GB2229041A - Electrical circuit heat sink - Google Patents
Electrical circuit heat sink Download PDFInfo
- Publication number
- GB2229041A GB2229041A GB8902067A GB8902067A GB2229041A GB 2229041 A GB2229041 A GB 2229041A GB 8902067 A GB8902067 A GB 8902067A GB 8902067 A GB8902067 A GB 8902067A GB 2229041 A GB2229041 A GB 2229041A
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat sink
- electrical circuit
- heat
- metal oxide
- ambient air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A metal oxide-filled fluid resin which cures on exposure to ambient air, for example an RTV (room temperature vulcanisable) silicone elastomer, is used to form a heat transfer layer electrical circuit heat sink material. The resin may be applied to preformed heat sink material by screen printing.
Description
ELECTR1(## CIRaJIT HEAT SINK The invention relates to the provision of heat transfer material for transferring heat between a heat generating electrical circuit cocconent and a heat sink.
Presently available thermally conductive materials include thermally conductive grease (thermopath) and insulating silicone rubber pads (flexipads), which are supplied as a separate component for sandwiching between the heat-generating oamponent and the preformed heat sink on assembly of the circuit.
The invention allows the supply of heat sinks preformed with a layer of heat transfer material, ready for direct placement of the heat generating component. The invention resides in the use of a metal oxide filled fluid resin that may be applied to the surface of the heat sink material and which will cure on exposure to ambient air, thus bonding to the surface of the material.
The resin should preferably be applied in a uniform layer. It has been found that this may be achieved by printing. Screen printing is a particularly preferred process.
The curable resin composition may be applied to a blank of heat sink material which may then be formed, if necessary, into a required shape. Usually a sheet of heat sink material sufficient to make several blanks will have the curable resin composition applied where appropriate and will then be formed into separate heat sinks. The heat sink material could for example be aluminium, which can be anodized without disturbing the layer of heat transfer material.
The curable resin oamposition could be applied directly to a preshaped heat sink. Another possibility is to apply the curable resin composition to areas of exposed copper on circuit boards, such areas being specifically left exposed for use as heat sinks. In this case, there is no need for an additional heat sink component.
The curable resin composition may be applied over the entire heat sink surface or in a desired shape or shapes to fit the heat generating cocconent(s). The areas of heat sink coated with the resin may be varied on demand.
Particularly useful curable resins for use in the invention are so-called room temperature vulcanisable (RTV) materials, in particular RTV silicone elastomers. Elastomeric or similar heat transfer layers can give good thermal contact with the heat sink material. At least some of the metal oxide filled materials are novel in themselves.
The optimum properties of the layer will vary according to the precise context. For example, the thermal conductivity of the heat transfer medium may be between 5 and 15 n##/cm0C, and the dielectric strength around 18 kV/m.
The thermal conductivity of the cured resin oomposition is governed inter alia by the amount of metal oxide filler.
An increase in the metal oxide concentration will increase the thermal conductivity, but depending on the metal oxide, may be to the detriment of the electrical insulating properties.
The viscosity of the curable resin oomposition is also dependent on the level of filler. For screen printing, it is preferred that the viscosity falls between 50 and 500 cyst.
It is necessary to avoid curing the curable materials during application. The eapplication may be done under a blanket of nitrogen, or other shield gas, to prevent premature curing.
There are several aspects to this invention. Invention resides not only in the use of curable resin compositions for making heat sinks preformed with a layer of heat transfer material, but also in the finished coccosite heat sinks, the resin-coated blanks for making them, the resin-coated sheet material for forming the blanks, and in circuit boards with the resin cepposition applied to exposed copper areas.
Furthermore, invention resides in the methods for making these products and intermediates, and in the novel metal oxide filled compositions per se.
Claims (6)
1. The use of a metal oxide-filled fluid resin, which cures on exposure to ambient air, to preform a heat transfer layer on electrical circuit heat sink material.
2. A heat sink for dissipating heat from a heat generating electrical circuit component, the heat sink being preformed with a heat transfer component thereon by forming and curing on the heat sink material surface a layer of ambient air-curable metal oxide-filled fluid resin.
