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FR2967328B1 - Circuit electronique comprenant une face de report sur laquelle sont agences des plots de contact - Google Patents

Circuit electronique comprenant une face de report sur laquelle sont agences des plots de contact

Info

Publication number
FR2967328B1
FR2967328B1 FR1059310A FR1059310A FR2967328B1 FR 2967328 B1 FR2967328 B1 FR 2967328B1 FR 1059310 A FR1059310 A FR 1059310A FR 1059310 A FR1059310 A FR 1059310A FR 2967328 B1 FR2967328 B1 FR 2967328B1
Authority
FR
France
Prior art keywords
agencies
report
face
electronic circuit
plots
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1059310A
Other languages
English (en)
Other versions
FR2967328A1 (fr
Inventor
Jean Pierre Mauclerc
Kent Gawain Crandall
Sean Aquilla Marcus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sierra Wireless SA
Original Assignee
Sierra Wireless SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sierra Wireless SA filed Critical Sierra Wireless SA
Priority to FR1059310A priority Critical patent/FR2967328B1/fr
Priority to CN201110351560.8A priority patent/CN102548204B/zh
Priority to US13/293,286 priority patent/US20120111606A1/en
Publication of FR2967328A1 publication Critical patent/FR2967328A1/fr
Application granted granted Critical
Publication of FR2967328B1 publication Critical patent/FR2967328B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
FR1059310A 2010-11-10 2010-11-10 Circuit electronique comprenant une face de report sur laquelle sont agences des plots de contact Expired - Fee Related FR2967328B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR1059310A FR2967328B1 (fr) 2010-11-10 2010-11-10 Circuit electronique comprenant une face de report sur laquelle sont agences des plots de contact
CN201110351560.8A CN102548204B (zh) 2010-11-10 2011-11-09 包含具有接触焊盘转接面的电子电路
US13/293,286 US20120111606A1 (en) 2010-11-10 2011-11-10 Electronic circuit comprising a transfer face on which contact pads are laid out

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1059310A FR2967328B1 (fr) 2010-11-10 2010-11-10 Circuit electronique comprenant une face de report sur laquelle sont agences des plots de contact

Publications (2)

Publication Number Publication Date
FR2967328A1 FR2967328A1 (fr) 2012-05-11
FR2967328B1 true FR2967328B1 (fr) 2012-12-21

Family

ID=43859748

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1059310A Expired - Fee Related FR2967328B1 (fr) 2010-11-10 2010-11-10 Circuit electronique comprenant une face de report sur laquelle sont agences des plots de contact

Country Status (3)

Country Link
US (1) US20120111606A1 (fr)
CN (1) CN102548204B (fr)
FR (1) FR2967328B1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3044164B1 (fr) * 2015-11-24 2018-01-05 Electricite De France Support perfectionne de cellule photovoltaique, pour tester ladite cellule
KR102542759B1 (ko) * 2016-07-05 2023-06-15 삼성디스플레이 주식회사 표시 장치
WO2018045167A1 (fr) * 2016-09-02 2018-03-08 Octavo Systems Llc Substrat destiné à être utilisé dans dispositifs de système en boîtier (sip)
GB2553355A (en) * 2016-09-05 2018-03-07 Continental Automotive Gmbh Connection device for providing a mechanical and electrical connection of at least one sensor element to an electronic circuit, and cable endpiece
CN212064501U (zh) * 2020-03-13 2020-12-01 华为技术有限公司 电路板结构和电子设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220490A (en) * 1990-10-25 1993-06-15 Microelectronics And Computer Technology Corporation Substrate interconnect allowing personalization using spot surface links
KR100192766B1 (ko) * 1995-07-05 1999-06-15 황인길 솔더볼을 입출력 단자로 사용하는 볼그리드 어레이 반도체 패키지의 솔더볼 평탄화 방법 및 그 기판구조
JPH1174407A (ja) * 1997-08-29 1999-03-16 Mitsubishi Electric Corp 半導体装置
JP2000100851A (ja) * 1998-09-25 2000-04-07 Sony Corp 半導体部品及びその製造方法、半導体部品の実装構造及びその実装方法
JP3846611B2 (ja) * 1998-09-25 2006-11-15 ソニー株式会社 実装用半導体部品、実装構造及び実装方法
JP2001217355A (ja) * 1999-11-25 2001-08-10 Hitachi Ltd 半導体装置
US7259336B2 (en) * 2000-06-19 2007-08-21 Nortel Networks Limited Technique for improving power and ground flooding
KR100416000B1 (ko) * 2001-07-11 2004-01-24 삼성전자주식회사 다수의 핀을 갖는 부품이 실장되는 인쇄회로기판
JP4082220B2 (ja) * 2003-01-16 2008-04-30 セイコーエプソン株式会社 配線基板、半導体モジュールおよび半導体モジュールの製造方法
US6762495B1 (en) * 2003-01-30 2004-07-13 Qualcomm Incorporated Area array package with non-electrically connected solder balls
JP2005101031A (ja) * 2003-09-22 2005-04-14 Rohm Co Ltd 半導体集積回路装置、及び電子機器
JP2006222374A (ja) * 2005-02-14 2006-08-24 Fuji Film Microdevices Co Ltd 半導体チップ
JP4555119B2 (ja) * 2005-02-22 2010-09-29 アルプス電気株式会社 面実装型電子回路ユニット
KR101131138B1 (ko) * 2006-01-04 2012-04-03 삼성전자주식회사 다양한 크기의 볼 패드를 갖는 배선기판과, 그를 갖는반도체 패키지 및 그를 이용한 적층 패키지
US8304290B2 (en) * 2009-12-18 2012-11-06 International Business Machines Corporation Overcoming laminate warpage and misalignment in flip-chip packages
US8604614B2 (en) * 2010-03-26 2013-12-10 Samsung Electronics Co., Ltd. Semiconductor packages having warpage compensation
US8394672B2 (en) * 2010-08-14 2013-03-12 Advanced Micro Devices, Inc. Method of manufacturing and assembling semiconductor chips with offset pads

Also Published As

Publication number Publication date
FR2967328A1 (fr) 2012-05-11
CN102548204A (zh) 2012-07-04
US20120111606A1 (en) 2012-05-10
CN102548204B (zh) 2016-01-13

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