HK1043162B - 鍍銅材料、其製造方法及鍍銅的方法 - Google Patents

鍍銅材料、其製造方法及鍍銅的方法

Info

Publication number: HK1043162B
Authority: HK; Hong Kong
Prior art keywords: copper electroplating; manufacturing same; copper; electroplating; manufacturing
Prior art date: 2000-09-04

Application number

HK02104082.9A

Other languages

English (en)

Other versions

HK1043162A1 (en

Inventor

松木詩路士

秋山一則

Original Assignee

東亞合成株式會社

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-09-04

Filing date

2002-05-31

Publication date

2005-03-24

2000-09-04 Priority claimed from JP2000267018A external-priority patent/JP4033616B2/ja

2000-10-11 Priority claimed from JP2000310547A external-priority patent/JP3839653B2/ja

2002-05-31 Application filed by 東亞合成株式會社 filed Critical 東亞合成株式會社

2002-09-06 Publication of HK1043162A1 publication Critical patent/HK1043162A1/xx

2005-03-24 Publication of HK1043162B publication Critical patent/HK1043162B/zh

Classifications

- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G3/00—Compounds of copper
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G3/00—Compounds of copper
- C01G3/02—Oxides; Hydroxides
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Inorganic Chemistry (AREA)
Automation & Control Theory (AREA)
Electroplating And Plating Baths Therefor (AREA)
Electrolytic Production Of Metals (AREA)

HK02104082.9A 2000-09-04 2002-05-31 鍍銅材料、其製造方法及鍍銅的方法 HK1043162B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2000267018A JP4033616B2 (ja)	2000-09-04	2000-09-04	銅メッキ材料の製造方法
JP2000310547A JP3839653B2 (ja)	2000-10-11	2000-10-11	電解メッキ用塩基性炭酸銅の製造方法

Publications (2)

Publication Number	Publication Date
HK1043162A1 HK1043162A1 (en)	2002-09-06
HK1043162B true HK1043162B (zh)	2005-03-24

Family

ID=26599175

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
HK02104082.9A HK1043162B (zh)	2000-09-04	2002-05-31	鍍銅材料、其製造方法及鍍銅的方法

Country Status (6)

Country	Link
US (1)	US20020053518A1 (zh)
KR (2)	KR100539652B1 (zh)
CN (1)	CN1170010C (zh)
DE (1)	DE10143076B4 (zh)
HK (1)	HK1043162B (zh)
TW (1)	TW539652B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6723219B2 (en) *	2001-08-27	2004-04-20	Micron Technology, Inc.	Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewith
TWI267494B (en) *	2004-06-18	2006-12-01	Tsurumisoda Co Ltd	Copper plating material, and copper plating method
ATE502138T1 (de) *	2006-03-17	2011-04-15	Univ Bremen	Synthetische perlmutter, verfahren und vorrichtung zu ihrer herstellung
US8262894B2 (en)	2009-04-30	2012-09-11	Moses Lake Industries, Inc.	High speed copper plating bath
KR101313844B1 (ko)	2012-04-02	2013-10-01	(주)에이치에스켐텍	동폐액으로부터 동 도금 재료용 및 고품위 산화동을 제조하는 방법
CN103303961B (zh) *	2013-05-23	2014-12-17	东又悦（苏州）电子科技新材料有限公司	一种球状电镀级氧化铜粉的制备方法
CN103303960B (zh) *	2013-05-23	2014-12-31	东又悦（苏州）电子科技新材料有限公司	一种球状碱式碳酸铜粉的制备方法
JP6619718B2 (ja) *	2016-10-14	2019-12-11	株式会社荏原製作所	基板のめっきに使用される酸化銅粉体、該酸化銅粉体を用いて基板をめっきする方法、該酸化銅粉体を用いてめっき液を管理する方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3417629C1 (de) *	1984-05-12	1985-01-24	Th. Goldschmidt Ag, 4300 Essen	Verfahren zur Herstellung von basischem Kupfercarbonat
JPS6158816A (ja) *	1984-08-21	1986-03-26	Mitsujiro Konishi	亜酸化銅の製造方法
US4677234A (en) *	1985-02-04	1987-06-30	Union Carbide Corporation	Process for the preparation of ethylene glycol
CA2003039A1 (en) *	1988-11-22	1990-05-22	Richard E. Fernandez	Purification of saturated halocarbons
JP2753855B2 (ja) *	1989-04-27	1998-05-20	鶴見曹達株式会社	銅メッキ材料の製造方法
JPH0380116A (ja) *	1989-08-23	1991-04-04	Sumitomo Metal Mining Co Ltd	酸化第二銅粉末の製造方法
JPH0452296A (ja) *	1990-06-20	1992-02-20	Permelec Electrode Ltd	銅めっき方法
US5492681A (en) *	1993-03-22	1996-02-20	Hickson Corporation	Method for producing copper oxide
JP5072136B2 (ja) *	1998-07-24	2012-11-14	千代田化工建設株式会社	多孔性スピネル型複合酸化物の製造方法

2001
- 2001-08-29 TW TW090121323A patent/TW539652B/zh not_active IP Right Cessation
- 2001-09-03 KR KR10-2001-0053773A patent/KR100539652B1/ko active IP Right Grant
- 2001-09-03 DE DE10143076A patent/DE10143076B4/de not_active Expired - Lifetime
- 2001-09-04 CN CNB011324597A patent/CN1170010C/zh not_active Expired - Lifetime
- 2001-09-04 US US09/944,344 patent/US20020053518A1/en not_active Abandoned
2002
- 2002-05-31 HK HK02104082.9A patent/HK1043162B/zh not_active IP Right Cessation
2005
- 2005-08-26 KR KR1020050078530A patent/KR100683598B1/ko active IP Right Grant

Also Published As

Publication number	Publication date
DE10143076B4 (de)	2009-11-26
KR20020018963A (ko)	2002-03-09
HK1043162A1 (en)	2002-09-06
KR20050089783A (ko)	2005-09-08
DE10143076A1 (de)	2002-05-29
TW539652B (en)	2003-07-01
KR100539652B1 (ko)	2005-12-30
US20020053518A1 (en)	2002-05-09
CN1170010C (zh)	2004-10-06
KR100683598B1 (ko)	2007-02-16
CN1342787A (zh)	2002-04-03

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Legal Events

Date	Code	Title	Description
2021-09-17	PE	Patent expired	Effective date: 20210903