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GB2421244B - Polishing composition - Google Patents

Polishing composition

Info

Publication number
GB2421244B
GB2421244B GB0523438A GB0523438A GB2421244B GB 2421244 B GB2421244 B GB 2421244B GB 0523438 A GB0523438 A GB 0523438A GB 0523438 A GB0523438 A GB 0523438A GB 2421244 B GB2421244 B GB 2421244B
Authority
GB
United Kingdom
Prior art keywords
polishing composition
polishing
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0523438A
Other versions
GB0523438D0 (en
GB2421244A (en
Inventor
Shigeo Fujii
Kenichi Suenaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Publication of GB0523438D0 publication Critical patent/GB0523438D0/en
Publication of GB2421244A publication Critical patent/GB2421244A/en
Application granted granted Critical
Publication of GB2421244B publication Critical patent/GB2421244B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
GB0523438A 2004-11-30 2005-11-17 Polishing composition Expired - Fee Related GB2421244B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004347212A JP4836441B2 (en) 2004-11-30 2004-11-30 Polishing liquid composition

Publications (3)

Publication Number Publication Date
GB0523438D0 GB0523438D0 (en) 2005-12-28
GB2421244A GB2421244A (en) 2006-06-21
GB2421244B true GB2421244B (en) 2009-03-18

Family

ID=35580228

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0523438A Expired - Fee Related GB2421244B (en) 2004-11-30 2005-11-17 Polishing composition

Country Status (6)

Country Link
US (2) US20060112647A1 (en)
JP (1) JP4836441B2 (en)
CN (1) CN1781971B (en)
GB (1) GB2421244B (en)
MY (1) MY144163A (en)
TW (1) TWI370844B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4577296B2 (en) * 2006-10-27 2010-11-10 富士電機デバイステクノロジー株式会社 Reproduction method of non-metallic substrate for magnetic recording medium
JP2009013046A (en) * 2007-06-05 2009-01-22 Asahi Glass Co Ltd Method of processing glass substrate
JP2008307676A (en) * 2007-06-18 2008-12-25 Kao Corp Polishing liquid composition for hard disk substrate
JP5063339B2 (en) * 2007-12-28 2012-10-31 花王株式会社 Polishing liquid composition for hard disk substrate, polishing method using the same, and manufacturing method of hard disk substrate
JP5576634B2 (en) * 2008-11-05 2014-08-20 山口精研工業株式会社 Abrasive composition and method for polishing magnetic disk substrate
JP5657247B2 (en) * 2009-12-25 2015-01-21 花王株式会社 Polishing liquid composition
JP5940278B2 (en) * 2010-10-27 2016-06-29 花王株式会社 Manufacturing method of glass hard disk substrate
JP5925454B2 (en) 2010-12-16 2016-05-25 花王株式会社 Polishing liquid composition for magnetic disk substrate
JP5979872B2 (en) * 2011-01-31 2016-08-31 花王株式会社 Manufacturing method of magnetic disk substrate
JP5134739B2 (en) 2011-02-23 2013-01-30 大日精化工業株式会社 Aqueous liquid composition, aqueous coating liquid, functional coating film, and composite material
JP5933950B2 (en) * 2011-09-30 2016-06-15 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド Etching solution for copper or copper alloy
CN104583333B (en) 2012-08-21 2017-06-16 大日精化工业株式会社 Aqueous fluid composition, aqueous coating liquid, functional-coated film and composite
US20150251293A1 (en) * 2012-10-03 2015-09-10 Fujimi Incorporated Polishing method and method for producing alloy material
WO2016043288A1 (en) * 2014-09-17 2016-03-24 Hoya株式会社 Method for manufacturing magnetic disk substrate
JP6659449B2 (en) * 2016-05-09 2020-03-04 山口精研工業株式会社 Abrasive composition for electroless nickel-phosphorus plated aluminum magnetic disk substrate
JP6734146B2 (en) * 2016-08-23 2020-08-05 山口精研工業株式会社 Abrasive composition for magnetic disk substrate
CN108148507B (en) * 2017-12-18 2020-12-04 清华大学 Polishing composition for fused quartz
JP2021137931A (en) * 2020-03-06 2021-09-16 株式会社フジミインコーポレーテッド Alumina slurry, slurry for wet blast process using the same, and process method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001012740A1 (en) * 1999-08-13 2001-02-22 Cabot Microelectronics Corporation Polishing system and method of its use
EP1085067A1 (en) * 1999-09-20 2001-03-21 Fujimi Incorporated Polishing composition and polishing process
EP1209731A1 (en) * 2000-11-24 2002-05-29 Fujimi Incorporated Polishing composition and polishing method employing it
JP2004311484A (en) * 2003-04-02 2004-11-04 Sumitomo Bakelite Co Ltd Abrasive composition

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4639394A (en) * 1985-04-01 1987-01-27 Ppg Industries, Inc. Non-aqueous dispersions prepared with styrene polymer dispersion stabilizers
US5209816A (en) * 1992-06-04 1993-05-11 Micron Technology, Inc. Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing
US5350788A (en) * 1993-03-11 1994-09-27 E. I. Du Pont De Nemours And Company Method for reducing odors in recycled plastics and compositions relating thereto
US5391258A (en) * 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
US5362784A (en) * 1993-05-28 1994-11-08 E. I. Du Pont De Nemours And Company Aldehyde scavenging compositions and methods relating thereto
US6855266B1 (en) * 1999-08-13 2005-02-15 Cabot Microelectronics Corporation Polishing system with stopping compound and method of its use
JP3575750B2 (en) * 2000-05-12 2004-10-13 花王株式会社 Polishing liquid composition
JP3768401B2 (en) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 Chemical mechanical polishing slurry
US7323416B2 (en) * 2001-03-14 2008-01-29 Applied Materials, Inc. Method and composition for polishing a substrate
US6776810B1 (en) * 2002-02-11 2004-08-17 Cabot Microelectronics Corporation Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
US6755721B2 (en) * 2002-02-22 2004-06-29 Saint-Gobain Ceramics And Plastics, Inc. Chemical mechanical polishing of nickel phosphorous alloys
JP2003347247A (en) * 2002-05-28 2003-12-05 Hitachi Chem Co Ltd Cmp polishing agent for semiconductor insulating film and method of polishing substrate
GB2393186B (en) * 2002-07-31 2006-02-22 Kao Corp Polishing composition
JP3875155B2 (en) * 2002-07-31 2007-01-31 花王株式会社 Roll-off reducing agent
JP4446371B2 (en) * 2002-08-30 2010-04-07 花王株式会社 Polishing liquid composition
GB2393447B (en) * 2002-08-07 2006-04-19 Kao Corp Polishing composition
JP2004193495A (en) * 2002-12-13 2004-07-08 Toshiba Corp Cmp slurry, and method of producing semiconductor device using same
JPWO2004100242A1 (en) * 2003-05-09 2006-07-13 三洋化成工業株式会社 Polishing liquid and polishing method for CMP process
JP2004335978A (en) * 2003-05-12 2004-11-25 Jsr Corp Chemical mechanical polishing method
US7247566B2 (en) * 2003-10-23 2007-07-24 Dupont Air Products Nanomaterials Llc CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001012740A1 (en) * 1999-08-13 2001-02-22 Cabot Microelectronics Corporation Polishing system and method of its use
EP1085067A1 (en) * 1999-09-20 2001-03-21 Fujimi Incorporated Polishing composition and polishing process
EP1209731A1 (en) * 2000-11-24 2002-05-29 Fujimi Incorporated Polishing composition and polishing method employing it
JP2004311484A (en) * 2003-04-02 2004-11-04 Sumitomo Bakelite Co Ltd Abrasive composition

Also Published As

Publication number Publication date
CN1781971A (en) 2006-06-07
US20080280538A1 (en) 2008-11-13
MY144163A (en) 2011-08-15
JP2006150534A (en) 2006-06-15
GB0523438D0 (en) 2005-12-28
TWI370844B (en) 2012-08-21
JP4836441B2 (en) 2011-12-14
US20060112647A1 (en) 2006-06-01
TW200621967A (en) 2006-07-01
CN1781971B (en) 2010-05-05
GB2421244A (en) 2006-06-21

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20161117