CN217360724U - Heat radiation module - Google Patents

Abstract

A heat dissipation module comprises a temperature equalizing plate, a first fin group and a heat pipe group. The temperature equalizing plate is used for thermally contacting a heating source, the first fin group comprises a plurality of first fins which are sequentially arranged in parallel, and the heat pipe group comprises a first heat pipe which is clamped between the temperature equalizing plate and the first fin group. The first heat pipe is in thermal contact with the temperature equalizing plate and the first fins to improve the heat dissipation efficiency.

Description

Heat radiation module

Technical Field

The utility model relates to a heat dissipation module, in particular to heat dissipation module with heat pipe.

Background

With the increasing enhancement of the computing power of computers, the temperature control of electronic components such as cpus is more and more important. When the operation speed of the working chip (i.e. the heating source) in the computer system is continuously increased, the environmental temperature in the system is increased, and the stability of the system is further reduced. In order to solve the above problems, a Heat dissipation module formed by a Heat Pipe (Heat Pipe) and a Heat dissipation fin (Cooling fin) contacts the working chip, so that the Heat energy of the working chip can be discharged out of the system through the Heat dissipation module to control the temperature in the computer system, thereby maintaining the stability of the computer system.

Generally, a heat pipe of a heat dissipation module is connected to a heat source to be dissipated, and the heat pipe is further connected to a heat dissipation fin, so as to transfer heat to the heat dissipation fin through the heat pipe, and further take the heat out of a computer system, thereby improving the working reliability of an electronic device.

However, in the face of increasing technological progress, the thermal conductivity of the existing heat dissipation module still has poor performance and there is room for improvement, so as to improve the performance of the heat dissipation module in the computer system, which is a challenge faced by the related manufacturers.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat radiation module for solve the difficulty that prior art mentioned above.

An embodiment of the utility model provides a heat radiation module. The heat dissipation module comprises a temperature equalizing plate, a first fin group and a heat pipe group. The temperature equalizing plate is used for thermally contacting a heating source, the first fin group comprises a plurality of first fins which are sequentially arranged in parallel, and the heat pipe group comprises a first heat pipe which is clamped between the temperature equalizing plate and the first fin group. The first heat pipe is in thermal contact with the temperature equalizing plate and the first fins.

According to one or more embodiments of the present invention, the surface of the first heat pipe facing the first fin group is a flat bottom surface.

According to the utility model discloses a one or more embodiments, the temperature-uniforming plate includes an upper plate, a lower plate and a plurality of capillary layer. A cavity is formed between the upper plate and the lower plate, the lower plate comprises a heat source area used for contacting with a heat source, and the capillary layer is formed on the inner surfaces of the upper plate and the lower plate.

According to the utility model discloses one or more embodiments, the temperature-uniforming plate still includes a plurality of powder columns, forms among the cavity to connect the capillary layer in upper plate and the hypoplastron. In addition, the temperature-uniforming plate also comprises a plurality of metal structures formed among the powder columns so as to divide the cavity area into a plurality of areas.

According to one or more embodiments of the present invention, the vapor chamber further comprises a plurality of vermicelli formed in the cavity and located in the partial region away from the heat source region.

According to the utility model discloses one or more embodiments, the upper plate of temperature-uniforming plate includes a first indent, and first indent is formed on the surface of upper plate to first fin group, and first heat pipe is the U font, and first heat pipe contains a first section and two second sections, and first section is connected the second section, and the first section clamp of first heat pipe fit between first fin group and temperature-uniforming plate to first indent and the first fin group of direct contact temperature-uniforming plate.

According to the utility model discloses a plurality of embodiments, the temperature-uniforming plate still includes a second indent, the second indent is formed at the surface of upper plate to first fin group, first fin group still contains two first channels that run through, first channel runs through first fin, and heat pipe group still contains a second heat pipe, the second heat pipe contains a first U type section and two first sections of buckling, first U type section is located the second indent, and connect first section of buckling respectively, a part of first section of buckling stretches into among the first channel of running through, and the first fin of direct contact.

According to the utility model discloses a plurality of embodiments, the temperature-uniforming plate still includes a third indent, and the third indent is formed at the surface of upper plate to first fin group, and heat pipe group still contains a third heat pipe, and the third heat pipe includes a second U type section and two second buckling segments, and second U type section is located the third indent, and connects the second buckling segment respectively.

According to one or more embodiments of the present invention, the heat dissipation module further includes a second fin group, and the second fin group includes a plurality of second fins and two second through channels. The second fins are arranged in parallel at intervals in sequence, and the second through channel penetrates through the second fins. Wherein, a part of the second bending section extends into the second through channel and directly contacts the second fin.

According to the utility model discloses one or more embodiments, the upper plate of temperature-uniforming plate includes a fifth concave ditch, the fifth concave ditch is formed at the surface of upper plate face first fin group, heat pipe group still includes a fifth heat pipe, the fifth heat pipe includes a third U type section and two third bending sections, third U type section is connected the third bending section and is located between the third bending section, third U type section includes a first section and two second sections, and the first section of third U type section is located between the second section of third U type section, the first section of third U type section is located the fifth concave ditch and laminates the inner wall of fifth concave ditch, and the first section of third U type section and the first fin group of second section direct contact of third U type section, and the second section of third U type section exposes the fifth concave ditch. In addition, the second fin group also comprises two fifth through channels, the fifth through channels penetrate through the second fins, wherein one part of the third bending section of the fifth heat pipe extends into the fifth through channels and is directly contacted with the second fins.

Therefore, through the above embodiments, the present invention enables the heat pipe and the temperature-uniforming plate to be closely attached to the fin group, so as to improve the heat dissipation efficiency of the heat dissipation module.

The above description is only for the purpose of illustrating the problems to be solved, the technical means for solving the problems, the technical effects produced by the technical means, and the like, and the specific details of the present invention will be described in detail in the following embodiments and the related drawings.

Drawings

In order to make the above and other objects, features, advantages and embodiments of the present invention more comprehensible, the following description of the drawings is provided:

fig. 1 is a schematic perspective view of a heat dissipation module according to an embodiment of the present invention;

fig. 2 is another perspective view of the heat dissipation module of fig. 1;

FIG. 3 is an exploded view of the heat dissipation module of FIG. 1;

fig. 4 is a perspective view of a vapor chamber of the heat dissipation module of fig. 1;

fig. 5 is a cross-sectional view of the heat dissipation module of fig. 1 taken along section line 5-5;

fig. 6 is a cross-sectional view of the heat dissipation module of fig. 1 taken along section line 6-6; and

fig. 7 is a schematic perspective view of an upper plate of a temperature equalizing plate of the heat dissipating module of fig. 1.

Description of reference numerals:

100: heat radiation module

200: temperature equalizing plate

210: upper plate

211: surface of

220: the first groove

230: second groove

240: the third groove

250: the fourth groove

260: lower plate

262: heating source

270: fifth groove

300: the first fin group

310: first fin

330: linear groove

331: straight bottom surface

340: the first through channel

350: third through passage

400: the second fin group

410: second fin

420: second through channel

430: the fourth through channel

440: fifth through passage

500: heat pipe set

510: first heat pipe

513: first stage

514: second section

520: second heat pipe

523: a first U-shaped section

524: first bending section

530: third heat pipe

533: second U-shaped section

534: second bending section

540: fourth heat pipe

550: fifth heat pipe

553: third U-shaped section

554: third bending section

555: first stage

556: second section

610: capillary layer

620: powder column

630: heat source area

640: metal structure

650: vermicelli

660: cavity body

5-5, 6-6: section line

Detailed Description

In the following description, numerous implementation details are set forth in order to provide a more thorough understanding of the present invention. It should be understood, however, that these implementation details should not be used to limit the invention. That is, in the embodiments of the present invention, these practical details are not necessary. In addition, some conventional structures and elements are shown in the drawings in a simple schematic manner for the sake of simplifying the drawings.

Fig. 1 is a perspective view of a heat dissipation module, and fig. 2 is a perspective view of another angle thereof, in which a part of fins is omitted in fig. 1 to facilitate description of the configuration of the heat pipe set. Fig. 3 is an exploded view of the heat dissipation module of fig. 1. Fig. 4 is a schematic perspective view of a temperature equalization plate of the heat dissipation module. Fig. 5 is a sectional view of the heat dissipation module of fig. 1 taken along a sectional line 5-5, and fig. 6 is a sectional view of the heat dissipation module of fig. 1 taken along a sectional line 6-6. In addition, fig. 7 is a schematic perspective view of an upper plate of the temperature equalizing plate of the heat dissipating module of fig. 1.

As shown in fig. 1 and fig. 2, the heat dissipation module 100 includes a temperature equalizing plate 200, a first fin set 300 and a heat pipe set 500. The vapor chamber 200 is in thermal contact with a heat source 262. The first fin set 300 includes a plurality of first fins 310. The first fins 310 are sequentially spaced, parallel and side by side. The heat pipe set 500 includes a first heat pipe 510. A portion of the first heat pipe 510 is sandwiched between the vapor chamber 200 and the first fin group 300, and another portion of the first heat pipe 510 directly contacts the first fins 310, but the present invention is not limited thereto.

In some embodiments, the first heat pipe 510 is U-shaped, and the first heat pipe 510 includes a first section 513 and two second sections 514. The first section 513 is connected to the second sections 514 and is located between the second sections 514. The long axis direction of the first segment 513 intersects, e.g., is orthogonal to, the long axis direction of the second segment 514. The first section 513 is sandwiched between the first fin set 300 and the vapor chamber 200 for absorbing the heat energy transferred from the vapor chamber 200. In addition, the long axis directions of the second sections 514 are parallel to each other, and two opposite ends of the first heat pipe 510 are respectively located on the second sections 514. However, the present invention is not limited thereto. In this way, since the first section 513 of the first heat pipe 510 can absorb the heat energy transferred from the temperature equalizing plate 200, and synchronously and bidirectionally transfer the heat energy to the second sections 514, and then transfer the heat energy to the first fin group 300, the performance of higher power is provided, the purpose of quickly completing the heat exchange is achieved, the water return distance inside the first heat pipe 510 can be shortened, and the overall efficiency is improved.

Fig. 5 is a cross-sectional view of the heat dissipation module 100 of fig. 1 taken along the section line 5-5. Fig. 6 is a cross-sectional view of the heat dissipation module 100 of fig. 1 taken along section line 6-6.

In some embodiments, the linear groove 330 is formed on the first fin assembly 300 on a surface of the first fin assembly 300 facing the temperature equalizing plate 200. The linear groove 330 has a flat bottom surface 331, and the flat bottom surfaces 331 are parallel to each other. Each flat bottom surface 331 is about the same width as the second section 514 of the first heat pipe 510. The upper plate 210 of the vapor chamber 200 has a first groove 220 formed therein and facing a surface of the first fin group 300, such as the surface 211 shown in fig. 4.

In some embodiments, as shown in fig. 1-5, the first section 513 of the first heat pipe 510 is located within the first groove 220. More specifically, a portion of the first section 513 of the first heat pipe 510 is located in the first groove 220, and directly contacts the vapor chamber 200, i.e., matches the shape thereof to fit the inner wall of the first groove 220. Portions of the first segment 513 also directly contact the first set of fins 300. In addition, the second section 514 of the first heat pipe 510 is located within the linear groove 330, and more specifically, a portion of the second section 514 of the first heat pipe 510 closely conforms to the flat bottom 331 of the linear groove 330.

Furthermore, in some embodiments, the heat pipe set 500 includes a second heat pipe 520. A portion of the second heat pipe 520 is also sandwiched between the vapor chamber 200 and the first fin group 300, and another portion of the second heat pipe 520 is inserted into the first fins 310. For example, the second heat pipe 520 includes a first U-shaped segment 523 and two first bent segments 524. The first U-shaped segment 523 is connected to the first bending segments 524 and located between the first bending segments 524, and the first U-shaped segment 523 is sandwiched between the first fin set 300 and the temperature-uniforming plate 200.

In some embodiments, as shown in fig. 1 to 5, the vapor chamber 200 further includes a second groove 230. The second groove 230 is formed on the surface 211 of the upper plate 210. The first fin group 300 further includes two first through channels 340. The first through-channels 340 extend through the first fins 310. The first U-shaped segment 523 is located in the second groove 230, and a portion of the first bending segment 524 of the second heat pipe 520 extends into the first through channel 340 and directly contacts the first fins 310, i.e., directly contacts the inner wall of the first through channel 340.

The outer surface of the first U-shaped segment 523 directly contacts the vapor chamber 200 and conforms to the inner wall of the second groove 230. The first U-shaped segment 523 of the second heat pipe 520 can absorb the heat energy transferred from the temperature equalizing plate 200 and synchronously and bidirectionally transfer the heat energy to the first bending segments 524, so as to transfer the heat energy into the first fin group 300, thereby achieving the purpose of rapidly completing the heat exchange and further improving the overall performance.

In some embodiments, the vapor chamber 200 further comprises a third groove 240. The third groove 240 is formed on the surface 211 of the upper plate 210, and the heat pipe set 500 further includes a third heat pipe 530. The third heat pipe 530 includes a second U-shaped section 533 and two second bending sections 534. The second U-shaped section 533 is connected to the second bending sections 534 and located between the second bending sections 534, and the second U-shaped section 533 is sandwiched between the first fin set 300 and the vapor chamber 200. More specifically, the second U-shaped section 533 is located in the third groove 240, and in addition, an outer surface of the second U-shaped section 533 also directly contacts the first fin 310 to closely adhere to the first fin 310 and an inner wall of the third groove 240 of the temperature equalizing plate 200.

In some embodiments, the vapor chamber 200 further comprises a fifth groove 270. Fifth groove 270 is formed in surface 211 of upper plate 210, and heat pipe set 500 further includes a fifth heat pipe 550. The fifth heat pipe 550 includes a third U-shaped segment 553 and two third bent segments 554. The third U-shaped segment 553 connects the third bent segments 554 and is located between the third bent segments 554, and the third U-shaped segment 553 is sandwiched between the first fin set 300 and the vapor chamber 200. Therefore, the third U-shaped segment 553 is located in the fifth groove 270, and besides, the outer surface of the third U-shaped segment 553 also directly contacts the first fin 310 to closely adhere to the first fin 310 and the inner wall of the fifth groove 270 of the temperature-uniforming plate 200.

More specifically, the third U-shaped segment 553 includes a first segment 555 and two second segments 556, the first segment 555 is located between the second segments 556, and the first segment 555 of the third U-shaped segment 553 is located in the fifth groove 270 and directly contacts the temperature-uniforming plate 200, i.e., matches the shape thereof and fits the inner wall of the fifth groove 270. The first segment 555 and the second segment 556 of the third U-shaped segment 553 directly contact the first set of fins 300. In addition, the second section 556 of the third U-shaped section 553 is exposed to the fifth groove 270.

Referring to fig. 1, fig. 2 and fig. 6, the heat dissipation module 100 further includes a second fin group 400. The second set of fins 400 is adjacent to the first set of fins 300. The second fin group 400 includes a plurality of second fins 410. The second fins 410 are sequentially spaced apart and parallel, and the second fin group 400 further includes two second through channels 420. The second through channels 420 sequentially pass through the second fins 410. A portion of the second bending portion 534 extends into the second through channel 420 and directly contacts the second fins 410, i.e., contacts the inner wall of the second through channel 420. Therefore, the second U-shaped section 533 of the third heat pipe 530 can absorb the heat energy transferred from the vapor chamber 200, and synchronously and bidirectionally transfer to the second bending sections 534, so as to transfer to the second fin group 400.

Referring to fig. 4, the vapor chamber 200 includes two fourth grooves 250. The fourth grooves 250 are parallel to each other and formed on the surface 211 of the upper plate 210 and communicate with the second grooves 230, and the long axis directions of each of the fourth grooves 250 are parallel to each other.

Referring to fig. 5 and 6, the first fin assembly 300 further includes at least one third through channel 350, for example, 2, but the present invention is not limited thereto. The third through channel 350 penetrates the first fin 310. The second fin assembly 400 further includes at least one fourth through channel 430, for example, 2, but the present invention is not limited thereto. The fourth through-channel 430 penetrates the second fin 410 and is coaxially aligned with the third through-channel 350. The heat pipe set 500 further includes at least one fourth heat pipe 540, for example, 2, but the invention is not limited thereto. The second fin assembly 400 further includes at least one fifth through channel 440, for example, 2, but the present invention is not limited thereto. The third bent segment 554 of the fifth heat pipe 550 penetrates the second fin 410 through the fifth through channel 440.

In addition, a portion of the fourth heat pipe 540 is compressed between the first fin set 300 and the temperature-uniforming plate 200, i.e., located in the fourth grooves 250 of the first fin set 300 and the temperature-uniforming plate 200, so as to directly contact the inner walls of the fourth grooves 250 of the first fin set 300 and the temperature-uniforming plate 200. Another portion of each of the fourth heat pipes 540 passes through the third through channel 350 and the fourth through channel 430, and directly contacts the first fin 310 and the second fin 410, i.e. matches the shapes thereof to fit the inner walls of the first through channel 340 and the second through channel 420.

In some embodiments, referring to fig. 1, 2, 4 and 7, fig. 7 is a bottom view of the upper plate 210. As shown, the vapor chamber 200 includes an upper plate 210, a lower plate 260, and a plurality of capillary layers 610. A cavity 660 is formed between the upper plate 210 and the lower plate 260. The lower plate 260 includes a heat source region 630 for contacting a heat source 262, such as a heat generating element like a cpu, and the capillary layer 610 is formed on the inner surface of the upper plate 210 and the inner surface of the lower plate 260, respectively.

In addition, the vapor chamber 200 further includes a plurality of powder pillars 620 and a plurality of metal structures 640 formed in the cavity 660, wherein the powder pillars 620 connect the upper plate 210 and the capillary layer 610 in the lower plate 260. The metal structure 640 may be a metal block or a metal capillary structure, and the metal structure 640 is formed between the powder pillars 620 along the shape of the heat pipe to divide the cavity 660 into a plurality of regions. In addition, the vermicelli 650 is also formed in the cavity 660, preferably, the vermicelli 650 is formed in the area far away from the heat source area 630. The powder pillar 620 and the vermicelli 650 may be a metal capillary structure formed by powder metallurgy, but the present invention is not limited thereto. In some embodiments, the vermicelli 620 may be a cylinder, a square column, a triangular column or a polygonal column, and the vermicelli 650 may be a rectangular column, an elliptical column or a polygonal long column, without departing from the spirit and scope of the present invention.

The capillary layer 610 contacts the metal structure 640, so that the metal structure 640 can serve as a boundary of the capillary layer 610, thereby achieving a partition effect of the capillary layer 610. The partitioned structure can partition the working fluid (i.e., the liquid working fluid) in a plurality of specific regions of the capillary layer 610 through the metal structure 640, and the specific regions are separated from each other to some extent.

In some embodiments, the powder column 620, the metal structure 640 or the powder strips 650 may be interposed between the plurality of capillary layers 610 or directly formed on the surfaces of the upper plate 210 and the lower plate 260, without departing from the spirit and scope of the present invention.

In some embodiments, the surfaces of the first, second, third and fifth heat pipes 510, 520, 530 and 550 facing the first fin group 300 are preferably flat bottom surfaces, and the surface of the fourth heat pipe 540 facing the first fin group 300 is preferably circular, but the invention is not limited thereto. So, through above each embodiment the framework, the utility model discloses let heat pipe and samming board and fin group closely laminate to promote heat radiation module's radiating efficiency.

