GB2141141B - Electrodepositing copper - Google Patents

Electrodepositing copper

Info

Publication number: GB2141141B
Authority: GB; United Kingdom
Prior art keywords: electrodepositing copper; electrodepositing; copper
Prior art date: 1983-06-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

GB08414863A

Other versions

GB8414863D0 (en

GB2141141A (en

Inventor

Daniel J Combs

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

OMI International Corp

Original Assignee

OMI International Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1983-06-10

Filing date

1984-06-11

Publication date

1987-01-07

1984-06-11 Application filed by OMI International Corp filed Critical OMI International Corp

1984-07-18 Publication of GB8414863D0 publication Critical patent/GB8414863D0/en

1984-12-12 Publication of GB2141141A publication Critical patent/GB2141141A/en

1987-01-07 Application granted granted Critical

1987-01-07 Publication of GB2141141B publication Critical patent/GB2141141B/en

Status Expired legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Manufacturing Of Printed Wiring (AREA)

GB08414863A 1983-06-10 1984-06-11 Electrodepositing copper Expired GB2141141B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US50121283A	1983-06-10	1983-06-10

Publications (3)

Publication Number	Publication Date
GB8414863D0 GB8414863D0 (en)	1984-07-18
GB2141141A GB2141141A (en)	1984-12-12
GB2141141B true GB2141141B (en)	1987-01-07

Family

ID=23992566

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB08414863A Expired GB2141141B (en)	1983-06-10	1984-06-11	Electrodepositing copper

Country Status (10)

Country	Link
JP (1)	JPS609891A (en)
AU (1)	AU559896B2 (en)
BR (1)	BR8402812A (en)
CA (1)	CA1255622A (en)
DE (1)	DE3421017A1 (en)
ES (1)	ES8601337A1 (en)
FR (1)	FR2547836A1 (en)
GB (1)	GB2141141B (en)
IT (1)	IT1177790B (en)
NL (1)	NL8401842A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7556722B2 (en)	1996-11-22	2009-07-07	Metzger Hubert F	Electroplating apparatus
US8298395B2 (en)	1999-06-30	2012-10-30	Chema Technology, Inc.	Electroplating apparatus
DE10261852B3 (en)	2002-12-20	2004-06-03	Atotech Deutschland Gmbh	Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
JP4644447B2 (en) *	2004-06-25	2011-03-02	株式会社日立製作所	Method for manufacturing printed wiring board
WO2007076898A1 (en) *	2006-01-06	2007-07-12	Enthone Inc	Electrolyte and process for depositing a matt metal layer
US9243339B2 (en)	2012-05-25	2016-01-26	Trevor Pearson	Additives for producing copper electrodeposits having low oxygen content

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2882209A (en) *	1957-05-20	1959-04-14	Udylite Res Corp	Electrodeposition of copper from an acid bath
NL291575A (en) *	1962-04-16
US3328273A (en) *	1966-08-15	1967-06-27	Udylite Corp	Electro-deposition of copper from acidic baths
ZA708430B (en) *	1970-02-12	1971-09-29	Udylite Corp	Electrodeposition of copper from acidic baths
DE2039831C3 (en) *	1970-06-06	1979-09-06	Schering Ag, 1000 Berlin Und 4619 Bergkamen	Acid bath for the galvanic deposition of shiny copper coatings
US3770598A (en) *	1972-01-21	1973-11-06	Oxy Metal Finishing Corp	Electrodeposition of copper from acid baths
GB1526076A (en) *	1975-03-11	1978-09-27	Oxy Metal Industries Corp	Electrodeposition of copper
CA1105045A (en) *	1977-05-04	1981-07-14	Hans G. Creutz (Deceased)	Electrodeposition of copper
DE2746938C2 (en) *	1977-10-17	1987-04-09	Schering AG, 1000 Berlin und 4709 Bergkamen	Aqueous acid bath for the galvanic deposition of shiny and crack-free copper coatings and use of this bath
US4272335A (en) *	1980-02-19	1981-06-09	Oxy Metal Industries Corporation	Composition and method for electrodeposition of copper
US4336114A (en) *	1981-03-26	1982-06-22	Hooker Chemicals & Plastics Corp.	Electrodeposition of bright copper

1984
- 1984-06-04 AU AU29034/84A patent/AU559896B2/en not_active Ceased
- 1984-06-06 DE DE19843421017 patent/DE3421017A1/en active Granted
- 1984-06-07 CA CA000456109A patent/CA1255622A/en not_active Expired
- 1984-06-08 NL NL8401842A patent/NL8401842A/en not_active Application Discontinuation
- 1984-06-08 ES ES533253A patent/ES8601337A1/en not_active Expired
- 1984-06-08 FR FR8409045A patent/FR2547836A1/en active Pending
- 1984-06-08 BR BR8402812A patent/BR8402812A/en unknown
- 1984-06-08 IT IT48356/84A patent/IT1177790B/en active
- 1984-06-11 GB GB08414863A patent/GB2141141B/en not_active Expired
- 1984-06-11 JP JP59119716A patent/JPS609891A/en active Granted

Also Published As

Publication number	Publication date
ES533253A0 (en)	1985-10-16
GB8414863D0 (en)	1984-07-18
AU559896B2 (en)	1987-03-26
JPS6112037B2 (en)	1986-04-05
BR8402812A (en)	1985-05-21
ES8601337A1 (en)	1985-10-16
AU2903484A (en)	1984-12-13
DE3421017C2 (en)	1987-08-27
FR2547836A1 (en)	1984-12-28
IT1177790B (en)	1987-08-26
GB2141141A (en)	1984-12-12
JPS609891A (en)	1985-01-18
IT8448356A0 (en)	1984-06-08
CA1255622A (en)	1989-06-13
NL8401842A (en)	1985-01-02
DE3421017A1 (en)	1984-12-13

Publication	Publication Date	Title
GB8513501D0 (en)	1985-07-03	Copper electroplating
DE3272891D1 (en)	1986-10-02	Electroplating arrangements
GB8531356D0 (en)	1986-02-05	Copper plating
EP0137981A3 (en)	1986-08-13	Through-hole plating
GB8600198D0 (en)	1986-02-12	Ion plating
GB8402650D0 (en)	1984-03-07	Circuit
GB8410849D0 (en)	1984-06-06	Circuit
GB8426005D0 (en)	1984-11-21	Electrical components
GB8300732D0 (en)	1983-02-16	Circuit
GB8430687D0 (en)	1985-01-16	Circuit
GB8413349D0 (en)	1984-06-27	Circuit means
DE3473303D1 (en)	1988-09-15	Electrolytic copper plating
GB2141140B (en)	1986-12-10	Electrodeposition of copper
GB2141141B (en)	1987-01-07	Electrodepositing copper
GB8411891D0 (en)	1984-06-13	Circuit
GB8529856D0 (en)	1986-01-15	Cyanide-free copper plating process
GB8332514D0 (en)	1984-01-11	Electrical components
GB8401298D0 (en)	1984-02-22	Circuit
GB8324174D0 (en)	1983-10-12	Electrical components
GB8412497D0 (en)	1984-06-20	Solution for polishing copper
GB8431596D0 (en)	1985-01-30	Destruction-prevention circuit
GB8417576D0 (en)	1984-08-15	Interface circuit
GB2136018B (en)	1985-11-20	Electroplating rack contacts
GB8320821D0 (en)	1983-09-01	Plating
GB8432395D0 (en)	1985-02-06	Copper plating

Legal Events

Date	Code	Title	Description
1989-02-01	PCNP	Patent ceased through non-payment of renewal fee