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GB2345453B - Laminated reflow soldering - Google Patents

Laminated reflow soldering

Info

Publication number
GB2345453B
GB2345453B GB9921517A GB9921517A GB2345453B GB 2345453 B GB2345453 B GB 2345453B GB 9921517 A GB9921517 A GB 9921517A GB 9921517 A GB9921517 A GB 9921517A GB 2345453 B GB2345453 B GB 2345453B
Authority
GB
United Kingdom
Prior art keywords
laminated
reflow soldering
reflow
soldering
laminated reflow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9921517A
Other versions
GB9921517D0 (en
GB2345453A (en
Inventor
Lee John Robinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB9921517A priority Critical patent/GB2345453B/en
Publication of GB9921517D0 publication Critical patent/GB9921517D0/en
Priority to PCT/GB2000/002029 priority patent/WO2001020957A1/en
Priority to AU49387/00A priority patent/AU4938700A/en
Publication of GB2345453A publication Critical patent/GB2345453A/en
Application granted granted Critical
Publication of GB2345453B publication Critical patent/GB2345453B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/053—Heating appliances electric using resistance wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0004—Resistance soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB9921517A 1999-09-14 1999-09-14 Laminated reflow soldering Expired - Fee Related GB2345453B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB9921517A GB2345453B (en) 1999-09-14 1999-09-14 Laminated reflow soldering
PCT/GB2000/002029 WO2001020957A1 (en) 1999-09-14 2000-05-26 Laminated reflow soldering
AU49387/00A AU4938700A (en) 1999-09-14 2000-05-26 Laminated reflow soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9921517A GB2345453B (en) 1999-09-14 1999-09-14 Laminated reflow soldering

Publications (3)

Publication Number Publication Date
GB9921517D0 GB9921517D0 (en) 1999-11-17
GB2345453A GB2345453A (en) 2000-07-12
GB2345453B true GB2345453B (en) 2000-12-27

Family

ID=10860756

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9921517A Expired - Fee Related GB2345453B (en) 1999-09-14 1999-09-14 Laminated reflow soldering

Country Status (3)

Country Link
AU (1) AU4938700A (en)
GB (1) GB2345453B (en)
WO (1) WO2001020957A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6911624B2 (en) * 2002-08-23 2005-06-28 Micron Technology, Inc. Component installation, removal, and replacement apparatus and method
US8462462B1 (en) 2011-10-20 2013-06-11 Western Digital (Fremont), Llc Localized heating for flip chip bonding
CN104028869A (en) * 2014-06-30 2014-09-10 哈尔滨工业大学 Welding method for inter-board connection in board level stereoscopic packaging through resistance heat
US11683890B2 (en) * 2018-12-20 2023-06-20 Intel Corporation Reflow grid array to support late attach of components

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5394609A (en) * 1993-10-26 1995-03-07 International Business Machines, Corporation Method and apparatus for manufacture of printed circuit cards
GB2329073A (en) * 1997-09-03 1999-03-10 Motorola Israel Ltd Multi-layer circuit board with layers acting as a "heat capacitor"

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01239897A (en) * 1988-03-22 1989-09-25 Hitachi Denshi Ltd Printed board for surface-mount parts
JPH01305592A (en) * 1988-06-02 1989-12-08 Nec Corp Multilayer printed wiring board
FR2638050B1 (en) * 1988-10-18 1996-03-01 Thomson Hybrides COMPONENT TRANSFER DEVICE ON A HYBRID CIRCUIT
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
JPH0494590A (en) * 1990-08-10 1992-03-26 Toshiba Corp Soldering method for electronic component
JPH07162106A (en) * 1993-12-10 1995-06-23 Hitachi Ltd Wiring board
GB9508631D0 (en) * 1995-04-28 1995-06-14 Smiths Industries Ltd Electrical circuits
DE19542165A1 (en) * 1995-11-11 1997-05-15 Wuerth Elektronik Gmbh & Co Kg Electrical flexible circuit board
FI965301A (en) * 1996-12-31 1998-07-01 Nokia Telecommunications Oy Procedure and arrangement for heating a component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5394609A (en) * 1993-10-26 1995-03-07 International Business Machines, Corporation Method and apparatus for manufacture of printed circuit cards
GB2329073A (en) * 1997-09-03 1999-03-10 Motorola Israel Ltd Multi-layer circuit board with layers acting as a "heat capacitor"

Also Published As

Publication number Publication date
WO2001020957A1 (en) 2001-03-22
AU4938700A (en) 2001-04-17
GB9921517D0 (en) 1999-11-17
GB2345453A (en) 2000-07-12

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20030914