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EP2256219A4 - Matériau d'alliage de cuivre - Google Patents

Matériau d'alliage de cuivre

Info

Publication number
EP2256219A4
EP2256219A4 EP09712614A EP09712614A EP2256219A4 EP 2256219 A4 EP2256219 A4 EP 2256219A4 EP 09712614 A EP09712614 A EP 09712614A EP 09712614 A EP09712614 A EP 09712614A EP 2256219 A4 EP2256219 A4 EP 2256219A4
Authority
EP
European Patent Office
Prior art keywords
copper alloy
alloy material
copper
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09712614A
Other languages
German (de)
English (en)
Other versions
EP2256219A1 (fr
Inventor
Kiyoshige Hirose
Tatsuhiko Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2256219A1 publication Critical patent/EP2256219A1/fr
Publication of EP2256219A4 publication Critical patent/EP2256219A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP09712614A 2008-02-18 2009-02-17 Matériau d'alliage de cuivre Withdrawn EP2256219A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008036694 2008-02-18
PCT/JP2009/052718 WO2009104615A1 (fr) 2008-02-18 2009-02-17 Matériau d'alliage de cuivre

Publications (2)

Publication Number Publication Date
EP2256219A1 EP2256219A1 (fr) 2010-12-01
EP2256219A4 true EP2256219A4 (fr) 2012-06-27

Family

ID=40985494

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09712614A Withdrawn EP2256219A4 (fr) 2008-02-18 2009-02-17 Matériau d'alliage de cuivre

Country Status (5)

Country Link
US (2) US20100310413A1 (fr)
EP (1) EP2256219A4 (fr)
JP (1) JPWO2009104615A1 (fr)
CN (1) CN101946014A (fr)
WO (1) WO2009104615A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102822364A (zh) * 2010-04-02 2012-12-12 Jx日矿日石金属株式会社 电子材料用Cu-Ni-Si系合金
WO2011125264A1 (fr) * 2010-04-07 2011-10-13 古河電気工業株式会社 Alliage de cuivre corroyé, partie d'alliage de cuivre et procédé de production d'un alliage de cuivre corroyé
JP4830048B1 (ja) * 2010-07-07 2011-12-07 三菱伸銅株式会社 深絞り加工性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板及びその製造方法
JP5773929B2 (ja) * 2012-03-28 2015-09-02 株式会社神戸製鋼所 曲げ加工性及び耐応力緩和特性に優れる電気電子部品用銅合金板
CN102703754B (zh) * 2012-06-05 2014-03-26 太原理工大学 一种Cu-Ni-Si基合金及其制备方法
WO2013191022A1 (fr) * 2012-06-19 2013-12-27 株式会社村田製作所 Elément de jonction
CN102925746B (zh) * 2012-11-29 2014-09-17 宁波兴业鑫泰新型电子材料有限公司 高性能Cu-Ni-Si系铜合金及其制备和加工方法
KR101910702B1 (ko) * 2013-03-29 2018-10-22 후루카와 덴키 고교 가부시키가이샤 알루미늄 합금 선재, 알루미늄 합금 연선, 피복 전선, 와이어 하네스 및 알루미늄 합금 선재의 제조방법
CN103740975A (zh) * 2013-12-23 2014-04-23 烟台万隆真空冶金股份有限公司 一种铜-镍-硅合金及其制备方法
CN103695704A (zh) * 2013-12-26 2014-04-02 青岛友铭辰生物技术有限公司 一种电气电子设备用耐疲劳铜合金材料及其制备方法
CN103757479B (zh) * 2014-01-10 2016-01-20 滁州学院 一种无铅环保锌白铜合金材料及其制备方法
JP6210563B2 (ja) * 2015-04-10 2017-10-11 古河電気工業株式会社 ばね用銅合金線材、該ばね用銅合金線材の製造方法、並びにばね、該ばねの製造方法
CN105695797A (zh) * 2016-04-20 2016-06-22 苏州市相城区明达复合材料厂 一种铸造加工零部件用青铜合金
CN106282657A (zh) * 2016-08-31 2017-01-04 裴秀琴 一种铜合金新材料
CN107012357B (zh) * 2017-03-22 2018-11-06 合肥达户电线电缆科技有限公司 一种铜合金线材及其制备方法
RU2691823C1 (ru) * 2018-05-14 2019-06-18 Федеральное государственное бюджетное образовательное учреждение высшего образования Балтийский государственный технический университет "ВОЕНМЕХ" им. Д.Ф. Устинова (БГТУ "ВОЕНМЕХ") Способ термической обработки заготовки или изделия (пружин) из бронзы БрНХК 2,5-0,7-0,6
JP6629401B1 (ja) * 2018-08-30 2020-01-15 Ｊｘ金属株式会社 時効処理前のチタン銅板、プレス加工品およびプレス加工品の製造方法
JP2021098887A (ja) * 2019-12-20 2021-07-01 Ｊｘ金属株式会社 積層造形用金属粉末及び該金属粉末を用いて作製した積層造形物
JP7525322B2 (ja) 2020-07-29 2024-07-30 Ｄｏｗａメタルテック株式会社 Ｃｕ－Ｎｉ－Ｃｏ－Ｓｉ系銅合金板材、その製造方法および導電ばね部材

