CN218071292U

CN218071292U - Integrated power module with good heat dissipation

Info

Publication number: CN218071292U
Application number: CN202220895087.3U
Authority: CN
Inventors: 顾同明; 房应圣
Original assignee: Yangzhou Pinuoer Electric Co ltd
Current assignee: Yangzhou Pinuoer Electric Co ltd
Priority date: 2022-04-18
Filing date: 2022-04-18
Publication date: 2022-12-16
Anticipated expiration: 2032-04-18

Abstract

The utility model discloses a power module with good integrated heat dissipation, which belongs to the technical field of power modules and comprises a module base and a radiation screen plate, wherein a module cover is arranged in the middle of the top end of the module base, a radiator shell is arranged at the top in the module cover, a power system shell is arranged at the bottom in the module cover, the radiation screen plate is arranged around the inner wall of the power system shell, a power substrate is arranged between the inner walls of the radiation screen plate, and a heat dissipation plate is arranged in the radiator shell; the utility model discloses a set up the high-efficient heat radiation structure who comprises components such as fin, first heat dissipation fan, second heat dissipation fan, heating panel, heat conduction pole, heat conduction glue and radiation otter board in traditional power module, on the limited usage space of power module, utilize principles such as conduction heat dissipation, convection type heat dissipation and radiation type heat dissipation, improved power module's radiating efficiency greatly, can ensure power module continuous safe work under high power state.

Description

Integrated power module with good heat dissipation

Technical Field

The utility model relates to a power module especially relates to a power module that integration heat dissipation is good, belongs to power module heat dissipation technical field.

Background

A power module is a power supply that can be directly mounted on a printed circuit board, and is characterized by supplying power to an application specific integrated circuit, a digital signal processor, a microprocessor, a memory, a field programmable gate array, and other digital or analog loads, and generally, such a module is called a load power supply system or a point of use power supply system (PUPS). Due to the advantages of the modular structure, the modular power supply is widely used in the communication fields of switching equipment, access equipment, mobile communication, microwave communication, optical transmission, routers and the like, and in automotive electronics, aerospace and the like.

Most of the heat dissipation structures on the existing power modules are conduction type heat dissipation structures, and the size of the conduction type heat dissipation structure is small due to the small size of the power module, so that the heat dissipation effect of the conduction type heat dissipation structure is limited, and the continuous and safe work of the power module cannot be guaranteed when the power module works at high power.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims at providing a power module that integration heat dissipation is good.

The purpose of the utility model can be achieved by adopting the following technical scheme:

the utility model provides a good power module of integration heat dissipation, includes module base and radiation otter board, module base top middle part is provided with the module cover, the top is provided with the radiator shell in the module cover, the bottom is provided with the electrical power generating system shell in the module cover, electrical power generating system shell inner wall is provided with all around the radiation otter board, be provided with the power substrate between the radiation otter board inner wall, be provided with the heating panel in the radiator shell, the outer top of radiator shell is provided with the fin, be provided with first heat dissipation fan in the module cover top inner wall.

Preferably, the module cover with the module base splices, the outside both sides of module cover be provided with module base welded wire holder, the outside both sides of wire holder are provided with and run through the mounting hole of module base.

Preferably, the radiator shell is fixed between the inner walls of the module covers, the radiating plate is embedded in the radiator shell, and the radiator shell is made of a heat-conducting insulating material.

Preferably, the radiating fin penetrates through and is fixed on the radiator shell and is communicated with the radiating plate in a welding mode, the bottom of the radiating plate is welded with the heat conducting rod, and the power supply system shell is fixed at the bottom in the module cover.

Preferably, the radiation screen plate and the inner wall of the power system shell are fixedly installed through a clamping groove, the power substrate is clamped and pressed between the radiation screen plates, and the heat conducting rod and the top of the power substrate are connected through heat conducting glue in an adhesive mode.

Preferably, first heat dissipation fan is embedded at the module cover top, the inside card of module base has pressed the second heat dissipation fan, it has the exhaust window to embed on the outside both sides wall of module base.

The utility model has the advantages of:

the utility model discloses a set up the high-efficient heat radiation structure who comprises components such as fin, first heat dissipation fan, second heat dissipation fan, heating panel, heat conduction pole, heat conduction glue and radiation otter board in traditional power module, on the limited usage space of power module, utilize principles such as conduction heat dissipation, convection type heat dissipation and radiation type heat dissipation, improved power module's radiating efficiency greatly, can ensure power module continuous safe work under high power state.

Drawings

Fig. 1 is a schematic structural diagram of a preferred embodiment of an integrated power module with good heat dissipation according to the present invention;

fig. 2 is a schematic diagram of an internal structure of a module cover in a preferred embodiment of an integrated heat-dissipating power module according to the present invention;

fig. 3 is a schematic diagram illustrating a connection relationship among a module base, a power system housing, and an internal structure of a heat sink housing according to a preferred embodiment of the integrated heat dissipating power module of the present invention.

The reference numerals are explained below:

1-a module base; 2-module cover; 3-a wire holder; 4-a radiator housing; 5-radiating fins, 6-a power system shell, 7-a first radiating fan, 8-a power supply substrate, 9-a radiating plate, 10-heat-conducting glue, 11-a heat-conducting rod, 12-a radiating screen plate, 13-a second radiating fan, 14-an exhaust window and 15-mounting holes.

Detailed Description

In order to make the technical solutions of the present invention clearer and clearer for those skilled in the art, the present invention is further described in detail below with reference to the following examples and drawings, but the embodiments of the present invention are not limited thereto.

As shown in fig. 1-3, the power module with integrated heat dissipation provided in this embodiment includes a module base 1 and a radiation screen 12, a module cover 2 is disposed in the middle of the top end of the module base 1, a heat sink housing 4 is disposed at the top inside the module cover 2, a power system housing 6 is disposed at the bottom inside the module cover 2, the radiation screen 12 is disposed around the inner wall of the power system housing 6, a power substrate 8 is disposed between the inner walls of the radiation screen 12, a heat dissipation plate 9 is disposed inside the heat sink housing 4, a heat dissipation plate 5 is disposed at the top outside the heat sink housing 4, and a first heat dissipation fan 7 is disposed in the inner wall of the top of the module cover 2.

Module cover 2 splices with module base 1, and the outside both sides of module cover 2 are provided with module base 1 welded wire holder 3, and the outside both sides of wire holder 3 are provided with the mounting hole 15 that runs through module base 1, and module cover 2 outsides are the black, and module base 1 is the plastics material, can insulate, waterproof and prevent static.

Radiator shell 4 is fixed in between the 2 inner walls of module cover, and the heating panel 9 is embedded in radiator shell 4, and radiator shell 4 is heat conduction insulating material, and heating panel 9 and heat conduction pole 11 are the copper product, and fin 5 is the aluminium material.

The radiating fins 5 penetrate through and are fixed on the radiator shell 4 and are welded and communicated with the radiating plate 9, the heat conducting rods 11 are welded at the bottom of the radiating plate 9, the power supply system shell 6 is fixed at the bottom in the module cover 2, and the power supply system shell 6 is made of heat conducting materials and can radiate heat of the power supply substrate 8 outwards.

The radiation screen plate 12 and the inner wall of the power supply system shell 6 are fixedly installed through a clamping groove, the power supply substrate 8 is clamped and pressed between the radiation screen plates 12, the heat conducting glue 10 is glued on the top of the heat conducting rod 11 and the top of the power supply substrate 8, the radiation screen plates 12 utilize the radiation heat dissipation principle, when two interfaces with different temperatures are opposite, heat continuous radiation transmission occurs, and through holes of the radiation screen plates 12 are used for circulating airflow in the inner space of the power supply substrate 8 and accelerating convection heat dissipation.

The first heat dissipation fan 7 is embedded in the top of the module cover 2, the second heat dissipation fan 13 is clamped and pressed in the module base 1, and exhaust windows 14 are embedded in two side walls outside the module base 1.

