GB2094836A - A bath for the electrolytic deposition of a palladium-nickel alloy - Google Patents
A bath for the electrolytic deposition of a palladium-nickel alloy Download PDFInfo
- Publication number
- GB2094836A GB2094836A GB8204857A GB8204857A GB2094836A GB 2094836 A GB2094836 A GB 2094836A GB 8204857 A GB8204857 A GB 8204857A GB 8204857 A GB8204857 A GB 8204857A GB 2094836 A GB2094836 A GB 2094836A
- Authority
- GB
- United Kingdom
- Prior art keywords
- palladium
- sodium
- nickel
- bath
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
A bath for the electrolytic deposition of a palladium-nickel alloy for decorative and/or technical finishes having outstandingly fine and uniform grain structure and satisfactory mixed crystal formation, which enhances brightness, ductility and resistance to the widest variety of corrosive media, and which may improve smoothness, consists of an aqueous solution of palladium- and nickel-amines having a palladium content in the range 5 to 30 g/l and a nickel content in the same range 5 to 30 g/l, together with an addition of sulphonic acid salts, the ration of palladium to nickel being adjusted to that the electrolytically deposited alloy has a palladium content of 30 to 90% by weight, to which is added one or more of the following substances: sodium vinylsulphonate, sodium allylsulphonate, sodium propinesulphonate, sodium methylalylsulphonate, N-pyridinium propylsulpho-betaine, N-pyridinum ethylsulphobetaine, sodium N- benzylpyridinium-2-ethylsulphonate.
Description
SPECIFICATION
A bath for the electrolytic deposition of a palladium-nickel alloy
This invention relates to a bath for the electrolytic deposition of a palladium-nickel alloy for decorative and/or technical finishes, consisting of an aqueous solution of palladium- and nickelamines having a palladium content in the range 5 to 30 g/l, a nickel content in the same range 5 to 30 g/l and an addition of sulphonic acid salts, in which aqueous solution the ratio of palladium to nickel is so adjusted that the electrolytically deposited alloy has a palladium content of 30 to 90% by weight. Electroplating produced by means of this type of bath is used as a substitute for gold.
In the known baths (G.B.-P.S. 1 143178), the sulphonic acids and/or their salts are added as brighteners. The substances specifically named are the salts of naphthalene-sulphonic acid and aromatic sulphonamides such as the sodium salt of naphthalene-1 ,5-disulphonic acid, the sodium salts of naphthalene- 1 ,3,6-trisulphonic acid, saccharin (o-sulpho-benzoic acid imide) and ptoluenesulphonamide. However, it has been found by experience that electroplatings produced in this type of bath fail to meet requirements in respect of mechanical properties -- and even their lustre is inadequate for many decorative
purposes. According to the discoveries on which the present invention is based, these deficiencies
arise from defective mixed crystal formation.
The object of the invention is to provide a bath
of the type defined in which satisfactory mixed
crystal formation is ensured.
According to the present invention, this object
is achieved by the addition to a bath of the type
defined, of one or more of the following
substances:
sodium vinylsulphonate
sodium allylsulphonate
sodium propinesulphonate
sodium methallylsulphonate
N-pyridinium propylsulpho-beta-ine
N-pyridinium ethylsulpho-beta-ine
sodium N-benzylpyridinium-2-ethylsulphonate
With an additive from the above selection
electrolytic deposition from the bath produces
palladium-nickel finishes with an outstandingly
fine and uniform grain structure and satisfactory
mixed crystal formation. This enhances their
brightness, ductility and resistance to the widest
variety of corrosive media. Moreover, the
smoothing action may be improved.
The invention and the effects it achieves will
now be described with reference to some typical
embodiments thereof:
EXAMPLE 1
(Addition of an aliphatic sulphonic acid salt):
An electrolyte was prepared from:
20 g palladium as (Pd(NH3)4Cl2 10 9 nickel as (Ni(NH3)6)SO4 50 g conductivity as (NH4)2SO4 or Nh4CI to
salt give the electrolyte
adequate conductivity NH4OH to adjust the pH to 8.5 water to bring the volume to
1 litre 2.5 9 sodium allylsulphonate
The electrolyte temperature was 300 C; the articles were kept moving gently: the cathode current density was 1 A/dm2; the deposition time was 10 min.
A lustrous palladium-nickel coating was produced on a brushed brass sheet, without significant smoothing or inhibitive action.
To check the corrosion resistance, the test sheet made as above was immersed for 60 s in dilute nitric acid at room temperature; the medium contained equal parts of concentrated nitric acid and water. there was no visible evidence of corrosive attack.
Following G.B.-P.S. 1143178 previously referred to and adding 10 g of sodium naphthalene-1 ,3,6-trisulphonate to the electrolyte instead of sodium allylsulphonate, the resulting palladium-nickel coating corrodes seriously in the above nitric acid test. The cause lies in a deficient mixed crystal formation. X-ray examinations have detected the presence of free nickel, which constitutes the cause of corrosion.
EXAMPLE2 (Addition of an aliphatic sulphonic acid salt combination):
An electrolyte was prepared from: 20 g palladium as (Pd(NH3)4)CI2 10 9 nickel as (Ni(NH3)6) SO4 50 g conductivity as (NH4)2SO4 or Nh4CI to
salt give the electrolyte
adequate conductivity NH4OH to adjust the pH to 8.5 water to bring the volume to
1 litre 2.5 g sodium allylsulphonate 0.25 g sodium propinesulphonate
The electroplating temperature was 300C; the articles were kept moving gently; the cathode current density was 1 A/dm2; the deposition time was 10 min.
A more lustrous palladium-nickel coating was produced on a brushed brass sheet, compared with Example 1 , with no significant smoothing and no inhibitive action. The nitric acid test as in
Example 1 was again easily withstood.
EXAMPLE3 (Addition of a combination of an aliphatic and a heterocyclic sulphonic acid salt):
An electrolyte was prepared from: 20 g palladium as (Pd(NH3)4)SO4 10 9 nickel as (Ni(NH3)6)Cl2 50 g conductivity as (NH4)2S04 or NH4CI to
salt give the electrolyte
adequate conductivity
NH40H to adjust the pH to 8.5 water to bring the volume to
1 litre 2.5 g sodium allylsulphonate 0.1 g N-pyridinium propylsulpho-beta-ine
The electroplating temperature was 300C; the articles were kept moving gently; the cathode current density was 1 A/dm2; the deposition time was 10 min.
A lustrous palladium-nickel coating was produced on a brushed brass sheet, with no detectable smoothing and no inhibitive action. The nitric acid test was easily withstood.
Claims (2)
1. A bath for electrolytic deposition of a palladium-nickel alloy for decorative and/or technical finishes, consisting of an aqueous solution of palladium- and nickel-amines having a palladium content in the range 5 to 30 g/l, a nickel content in the same range 5 to 30 g/l and an addition of sulphonic acid salts, in which aqueous solution the ratio of palladium to nickel is so adjusted that the electrolytically deposited alloy has a palladium content of 30 to 90% by weight, to which is added one or more of the following substances:
sodium vinylsulphonate
sodium allylsulphonate
sodium propinesulphonate
sodium methallylsulphonate
N-pyridinium propylsulpho-beta-ine
N-pyridinium ethylsulpho-beta-ine
sodium N-benzylpyridinium-2-ethylsulphonate.
2. A bath for the electrolytic deposition of a palladium-nickel alloy for decorative and/or technical finishes substantially as hereinbefore described with reference to any one of the
Examples.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3108508A DE3108508C2 (en) | 1981-03-06 | 1981-03-06 | Bath for the electrodeposition of a palladium / nickel alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2094836A true GB2094836A (en) | 1982-09-22 |
| GB2094836B GB2094836B (en) | 1984-12-05 |
Family
ID=6126504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8204857A Expired GB2094836B (en) | 1981-03-06 | 1982-02-18 | A bath for the electrolytic deposition of a palladium-nickel alloy |
Country Status (14)
| Country | Link |
|---|---|
| JP (1) | JPS5816089A (en) |
| AT (1) | AT377013B (en) |
| AU (1) | AU535531B2 (en) |
| BE (1) | BE892344A (en) |
| BR (1) | BR8201157A (en) |
| CA (1) | CA1176204A (en) |
| CH (1) | CH649318A5 (en) |
| DE (1) | DE3108508C2 (en) |
| FR (1) | FR2501243B1 (en) |
| GB (1) | GB2094836B (en) |
| IT (1) | IT1150627B (en) |
| NL (1) | NL8200908A (en) |
| SE (1) | SE8201299L (en) |
| ZA (1) | ZA821367B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2242200A (en) * | 1990-02-20 | 1991-09-25 | Omi International | Plating compositions and processes |
| EP0916747A1 (en) * | 1997-11-15 | 1999-05-19 | AMI Doduco GmbH | Electrolytic bath for the deposition of palladium and palladium alloys |
| CN113699565A (en) * | 2021-09-28 | 2021-11-26 | 万明电镀智能科技(东莞)有限公司 | High-corrosion-resistance palladium-nickel alloy plating layer, electroplating method thereof and palladium-nickel plating layer electroplating solution |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3443420A1 (en) * | 1984-11-26 | 1986-05-28 | Siemens AG, 1000 Berlin und 8000 München | Electroplating bath for the rapid deposition of palladium alloys |
| US4628165A (en) * | 1985-09-11 | 1986-12-09 | Learonal, Inc. | Electrical contacts and methods of making contacts by electrodeposition |
| DE3809139A1 (en) * | 1988-03-18 | 1989-09-28 | Lpw Chemie Gmbh | USE OF A PALLADIUM / NICKEL ALLOY LAYER AS AN INTERMEDIATE LAYER BETWEEN A NON-CORROSION-RESISTANT OR LESS-CORROSION-RESISTANT METAL BASE MATERIAL AND A COATING APPLIED BY THE PVD PROCESS |
| US5415685A (en) * | 1993-08-16 | 1995-05-16 | Enthone-Omi Inc. | Electroplating bath and process for white palladium |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2328243A (en) * | 1941-04-28 | 1943-08-31 | Posture Res Corp | Chair |
| US2800442A (en) * | 1955-10-04 | 1957-07-23 | Udylite Res Corp | Electrodeposition of nickel |
| JPS4733176B1 (en) * | 1967-01-11 | 1972-08-23 | ||
| US3730854A (en) * | 1971-10-29 | 1973-05-01 | Basf Ag | Stabilized aqueous solutions of unsaturated aliphatic sulfonic acids or salts thereof |
| CH572989A5 (en) * | 1973-04-27 | 1976-02-27 | Oxy Metal Industries Corp | |
| GB1553503A (en) * | 1976-05-14 | 1979-09-26 | Oxy Metal Industries Corp | Electrodeposition of bright nickel-iron deposits |
| FR2364980A1 (en) * | 1976-09-17 | 1978-04-14 | Parker Ste Continentale | Electrodeposition of palladium alloys for jewellery - or protective coatings, using bath contg. organic cpds. and brighteners |
| DE2825966A1 (en) * | 1978-06-14 | 1980-01-03 | Basf Ag | ACID GALVANIC NICKEL BATH, WHICH CONTAINS SULFOBETAINE AS A GLOSSY AND LEVELING AGENT |
-
1981
- 1981-03-06 DE DE3108508A patent/DE3108508C2/en not_active Expired
-
1982
- 1982-02-18 GB GB8204857A patent/GB2094836B/en not_active Expired
- 1982-02-26 CH CH1184/82A patent/CH649318A5/en not_active IP Right Cessation
- 1982-03-02 AU AU81049/82A patent/AU535531B2/en not_active Ceased
- 1982-03-02 ZA ZA821367A patent/ZA821367B/en unknown
- 1982-03-03 SE SE8201299A patent/SE8201299L/en not_active Application Discontinuation
- 1982-03-03 JP JP57032483A patent/JPS5816089A/en active Granted
- 1982-03-03 BE BE2/59611A patent/BE892344A/en not_active IP Right Cessation
- 1982-03-03 AT AT0082182A patent/AT377013B/en not_active IP Right Cessation
- 1982-03-04 FR FR8203613A patent/FR2501243B1/en not_active Expired
- 1982-03-05 NL NL8200908A patent/NL8200908A/en not_active Application Discontinuation
- 1982-03-05 BR BR8201157A patent/BR8201157A/en unknown
- 1982-03-05 CA CA000397678A patent/CA1176204A/en not_active Expired
- 1982-03-05 IT IT19992/82A patent/IT1150627B/en active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2242200A (en) * | 1990-02-20 | 1991-09-25 | Omi International | Plating compositions and processes |
| GB2242200B (en) * | 1990-02-20 | 1993-11-17 | Omi International | Plating compositions and processes |
| EP0916747A1 (en) * | 1997-11-15 | 1999-05-19 | AMI Doduco GmbH | Electrolytic bath for the deposition of palladium and palladium alloys |
| CN113699565A (en) * | 2021-09-28 | 2021-11-26 | 万明电镀智能科技(东莞)有限公司 | High-corrosion-resistance palladium-nickel alloy plating layer, electroplating method thereof and palladium-nickel plating layer electroplating solution |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2501243A1 (en) | 1982-09-10 |
| AU535531B2 (en) | 1984-03-29 |
| ATA82182A (en) | 1984-06-15 |
| JPS6112038B2 (en) | 1986-04-05 |
| CA1176204A (en) | 1984-10-16 |
| IT1150627B (en) | 1986-12-17 |
| AT377013B (en) | 1985-01-25 |
| JPS5816089A (en) | 1983-01-29 |
| BR8201157A (en) | 1982-11-23 |
| SE8201299L (en) | 1982-09-07 |
| GB2094836B (en) | 1984-12-05 |
| ZA821367B (en) | 1983-01-26 |
| NL8200908A (en) | 1982-10-01 |
| DE3108508C2 (en) | 1983-06-30 |
| IT8219992A0 (en) | 1982-03-05 |
| DE3108508A1 (en) | 1982-09-16 |
| BE892344A (en) | 1982-07-01 |
| CH649318A5 (en) | 1985-05-15 |
| FR2501243B1 (en) | 1988-05-27 |
| AU8104982A (en) | 1982-09-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |