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GB0412000D0 - Apparatus and method for extracting debris during laser ablation - Google Patents

Apparatus and method for extracting debris during laser ablation

Info

Publication number
GB0412000D0
GB0412000D0 GBGB0412000.2A GB0412000A GB0412000D0 GB 0412000 D0 GB0412000 D0 GB 0412000D0 GB 0412000 A GB0412000 A GB 0412000A GB 0412000 D0 GB0412000 D0 GB 0412000D0
Authority
GB
United Kingdom
Prior art keywords
laser ablation
during laser
debris during
extracting debris
extracting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0412000.2A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cambridge Display Technology Ltd
Original Assignee
Cambridge Display Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cambridge Display Technology Ltd filed Critical Cambridge Display Technology Ltd
Priority to GBGB0412000.2A priority Critical patent/GB0412000D0/en
Publication of GB0412000D0 publication Critical patent/GB0412000D0/en
Priority to PCT/GB2005/002087 priority patent/WO2005118210A1/en
Priority to GB0623390A priority patent/GB2428398B/en
Priority to TW094117495A priority patent/TWI364340B/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Electroluminescent Light Sources (AREA)
GBGB0412000.2A 2004-05-28 2004-05-28 Apparatus and method for extracting debris during laser ablation Ceased GB0412000D0 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GBGB0412000.2A GB0412000D0 (en) 2004-05-28 2004-05-28 Apparatus and method for extracting debris during laser ablation
PCT/GB2005/002087 WO2005118210A1 (en) 2004-05-28 2005-05-26 Apparatus and method using a gas vortex for extracting debris during laser ablation
GB0623390A GB2428398B (en) 2004-05-28 2005-05-26 Apparatus and method using a gas vortex for extracting debris during laser ablation
TW094117495A TWI364340B (en) 2004-05-28 2005-05-27 Method of encapsulation an oled or organic photovoltaic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0412000.2A GB0412000D0 (en) 2004-05-28 2004-05-28 Apparatus and method for extracting debris during laser ablation

Publications (1)

Publication Number Publication Date
GB0412000D0 true GB0412000D0 (en) 2004-06-30

Family

ID=32671263

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB0412000.2A Ceased GB0412000D0 (en) 2004-05-28 2004-05-28 Apparatus and method for extracting debris during laser ablation
GB0623390A Expired - Fee Related GB2428398B (en) 2004-05-28 2005-05-26 Apparatus and method using a gas vortex for extracting debris during laser ablation

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB0623390A Expired - Fee Related GB2428398B (en) 2004-05-28 2005-05-26 Apparatus and method using a gas vortex for extracting debris during laser ablation

Country Status (3)

Country Link
GB (2) GB0412000D0 (en)
TW (1) TWI364340B (en)
WO (1) WO2005118210A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7863542B2 (en) * 2005-12-22 2011-01-04 Sony Corporation Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method
GB2438527B (en) * 2006-03-07 2008-04-23 Sony Corp Laser processing apparatus, laser processing head and laser processing method
JP5165203B2 (en) * 2006-03-07 2013-03-21 ソニー株式会社 Laser processing apparatus and laser processing method
JP4840110B2 (en) * 2006-03-09 2011-12-21 日産自動車株式会社 Laser welding apparatus and laser welding method
JP2009006350A (en) * 2007-06-27 2009-01-15 Sony Corp Laser beam machining apparatus and method, debris recovery mechanism and method, and manufacturing method of display panel
CN101825780B (en) * 2009-03-05 2011-08-24 北京京东方光电科技有限公司 Device and method for detecting and removing residual material on periphery of liquid crystal panel
WO2013029038A2 (en) 2011-08-25 2013-02-28 Preco, Inc. Method and apparatus for making a clean cut with a laser
JP2015134364A (en) * 2014-01-16 2015-07-27 株式会社デンソー Laser processing apparatus and laser processing method
JP5663776B1 (en) 2014-03-27 2015-02-04 福井県 Suction method, suction device, laser processing method, and laser processing device
TWI561328B (en) * 2014-09-03 2016-12-11 Univ Nat Yunlin Sci & Tech Swirl jet flow auxiliary manufacturing device
US9945253B2 (en) * 2015-01-29 2018-04-17 Rohr, Inc. Collecting / removing byproducts of laser ablation
DE202015102740U1 (en) * 2015-05-27 2016-08-31 Uwe Bergmann Laser welding device with spatter protection device
WO2017096241A1 (en) 2015-12-02 2017-06-08 Augmenteum, Inc. System for and method of projecting augmentation imagery in a head-mounted display
CN117564518B (en) * 2024-01-15 2024-05-17 洛阳船舶材料研究所(中国船舶集团有限公司第七二五研究所) Vacuum laser welding device and welding method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29504457U1 (en) * 1995-03-16 1995-05-18 Haas Laser GmbH & Co. KG, 78713 Schramberg Device for protecting the processing optics of a laser processing device against contamination
EP1021839A1 (en) * 1997-07-11 2000-07-26 Fed Corporation Laser ablation method to fabricate color organic light emitting diode displays
WO2000060668A1 (en) * 1999-04-07 2000-10-12 Siemens Solar Gmbh Device and method for removing thin layers on a support material
JP3479833B2 (en) * 2000-08-22 2003-12-15 日本電気株式会社 Laser correction method and apparatus
IES20010599A2 (en) * 2000-12-15 2001-11-28 Xsil Technology Ltd Fume extraction for laser machining
JP4205486B2 (en) * 2003-05-16 2009-01-07 株式会社ディスコ Laser processing equipment

Also Published As

Publication number Publication date
GB2428398A (en) 2007-01-31
TW200615071A (en) 2006-05-16
TWI364340B (en) 2012-05-21
WO2005118210A1 (en) 2005-12-15
GB2428398B (en) 2008-01-02
GB0623390D0 (en) 2007-01-03

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)