EP0177759A1 - Electronic component, in particular for a chip inductor - Google Patents
Electronic component, in particular for a chip inductor Download PDFInfo
- Publication number
- EP0177759A1 EP0177759A1 EP85111179A EP85111179A EP0177759A1 EP 0177759 A1 EP0177759 A1 EP 0177759A1 EP 85111179 A EP85111179 A EP 85111179A EP 85111179 A EP85111179 A EP 85111179A EP 0177759 A1 EP0177759 A1 EP 0177759A1
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- Prior art keywords
- contact elements
- recesses
- electronic component
- component according
- winding
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- 238000004804 winding Methods 0.000 claims abstract description 20
- 239000007787 solid Substances 0.000 claims abstract description 5
- 239000012811 non-conductive material Substances 0.000 claims abstract description 4
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 3
- 229910000859 α-Fe Inorganic materials 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000012216 screening Methods 0.000 claims 1
- IHQKEDIOMGYHEB-UHFFFAOYSA-M sodium dimethylarsinate Chemical class [Na+].C[As](C)([O-])=O IHQKEDIOMGYHEB-UHFFFAOYSA-M 0.000 claims 1
- 239000010410 layer Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000005291 magnetic effect Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/045—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
- H01F2027/295—Surface mounted devices with flexible terminals
Definitions
- the invention relates to an electronic component, in particular for a chip inductance, in particular air coil and RF choke, with a solid core part with a vertical prismatic spatial shape, in particular cuboids, cubes or cylinders, consisting of ferromagnetic or electrically non-conductive material, in particular ferrite, ceramic or Plastic, with a winding space that can be wound in one or more layers and is set apart from parallel ends of the core part and with recesses arranged in the area of these ends for receiving electrical contact elements.
- Chip inductors are smaller in comparison to conventional wired inductors, can be manufactured with less effort and are more suitable for use in the automatic assembly machines for printed circuit boards.
- the known chip inductors are partly produced using layer technology and partly designed as rectangular or cylindrical, wire-wound magnetic cores, in particular ferrite cores
- a carrier is coated with a layer of magnetic material and a conductor track shaped into a coil is applied to this layer, the partial inductance thus produced being combined with further partial inductances to form a stack, depending on the desired inductance.
- Numerous methods are not known for through-contacting the ends of the individual coils or partial inductors
- chip inductors are characterized by their space-saving design, can be killed directly on printed circuit boards and do not require any additional wires as connection elements.
- the disadvantage is their complex production, which is due to the layering technique. Variations in the layer thickness of the magnetic layer that are unavoidable in production cause undesirable fluctuations in the L and Q values of the inductors. Silver or a silver-palladium alloy, for example, must be used as the material for the coil conductor tracks and a high ohmic resistance of the conductor tracks must be accepted. Since the conductor tracks are embedded in the magnetic layer, magnetic saturation occurs due to the closed magnetic circuit even at low values; the DC bias properties of the chip inductance are consequently deteriorated. In addition, the number of coil turns cannot be selected to any desired height and therefore no inductance of any desired value can be set.
- a likewise known chip inductor has a rectangular ferrite core with a rectangular or cylindrical central part as a winding support and flanges integrally formed on this support, which also have a rectangular cross section.
- the winding ends are contacted by means of electrically conductive layers on the flanges on the end face, to which the winding ends are soldered.
- the finished wrap is embedded in synthetic resin, which forms a cuboid together with the flanges
- connection elements have to be fastened to the coil core in two processing steps. First, a metal plate is glued to the coil body and only then is the actual connection strip soldered on.
- US Pat. No. 3,585,553 discloses a chip inductor with a solid ferrite part with a cuboid shape, which has a winding space which is wound in one layer and is set down against the parallel ends of the core part and has recesses arranged in the region of these ends for leading out the winding ends.
- the recesses are guided in the longitudinal direction of the chip inductor and the surfaces of the stimulators arranged on both sides are covered with electrically conductive layers, via which the winding ends are contacted.
