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GB2397172A - A shadow-creating apparatus - Google Patents

A shadow-creating apparatus Download PDF

Info

Publication number
GB2397172A
GB2397172A GB0407477A GB0407477A GB2397172A GB 2397172 A GB2397172 A GB 2397172A GB 0407477 A GB0407477 A GB 0407477A GB 0407477 A GB0407477 A GB 0407477A GB 2397172 A GB2397172 A GB 2397172A
Authority
GB
United Kingdom
Prior art keywords
chip
shadow
side walls
spaced
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0407477A
Other versions
GB0407477D0 (en
GB2397172B (en
Inventor
Malcolm V Hawkes
Jon Stuart Wright
Robert S Burgoyne
Jeffrey L Fish
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of GB0407477D0 publication Critical patent/GB0407477D0/en
Publication of GB2397172A publication Critical patent/GB2397172A/en
Application granted granted Critical
Publication of GB2397172B publication Critical patent/GB2397172B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements

Landscapes

  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

An apparatus (12) or accurately locating a micro-electronic chip (9) in a chip-holding cavity (28) for visual testing, the chip (9) having at least a front wall and a pair of opposed, spaced-apart side walls, wherein the front wall meets with each of the side walls to form opposed, spaced-apart first and second front edges, comprising a cavity side wall formed to juxtapositionally about at least one of the side walls of the chip, the cavity side wall having formed therein a depression creating a shadow projecting forward from the depression, wherein the first front edge of the chip (9) forms a border of the shadow to form an objectively measurable contrast in grayness between the shadow and the chip (9).

Description

GB 2397172 A continuation (74) Agent and/or Address for Service: Forrester
Ketley & Co Forrester House, 52 Bounds Green Road, LONDON, N11 2EY, United Kingdom
GB0407477A 2001-11-27 2002-11-14 A shadow-creating apparatus Expired - Fee Related GB2397172B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33369001P 2001-11-27 2001-11-27
PCT/US2002/036619 WO2003046510A2 (en) 2001-11-27 2002-11-14 A shadow-creating apparatus

Publications (3)

Publication Number Publication Date
GB0407477D0 GB0407477D0 (en) 2004-05-05
GB2397172A true GB2397172A (en) 2004-07-14
GB2397172B GB2397172B (en) 2005-05-11

Family

ID=23303855

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0407477A Expired - Fee Related GB2397172B (en) 2001-11-27 2002-11-14 A shadow-creating apparatus

Country Status (8)

Country Link
JP (1) JP2005523424A (en)
KR (1) KR20040062572A (en)
CN (1) CN1328775C (en)
AU (1) AU2002346400A1 (en)
DE (1) DE10297486T5 (en)
GB (1) GB2397172B (en)
TW (1) TW577163B (en)
WO (1) WO2003046510A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016190021A1 (en) * 2015-05-26 2016-12-01 住友化学株式会社 Cleanroom for polarizing plate production
CN110379784B (en) * 2019-07-23 2021-05-07 深圳市优一达电子有限公司 Semiconductor packaging structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4312117A (en) * 1977-09-01 1982-01-26 Raytheon Company Integrated test and assembly device
US5088190A (en) * 1990-08-30 1992-02-18 Texas Instruments Incorporated Method of forming an apparatus for burn in testing of integrated circuit chip
US5123850A (en) * 1990-04-06 1992-06-23 Texas Instruments Incorporated Non-destructive burn-in test socket for integrated circuit die
US5543725A (en) * 1993-08-25 1996-08-06 Sunright Limited Reusable carrier for burn-in/testing on non packaged die

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680602B2 (en) * 1987-11-28 1994-10-12 株式会社村田製作所 Electronic component chip holding jig and electronic component chip handling method
US5673799A (en) * 1995-06-05 1997-10-07 Chip Star Inc. Machine for testing and sorting capacitor chips and method of operating same
KR100766095B1 (en) * 1997-06-12 2007-10-11 가부시키가이샤 니콘 Substrate for device manufacturing, process for manufacturing the substrate, and method of exposure using the substrate
GB2349205B (en) * 1999-04-19 2003-12-31 Applied Materials Inc Method and apparatus for detecting that two moveable members are correctly positioned relatively to one another
US6294747B1 (en) * 1999-06-02 2001-09-25 Electro Scientific Industries, Inc. Inspection machine for surface mount passive component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4312117A (en) * 1977-09-01 1982-01-26 Raytheon Company Integrated test and assembly device
US5123850A (en) * 1990-04-06 1992-06-23 Texas Instruments Incorporated Non-destructive burn-in test socket for integrated circuit die
US5088190A (en) * 1990-08-30 1992-02-18 Texas Instruments Incorporated Method of forming an apparatus for burn in testing of integrated circuit chip
US5543725A (en) * 1993-08-25 1996-08-06 Sunright Limited Reusable carrier for burn-in/testing on non packaged die

Also Published As

Publication number Publication date
CN1575513A (en) 2005-02-02
KR20040062572A (en) 2004-07-07
DE10297486T5 (en) 2004-12-02
CN1328775C (en) 2007-07-25
GB0407477D0 (en) 2004-05-05
AU2002346400A8 (en) 2003-06-10
AU2002346400A1 (en) 2003-06-10
WO2003046510B1 (en) 2004-04-29
TW200301008A (en) 2003-06-16
WO2003046510A3 (en) 2003-11-27
GB2397172B (en) 2005-05-11
WO2003046510A2 (en) 2003-06-05
JP2005523424A (en) 2005-08-04
WO2003046510A9 (en) 2004-03-25
TW577163B (en) 2004-02-21

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20071114