As shown in fig. 1 to fig. 3, the working process of the power module with good integrated heat dissipation provided in this embodiment is as follows:

step 1: when the device is used specifically, a module base 1 is fixedly installed with a system circuit board of electrical equipment through screws screwed into a mounting hole 15, and then is electrically communicated with the system circuit board through a wire holder 3, so that power can be normally supplied by a power supply substrate 8, when the power supply substrate 8 works, part of heat generated by the power supply substrate 8 is transferred to a heat conducting rod 11 through heat conducting glue 10, the heat conducting rod 11 is transferred to a heat dissipation plate 9, a small part of heat of the heat dissipation plate 9 is dissipated outwards through a heat dissipation shell 4, most of the rest heat is dissipated outwards through a heat dissipation fin 5, and a first heat dissipation fan 7 accelerates convection of gas to take out the heat of the heat dissipation fin 5, so that heat dissipation is realized;

step 2: the other part of heat of the power supply substrate 8 is absorbed by the radiation screen 12 wrapped on the periphery of the power supply substrate 8 in a heat radiation mode, the heat absorbed by the radiation screen 12 is radiated outwards by the power supply system shell 6, the last part of heat of the power supply substrate 8 is taken out of the hot air flow in the power supply system shell 6 by the second heat radiation fan 13, the air flow channel around the power supply substrate 8 is accelerated, the heat radiation is accelerated, and meanwhile, the heat on the radiation screen 12 is also taken out by the second heat radiation fan 13;

and step 3: in summary, the conductive heat dissipation, convection heat dissipation and radiation heat dissipation structure formed by the heat dissipation sheet 5, the first heat dissipation fan 7, the second heat dissipation fan 13, the heat dissipation sheet 9, the heat conduction rod 11, the heat conduction glue 10, the radiation screen 12 and other components fully utilizes the space inside the power module, realizes efficient heat dissipation, and compared with the structure of the traditional power module which only has conductive heat dissipation, the device can ensure the continuous and safe operation of the power module in a high power state.

Above, only be the further embodiment of the present invention, but the scope of protection of the present invention is not limited thereto, and any person skilled in the art is in the scope of the present invention, and the technical solution and the concept of the present invention are equivalent to replace or change, and all belong to the scope of protection of the present invention.

Claims

1. The utility model provides a power module that integration heat dissipation is good which characterized in that: including module base (1) and radiation otter board (12), module base (1) top middle part is provided with module cover (2), the top is provided with radiator shell (4) in module cover (2), the bottom is provided with electrical power generating system shell (6) in module cover (2), electrical power generating system shell (6) inner wall is provided with all around radiation otter board (12), be provided with power substrate (8) between radiation otter board (12) inner wall, be provided with heating panel (9) in radiator shell (4), radiator shell (4) outer top is provided with fin (5), be provided with first heat dissipation fan (7) in module cover (2) top inner wall.

2. The power module with good integrated heat dissipation of claim 1, wherein: module cover (2) with module base (1) splices, module cover (2) outside both sides be provided with module base (1) welded wire holder (3), wire holder (3) outside both sides are provided with and run through mounting hole (15) of module base (1).

3. The power module with good integrated heat dissipation of claim 2, wherein: the radiator shell (4) is fixed between the inner walls of the module covers (2), the radiating plate (9) is embedded in the radiator shell (4), and the radiator shell (4) is made of heat-conducting insulating materials.

4. The power module with good integrated heat dissipation of claim 3, wherein: the radiating fins (5) penetrate through and are fixed on the radiator shell (4) and are communicated with the radiating plate (9) in a welding mode, the bottom of the radiating plate (9) is welded with a heat conducting rod (11), and the power supply system shell (6) is fixed to the bottom in the module cover (2).

5. The power module with good integrated heat dissipation of claim 4, wherein: the radiation screen plate (12) and the inner wall of the power system shell (6) are fixedly installed through clamping grooves, the power substrate (8) is clamped and pressed between the radiation screen plates (12), and the top of the heat conducting rod (11) and the power substrate (8) is glued with heat conducting glue (10).

6. The power module with good integrated heat dissipation of claim 5, wherein: first heat dissipation fan (7) are embedded module cover (2) top, module base (1) inside card has pressed second heat dissipation fan (13), it has air discharge window (14) to embed on the outside both sides wall of module base (1).