Finally, the above embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all such changes and modifications are intended to be protected by the present invention. Therefore, the protection scope of the present invention should be determined by the appended claims.

Claims (9)

1. A heat dissipation module, comprising:

a temperature-equalizing plate for thermally contacting a heat generating source;

a first fin group comprising a plurality of first fins which are arranged in parallel in sequence; and

a heat pipe set comprising a first heat pipe sandwiched between the vapor chamber and the first fin set, wherein the first heat pipe thermally contacts the vapor chamber and the plurality of first fins, and wherein the vapor chamber comprises: an upper plate; a lower plate, wherein a cavity is formed between the upper plate and the lower plate, and the lower plate comprises a heat source area for contacting the heat source; and a plurality of capillary layers formed on the inner surfaces of the upper plate and the lower plate.

2. The heat dissipation module of claim 1, wherein a surface of the first heat pipe facing the first set of fins is a flat bottom surface.

3. The heat dissipating module of claim 1, wherein the vapor chamber further comprises:

a plurality of powder columns formed in the cavity and connected with the upper plate and the plurality of capillary layers in the lower plate; and

and a plurality of metal structures formed among the plurality of powder columns so as to divide the cavity into a plurality of areas.

4. The heat dissipating module of claim 3, wherein the vapor chamber further comprises:

and a plurality of vermicelli formed in the cavity and positioned in the area far away from the heat source area.

5. The heat dissipation module of claim 1, wherein the upper plate of the vapor chamber comprises a first groove formed on a surface of the upper plate facing the first fin assembly, and the first heat pipe is U-shaped, the first heat pipe comprises a first section and two second sections, the first section connects the plurality of second sections, and the first section of the first heat pipe is sandwiched between the first fin assembly and the vapor chamber and directly contacts the first groove of the vapor chamber and the first fin assembly.

6. The heat dissipating module of claim 5, wherein the temperature equalizing plate further comprises a second groove formed on the surface of the upper plate facing the first fin group, the first fin group further comprises two first through channels, each of the first through channels penetrates the first fins, and the heat pipe group further comprises a second heat pipe, the second heat pipe comprises a first U-shaped section and two first bent sections, the first U-shaped section is located in the second groove and respectively connected to the first bent sections, and a portion of each of the first bent sections extends into one of the first through channels and directly contacts the first fins.

7. The heat dissipating module of claim 6, wherein the temperature equalizing plate further comprises a third groove formed on the surface of the upper plate facing the first fin group, and the heat pipe group further comprises a third heat pipe comprising a second U-shaped section and two second bent sections, the second U-shaped section being located in the third groove and respectively connected to the second bent sections.

8. The heat dissipation module of claim 7, further comprising a second set of fins, wherein the second set of fins comprises:

the second fins are sequentially arranged side by side at intervals; and

and the second through channels penetrate through the second fins, wherein one part of the second bent sections extends into the second through channels and directly contacts the second fins.

9. The heat dissipating module of claim 8, wherein the top plate of the temperature uniforming plate includes a fifth groove formed on the surface of the top plate facing the first set of fins,

wherein the heat pipe set further comprises a fifth heat pipe, the fifth heat pipe comprises a third U-shaped section and two third bending sections, the third U-shaped section is connected with the third bending sections and is positioned between the third bending sections, the third U-shaped section comprises a first section and two second sections, the first section of the third U-shaped section is positioned between the second sections of the third U-shaped section, the first section of the third U-shaped section is positioned in the fifth concave groove and is attached to the inner wall of the fifth concave groove, the first section of the third U-shaped section and the second sections of the third U-shaped section are directly contacted with the first fin group, and the second sections of the third U-shaped section are exposed out of the fifth concave groove,

the second fin group further includes two fifth through channels, the fifth through channels penetrate through the second fins, and a portion of the third bent sections of the fifth heat pipe extends into the fifth through channels and directly contacts the second fins.

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