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GB9610170D0 - A heatsink and a method and an assembly for forming the same - Google Patents

A heatsink and a method and an assembly for forming the same

Info

Publication number
GB9610170D0
GB9610170D0 GBGB9610170.4A GB9610170A GB9610170D0 GB 9610170 D0 GB9610170 D0 GB 9610170D0 GB 9610170 A GB9610170 A GB 9610170A GB 9610170 D0 GB9610170 D0 GB 9610170D0
Authority
GB
United Kingdom
Prior art keywords
heatsink
assembly
forming
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9610170.4A
Other versions
GB2300975A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermalloy Ltd
Original Assignee
Redpoint Thermalloy Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Redpoint Thermalloy Ltd filed Critical Redpoint Thermalloy Ltd
Publication of GB9610170D0 publication Critical patent/GB9610170D0/en
Publication of GB2300975A publication Critical patent/GB2300975A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB9610170A 1995-05-16 1996-05-15 Heatsinks having fin members joined to a base Withdrawn GB2300975A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9509866.1A GB9509866D0 (en) 1995-05-16 1995-05-16 A heatsink and a method and an assembly for forming the same

Publications (2)

Publication Number Publication Date
GB9610170D0 true GB9610170D0 (en) 1996-07-24
GB2300975A GB2300975A (en) 1996-11-20

Family

ID=10774528

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB9509866.1A Pending GB9509866D0 (en) 1995-05-16 1995-05-16 A heatsink and a method and an assembly for forming the same
GB9610170A Withdrawn GB2300975A (en) 1995-05-16 1996-05-15 Heatsinks having fin members joined to a base

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB9509866.1A Pending GB9509866D0 (en) 1995-05-16 1995-05-16 A heatsink and a method and an assembly for forming the same

Country Status (6)

Country Link
EP (1) EP0826240A1 (en)
JP (1) JPH11505373A (en)
KR (1) KR19990014819A (en)
AU (1) AU5699496A (en)
GB (2) GB9509866D0 (en)
WO (1) WO1996036995A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19700432A1 (en) * 1997-01-10 1998-07-16 Swg Metallverarbeitung Und Mon Heat sink for electric and-or electronic component
GB2347206A (en) * 1998-12-18 2000-08-30 Alstom Uk Ltd Heatsink assembly
EP1328019A1 (en) * 2002-01-10 2003-07-16 Wen-Chen Wei Leaf piece structure for heat dissipater
DE102005007041A1 (en) * 2005-02-15 2006-08-17 Alcan Technology & Management Ag Heat sink for semiconductor devices or the like. Facilities and method for its preparation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2502472C2 (en) * 1975-01-22 1982-09-02 Siemens AG, 1000 Berlin und 8000 München Heat sink for thyristors
US4009752A (en) * 1975-02-24 1977-03-01 Honeywell Information Systems Inc. Warp-resistant heat sink
GB8700842D0 (en) * 1987-01-15 1987-02-18 Marston Palmer Ltd Heat sink
DE3703873A1 (en) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr HEAT SINK, ESPECIALLY FOR COOLING ELECTRONIC COMPONENTS
JP3122173B2 (en) * 1990-11-09 2001-01-09 株式会社東芝 Heatsink, heatsink, and method of manufacturing heatsink
US5311928A (en) * 1993-06-28 1994-05-17 Marton Louis L Heat dissipator

Also Published As

Publication number Publication date
JPH11505373A (en) 1999-05-18
GB2300975A (en) 1996-11-20
GB9509866D0 (en) 1995-07-12
AU5699496A (en) 1996-11-29
KR19990014819A (en) 1999-02-25
EP0826240A1 (en) 1998-03-04
WO1996036995A1 (en) 1996-11-21

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)