CN202467078U - Ground heating floorboard for upholstery - Google Patents
Ground heating floorboard for upholstery Download PDFInfo
- Publication number
- CN202467078U CN202467078U CN2011205259086U CN201120525908U CN202467078U CN 202467078 U CN202467078 U CN 202467078U CN 2011205259086 U CN2011205259086 U CN 2011205259086U CN 201120525908 U CN201120525908 U CN 201120525908U CN 202467078 U CN202467078 U CN 202467078U
- Authority
- CN
- China
- Prior art keywords
- type semiconductor
- floorboard
- ground heating
- heating
- floor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Central Heating Systems (AREA)
Abstract
The utility model provides a ground heating floorboard for upholstery, which comprises a floorboard, wherein a plurality of through holes are formed on the floorboard uniformly; a P-type semiconductor and an N-type semiconductor are arranged inside each through hole; the overlapping thickness of the P-type semiconductor and the N-type semiconductor does not exceed the depth of the through hole; the P-type semiconductor is connected with the N-type semiconductor directly; and the P-type semiconductor and the N-type semiconductor are connected with a power supply through a lead. According to the ground heating floorboard, a semiconductor heating sheet is used as a special heat source; the technical application has the following advantages that the ground heating floorboard can work continuously, is free from pollution, vibration and noise and is long in service life and convenient to install.
Description
Technical field
The utility model belongs to the indoor decoration constructional materials, relates in particular to a kind of floor.
Background technology
Semiconductor refrigerating (TE) also be thermoelectric cooling, is a kind of heat pump, and its advantage is not have slide unit, and reliability requirement is high, and no cold-producing medium pollutes.The operating principle of semiconductor refrigerating: operating current is a DC current, and it not only can freeze but also can heat, and decides on same refrigerator through the polarity that changes DC current; Realize refrigeration or heating function; The generation of this effect is exactly the principle through thermoelectricity, and accompanying drawing is exactly a unit cooling piece, and it is made up of two potsherds; The semi-conducting material (bismuth telluride) that N type and P type are arranged wherein, this semiconductor element are to link with the series connection form to form on circuit.Common body of wall is heating or refrigeration not, and the simple indoor household electrical appliances that utilize are obtained the changes in temperature effect, expends the energy and effect is not satisfactory.
At present, in the north of severe cold, the heating mode that people generally adopt has central heating, natural gas heating, the heating of native heating installation, air conditioning and heating and the most original coal fire heating.The universal face of central heating also is not very extensive, and there is the waste of the potential safety hazard and the energy in the natural gas heating, and coal fire heating and the heating of native heating installation are unhygienic, inconvenient, and air conditioning and heating has the noise expense.And hot gas rises, so floor heating is best heating mode.
The utility model content
The utility model technical problem to be solved provides the different heating equipment of a kind of and traditional heating.
Adopt following technical scheme in order to solve the problems of the technologies described above: ground heating floor is used in a kind of indoor decoration; Comprise the floor; Be provided with some through holes on the said floor uniformly, be provided with P-type semiconductor and N-type semiconductor in the through hole, the thickness that P-type semiconductor and N-type semiconductor stack up is no more than via depth; Directly connect between P-type semiconductor and the N-type semiconductor, P-type semiconductor is connected with power supply through lead with N-type semiconductor.
Waterproof film has all been made on upper and lower surface, floor.
The utility model heats sheet as extraordinary thermal source with semiconductor, on technical application, has following advantage: but continuous operation, not pollution does not have vibrations, noise, and the life-span is long, installs easily.
Description of drawings
Fig. 1 is the structural representation of the utility model.
The specific embodiment
As shown in Figure 1, ground heating floor is used in a kind of indoor decoration, comprises floor 1; Waterproof film 2 has all been made on 1 upper and lower surface, floor; Be provided with some through holes 3 on the floor 1 uniformly, be provided with P-type semiconductor 4 and N-type semiconductor 5 in the through hole 3, the thickness that P-type semiconductor and N-type semiconductor stack up is no more than via depth; Directly connect between P-type semiconductor and the N-type semiconductor, P-type semiconductor is connected with power supply through lead with N-type semiconductor.
Semiconductor directly is connected and carries out work on the dc source.When a N-type semiconductor material and P-type semiconductor material be coupled to galvanic couple to the time, in this circuit, connect DC current after, just can energy-producing transfer, flow to the joint release heat of N type element by P type element, become the hot junction.The heat absorption and the size of heat release are that the element logarithm through the size of electric current and semi-conducting material N, P decides.
Claims (2)
1. ground heating floor is used in an indoor decoration; Comprise the floor; It is characterized in that: be provided with some through holes on the said floor uniformly, be provided with P-type semiconductor and N-type semiconductor in the through hole, the thickness that P-type semiconductor and N-type semiconductor stack up is no more than via depth; Directly connect between P-type semiconductor and the N-type semiconductor, P-type semiconductor is connected with power supply through lead with N-type semiconductor.
2. ground heating floor is used in indoor decoration according to claim 1, it is characterized in that: waterproof film has all been made on upper and lower surface, floor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205259086U CN202467078U (en) | 2011-12-15 | 2011-12-15 | Ground heating floorboard for upholstery |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205259086U CN202467078U (en) | 2011-12-15 | 2011-12-15 | Ground heating floorboard for upholstery |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202467078U true CN202467078U (en) | 2012-10-03 |
Family
ID=46915245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205259086U Expired - Fee Related CN202467078U (en) | 2011-12-15 | 2011-12-15 | Ground heating floorboard for upholstery |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202467078U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106051897A (en) * | 2016-06-17 | 2016-10-26 | 平玉兰 | Semiconductor temperature-regulating floor based on Internet of Things |
| CN107062686A (en) * | 2016-12-29 | 2017-08-18 | 清华大学 | A kind of modular radiation floor based on semiconductor heating |
| CN113905930A (en) * | 2019-05-31 | 2022-01-07 | 艾倍思科技股份有限公司 | Load floor with electronic components |
-
2011
- 2011-12-15 CN CN2011205259086U patent/CN202467078U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106051897A (en) * | 2016-06-17 | 2016-10-26 | 平玉兰 | Semiconductor temperature-regulating floor based on Internet of Things |
| CN106051897B (en) * | 2016-06-17 | 2019-03-12 | 浙江暖诚智能科技有限公司 | A kind of semiconductor temp.-regulating floor based on Internet of Things |
| CN107062686A (en) * | 2016-12-29 | 2017-08-18 | 清华大学 | A kind of modular radiation floor based on semiconductor heating |
| CN113905930A (en) * | 2019-05-31 | 2022-01-07 | 艾倍思科技股份有限公司 | Load floor with electronic components |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202598984U (en) | Portable solar energy semiconductor cold and hot insulation can | |
| CN103383123A (en) | Solar power semiconductor air conditioning system | |
| CN202467078U (en) | Ground heating floorboard for upholstery | |
| CN203068872U (en) | Semiconductor auxiliary refrigerating system | |
| CN104456785A (en) | Solar central air conditioner | |
| CN201806492U (en) | Semiconductor cooling/heating pot | |
| CN203613672U (en) | Solar refrigerating and heating wall | |
| CN201898465U (en) | Domestic semiconductor temperature difference power generator | |
| CN203258959U (en) | Electronic superconducting refrigerator and hot water integrated machine | |
| CN204254926U (en) | Intelligent and high-efficiency environmental protection is cold and hot can utilize system simultaneously | |
| CN204227495U (en) | A kind of smoke exhaust ventilator device utilizing kitchen range cogeneration to drive | |
| CN204963289U (en) | Craze for computer electric refrigeration device | |
| CN103644679A (en) | Household cold and hot integrated insulation box | |
| CN201595659U (en) | Semiconductor cold and hot boiler | |
| CN203240688U (en) | Solar energy semiconductor air-conditioning system | |
| CN202018157U (en) | Semiconductor heating and refrigerating device | |
| CN206269294U (en) | A kind of semiconductor refrigerating fan with heat-insulation system | |
| CN201809876U (en) | Semiconductor cold-warm wall body | |
| CN203537275U (en) | Double liner water tank with thermoelectric power generation | |
| CN201373645Y (en) | Combined household appliance | |
| CN203413890U (en) | Air source heat pump solar defrosting system | |
| CN204555411U (en) | The vehicle power self power generation refrigeration system of rail vehicle | |
| CN202303647U (en) | Air source thermoelectric heat pump floor heating device | |
| CN205265328U (en) | Novel power | |
| CN204388352U (en) | Solar water heater |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121003 Termination date: 20131215 |