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020127133A1 (en) * 2000-07-25 2002-09-12 Takayuki Usami Copper alloy material for parts of electronic and electric machinery and tools
JP2004307905A (ja) * 2003-04-03 2004-11-04 Sumitomo Metal Ind Ltd Ｃｕ合金およびその製造方法
JP2004353069A (ja) * 2003-05-30 2004-12-16 Nikko Metal Manufacturing Co Ltd 電子材料用銅合金
US20050263218A1 (en) * 2004-05-27 2005-12-01 The Furukawa Electric Co., Ltd. Copper alloy
EP1873266A1 (fr) * 2005-02-28 2008-01-02 The Furukawa Electric Co., Ltd. Alliage de cuivre
JP2008024999A (ja) * 2006-07-24 2008-02-07 Dowa Holdings Co Ltd 耐力および曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板材

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3797882B2 (ja) * 2001-03-09 2006-07-19 株式会社神戸製鋼所 曲げ加工性が優れた銅合金板
JP4255330B2 (ja) 2003-07-31 2009-04-15 日鉱金属株式会社 疲労特性に優れたＣｕ−Ｎｉ−Ｓｉ系合金部材
JP4959141B2 (ja) * 2005-02-28 2012-06-20 Ｄｏｗａホールディングス株式会社 高強度銅合金
JP2007169764A (ja) * 2005-12-26 2007-07-05 Furukawa Electric Co Ltd:The 銅合金
JP2006200042A (ja) * 2006-03-23 2006-08-03 Kobe Steel Ltd 曲げ加工性に優れた銅合金板からなる電子部品
JP4143662B2 (ja) * 2006-09-25 2008-09-03 日鉱金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020127133A1 (en) * 2000-07-25 2002-09-12 Takayuki Usami Copper alloy material for parts of electronic and electric machinery and tools
JP2004307905A (ja) * 2003-04-03 2004-11-04 Sumitomo Metal Ind Ltd Ｃｕ合金およびその製造方法
JP2004353069A (ja) * 2003-05-30 2004-12-16 Nikko Metal Manufacturing Co Ltd 電子材料用銅合金
US20050263218A1 (en) * 2004-05-27 2005-12-01 The Furukawa Electric Co., Ltd. Copper alloy
EP1873266A1 (fr) * 2005-02-28 2008-01-02 The Furukawa Electric Co., Ltd. Alliage de cuivre
JP2008024999A (ja) * 2006-07-24 2008-02-07 Dowa Holdings Co Ltd 耐力および曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板材

Also Published As

Publication number Publication date
WO2009104615A1 (fr) 2009-08-27
JPWO2009104615A1 (ja) 2011-06-23
US20100310413A1 (en) 2010-12-09
US20110259480A1 (en) 2011-10-27
CN101946014A (zh) 2011-01-12
EP2256219A1 (fr) 2010-12-01

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Legal Events

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Effective date: 20120531

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Ipc: C22C 9/06 20060101AFI20120524BHEP

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