3. A method of preforming an electrical circuit heat sink combined with a heat transfer component thereon, the method comprising forming and curing on the heat sink material surface a layer of ambient air-curable metal oxide-filled fluid resin.
4. A method according to claim 3 wherein said layer is formed by screen printing.
5. A method according to claim 3 or 4 wherein the resin is an RTV silicone elastomer.
6. A metal oxide-filled fluid resin which is curable in ambient air to form a heat transfer medium for an electrical circuit heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8902067A GB2229041A (en) | 1989-01-31 | 1989-01-31 | Electrical circuit heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8902067A GB2229041A (en) | 1989-01-31 | 1989-01-31 | Electrical circuit heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB8902067D0 GB8902067D0 (en) | 1989-03-22 |
| GB2229041A true GB2229041A (en) | 1990-09-12 |
Family
ID=10650866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8902067A Withdrawn GB2229041A (en) | 1989-01-31 | 1989-01-31 | Electrical circuit heat sink |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2229041A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0986292A2 (en) * | 1998-09-09 | 2000-03-15 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Thermal transfer mat for electrical or electronic apparatuses |
| DE19905869C1 (en) * | 1999-02-12 | 2000-10-26 | Peters Research Gmbh & Co Kg | Binder-containing composition for the coating of printed circuit boards, use as printed circuit boards and manufacturing method |
| EP1094516A2 (en) * | 1999-10-20 | 2001-04-25 | Fuji Polymer Industries Co,, Ltd. | Thermally conductive composition and method of forming thermally conductive film with use of same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1293730A (en) * | 1970-07-09 | 1972-10-25 | Dow Corning | High filler content silicone elastomer with increased extrusion rate |
| GB1296302A (en) * | 1970-07-09 | 1972-11-15 | ||
| GB2026767A (en) * | 1978-07-10 | 1980-02-06 | Optical Coating Laboratory Inc | Concentrator solar cell array module |
| EP0065686A2 (en) * | 1981-05-21 | 1982-12-01 | General Electric Company | Power device module |
| EP0146255A2 (en) * | 1983-12-07 | 1985-06-26 | The Harshaw Chemical Company | Formable light-reflective compositions |
-
1989
- 1989-01-31 GB GB8902067A patent/GB2229041A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1293730A (en) * | 1970-07-09 | 1972-10-25 | Dow Corning | High filler content silicone elastomer with increased extrusion rate |
| GB1296302A (en) * | 1970-07-09 | 1972-11-15 | ||
| GB2026767A (en) * | 1978-07-10 | 1980-02-06 | Optical Coating Laboratory Inc | Concentrator solar cell array module |
| EP0065686A2 (en) * | 1981-05-21 | 1982-12-01 | General Electric Company | Power device module |
| EP0146255A2 (en) * | 1983-12-07 | 1985-06-26 | The Harshaw Chemical Company | Formable light-reflective compositions |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0986292A2 (en) * | 1998-09-09 | 2000-03-15 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Thermal transfer mat for electrical or electronic apparatuses |
| EP0986292A3 (en) * | 1998-09-09 | 2000-12-20 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Thermal transfer mat for electrical or electronic apparatuses |
| DE19905869C1 (en) * | 1999-02-12 | 2000-10-26 | Peters Research Gmbh & Co Kg | Binder-containing composition for the coating of printed circuit boards, use as printed circuit boards and manufacturing method |
| EP1028608A3 (en) * | 1999-02-12 | 2003-08-27 | Peters Research GmbH + Co. KG | Process and coating composition for applying heat-sink paste to circuit boards |
| EP1094516A2 (en) * | 1999-10-20 | 2001-04-25 | Fuji Polymer Industries Co,, Ltd. | Thermally conductive composition and method of forming thermally conductive film with use of same |
| EP1094516A3 (en) * | 1999-10-20 | 2003-01-15 | Fuji Polymer Industries Co,, Ltd. | Thermally conductive composition and method of forming thermally conductive film with use of same |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8902067D0 (en) | 1989-03-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |