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GB1022366A - Improvements in or relating to semiconductor devices - Google Patents

Improvements in or relating to semiconductor devices

Info

Publication number
GB1022366A
GB1022366A GB33754/63A GB3375463A GB1022366A GB 1022366 A GB1022366 A GB 1022366A GB 33754/63 A GB33754/63 A GB 33754/63A GB 3375463 A GB3375463 A GB 3375463A GB 1022366 A GB1022366 A GB 1022366A
Authority
GB
United Kingdom
Prior art keywords
contacts
substrate
aluminium
slice
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB33754/63A
Inventor
Carl Peter Sandbank
Roger Cullis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DENDAT1287696D priority Critical patent/DE1287696B/de
Priority to BE631066D priority patent/BE631066A/xx
Priority to NL291538D priority patent/NL291538A/xx
Priority to CH452163A priority patent/CH423995A/en
Priority to DEJ23535A priority patent/DE1282188B/en
Priority to US273062A priority patent/US3244939A/en
Priority to FR931635A priority patent/FR1354552A/en
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB33754/63A priority patent/GB1022366A/en
Priority to GB378564A priority patent/GB1036164A/en
Priority to NL6408106A priority patent/NL6408106A/xx
Priority to BE651446D priority patent/BE651446A/xx
Priority to FR984543A priority patent/FR86320E/en
Priority to DE1439529A priority patent/DE1439529B2/en
Priority to DEST22571A priority patent/DE1292758B/en
Priority to NL6409849A priority patent/NL6409849A/xx
Priority to FR986227A priority patent/FR86819E/en
Priority to NL6409848A priority patent/NL6409848A/xx
Priority to BE652660D priority patent/BE652660A/xx
Priority to DEST22635A priority patent/DE1292761B/en
Priority to FR989359A priority patent/FR86957E/en
Priority to CH1250264A priority patent/CH471468A/en
Priority to BE653537D priority patent/BE653537A/xx
Publication of GB1022366A publication Critical patent/GB1022366A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01005—Boron [B]
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
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    • H01L2924/01023—Vanadium [V]
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    • H01L2924/01024—Chromium [Cr]
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    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
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    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Die Bonding (AREA)

Abstract

1,022,366. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. Aug. 21, 1964 [Aug. 26, 1963], No. 33754/63. Heading H1K. A semi-conductor device has all its external electrodes, each consisting of a metallic contact carrying a layer of solder, disposed on the same plane face of a semi-conductor body. Transistors of this type are made in multiple on a common slice, part of which is shown in Fig. 1 of the Provisional drawings. The slice may be of N-type silicon and the base and emitter zones made by standard oxide masking and diffusion techniques. Aluminium is deposited over the oxide film to contact the collector, base and emitter zones through etched apertures 20, 19, 18, respectively. The oxide surface is then etched free of aluminium. A film grading from chromium beneath to gold above is vapour deposited over the entire surface and then reduced by etching to form contacts 20, 21, 22 which are next coated with solder. The transistor is soldered contacts downwards on a glass substrate carrying similar films aligned with the contacts. The substrate, alternatively of ceramic, oxidized silicon, mica, or plastics, may mount several such devices and other circuit elements. An apertured template may be used to facilitate registration of the device contacts with the films on the substrate. To facilitate accurate positioning of the contacts in relation to the wafer edge an N-type grid pattern is diffused into the slice simultaneously with the emitter formation and individual dice subsequently broken from the slice along the diffused lines. If desired, the aluminium contacts may be dispensed with and a gold, aluminium or plated nickel film used in place of the graded film. Contact may be made with the films on the substrate by thermo-compression bonding, bonding by radiation through the substrate if it is transparent, or by silverloaded epoxy resin instead of .by soldering. The device may finally be protected by a coating of glaze or resin.
GB33754/63A 1962-04-16 1963-08-26 Improvements in or relating to semiconductor devices Expired GB1022366A (en)

Priority Applications (22)

Application Number Priority Date Filing Date Title
DENDAT1287696D DE1287696B (en) 1962-04-16
BE631066D BE631066A (en) 1962-04-16
NL291538D NL291538A (en) 1962-04-16
CH452163A CH423995A (en) 1962-04-16 1963-04-09 Method of mounting and encapsulating a semiconductor device
DEJ23535A DE1282188B (en) 1962-04-16 1963-04-11 Electrical semiconductor arrangement with several strip-shaped supply lines isolated from one another
US273062A US3244939A (en) 1962-04-16 1963-04-15 Encapsulated die bonded hybrid integrated circuit
FR931635A FR1354552A (en) 1962-04-16 1963-04-16 Manufacturing process applicable to semiconductor electronic components for printed circuits
GB33754/63A GB1022366A (en) 1963-08-26 1963-08-26 Improvements in or relating to semiconductor devices
GB378564A GB1036164A (en) 1962-04-16 1964-01-29 Improvements in or relating to semiconductor devices
NL6408106A NL6408106A (en) 1962-04-16 1964-07-16
BE651446D BE651446A (en) 1962-04-16 1964-08-06
FR984543A FR86320E (en) 1962-04-16 1964-08-07 Manufacturing process applicable to semiconductor electronic components for printed circuits
DE1439529A DE1439529B2 (en) 1962-04-16 1964-08-12 : Semiconductor component with a planar semiconductor element on a bonding plate and method for producing the same
DEST22571A DE1292758B (en) 1962-04-16 1964-08-21 Electric semiconductor component
NL6409849A NL6409849A (en) 1962-04-16 1964-08-26
FR986227A FR86819E (en) 1962-04-16 1964-08-26 Manufacturing process applicable to semiconductor electronic components for printed circuits
NL6409848A NL6409848A (en) 1962-04-16 1964-08-26
BE652660D BE652660A (en) 1962-04-16 1964-09-04
DEST22635A DE1292761B (en) 1962-04-16 1964-09-05 Planar semiconductor device and method for its manufacture
FR989359A FR86957E (en) 1962-04-16 1964-09-25 Manufacturing process applicable to semiconductor electronic components for printed circuits
CH1250264A CH471468A (en) 1962-04-16 1964-09-25 Electric semiconductor device
BE653537D BE653537A (en) 1962-04-16 1964-09-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB33754/63A GB1022366A (en) 1963-08-26 1963-08-26 Improvements in or relating to semiconductor devices

Publications (1)

Publication Number Publication Date
GB1022366A true GB1022366A (en) 1966-03-09

Family

ID=10357013

Family Applications (1)

Application Number Title Priority Date Filing Date
GB33754/63A Expired GB1022366A (en) 1962-04-16 1963-08-26 Improvements in or relating to semiconductor devices

Country Status (1)

Country Link
GB (1) GB1022366A (en)

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