EP2484787A4 - Alliage cu-ni-si-co pour matériel électronique et son procédé de production - Google Patents

Alliage cu-ni-si-co pour matériel électronique et son procédé de production

Info

Publication number: EP2484787A4
Authority: EP; European Patent Office
Prior art keywords: copper alloy; electronic material; producing same; producing; electronic
Prior art date: 2009-09-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP09849834.8A

Other languages

German (de)

English (en)

Other versions

EP2484787B1 (fr

EP2484787A1 (fr

Inventor

Hiroshi Kuwagaki

Naohiko Era

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

JX Nippon Mining and Metals Corp

Original Assignee

JX Nippon Mining and Metals Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-09-28

Filing date

2009-09-28

Publication date

2013-06-05

2009-09-28 Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp

2012-08-08 Publication of EP2484787A1 publication Critical patent/EP2484787A1/fr

2013-06-05 Publication of EP2484787A4 publication Critical patent/EP2484787A4/fr

2015-01-07 Application granted granted Critical

2015-01-07 Publication of EP2484787B1 publication Critical patent/EP2484787B1/fr

Status Active legal-status Critical Current

2029-09-28 Anticipated expiration legal-status Critical

Classifications

- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Crystallography & Structural Chemistry (AREA)
Conductive Materials (AREA)

EP09849834.8A 2009-09-28 2009-09-28 Cu-ni-si-co alliage de cuivre pour matériel électronique et son procédé de production Active EP2484787B1 (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/JP2009/066794 WO2011036804A1 (fr)	2009-09-28	2009-09-28	Alliage cu-ni-si-co pour matériel électronique et son procédé de production

Publications (3)

Publication Number	Publication Date
EP2484787A1 EP2484787A1 (fr)	2012-08-08
EP2484787A4 true EP2484787A4 (fr)	2013-06-05
EP2484787B1 EP2484787B1 (fr)	2015-01-07

Family

ID=43795574

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP09849834.8A Active EP2484787B1 (fr)	2009-09-28	2009-09-28	Cu-ni-si-co alliage de cuivre pour matériel électronique et son procédé de production

Country Status (5)

Country	Link
EP (1)	EP2484787B1 (fr)
JP (1)	JP5506806B2 (fr)
KR (1)	KR20120054099A (fr)
CN (1)	CN102549180A (fr)
WO (1)	WO2011036804A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US8821477B2 (en)	2007-08-06	2014-09-02	Boston Scientific Scimed, Inc.	Alternative micromachined structures
US8795254B2 (en)	2008-12-10	2014-08-05	Boston Scientific Scimed, Inc.	Medical devices with a slotted tubular member having improved stress distribution
EP2552530A1 (fr)	2010-03-31	2013-02-06	Boston Scientific Scimed, Inc.	Fil guide ayant un profil de rigidité à la flexion
JP6246454B2 (ja) *	2011-11-02	2017-12-13	Ｊｘ金属株式会社	Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP5770113B2 (ja) *	2012-01-13	2015-08-26	Jx日鉱日石金属株式会社	金属箔複合体、並びに成形体及びその製造方法
US9901706B2 (en)	2014-04-11	2018-02-27	Boston Scientific Scimed, Inc.	Catheters and catheter shafts
JP6310004B2 (ja) *	2016-05-27	2018-04-11	Ｊｘ金属株式会社	電子部品用Ｃｕ−Ｃｏ−Ｎｉ−Ｓｉ合金
CN106244849A (zh) *	2016-10-13	2016-12-21	龙岩学院	一种超声波强化高性能铜合金的制备方法
CN108642419A (zh) *	2018-05-31	2018-10-12	太原晋西春雷铜业有限公司	一种折弯性优良的铜镍硅合金带材及其制备方法
JP7451964B2 (ja) *	2019-01-16	2024-03-19	株式会社プロテリアル	Ｃｕ合金板およびその製造方法
CN110195166A (zh) *	2019-04-17	2019-09-03	宁波兴业盛泰集团有限公司	一种引线框架用抗折弯CuNiCoSi系合金及其制造方法
CN112410646A (zh) *	2020-10-16	2021-02-26	扬州千裕电气有限公司	一种电子复合材料
CN113234958A (zh) *	2021-04-25	2021-08-10	江苏青益金属科技股份有限公司	适用于石油输送管道恒温包套的合金线材及其制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20040079456A1 (en) *	2002-07-02	2004-04-29	Onlin Corporation	Copper alloy containing cobalt, nickel and silicon
EP1876250A1 (fr) *	2005-03-31	2008-01-09	Nippon Mining & Metals Co., Ltd.	ALLIAGE DE CUIVRE A BASE DE Cu-Ni-Si-Co-Cr POUR MATERIAU ELECTRONIQUE ET SON PROCEDE DE FABRICATION
JP2008106356A (ja) *	2006-09-27	2008-05-08	Dowa Metaltech Kk	銅合金板材およびその製造法
US20080190524A1 (en) *	2007-02-13	2008-08-14	Weilin Gao	Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP2008266783A (ja) *	2007-03-26	2008-11-06	Furukawa Electric Co Ltd:The	電気・電子機器用銅合金およびその製造方法
JP2009007666A (ja) *	2007-05-31	2009-01-15	Furukawa Electric Co Ltd:The	電気・電子機器用銅合金
WO2009082695A1 (fr) *	2007-12-21	2009-07-02	Gbc Metals Llc	Alliages de cuivre-nickel-silicium

