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DE60115909D1 - Reinigungsmittelzusammensetzung - Google Patents

Reinigungsmittelzusammensetzung

Info

Publication number
DE60115909D1
DE60115909D1 DE60115909T DE60115909T DE60115909D1 DE 60115909 D1 DE60115909 D1 DE 60115909D1 DE 60115909 T DE60115909 T DE 60115909T DE 60115909 T DE60115909 T DE 60115909T DE 60115909 D1 DE60115909 D1 DE 60115909D1
Authority
DE
Germany
Prior art keywords
detergent composition
detergent
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60115909T
Other languages
English (en)
Other versions
DE60115909T2 (de
Inventor
Akimitsu Sakai
Atsushi Tamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Application granted granted Critical
Publication of DE60115909D1 publication Critical patent/DE60115909D1/de
Publication of DE60115909T2 publication Critical patent/DE60115909T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0042—Reducing agents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/268—Carbohydrates or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • C23G1/20—Other heavy metals
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Molecular Biology (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
DE60115909T 2000-06-16 2001-06-14 Reinigungsmittelzusammensetzung Expired - Lifetime DE60115909T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000181141 2000-06-16
JP2000181141 2000-06-16
PCT/JP2001/005091 WO2001097268A1 (fr) 2000-06-16 2001-06-14 Composion detergente

Publications (2)

Publication Number Publication Date
DE60115909D1 true DE60115909D1 (de) 2006-01-19
DE60115909T2 DE60115909T2 (de) 2006-09-07

Family

ID=18682119

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60115909T Expired - Lifetime DE60115909T2 (de) 2000-06-16 2001-06-14 Reinigungsmittelzusammensetzung

Country Status (5)

Country Link
US (1) US7396806B2 (de)
EP (1) EP1310989B1 (de)
KR (2) KR20030007969A (de)
DE (1) DE60115909T2 (de)
WO (1) WO2001097268A1 (de)

Families Citing this family (40)

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KR100410611B1 (ko) * 2001-04-03 2003-12-18 동우 화인켐 주식회사 스트립후 세정제
TWI295076B (en) * 2002-09-19 2008-03-21 Dongwoo Fine Chem Co Ltd Washing liquid for semiconductor substrate and method of producing semiconductor device
KR100974034B1 (ko) * 2002-11-08 2010-08-04 와코 쥰야꾸 고교 가부시키가이샤 세정액 및 이것을 이용한 세정방법
TWI286679B (en) 2003-06-04 2007-09-11 Kao Corp Removing agent composition
TWI362415B (en) * 2003-10-27 2012-04-21 Wako Pure Chem Ind Ltd Novel detergent and method for cleaning
KR100593668B1 (ko) 2004-01-20 2006-06-28 삼성전자주식회사 세정액 조성물 및 이를 이용한 반도체 장치의 세정방법
US7087564B2 (en) * 2004-03-05 2006-08-08 Air Liquide America, L.P. Acidic chemistry for post-CMP cleaning
EP1609847B1 (de) * 2004-06-25 2007-03-21 JSR Corporation Reinigungszusammensetzung für Halbleiterkomponente und Verfahren zur Herstellung eines Halbleitergeräts
JP2006016438A (ja) * 2004-06-30 2006-01-19 Dongwoo Fine-Chem Co Ltd 電子部品洗浄液
JP4792396B2 (ja) * 2004-08-31 2011-10-12 三洋化成工業株式会社 界面活性剤
US7674725B2 (en) 2005-05-25 2010-03-09 Freescale Semiconductor, Inc. Treatment solution and method of applying a passivating layer
JP2007220891A (ja) * 2006-02-16 2007-08-30 Toshiba Corp ポストｃｍｐ処理液、およびこれを用いた半導体装置の製造方法
JP4140923B2 (ja) * 2006-03-31 2008-08-27 花王株式会社 洗浄剤組成物
US7772128B2 (en) * 2006-06-09 2010-08-10 Lam Research Corporation Semiconductor system with surface modification
US9058975B2 (en) * 2006-06-09 2015-06-16 Lam Research Corporation Cleaning solution formulations for substrates
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US20090270299A1 (en) * 2008-04-23 2009-10-29 Nissan Chemical Industries, Ltd. Composition for removing protective layer in fabrication of MEMS and method for removing same
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US8765653B2 (en) 2009-07-07 2014-07-01 Air Products And Chemicals, Inc. Formulations and method for post-CMP cleaning
JP5515588B2 (ja) * 2009-10-05 2014-06-11 栗田工業株式会社 ウエハ用洗浄水及びウエハの洗浄方法
US8148311B2 (en) * 2009-10-24 2012-04-03 Wai Mun Lee Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid
US8431516B2 (en) 2009-10-24 2013-04-30 Wai Mun Lee Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid
KR101645036B1 (ko) * 2009-10-29 2016-08-03 동우 화인켐 주식회사 웨이퍼 다이싱용 세정제 조성물
CL2010000487A1 (es) * 2010-05-13 2011-04-08 Univ Santiago Chile Procedimiento para obtener electrodo de carbono desde desechos de pilas acidos que comprende extraer carbon de la pila, sacar recubrimiento, hervir, lavar, lijar y lavar hasta no obtener residuo, sonicar, lavar con solvente altamente apolar, sonicar y lavar con solventes organicos, hervir a ph acido y pulir.
JP5948758B2 (ja) * 2010-08-31 2016-07-06 三菱化学株式会社 半導体デバイス用基板洗浄液及び洗浄方法
JP5659729B2 (ja) * 2010-11-24 2015-01-28 三菱瓦斯化学株式会社 フォトレジスト剥離剤組成物
JP6066552B2 (ja) * 2011-12-06 2017-01-25 関東化學株式会社 電子デバイス用洗浄液組成物
US9133426B2 (en) * 2012-05-14 2015-09-15 Ecolab Usa Inc. Label removal solution for returnable beverage bottles
KR101467270B1 (ko) * 2013-11-07 2014-12-01 에이케이켐텍 주식회사 계면활성제 미포함 플럭스 제거용 수계 세정제 조성물
KR102261638B1 (ko) 2013-11-15 2021-06-08 삼성디스플레이 주식회사 세정제 조성물 및 이를 이용한 금속배선 제조방법
KR101670239B1 (ko) * 2014-10-31 2016-10-28 엘티씨에이엠 주식회사 포스트-에칭 포토레지스트 에칭 중합체 및 잔류물을 제거하기 위한 스트리퍼 조성물
US10988718B2 (en) 2016-03-09 2021-04-27 Entegris, Inc. Tungsten post-CMP cleaning composition
JP6697362B2 (ja) * 2016-09-23 2020-05-20 株式会社フジミインコーポレーテッド 表面処理組成物、ならびにこれを用いた表面処理方法および半導体基板の製造方法
KR101984468B1 (ko) * 2018-04-09 2019-05-30 한남대학교 산학협력단 친환경 세척제
US11560533B2 (en) 2018-06-26 2023-01-24 Versum Materials Us, Llc Post chemical mechanical planarization (CMP) cleaning
CN113412324B (zh) 2018-12-03 2022-12-02 富士胶片电子材料美国有限公司 蚀刻组合物
EP4204529A4 (de) 2020-08-28 2024-10-02 Versum Mat Us Llc Reinigung nach einer chemisch-mechanischen planarisierung (cmp)
JP2024536512A (ja) * 2021-10-12 2024-10-04 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド エッチング組成物
WO2023211110A1 (ko) * 2022-04-27 2023-11-02 (주)엠티아이 메탈 마스크 세정용 조성물 및 이를 이용한 세정 방법

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Also Published As

Publication number Publication date
KR100867287B1 (ko) 2008-11-06
EP1310989A1 (de) 2003-05-14
US20030158059A1 (en) 2003-08-21
EP1310989B1 (de) 2005-12-14
US7396806B2 (en) 2008-07-08
KR20030007969A (ko) 2003-01-23
DE60115909T2 (de) 2006-09-07
EP1310989A4 (de) 2003-07-16
KR20080011243A (ko) 2008-01-31
WO2001097268A1 (fr) 2001-12-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition