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GB9509863D0 - A heatsink and a method and an assembly for forming the same - Google Patents

A heatsink and a method and an assembly for forming the same

Info

Publication number
GB9509863D0
GB9509863D0 GBGB9509863.8A GB9509863A GB9509863D0 GB 9509863 D0 GB9509863 D0 GB 9509863D0 GB 9509863 A GB9509863 A GB 9509863A GB 9509863 D0 GB9509863 D0 GB 9509863D0
Authority
GB
United Kingdom
Prior art keywords
heatsink
assembly
forming
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB9509863.8A
Other versions
GB2300974A (en
GB2300974B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermalloy Ltd
Original Assignee
Redpoint Thermalloy Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Redpoint Thermalloy Ltd filed Critical Redpoint Thermalloy Ltd
Priority to GB9509863A priority Critical patent/GB2300974B/en
Publication of GB9509863D0 publication Critical patent/GB9509863D0/en
Priority to JP8534630A priority patent/JPH11505372A/en
Priority to CN96193944A priority patent/CN1184558A/en
Priority to AU57686/96A priority patent/AU5768696A/en
Priority to EP96914275A priority patent/EP0826239A1/en
Priority to KR1019970708162A priority patent/KR19990014818A/en
Priority to PCT/GB1996/001159 priority patent/WO1996036994A1/en
Publication of GB2300974A publication Critical patent/GB2300974A/en
Application granted granted Critical
Publication of GB2300974B publication Critical patent/GB2300974B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB9509863A 1995-05-16 1995-05-16 A heatsink and a method of forming the same Expired - Fee Related GB2300974B (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB9509863A GB2300974B (en) 1995-05-16 1995-05-16 A heatsink and a method of forming the same
JP8534630A JPH11505372A (en) 1995-05-16 1996-05-15 Heat sink and method and assembly for forming same
CN96193944A CN1184558A (en) 1995-05-16 1996-05-15 A heatsink and a method and an assembly for forming the same
AU57686/96A AU5768696A (en) 1995-05-16 1996-05-15 A heatsink and a method and an assembly for forming the same
EP96914275A EP0826239A1 (en) 1995-05-16 1996-05-15 A heatsink and a method and an assembly for forming the same
KR1019970708162A KR19990014818A (en) 1995-05-16 1996-05-15 Heat sink and assembly method
PCT/GB1996/001159 WO1996036994A1 (en) 1995-05-16 1996-05-15 A heatsink and a method and an assembly for forming the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9509863A GB2300974B (en) 1995-05-16 1995-05-16 A heatsink and a method of forming the same

Publications (3)

Publication Number Publication Date
GB9509863D0 true GB9509863D0 (en) 1995-07-12
GB2300974A GB2300974A (en) 1996-11-20
GB2300974B GB2300974B (en) 1999-12-29

Family

ID=10774526

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9509863A Expired - Fee Related GB2300974B (en) 1995-05-16 1995-05-16 A heatsink and a method of forming the same

Country Status (7)

Country Link
EP (1) EP0826239A1 (en)
JP (1) JPH11505372A (en)
KR (1) KR19990014818A (en)
CN (1) CN1184558A (en)
AU (1) AU5768696A (en)
GB (1) GB2300974B (en)
WO (1) WO1996036994A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990050155A (en) * 1997-12-16 1999-07-05 윤종용 Clip Heatsink
EP1328020A1 (en) * 2002-01-10 2003-07-16 Wen-Chen Wei Fin piece structure for heat dissipater
DE102009007612B4 (en) * 2008-02-07 2011-02-17 Optrex Europe Gmbh Heat sink for removing heat from electronic components and method for its production
CN102307456A (en) * 2011-08-31 2012-01-04 昆山锦泰电子器材有限公司 Vertical radiating fin with electronic component
JP6226446B2 (en) * 2012-10-09 2017-11-08 Ａｐｓジャパン株式会社 Heat sink manufacturing method
JP6939068B2 (en) * 2017-05-09 2021-09-22 三菱電機株式会社 How to manufacture heat sinks, lighting fixtures, and heat sinks
CN111589917B (en) * 2020-05-25 2021-03-26 深圳市维鼎精密五金有限公司 Fin structure and stamping processing equipment thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3536960A (en) * 1968-06-26 1970-10-27 Electric Regulator Corp Heat sink module
DE2502472C2 (en) * 1975-01-22 1982-09-02 Siemens AG, 1000 Berlin und 8000 München Heat sink for thyristors
US4009752A (en) * 1975-02-24 1977-03-01 Honeywell Information Systems Inc. Warp-resistant heat sink
US4729426A (en) * 1986-03-06 1988-03-08 Thermalloy Incorporated Bonded clip heat sink
GB8700842D0 (en) * 1987-01-15 1987-02-18 Marston Palmer Ltd Heat sink
DE3703873A1 (en) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr HEAT SINK, ESPECIALLY FOR COOLING ELECTRONIC COMPONENTS
JP3122173B2 (en) * 1990-11-09 2001-01-09 株式会社東芝 Heatsink, heatsink, and method of manufacturing heatsink
US5304735A (en) * 1992-02-14 1994-04-19 Aavid Engineering, Inc. Heat sink for an electronic pin grid array
EP0619605B1 (en) * 1993-04-05 1996-08-28 STMicroelectronics S.r.l. Combination of an electronic semiconductor device and a heat sink
JPH0750494A (en) * 1993-08-06 1995-02-21 Mitsubishi Electric Corp Cooling device

Also Published As

Publication number Publication date
KR19990014818A (en) 1999-02-25
CN1184558A (en) 1998-06-10
GB2300974A (en) 1996-11-20
GB2300974B (en) 1999-12-29
EP0826239A1 (en) 1998-03-04
AU5768696A (en) 1996-11-29
JPH11505372A (en) 1999-05-18
WO1996036994A1 (en) 1996-11-21

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20010516