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DE69702767D1 - Photopolymerisierbare, wärmehärtbare harzzusammensetzung - Google Patents

Photopolymerisierbare, wärmehärtbare harzzusammensetzung

Info

Publication number
DE69702767D1
DE69702767D1 DE69702767T DE69702767T DE69702767D1 DE 69702767 D1 DE69702767 D1 DE 69702767D1 DE 69702767 T DE69702767 T DE 69702767T DE 69702767 T DE69702767 T DE 69702767T DE 69702767 D1 DE69702767 D1 DE 69702767D1
Authority
DE
Germany
Prior art keywords
reacting
unsaturated
resin composition
photopolymerizable
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69702767T
Other languages
English (en)
Other versions
DE69702767T2 (de
Inventor
Yasuharu Nojima
Toyoyuki Ido
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Ciba Spezialitaetenchemie Holding AG
Ciba SC Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Spezialitaetenchemie Holding AG, Ciba SC Holding AG filed Critical Ciba Spezialitaetenchemie Holding AG
Publication of DE69702767D1 publication Critical patent/DE69702767D1/de
Application granted granted Critical
Publication of DE69702767T2 publication Critical patent/DE69702767T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
DE69702767T 1996-06-28 1997-06-17 Photopolymerisierbare, wärmehärtbare harzzusammensetzung Expired - Lifetime DE69702767T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16923696A JP3254572B2 (ja) 1996-06-28 1996-06-28 光重合性熱硬化性樹脂組成物
PCT/EP1997/003141 WO1998000759A1 (en) 1996-06-28 1997-06-17 Photopolymerizable thermosetting resin composition

Publications (2)

Publication Number Publication Date
DE69702767D1 true DE69702767D1 (de) 2000-09-14
DE69702767T2 DE69702767T2 (de) 2001-04-12

Family

ID=15882768

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69702767T Expired - Lifetime DE69702767T2 (de) 1996-06-28 1997-06-17 Photopolymerisierbare, wärmehärtbare harzzusammensetzung

Country Status (9)

Country Link
US (1) US6399277B1 (de)
EP (1) EP0909407B1 (de)
JP (1) JP3254572B2 (de)
CN (1) CN1179244C (de)
AT (1) ATE195378T1 (de)
AU (1) AU3259797A (de)
DE (1) DE69702767T2 (de)
TW (1) TW448191B (de)
WO (1) WO1998000759A1 (de)

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JP4683182B2 (ja) * 2004-09-28 2011-05-11 山栄化学株式会社 感光性熱硬化性樹脂組成物、並びにレジスト被覆プリント配線板及びその製造法
TW200630447A (en) * 2004-11-19 2006-09-01 Showa Denko Kk Resin cured film for flexible printed wiring board and production process thereof
JP5330633B2 (ja) * 2005-04-28 2013-10-30 日立化成株式会社 樹脂組成物、及びそれを用いた光学部材とその製造方法
KR100845697B1 (ko) 2005-05-04 2008-07-11 주식회사 엘지화학 유기 전계발광 소자의 절연막용 감방사선성 수지 조성물
JP4880249B2 (ja) * 2005-05-31 2012-02-22 第一工業製薬株式会社 光ラジカル架橋型ポリマー及び光硬化樹脂組成物
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JP5404028B2 (ja) * 2008-12-25 2014-01-29 東京応化工業株式会社 被エッチング基体の製造方法
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JP5797680B2 (ja) * 2013-03-04 2015-10-21 株式会社タムラ製作所 活性エネルギー線硬化性樹脂組成物
WO2016017473A1 (ja) * 2014-07-31 2016-02-04 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
KR102591306B1 (ko) * 2014-12-02 2023-10-20 제이에스알 가부시끼가이샤 포토레지스트 조성물 및 그의 제조 방법, 및 레지스트 패턴 형성 방법
JP6055028B2 (ja) * 2015-05-29 2016-12-27 互応化学工業株式会社 感光性樹脂組成物、ソルダーレジスト用組成物及びプリント配線板
JP6541460B2 (ja) * 2015-06-24 2019-07-10 東京応化工業株式会社 パターン形成方法
CN106318019B (zh) * 2015-07-06 2020-03-17 南亚塑胶工业股份有限公司 印刷电路板用低介电抗焊光阻油墨组合物
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WO2017217243A1 (ja) * 2016-06-16 2017-12-21 Dic株式会社 エポキシ（メタ）アクリレート樹脂及びレジスト部材
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Also Published As

Publication number Publication date
US6399277B1 (en) 2002-06-04
JPH1020493A (ja) 1998-01-23
JP3254572B2 (ja) 2002-02-12
WO1998000759A1 (en) 1998-01-08
EP0909407A1 (de) 1999-04-21
AU3259797A (en) 1998-01-21
DE69702767T2 (de) 2001-04-12
EP0909407B1 (de) 2000-08-09
CN1179244C (zh) 2004-12-08
ATE195378T1 (de) 2000-08-15
CN1223727A (zh) 1999-07-21
TW448191B (en) 2001-08-01

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