113419A HK 1185850 A1 HK1185850 A1 HK 1185850A1
Authority
HK
Hong Kong
Prior art keywords
electronic component
transfer apparatus
component transfer
taping unit
taping
Prior art date
Application number
HK13113419.1A
Other languages
English (en)
Inventor
白石成
的場隆行
Original Assignee
上野精機株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上野精機株式會社 filed Critical 上野精機株式會社
Publication of HK1185850A1 publication Critical patent/HK1185850A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
HK13113419.1A 2011-02-09 2013-12-02 電子零件搬送裝置及包帶單元 HK1185850A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/000716 WO2012107956A1 (ja) 2011-02-09 2011-02-09 電子部品搬送装置及びテーピングユニット

Publications (1)

Publication Number Publication Date
HK1185850A1 true HK1185850A1 (zh) 2014-02-28

Family

ID=46638202

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13113419.1A HK1185850A1 (zh) 2011-02-09 2013-12-02 電子零件搬送裝置及包帶單元

Country Status (5)

Country Link
JP (1) JP5674060B2 (zh)
CN (1) CN103339031B (zh)
HK (1) HK1185850A1 (zh)
TW (1) TWI525732B (zh)
WO (1) WO2012107956A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014087485A1 (ja) * 2012-12-04 2014-06-12 上野精機株式会社 電子部品搬送装置及びテーピングユニット
WO2014112041A1 (ja) * 2013-01-15 2014-07-24 上野精機株式会社 姿勢補正装置、電子部品搬送装置、及び電子部品移載装置
TWI494576B (zh) * 2013-12-03 2015-08-01 Tohoku Seiki Ind Co Ltd IC processor
WO2015151276A1 (ja) * 2014-04-04 2015-10-08 上野精機株式会社 収容ユニット及び電子部品搬送装置
JP5835825B1 (ja) * 2014-11-19 2015-12-24 上野精機株式会社 キャリアテープ走行装置及び電子部品搬送装置
JP6816383B2 (ja) * 2016-05-26 2021-01-20 Tdk株式会社 電子部品の搬送方法、検査方法および製造方法
US11477928B2 (en) 2017-06-06 2022-10-18 Yamaha Hatsudoki Kabushiki Kaisha Component mounting device
TWI644837B (zh) * 2017-11-14 2018-12-21 陳子忠 Parallel method for packaging electronic components and coating adhesive on carrier tape and mechanism thereof
JP7016761B2 (ja) * 2018-04-11 2022-02-07 ワイエイシイガーター株式会社 テープ送り装置
JP7359594B2 (ja) * 2019-08-23 2023-10-11 太陽誘電株式会社 テーピング装置およびテーピング方法
CN111891792B (zh) * 2020-08-25 2022-05-13 重庆鼎佳绝缘材料有限公司 泡棉用异步贴片机

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5969939A (ja) * 1982-10-15 1984-04-20 Toshiba Corp ワイヤボンデイング方法およびその装置
JPH07263517A (ja) * 1994-03-24 1995-10-13 Hitachi Electron Eng Co Ltd Ｉｃソケットの位置決め装置
JP2000100858A (ja) * 1998-09-18 2000-04-07 Shibaura Mechatronics Corp 部品実装装置およびその装置における撮像オフセットの校正方法
JP2002347710A (ja) * 2001-05-28 2002-12-04 Yayoi Kk キャリアテープ及びその走行駆動装置
JP2003095211A (ja) * 2001-09-18 2003-04-03 Shin Etsu Polymer Co Ltd エンボスキャリアテープ、その製造方法及び製造装置
JP4202102B2 (ja) * 2002-12-03 2008-12-24 上野精機株式会社 半導体装置のテーピング装置
JP2004288715A (ja) * 2003-03-19 2004-10-14 Nec Machinery Corp ダイボンダ
JP2006244559A (ja) * 2005-03-01 2006-09-14 Ricoh Co Ltd プリントコイル基板の取り付け位置調整方法および、その装置
CN101267912B (zh) * 2005-08-04 2010-05-12 上野精机株式会社 电子零件制造装置及该装置的控制方法
JP4848160B2 (ja) * 2005-09-08 2011-12-28 株式会社 東京ウエルズ 外観検査装置
JP2007179389A (ja) * 2005-12-28 2007-07-12 Nikon Corp 撮影装置
JP5233009B2 (ja) * 2007-11-12 2013-07-10 日東工業株式会社 チップ装填手段
JP2009154889A (ja) * 2007-12-25 2009-07-16 Canon Machinery Inc 部品供給装置及びテーピング装置
JP2011011748A (ja) * 2009-06-30 2011-01-20 Tesetsuku:Kk テーピング装置

Also Published As

Publication number Publication date
CN103339031B (zh) 2016-01-20
JPWO2012107956A1 (ja) 2014-07-03
WO2012107956A1 (ja) 2012-08-16
TW201246425A (en) 2012-11-16
TWI525732B (zh) 2016-03-11
CN103339031A (zh) 2013-10-02
JP5674060B2 (ja) 2015-02-25

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200208