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH01122264A (ja)	1987-11-05	1989-05-15	Nec Corp	画像出力装置
JP3408021B2 (ja)	1995-06-30	2003-05-19	古河電気工業株式会社	電子電気部品用銅合金およびその製造方法
EP1873267B1 (fr)	2005-03-24	2014-07-02	JX Nippon Mining & Metals Corporation	Alliage de cuivre pour materiel electronique
JP4596490B2 (ja) *	2008-03-31	2010-12-08	Ｊｘ日鉱日石金属株式会社	電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法

2009
- 2009-09-28 WO PCT/JP2009/066794 patent/WO2011036804A1/fr active Application Filing
- 2009-09-28 JP JP2011532878A patent/JP5506806B2/ja active Active
- 2009-09-28 KR KR1020127009709A patent/KR20120054099A/ko not_active Application Discontinuation
- 2009-09-28 CN CN2009801616889A patent/CN102549180A/zh active Pending
- 2009-09-28 EP EP09849834.8A patent/EP2484787B1/fr active Active

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20040079456A1 (en) *	2002-07-02	2004-04-29	Onlin Corporation	Copper alloy containing cobalt, nickel and silicon
EP1876250A1 (fr) *	2005-03-31	2008-01-09	Nippon Mining & Metals Co., Ltd.	ALLIAGE DE CUIVRE A BASE DE Cu-Ni-Si-Co-Cr POUR MATERIAU ELECTRONIQUE ET SON PROCEDE DE FABRICATION
JP2008106356A (ja) *	2006-09-27	2008-05-08	Dowa Metaltech Kk	銅合金板材およびその製造法
US20080190524A1 (en) *	2007-02-13	2008-08-14	Weilin Gao	Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP2008266783A (ja) *	2007-03-26	2008-11-06	Furukawa Electric Co Ltd:The	電気・電子機器用銅合金およびその製造方法
JP2009007666A (ja) *	2007-05-31	2009-01-15	Furukawa Electric Co Ltd:The	電気・電子機器用銅合金
WO2009082695A1 (fr) *	2007-12-21	2009-07-02	Gbc Metals Llc	Alliages de cuivre-nickel-silicium

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
H.-A. KUHN ET AL: "A new high performance copper based alloy for electro-mechanical connectors", MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK, vol. 38, no. 8, 1 August 2007 (2007-08-01), pages 624 - 634, XP055060686, ISSN: 0933-5137, DOI: 10.1002/mawe.200700152 *
See also references of WO2011036804A1 *

Also Published As

Publication number	Publication date
WO2011036804A1 (fr)	2011-03-31
CN102549180A (zh)	2012-07-04
KR20120054099A (ko)	2012-05-29
EP2484787B1 (fr)	2015-01-07
EP2484787A1 (fr)	2012-08-08
JPWO2011036804A1 (ja)	2013-02-14
JP5506806B2 (ja)	2014-05-28

Publication	Publication Date	Title
EP2554693A4 (fr)	2014-03-12	Alliage de cuivre contenant cu-ni-si-co pour un matériau électronique et procédé de fabrication de ce dernier
EP2484787A4 (fr)	2013-06-05	Alliage cu-ni-si-co pour matériel électronique et son procédé de production
EP2508635A4 (fr)	2015-11-25	Feuille d'alliage de cuivre et son procédé de fabrication
EP2194151A4 (fr)	2011-01-26	Alliage de cuivre à base de cu-ni-si-co pour matériau électronique et son procédé de production
EP2578709A4 (fr)	2014-04-09	Alliage de cuivre à base de cu-co-si pour un matériau électronique et son procédé de production
EP2570505A4 (fr)	2014-08-06	Alliage de cuivre pour dispositif électronique, procédé pour la production d'alliage de cuivre pour dispositif électronique, et matériau d'alliage de cuivre laminé pour dispositif électronique
ZA201105861B (en)	2012-04-25	Curved metallic material and process for producing same
EP2319947A4 (fr)	2011-11-23	Materiau en alliage de cuivre pour composants electriques et electroniques et procede de fabrication associe
EP2298945A4 (fr)	2012-07-04	Matériau de tôle d alliage de cuivre et procédé de fabrication de celui-ci
EP2157199A4 (fr)	2012-06-27	Matériau d'alliage du cuivre et son procédé de fabrication
EP2570506A4 (fr)	2014-07-09	Alliage de cuivre destiné à un dispositif électronique, procédé de production d'alliage de cuivre pour dispositif électronique et matériau laminé en alliage de cuivre pour dispositif électronique
EP2248921A4 (fr)	2011-03-16	Matériau d'alliage de cuivre pour composant électrique/électronique et procédé de fabrication du matériau d'alliage de cuivre
EP2641983A4 (fr)	2016-04-13	ALLIAGE DE CUIVRE Cu-Ni-Si-Co POUR MATÉRIAU ÉLECTRONIQUE ET PROCÉDÉ POUR SA PRODUCTION
EP2351862A4 (fr)	2012-07-04	Matériau en alliage de cuivre, pièces électriques et électroniques et procédé de fabrication d'un matériau en alliage de cuivre
SG11201400688YA (en)	2014-09-26	Metal material for electronic components and method for producing same
EP2653574A4 (fr)	2014-09-10	Alliage de cuivre et procédé de fabrication de celui-ci
EP2371976A4 (fr)	2013-06-12	Alliage de cuivre à base de cu-ni-si-co pour des matériaux électroniques et procédé de fabrication de cet alliage
EP2330224A4 (fr)	2012-01-25	Cuivre de haute pureté et procédé pour la production électrolytique de cuivre de haute pureté
EP2333128A4 (fr)	2012-07-04	Matière d'alliage de cuivre pour un composant électrique/électronique
EP2508633A4 (fr)	2014-07-23	Feuille d'alliage de cuivre et son procédé de fabrication
HK1141563A1 (en)	2010-11-12	Cu-ti-based copper alloy sheet material and method of manufacturing same cu-ti
EP2223754A4 (fr)	2014-10-29	Procédé de fabrication de produits d'alliage de cuivre et équipement associé
EP2256219A4 (fr)	2012-06-27	Matériau d'alliage de cuivre
EP2623619A4 (fr)	2014-04-09	Alliage de cuivre à base de cuivre-cobalt-silicium pour un matériau électronique et procédé de production de ce dernier
EP2422904A4 (fr)	2016-12-21	Particules fines d'alliage à l'état de solution solide et leur procédé de production

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