- the structure of this chip inductor is relatively simple; however, the electrically conductive contact layers have to be manufactured in a complicated manner.
- the present invention has for its object to provide an electronic component of the type mentioned, which can be produced with little effort, is suitable for manufacturing chip inductors and meets the requirements of certain electronic devices in terms of high resonance frequencies insofar as it e.g. single layer and can be wound with high numbers of turns despite small dimensions.
- the connection elements of this electronic component should also be such that they meet both the high mechanical requirements such. B. during assembly and also the mechanical loads caused by any bending of the printed circuit boards.
- the invention provides for an electronic component according to the preamble of the patent claim that the end faces of parallel ends of the core part of this electronic component have mutually parallel cutouts which run over the entire narrow or broad side of these end faces and which accommodate platelet-shaped contact elements are suitable.
- the contact elements which are glued, clamped or resiliently held in the recesses, protrude with their one ends in each case beyond the ends and are in these parts intended for winding the winding ends, e.g. bent in a U-shape or permitted as connector pins
- the production of these electronic components and their chip inductors is considerably simplified if - as is known per se - the contact elements are first formed as detachable parts of a system carrier, the wound core parts are placed on these contact elements, their winding ends are wound onto the contact elements and - if necessary required - the chip inductance manufactured in this way is encased with insulating material, which can be mixed with carbonyl iron or ferrite for certain shielding requirements.
- the system carriers equipped with these chip inductors can be separated before or, if necessary, only after they have been coated with insulating material.
- Fig. 1 is a solid core part in cuboid shape, which z. B. in the manufacture of an RF choke made of magnetic material, in particular ferrite, or, if z. B. an air coil is to be made of electrical non-conductive material, in particular ceramic or plastic.
- the core part 1 is formed with a winding space opposite its one parallel ends 2, which in the exemplary embodiment shown carries a single-layer winding 4.
- the end faces of the ends 2, 2 have parallel cut-outs 3, 3, which run over the entire narrow or broad side of the end faces and have a dovetail-shaped cross section.
- Platelet-shaped contact elements 5 are inserted into these recesses and are chamfered at one corner edge 7 to facilitate their insertion.
- the contact elements 5 each have a part 8 projecting over the front ends 2, 2 and bent in a U-shape and intended for winding the winding ends 6.
- the contact elements 5 can be glued into the recesses 3 or can be resiliently held in the recesses by appropriate design of their parts guided in the recess.
- the chip inductance is surrounded by an insulating material covering 11, which can be offset with carbonyl iron or ferrite for shielding.
- the contacting of the winding ends 7 with the contact elements 5, the z. B. can be carried out by means of welding or soldering, takes place here directly in the part of the contact elements 5 guided in the recesses 3.
- the parts 12 of the contact elements 5 led out of the insulating material sheath 11 can, for. B. be designed as connector pins for drilled circuit boards.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
Abstract
Elektronisches Bauteil für eine Chip-Induktivität, insbesondere Luftspule, HF-Drossel und Übertrager, mit einem massiven Kernteil (1) aus ferromagnetischem oder elektrisch nichtleitenden Werkstoff, mit einem ein- oder mehrlagig bewickelbaren und gegenüber parallelen Stirnenden (2, 2) des Kernteils (1) abgesetzten Wickelraum und mit im Bereich dieser Stirnenden angeordneten schwalbenschwanzförmigen Aussparungen (3, 3) zur Aufnahme plättchenförmiger elektrischer Kontaktelemente (5, 5), die in diese Aussparungen eingeklebt, eingeklemmt oder unter der Wirkung federnder Eigenschaften der Kontaktelemente in diesen Aussparungen gehalten sind.Electronic component for a chip inductance, in particular air coil, HF choke and transformer, with a solid core part (1) made of ferromagnetic or electrically non-conductive material, with a single or multi-layer winding and opposite parallel ends (2, 2) of the core part ( 1) remote winding space and with dovetail-shaped recesses (3, 3) arranged in the area of these ends for receiving plate-shaped electrical contact elements (5, 5) which are glued, clamped into these recesses or held in these recesses under the action of resilient properties of the contact elements.
Description
Die Erfindung betrifft ein elektronisches Bauteil, insbesondere für eine Chip-Induktivität, insbesondere Luftspule und HF-Drossel, mit einem massiven Kemteil mit senkrechter prismatischer Raumform, insbesondere Quader, Würfel oder Zylinder, bestehend aus ferromagnetischen oder elektrisch nichtleitendem Werkstoff, insbesondere Ferrit, Keramik oder Kunststoff, mit einem ein- oder mehrlagig bewickelbaren und gegenüber parallelen Stimenden des Kemteils abgesetzten Wickelraum und mit im Bereich dieser Stimenden angeordneten Aussparungen zur Aufnahme elektrischer Kontaktelemente.The invention relates to an electronic component, in particular for a chip inductance, in particular air coil and RF choke, with a solid core part with a vertical prismatic spatial shape, in particular cuboids, cubes or cylinders, consisting of ferromagnetic or electrically non-conductive material, in particular ferrite, ceramic or Plastic, with a winding space that can be wound in one or more layers and is set apart from parallel ends of the core part and with recesses arranged in the area of these ends for receiving electrical contact elements.
Chip-Induktivitäten sind im Vergleich zu üblichen bedrahteten Induktivitäten kleiner, mit geringerem Aufwand herstellbar und für den Einsatz für den Bestükkungsautomaten für Leiterplatten geeigneter. Die be- ' kannten Chip-Induktivitäten sind teils in Schichttechnik hergestellt und teils als rechteckige oder zylinderförmige, drahtbewickette magnetische Kerne, insbesondere Ferritkerne gestaltetChip inductors are smaller in comparison to conventional wired inductors, can be manufactured with less effort and are more suitable for use in the automatic assembly machines for printed circuit boards. The known chip inductors are partly produced using layer technology and partly designed as rectangular or cylindrical, wire-wound magnetic cores, in particular ferrite cores
Zur Fertigung der Chip-Induktivität in Schichttechnik wird ein Träger mit einer Schicht aus magnetischem Werkstoff beschichtet und auf diese Schicht eine zu einer Spule geformte Leiterbahn aufgebracht, wobei je nach gewünschter Induktivität die so gefertigte Teilinduktivität mit weiteren Teilinduktivitäten zu einem Stapel zusammengefaßt wird. Zur Durchkontaktierung der Enden der einzelnen Spulen bzw. Teilinduktivitäten sind zahlreiche hier nicht näher erläuterte Verfahren bekanntTo manufacture the chip inductance in layer technology, a carrier is coated with a layer of magnetic material and a conductor track shaped into a coil is applied to this layer, the partial inductance thus produced being combined with further partial inductances to form a stack, depending on the desired inductance. Numerous methods are not known for through-contacting the ends of the individual coils or partial inductors
Diese Chip-Induktivitäten zeichnen sich durch ihre raumsparende Bauweise aus, sind unmittelbar auf gedruckte Leiterplatten auftötbar und erfordern keine zusätzlichen Drähte als Anschlußelemente. Nachteilig ist allerdings ihre durch die Schichttechnik bedingte, aufwendige Herstellung. In der Fertigung unvermeidbare Schichtdicken-Schwankungen der magnetischen Schicht verursachen unerwünschte Schwankungen der L- und Q-Werte der Induktivitäten. Als Werkstoff für die Spulen-Leiterbahnen muß beispielsweise Silber oder eine Silber-Palladium-Legierung verwendet und ein hoher Ohm'scher Widerstand der Leiterbahnen in Kauf genommen werden. Da die Leiterbahnen in die magnetische Schicht eingebettet sind, tritt, verursacht durch den geschlossenen Magnetkreis bereits bei geringen Werten eine magnetische Sättigung ein; die Gleichstrom-Vormagnetisierungseigenschaften der Chip-Induktivität sind folglich verschlechtert. Auch ist die Anzahl der Spulenwindungen nicht beliebig hoch wählbar und damit keine beliebig hohe Induktivität einstellbar.These chip inductors are characterized by their space-saving design, can be killed directly on printed circuit boards and do not require any additional wires as connection elements. The disadvantage, however, is their complex production, which is due to the layering technique. Variations in the layer thickness of the magnetic layer that are unavoidable in production cause undesirable fluctuations in the L and Q values of the inductors. Silver or a silver-palladium alloy, for example, must be used as the material for the coil conductor tracks and a high ohmic resistance of the conductor tracks must be accepted. Since the conductor tracks are embedded in the magnetic layer, magnetic saturation occurs due to the closed magnetic circuit even at low values; the DC bias properties of the chip inductance are consequently deteriorated. In addition, the number of coil turns cannot be selected to any desired height and therefore no inductance of any desired value can be set.
Eine gleichfalls bekannte Chip-Induktivität besitzt einen rechteckförmigen Ferritkern mit rechteck- oder zylinderförmigem Mittelteil als Wickelträger und einstückig an diesen Träger angeformte Flansche, die gleichfalls rechteckförmigen Querschnitt haben. Die Kontaktierung der Wickelenden erfolgt mittels stimseitig an den Flanschen angeordneter, elektrisch leitender Schichten, auf welche die Wickelenden aufgelötet sind. Der fertige Wickel ist hier in Kunstharz eingebettet, das zusammen mit den Flanschen einen Quader bildetA likewise known chip inductor has a rectangular ferrite core with a rectangular or cylindrical central part as a winding support and flanges integrally formed on this support, which also have a rectangular cross section. The winding ends are contacted by means of electrically conductive layers on the flanges on the end face, to which the winding ends are soldered. The finished wrap is embedded in synthetic resin, which forms a cuboid together with the flanges
Zur . Behebung der diesem bekannten Chip-Induktivitätenteil fertigungstechnisch teils elektrisch teils mechanisch an haftenden Nachteile wurde darüberhinaus eine mit einem Ferrit-Rollenkem ausgerüstete Chip-Induktivität vorgeschlagen. Der bewickelte Rollenkern ist dabei in einen quaderförmigen Verguß eingebettet, gegen dessen eine Stirnflächen die Enden streifenförmiger Anschlußelemente anliegen, die mit ihren anderen Enden mit elektrisch leitenden lötfähigen Schichten der Stimflächen der Rollenkemflansche kontaktiert sind (siehe DE-OS 3225782 A1). Als nachteilig erweist sich bei dieser Ausführung, daß die Anschlußelemente in zwei Bearbeitungsschritten am Spulenkem befestigt werden müssen. Zuerst wird nämlich eine Metallplatte auf den Spulenkörper aufgeklebt und erst anschließend der eigentliche Anschluβstreifen angelötet.To. Eliminating the known chip inductance part in terms of manufacturing technology partly electrically partly mechanically adhering to disadvantages has also been proposed a chip inductor equipped with a ferrite core. The wound roll core is embedded in a cuboid potting, against the one end faces of which the ends of strip-shaped connecting elements rest, which are contacted at their other ends with electrically conductive solderable layers of the end faces of the roll core flanges (see DE-OS 3225782 A1). A disadvantage of this embodiment is that the connection elements have to be fastened to the coil core in two processing steps. First, a metal plate is glued to the coil body and only then is the actual connection strip soldered on.
Durch die US - A - 3,585,553 ist schließlich eine Chip-Induktivität mit einem massiven Ferritkeenteil mit Quaderform bekannt, die einen einlagig bewickelten, gegen die parallelen Stimenden des Kemteils abgesetzten Wickelraum und im Bereich dieser Stimenden angeordnete Aussparungen zur Herausführung der Wickelenden aufweist. Die Aussparungen sind dabei in Längsrichtung der Chip-Induktivität geführt und die beiderseits hierzu angeordneten Flächen der Stimenden mit elektrisch leitenden Schichten bedeckt, über welche die Kontaktierung der Wickelenden erfolgt Diese Chip-Induktivität ist zwar in ihrem Aufbau verhältnismässigeinfach; die elektrisch leitenden Kontaktschichten müssen jedoch in komplizierter Weise gefertigt werden.Finally, US Pat. No. 3,585,553 discloses a chip inductor with a solid ferrite part with a cuboid shape, which has a winding space which is wound in one layer and is set down against the parallel ends of the core part and has recesses arranged in the region of these ends for leading out the winding ends. The recesses are guided in the longitudinal direction of the chip inductor and the surfaces of the stimulators arranged on both sides are covered with electrically conductive layers, via which the winding ends are contacted. The structure of this chip inductor is relatively simple; however, the electrically conductive contact layers have to be manufactured in a complicated manner.
Der vorliegenden Erfindung liegt die Aufgabe zugrunde, ein elektronisches Bauteil der eingangs genannten Art zu schaffen, das mit nur geringem Aufwand herstellbar ist, zur Fertigung für Chip-Induktivitäten geeignet ist und den Arforderung bestimmter elektonischer Geräte auch hinsichtlich hoher Resonanzfrequenzen insoweit entgegenkommt, als es z.B. einlagig und trotz geringer Abmessungen mit hohen Windungszahlen bewickelbar ist. Die Anschlußelemente dieses elektronischen Bauteils sollen zusätzlich so beschaffen sein, daß sie sowohl den hohen mechanischen Anforderungen z. B. bei der Montage und auch den bei eventuell auftretender Durchbiegung der Leiterplatten verursachten mechanischen Belastungen genügen.The present invention has for its object to provide an electronic component of the type mentioned, which can be produced with little effort, is suitable for manufacturing chip inductors and meets the requirements of certain electronic devices in terms of high resonance frequencies insofar as it e.g. single layer and can be wound with high numbers of turns despite small dimensions. The connection elements of this electronic component should also be such that they meet both the high mechanical requirements such. B. during assembly and also the mechanical loads caused by any bending of the printed circuit boards.
Zur Lösung dieser Aufgabe sieht die Erfindung bei einem elektronischen Bauteil gemäß Oberbegriff des Patentanspruches vor, daß die Stirnflächen paralleler Stimenden des Kemteiles dieses elektronischen Bauteils zueinander parallele, über die gesamte Schmal= oder Breitseite dieser Stimfiächen geführte randoffene Aussparungen aufweisen, die zur Aufnahme von plättchenförmigen Kontaktefernenten geeignet sind.To achieve this object, the invention provides for an electronic component according to the preamble of the patent claim that the end faces of parallel ends of the core part of this electronic component have mutually parallel cutouts which run over the entire narrow or broad side of these end faces and which accommodate platelet-shaped contact elements are suitable.
Als randoffene Aussparungen sind z. B. Nuten und Schlitze insbesondere schwalbenschwanzförmigen Querschnitts geeignetAs open-edge recesses z. B. grooves and slots particularly suitable dovetail cross-section
Die Kontaktelemente, die in die Aussparungen eingeklebt, eingeklemmt oder federnd in diesen gehalten sind, ragen mit ihren einen Enden jeweils über die Stimenden hinaus und sind in diesen zum Anwickeln der Wickelenden bestimmten Teilen z.B. u-förmig gebogen oder als Steckerstifte gestattetThe contact elements, which are glued, clamped or resiliently held in the recesses, protrude with their one ends in each case beyond the ends and are in these parts intended for winding the winding ends, e.g. bent in a U-shape or permitted as connector pins
Zur Halterung der Kontaktelemente mit Klemmsitz in den Aussparungen empfiehlt es sich, die Aussparungen und die Kontaktelemente mit ihren in die Aussparungen einschiebbaren Teilen konisch zu gestatten.To hold the contact elements with a clamp fit in the cutouts, it is advisable to allow the cutouts and the contact elements with their parts which can be inserted into the cutouts conically.
Fertigungstechnisch wird die Herstellung dieser elektronischen Bauteile und ihrer Chip-Induktivitäten erheblich vereinfacht, wenn - wie an sich bekannt ist - die Kontektelemente zunächst als abtrennbare Teile eine Systemträgers susgebildet, auf diese Kontaktelemente die bewickelten Kernteile aufgesbeckt, ihre Wickelenden an die Kontaktelemente angewickelt und - falls erforderlich - die so gefertigte Chip-Induktivität mit Isolierstoff umhüllt wird, der bei bestimmten Schirmungsanforderungen mit Karbonyleisen oder Ferrit versetzt sein kann. Die Auftrennung der mit diesen Chip-Induktivitäten bestückten Systemträger kann vor oder ggf. erst nach der Umhüllung mit Isolierstoff erfolgen.In terms of manufacturing technology, the production of these electronic components and their chip inductors is considerably simplified if - as is known per se - the contact elements are first formed as detachable parts of a system carrier, the wound core parts are placed on these contact elements, their winding ends are wound onto the contact elements and - if necessary required - the chip inductance manufactured in this way is encased with insulating material, which can be mixed with carbonyl iron or ferrite for certain shielding requirements. The system carriers equipped with these chip inductors can be separated before or, if necessary, only after they have been coated with insulating material.
Die Erfindung wird nachstehend anhand von Ausführungbeispielen näher erläutert.The invention is explained in more detail below with the aid of exemplary embodiments.
Es zeigt
- Fig. 1 eine Chip-Induktivität nach der Erfindung in teils geschnittener und perspektivischer Ansicht
- Fig. 2 in der Darstellung nach Fig. 1 ein zweites Ausführungsbeispiel einer Chip-Induktivität nach der Erfindung, die mit Isolierstoff umhüllt ist.
- Fig. 1 shows a chip inductor according to the invention in a partially sectioned and perspective view
- Fig. 2 in the representation of Fig. 1 shows a second embodiment of a chip inductor according to the invention, which is coated with insulating material.
Gleiche Teile sind dabei mit gleichen Bezugszeichen bezeichnetThe same parts are designated with the same reference numerals
Mit 1 ist in Fig. 1 ein massives Kemteil in Quaderform, bezeichnet, das z. B. bei einer Fertigung einer HF-Drossel aus magnetischem Werkstoff, insbesondere Ferrit, oder, falls z. B. eine Luftspule gefertigt werden soll, aus elektrischem nichtteitenden Werkstoff, insbesondere Keramik oder Kunststoff besteht Das Kernteil 1 ist mit einem gegenüber seinen einen parallelen Stimenden 2 abgesetzten Wickelraum ausgebildet, der im gezeigten Ausführungsbeispiel eine einlagige Wicklung 4 trägt Die Stimflächen der Stirnenden 2, 2 weisen zueinder parallele, über die gesamte Schmal = bzw. Breitseite der Stimflächen geführte randoffene Aussparungen 3, 3 auf, die einen schwalbenschwanzförmigen Querschnitt besitzen. 1 in Fig. 1 is a solid core part in cuboid shape, which z. B. in the manufacture of an RF choke made of magnetic material, in particular ferrite, or, if z. B. an air coil is to be made of electrical non-conductive material, in particular ceramic or plastic. The core part 1 is formed with a winding space opposite its one parallel ends 2, which in the exemplary embodiment shown carries a single-layer winding 4. The end faces of the ends 2, 2 have parallel cut-outs 3, 3, which run over the entire narrow or broad side of the end faces and have a dovetail-shaped cross section.
In diese Aussparungen sind plättchenförmige Kontaktelemente 5 eingeschoben, die zu ihrer erleichterten Einführung an ihren einen Eckkanten 7 abgeschrägt sind. Die Kontaktelemente 5 weisen dabei jeweils einen über die Stirnenden 2, 2 ragenden u-förmig gebogenen und zum Anwickeln der Wickelenden 6 bestimmten Teil 8 auf.Platelet-
Die Kontaktelemente 5 können in die Aussparungen 3 eingeklebt oder durch entsprechende Gestaltung ihrer in den Aussparung geführten Teile federnd in den Aussparungen gehalten sein.The
Im Ausführungsbeispiel nach Fig. 2 ist die Chip-Induktivität mit einer Isolierstoff-Umhüllung 11 umgeben, die zur Schirmung mit Karbonyleisen oder Ferrit versetzt sein kann. Die Kontaktierung der Wickelenden 7 mit den Kontaktelementen 5, die z. B. mittels Schweißen oder Löten durchführbar ist, erfolgt hier unmittelbar in dem in den Aussparungen 3 geführten Teil der Kontaktelemente 5. Die aus der Isolierstoff-Umhüllung 11 herausgeführten Teile 12 der Kontaktelemente 5 können z. B. als Steckerstifte für gebohrte Leiterplatten ausgebildet sein.In the exemplary embodiment according to FIG. 2, the chip inductance is surrounded by an insulating material covering 11, which can be offset with carbonyl iron or ferrite for shielding. The contacting of the winding ends 7 with the
Claims (11)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3433692 | 1984-09-13 | ||
| DE3433692 | 1984-09-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0177759A1 true EP0177759A1 (en) | 1986-04-16 |
| EP0177759B1 EP0177759B1 (en) | 1990-05-16 |
Family
ID=6245346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP85111179A Expired - Lifetime EP0177759B1 (en) | 1984-09-13 | 1985-09-04 | Electronic component, in particular for a chip inductor |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4704592A (en) |
| EP (1) | EP0177759B1 (en) |
| JP (1) | JPS6171609A (en) |
| DE (1) | DE3577771D1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4332638A1 (en) * | 1993-09-24 | 1995-03-30 | Siemens Matsushita Components | Chip inductance |
| EP0675513A1 (en) * | 1994-03-30 | 1995-10-04 | Matsushita Electric Industrial Co., Ltd. | Chip inductor |
| EP1250828A1 (en) * | 2000-01-13 | 2002-10-23 | Sonion Microtronic Nederland B.V. | Packaging and rf shielding for telecoils |
| DE19547091B4 (en) * | 1995-12-16 | 2005-04-07 | Kaschke Kg (Gmbh & Co.) | Antenna coil with surface mountable housing and method of making the same |
| DE10031599B4 (en) * | 1999-06-29 | 2005-06-23 | Matsushita Electric Industrial Co., Ltd., Kadoma | coil element |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2606544B1 (en) * | 1986-11-07 | 1990-05-18 | Thomson Csf | INDUCTANCE |
| JPS63187312U (en) * | 1987-05-26 | 1988-11-30 | ||
| JPH06325938A (en) * | 1993-05-11 | 1994-11-25 | Murata Mfg Co Ltd | Winding type coil |
| DE4432740A1 (en) | 1994-09-14 | 1996-03-21 | Siemens Matsushita Components | Chip inductance |
| US6144280A (en) * | 1996-11-29 | 2000-11-07 | Taiyo Yuden Co., Ltd. | Wire wound electronic component and method of manufacturing the same |
| US5959587A (en) * | 1997-09-12 | 1999-09-28 | Ppg Industries Ohio, Inc. | On the glass antenna system |
| FI105294B (en) | 1997-12-16 | 2000-07-14 | Nokia Networks Oy | Arrangement for realizing a magnetic circuit on a circuit board |
| US6137390A (en) * | 1999-05-03 | 2000-10-24 | Industrial Technology Research Institute | Inductors with minimized EMI effect and the method of manufacturing the same |
| US7088211B2 (en) * | 2003-07-15 | 2006-08-08 | Astec International Limited | Space saving surface-mounted inductors |
| US20050145408A1 (en) * | 2003-12-03 | 2005-07-07 | Scott Hess | Electronic component |
| CN101501791A (en) * | 2006-07-14 | 2009-08-05 | 美商·帕斯脉冲工程有限公司 | Self-leaded surface mount inductors and methods |
| US20150137919A1 (en) * | 2011-10-25 | 2015-05-21 | Correlated Magnetics Research, Llc | System and Method for Producing Magnetic Structures |
| US20120249107A1 (en) * | 2011-04-01 | 2012-10-04 | Cowley Nicholas P | Coupled inductor to facilitate integrated power delivery |
| EP2530686B1 (en) * | 2011-06-01 | 2014-08-06 | ABB Research Ltd. | Pressing of transformer windings during active part drying |
| US10136516B2 (en) | 2012-03-13 | 2018-11-20 | Intel Corporation | Microelectronic device attachment on a reverse microelectronic package |
| DE112012006033B4 (en) | 2012-03-13 | 2024-09-12 | Intel Corp. | Mounting a microelectronic device on an inverted microelectronic package |
| US9526175B2 (en) * | 2012-04-24 | 2016-12-20 | Intel Corporation | Suspended inductor microelectronic structures |
| US9177714B2 (en) * | 2012-12-28 | 2015-11-03 | Power Integrations, Inc. | Transverse shield wire for energy transfer element |
| JP2021002577A (en) * | 2019-06-21 | 2021-01-07 | 株式会社村田製作所 | Winding-type inductor component |
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| GB397536A (en) * | 1932-02-19 | 1933-08-21 | Pye Radio Ltd | Improvements in or relating to electrical transformers, particularly for use as intervalve transformers in radio apparatus |
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- 1985-08-01 US US06/761,288 patent/US4704592A/en not_active Expired - Fee Related
- 1985-09-04 EP EP85111179A patent/EP0177759B1/en not_active Expired - Lifetime
- 1985-09-04 DE DE8585111179T patent/DE3577771D1/en not_active Expired - Lifetime
- 1985-09-09 JP JP60199299A patent/JPS6171609A/en active Granted
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| US3533054A (en) * | 1968-01-11 | 1970-10-06 | United Carr Inc | Electrical terminal structure |
| US3735214A (en) * | 1972-01-27 | 1973-05-22 | Coilcraft Inc | A header for mounting circuit elements for incorporation in an electric circuit |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4332638A1 (en) * | 1993-09-24 | 1995-03-30 | Siemens Matsushita Components | Chip inductance |
| EP0675513A1 (en) * | 1994-03-30 | 1995-10-04 | Matsushita Electric Industrial Co., Ltd. | Chip inductor |
| DE19547091B4 (en) * | 1995-12-16 | 2005-04-07 | Kaschke Kg (Gmbh & Co.) | Antenna coil with surface mountable housing and method of making the same |
| DE10031599B4 (en) * | 1999-06-29 | 2005-06-23 | Matsushita Electric Industrial Co., Ltd., Kadoma | coil element |
| EP1250828A1 (en) * | 2000-01-13 | 2002-10-23 | Sonion Microtronic Nederland B.V. | Packaging and rf shielding for telecoils |
| EP1250828A4 (en) * | 2000-01-13 | 2006-08-02 | Sonion Microtronic Nederland B | Packaging and rf shielding for telecoils |
Also Published As
| Publication number | Publication date |
|---|---|
| US4704592A (en) | 1987-11-03 |
| JPS6171609A (en) | 1986-04-12 |
| JPH0564845B2 (en) | 1993-09-16 |
| DE3577771D1 (en) | 1990-06-21 |
| EP0177759B1 (en) | 1990-05-16 |
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