EP2154257A4 - Alliage à base de cu-ni-si pour un matériau électronique - Google Patents
Alliage à base de cu-ni-si pour un matériau électroniqueInfo
- Publication number
- EP2154257A4 EP2154257A4 EP08739256A EP08739256A EP2154257A4 EP 2154257 A4 EP2154257 A4 EP 2154257A4 EP 08739256 A EP08739256 A EP 08739256A EP 08739256 A EP08739256 A EP 08739256A EP 2154257 A4 EP2154257 A4 EP 2154257A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- based alloy
- electronic material
- electronic
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000956 alloy Substances 0.000 title 1
- 229910045601 alloy Inorganic materials 0.000 title 1
- 239000012776 electronic material Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007094441 | 2007-03-30 | ||
PCT/JP2008/056138 WO2008123433A1 (fr) | 2007-03-30 | 2008-03-28 | Alliage à base de cu-ni-si pour un matériau électronique |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2154257A1 EP2154257A1 (fr) | 2010-02-17 |
EP2154257A4 true EP2154257A4 (fr) | 2012-01-11 |
EP2154257B1 EP2154257B1 (fr) | 2016-10-05 |
Family
ID=39830918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08739256.9A Active EP2154257B1 (fr) | 2007-03-30 | 2008-03-28 | Alliage à base de cu-ni-si pour un matériau électronique |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100086435A1 (fr) |
EP (1) | EP2154257B1 (fr) |
JP (1) | JP4418028B2 (fr) |
KR (1) | KR101211984B1 (fr) |
CN (1) | CN101646792B (fr) |
TW (1) | TWI395824B (fr) |
WO (1) | WO2008123433A1 (fr) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101114147B1 (ko) * | 2008-03-31 | 2012-03-13 | 후루카와 덴키 고교 가부시키가이샤 | 전기전자기기용 동합금 재료 및 전기전자부품 |
EP2270242B1 (fr) * | 2008-03-31 | 2014-06-04 | The Furukawa Electric Co., Ltd. | Matériau d'alliage de cuivre destiné à des appareils électriques ou électroniques, procédé de son fabrication et composant |
KR20120104553A (ko) * | 2009-12-02 | 2012-09-21 | 후루카와 덴키 고교 가부시키가이샤 | 저영율을 갖는 구리합금판재 및 그 제조법 |
CN102822364A (zh) * | 2010-04-02 | 2012-12-12 | Jx日矿日石金属株式会社 | 电子材料用Cu-Ni-Si系合金 |
JP5045784B2 (ja) * | 2010-05-14 | 2012-10-10 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 |
JP5714863B2 (ja) | 2010-10-14 | 2015-05-07 | 矢崎総業株式会社 | 雌端子および雌端子の製造方法 |
JP5712585B2 (ja) * | 2010-12-03 | 2015-05-07 | 三菱マテリアル株式会社 | 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 |
JP5684022B2 (ja) * | 2011-03-28 | 2015-03-11 | 三菱伸銅株式会社 | 耐応力緩和特性と曲げ加工後の耐疲労特性およびばね特性に優れたCu−Ni−Si系銅合金板およびその製造方法 |
US9159985B2 (en) * | 2011-05-27 | 2015-10-13 | Ostuka Techno Corporation | Circuit breaker and battery pack including the same |
JP5903842B2 (ja) | 2011-11-14 | 2016-04-13 | 三菱マテリアル株式会社 | 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法 |
KR101274063B1 (ko) * | 2013-01-22 | 2013-06-12 | 한국기계연구원 | 배향된 석출물을 가지는 금속복합재료 및 이의 제조방법 |
KR101709560B1 (ko) | 2013-09-27 | 2017-02-23 | 주식회사 엘지화학 | 낮은 저항의 전극 탭을 포함하는 이차전지 |
JP6452472B2 (ja) * | 2014-01-27 | 2019-01-16 | 古河電気工業株式会社 | 銅合金材およびその製造方法 |
CN105385890A (zh) * | 2015-11-27 | 2016-03-09 | 宁波博威合金材料股份有限公司 | 一种含镍、硅的青铜合金及其应用 |
CN105821238B (zh) * | 2016-05-31 | 2018-01-02 | 黄河科技学院 | 一种铜合金材料及其制备方法 |
CN106191725B (zh) * | 2016-06-24 | 2018-01-26 | 河南江河机械有限责任公司 | 高强度高导电铜合金纳米相析出工艺方法 |
CN108193080B (zh) * | 2016-12-08 | 2019-12-17 | 北京有色金属研究总院 | 高强度、高导电耐应力松弛铜镍硅合金材料及其制备方法 |
CN109609801A (zh) * | 2018-12-06 | 2019-04-12 | 宁波博威合金材料股份有限公司 | 高性能铜合金及其制备方法 |
CN115386766A (zh) * | 2022-08-11 | 2022-11-25 | 中国科学院金属研究所 | 一种Cu-Ni-Si-Cr-Mg五元铜合金及其制备方法 |
WO2024090450A1 (fr) | 2022-10-24 | 2024-05-02 | 三菱マテリアル株式会社 | Poudre d'alliage de cuivre pour fa métal et procédé de fabrication d'un article moulé stratifié |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05179377A (ja) * | 1991-12-27 | 1993-07-20 | Kobe Steel Ltd | 曲げ加工性が優れた高力銅合金及びその製造方法 |
JP2001207229A (ja) * | 2000-01-27 | 2001-07-31 | Nippon Mining & Metals Co Ltd | 電子材料用銅合金 |
JP2005350696A (ja) * | 2004-06-08 | 2005-12-22 | Hitachi Cable Ltd | 端子・コネクタ用銅合金の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61115249A (ja) | 1984-11-09 | 1986-06-02 | Sanyo Electric Co Ltd | 電気機械変換器の支持装置 |
JP2862942B2 (ja) | 1990-03-20 | 1999-03-03 | 古河電気工業株式会社 | コルソン合金の熱処理方法 |
JPH0718356A (ja) * | 1993-07-01 | 1995-01-20 | Mitsubishi Electric Corp | 電子機器用銅合金、その製造方法およびicリードフレーム |
JP4177221B2 (ja) | 2003-10-06 | 2008-11-05 | 古河電気工業株式会社 | 電子機器用銅合金 |
EP1873266B1 (fr) * | 2005-02-28 | 2012-04-25 | The Furukawa Electric Co., Ltd. | Alliage de cuivre |
CN1776997B (zh) * | 2005-12-13 | 2010-05-05 | 江苏科技大学 | 大容量汽轮发电机转子铜合金槽楔及其制备方法 |
-
2008
- 2008-03-28 CN CN2008800101895A patent/CN101646792B/zh active Active
- 2008-03-28 WO PCT/JP2008/056138 patent/WO2008123433A1/fr active Application Filing
- 2008-03-28 EP EP08739256.9A patent/EP2154257B1/fr active Active
- 2008-03-28 JP JP2009509224A patent/JP4418028B2/ja active Active
- 2008-03-28 TW TW097111276A patent/TWI395824B/zh active
- 2008-03-28 KR KR1020097022449A patent/KR101211984B1/ko active IP Right Grant
- 2008-03-28 US US12/532,929 patent/US20100086435A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05179377A (ja) * | 1991-12-27 | 1993-07-20 | Kobe Steel Ltd | 曲げ加工性が優れた高力銅合金及びその製造方法 |
JP2001207229A (ja) * | 2000-01-27 | 2001-07-31 | Nippon Mining & Metals Co Ltd | 電子材料用銅合金 |
JP2005350696A (ja) * | 2004-06-08 | 2005-12-22 | Hitachi Cable Ltd | 端子・コネクタ用銅合金の製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of WO2008123433A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP4418028B2 (ja) | 2010-02-17 |
EP2154257A1 (fr) | 2010-02-17 |
JPWO2008123433A1 (ja) | 2010-07-15 |
KR101211984B1 (ko) | 2012-12-13 |
TWI395824B (zh) | 2013-05-11 |
CN101646792A (zh) | 2010-02-10 |
CN101646792B (zh) | 2012-02-22 |
WO2008123433A1 (fr) | 2008-10-16 |
US20100086435A1 (en) | 2010-04-08 |
EP2154257B1 (fr) | 2016-10-05 |
TW200902732A (en) | 2009-01-16 |
KR20090123017A (ko) | 2009-12-01 |
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