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ES533253A0 - A PROCEDURE FOR ELECTROPOSING A HIGHLY LEVEL, DUCTILE, GLOSSY ENGINEERING COPPER PLATE, SUBSTANTIALLY UNIFORM HARDNESS AND NOT PICKABLE, ON A CONDUCTIVE SUBSTRATE - Google Patents

A PROCEDURE FOR ELECTROPOSING A HIGHLY LEVEL, DUCTILE, GLOSSY ENGINEERING COPPER PLATE, SUBSTANTIALLY UNIFORM HARDNESS AND NOT PICKABLE, ON A CONDUCTIVE SUBSTRATE

Info

Publication number
ES533253A0
ES533253A0 ES533253A ES533253A ES533253A0 ES 533253 A0 ES533253 A0 ES 533253A0 ES 533253 A ES533253 A ES 533253A ES 533253 A ES533253 A ES 533253A ES 533253 A0 ES533253 A0 ES 533253A0
Authority
ES
Spain
Prior art keywords
electroposing
pickable
ductile
glossy
procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES533253A
Other languages
Spanish (es)
Other versions
ES8601337A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of ES533253A0 publication Critical patent/ES533253A0/en
Publication of ES8601337A1 publication Critical patent/ES8601337A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
ES533253A 1983-06-10 1984-06-08 Electrodepositing copper Expired ES8601337A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US50121283A 1983-06-10 1983-06-10

Publications (2)

Publication Number Publication Date
ES533253A0 true ES533253A0 (en) 1985-10-16
ES8601337A1 ES8601337A1 (en) 1985-10-16

Family

ID=23992566

Family Applications (1)

Application Number Title Priority Date Filing Date
ES533253A Expired ES8601337A1 (en) 1983-06-10 1984-06-08 Electrodepositing copper

Country Status (10)

Country Link
JP (1) JPS609891A (en)
AU (1) AU559896B2 (en)
BR (1) BR8402812A (en)
CA (1) CA1255622A (en)
DE (1) DE3421017A1 (en)
ES (1) ES8601337A1 (en)
FR (1) FR2547836A1 (en)
GB (1) GB2141141B (en)
IT (1) IT1177790B (en)
NL (1) NL8401842A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7556722B2 (en) 1996-11-22 2009-07-07 Metzger Hubert F Electroplating apparatus
US8298395B2 (en) 1999-06-30 2012-10-30 Chema Technology, Inc. Electroplating apparatus
DE10261852B3 (en) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
JP4644447B2 (en) * 2004-06-25 2011-03-02 株式会社日立製作所 Method for manufacturing printed wiring board
WO2007076898A1 (en) * 2006-01-06 2007-07-12 Enthone Inc Electrolyte and process for depositing a matt metal layer
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
NL291575A (en) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
ZA708430B (en) * 1970-02-12 1971-09-29 Udylite Corp Electrodeposition of copper from acidic baths
DE2039831C3 (en) * 1970-06-06 1979-09-06 Schering Ag, 1000 Berlin Und 4619 Bergkamen Acid bath for the galvanic deposition of shiny copper coatings
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
GB1526076A (en) * 1975-03-11 1978-09-27 Oxy Metal Industries Corp Electrodeposition of copper
CA1105045A (en) * 1977-05-04 1981-07-14 Hans G. Creutz (Deceased) Electrodeposition of copper
DE2746938C2 (en) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Aqueous acid bath for the galvanic deposition of shiny and crack-free copper coatings and use of this bath
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper

Also Published As

Publication number Publication date
GB8414863D0 (en) 1984-07-18
AU559896B2 (en) 1987-03-26
JPS6112037B2 (en) 1986-04-05
BR8402812A (en) 1985-05-21
ES8601337A1 (en) 1985-10-16
GB2141141B (en) 1987-01-07
AU2903484A (en) 1984-12-13
DE3421017C2 (en) 1987-08-27
FR2547836A1 (en) 1984-12-28
IT1177790B (en) 1987-08-26
GB2141141A (en) 1984-12-12
JPS609891A (en) 1985-01-18
IT8448356A0 (en) 1984-06-08
CA1255622A (en) 1989-06-13
NL8401842A (en) 1985-01-02
DE3421017A1 (en) 1984-12-13

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