CN207637840U - A kind of high contrast integration packaging display module structure - Google Patents
A kind of high contrast integration packaging display module structure Download PDFInfo
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- CN207637840U CN207637840U CN201721409785.3U CN201721409785U CN207637840U CN 207637840 U CN207637840 U CN 207637840U CN 201721409785 U CN201721409785 U CN 201721409785U CN 207637840 U CN207637840 U CN 207637840U
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Abstract
The utility model discloses a kind of high contrast integration packaging display module structures, including, module group substrates, circuit-line；Circuit-line can be by 37 sandwich circuit structure compositions；Driving IC for connecting the positive LED light emitting structures of module group substrates and the back side；Module group substrates front circuit reserves pad and is used for the die bond of LED chip, bonding wire；Module group substrates back side line construction reserves the patch that pad is used to drive the devices such as IC, resistance；Packing colloid inside module group substrates is set, and packing colloid surface is provided with matt processing glue-line.The utility model by substrate carry out die bond, Darkening process after bonding wire design scheme, it is low to reduce aberration, contrast that interiors of products color after screen reflects, improves the contrast of product；Its basic principle is：The gold that PCB front metal pad reflectives go out, is affected to the contrast of screen, and by spraying black ink processing, under the influence of reducing extraneous light, the reflection of front pad color improves aobvious screen contrast.
Description
Technical field
It is more particularly to a kind of high the utility model is related to display screen module encapsulation and LED encapsulation technologies field
Contrast integration packaging display module structure.
Background technology
As the demand of the continuous improvement of indoor display application technology and terminal market is higher and higher, high contrast height is aobvious to be become
Indoor small spacing screen factory and encapsulation factory promote the Main way of product competitiveness.Conventional SMD LED are due to by patch back light
The influence of foot tin cream, aberration is restricted in terms of contrast promotion.With it is uncommon up to electronics, Ao Leida, Wei Qiao along etc. for representative enterprise
Industry has carried out COB integration packaging patterns, optimizes processing to lamp face, improves the contrast of display screen.But it is directed to lamp bead
Internal pads, gold thread, chip it is reflective caused by poor contrast problem, can not provide preferable ameliorative way in the market.
Therefore, a display screen for solving the problems, such as aberration inside lamp bead is developed, the contrast of display screen is promoted with larger potential
Market value.
Therefore, how to provide it is a kind of have can reduce the reflection of interiors of products color, after upper screen, the comparison of product can be improved
The problem of high contrast integration packaging display module structure of degree feature is those skilled in the art's urgent need to resolve.
Utility model content
In view of this, the utility model provide it is a kind of have can reduce the reflection of interiors of products color, after upper screen, can carry
The high contrast integration packaging display module structure of the contrast feature of high product.
To achieve the above object, the utility model provides the following technical solutions：
A kind of high contrast integration packaging display module structure, including, module group substrates：It is set on the module group substrates
Circuit-line, the circuit-line can be by 3-7 sandwich circuit structure compositions；It shines for connecting the positive LED of the module group substrates
The driving IC at structure and the back side；Module group substrates front circuit reserves pad and is used for the die bond of LED chip, bonding wire；The mould
Group substrate back side line construction reserves the patch that pad is used to drive the devices such as IC, resistance；Encapsulation inside module group substrates is set
Colloid, the packing colloid surface are provided with matt processing glue-line.
Preferably, in a kind of above-mentioned high contrast integration packaging display module structure, the module group substrates thickness is
1mm-3mm, color are black or white.
Preferably, in a kind of above-mentioned high contrast integration packaging display module structure, the front of the module group substrates is set
There is LED chip placement region, and the front LED chip density spacing is set as P0.6-P1.2.
Preferably, it in a kind of above-mentioned high contrast integration packaging display module structure, is equipped in the module group substrates
Multiple pixels, each pixel are made of three LED chips；And the LED chips can be to pass through wire bonding
The positive cartridge chip being connect with the module group substrates or the flip-chip to be connect with the module group substrates by tin cream, elargol.
Preferably, in a kind of above-mentioned high contrast integration packaging display module structure, the face of three LED chips
Color is respectively feux rouges, green light and blue light.
Preferably, in a kind of above-mentioned high contrast integration packaging display module structure, to the module base after bonding wire
Plate front surface is coated with one layer of black ink layer or adhesive film by Darkening process；And the Darkening process can be ink-jet, silk-screen
Printing or coating film treatment, thickness 2-50um.
Preferably, in a kind of above-mentioned high contrast integration packaging display module structure, the module group substrates back side setting
The driving IC can be electric current drive IC, row sweep, arrange and sweep the driving elements such as IC.
It can be seen via above technical scheme that compared with prior art, the utility model to substrate by carrying out die bond, weldering
The design scheme of Darkening process after line, it is low to reduce aberration, contrast that interiors of products color after screen reflects, improves
The contrast of product；Its basic principle is：The gold that PCB front metal pad reflectives go out, on the contrast of screen influence compared with
Greatly, by spraying black ink processing, under the influence of reducing extraneous light, the reflection of front pad color improves aobvious screen contrast.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is the embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also
Other attached drawings can be obtained according to the attached drawing of offer.
Fig. 1 attached drawings are the dimensional structure diagram of the utility model.
Fig. 2 attached drawings are the side structure schematic diagram of the utility model.
Fig. 3 attached drawings are the design sketch of Darkening process after the utility model bonding wire.
Fig. 4 attached drawings are design sketch after tradition COB structure bonding wires.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
The utility model embodiment disclose it is a kind of have can reduce the reflection of interiors of products color, after upper screen, can be improved
The high contrast integration packaging display module structure of the contrast feature of product.
Attached drawing 1, attached drawing 2, attached drawing 3, attached drawing 4 are please referred to, is a kind of high contrast integration packaging disclosed by the utility model
Display module structure, specifically includes：
Module group substrates 1：The circuit-line being set on module group substrates 1, circuit-line can be by 3-7 sandwich circuit structure compositions；
Driving IC3 for connecting 1 positive LED light emitting structures 2 of module group substrates and the back side；1 front circuit of module group substrates reserves pad
Die bond, bonding wire for LED chip 4；1 back side line construction of module group substrates reserves pad for driving the devices such as IC3, resistance
Patch；Packing colloid 5 inside module group substrates 1 is set, and 5 surface of packing colloid is provided with matt processing glue-line 6.
A kind of high contrast integration packaging display module structure of the utility model, including, module group substrates, circuit-line；Electricity
It route road can be by 3-7 sandwich circuit structure compositions；Driving IC for connecting the positive LED light emitting structures of module group substrates and the back side；
Module group substrates front circuit reserves pad and is used for the die bond of LED chip, bonding wire；Module group substrates back side line construction is reserved pad and is used
In the patch of the devices such as driving IC, resistance；Packing colloid inside module group substrates is set, and packing colloid surface is provided at matt
Manage glue-line.The utility model is produced by the design scheme of the Darkening process after carrying out die bond, bonding wire to substrate after reducing screen
Aberration that product internal color reflects, contrast are low, improve the contrast of product；Its basic principle is：PCB front metals
The gold that pad reflective goes out is affected to the contrast of screen, and by spraying black ink processing, reducing extraneous light influences
Under, the reflection of front pad color improves aobvious screen contrast.
In order to advanced optimize above-mentioned technical proposal, specific technological process is：A, module group substrates back side IC, resistance, electricity
Hold fitting；B, module group substrates carry out dehumidification treatments；C, module group substrates die bond；D, the substrate after die bond is subjected to bonding wire；E, it uses
Surface processing equipment carries out Darkening process to the substrate front side after bonding wire；F, the substrate after Darkening process is subjected to injection molding sealing；
G, packaging plastic is toasted.
In order to advanced optimize above-mentioned technical proposal, 1 thickness of module group substrates is 1mm-3mm, and color is black or white,
Material is BT substrates, FR4 substrates, the one of which of ceramic substrate or several mixing.
In order to advanced optimize above-mentioned technical proposal, equipped with LED chip placement region 8, (chip is put in the front of module group substrates 1
Set outside region, remaining region all standing), and positive 4 density spacing of LED chip is set as P0.6-P1.2.
In order to advanced optimize above-mentioned technical proposal, multiple pixels are equipped in module group substrates 1, each pixel is by three
LED chip 4 forms；And LED chip 4 can be the positive cartridge chip being connect with module group substrates 1 by wire bonding or be to pass through tin
The flip-chip that cream, elargol and module group substrates 1 connect.
In order to advanced optimize above-mentioned technical proposal, the color of three LED chips 4 is respectively feux rouges, green light and blue light.
In order to advanced optimize above-mentioned technical proposal, 1 front surface of module group substrates after bonding wire is coated with by Darkening process
One layer of black ink layer 8 or adhesive film；And Darkening process can be ink-jet, silk-screen printing or coating film treatment, thickness 2-50um.
In order to advanced optimize above-mentioned technical proposal, the driving IC3 of 1 back side of module group substrates setting can be that electric current drives IC,
Row is swept, arranges and sweep the driving elements such as IC.
Each embodiment is described by the way of progressive in this specification, the highlights of each of the examples are with other
The difference of embodiment, just to refer each other for identical similar portion between each embodiment.For device disclosed in embodiment
For, since it is corresponded to the methods disclosed in the examples, so description is fairly simple, related place is said referring to method part
It is bright.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use this practicality new
Type.Various modifications to these embodiments will be apparent to those skilled in the art, and determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause
This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest range consistent with features of novelty.
Claims (7)
1. a kind of high contrast integration packaging display module structure, including, module group substrates：The electricity being set on the module group substrates
Route road, the circuit-line can be by 3-7 sandwich circuit structure compositions；For connecting the positive LED light-emitting junctions of the module group substrates
Structure and the driving IC at the back side；Module group substrates front circuit reserves pad and is used for the die bond of LED chip, bonding wire；The module
Substrate back line construction reserves the patch that pad is used to drive the devices such as IC, resistance；Packaging plastic inside module group substrates is set
Body, the packing colloid surface are provided with matt processing glue-line.
2. a kind of high contrast integration packaging display module structure according to claim 1, which is characterized in that the module
Substrate thickness is 1mm-3mm, and color is black or white.
3. a kind of high contrast integration packaging display module structure according to claim 1, which is characterized in that the module
The front of substrate is equipped with LED chip placement region, and the front LED chip density spacing is set as P0.6-P1.2.
4. a kind of high contrast integration packaging display module structure according to claim 1, which is characterized in that in the mould
Multiple pixels are equipped in group substrate, each pixel is made of three LED chips；And the LED chip can be
The positive cartridge chip that is connect with the module group substrates by wire bonding or to be connect with the module group substrates by tin cream, elargol
Flip-chip.
5. a kind of high contrast integration packaging display module structure according to claim 1, which is characterized in that described in three
The color of LED chip is respectively feux rouges, green light and blue light.
6. a kind of high contrast integration packaging display module structure according to claim 1, which is characterized in that after bonding wire
The module group substrates front surface one layer of black ink layer or adhesive film are coated with by Darkening process；And the Darkening process can
For ink-jet, silk-screen printing or coating film treatment, thickness 2-50um.
7. a kind of high contrast integration packaging display module structure according to claim 1, which is characterized in that the module
The driving IC of substrate back setting can be that electric current drives IC, row sweep, arrange and sweep the driving elements such as IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721409785.3U CN207637840U (en) | 2017-10-30 | 2017-10-30 | A kind of high contrast integration packaging display module structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721409785.3U CN207637840U (en) | 2017-10-30 | 2017-10-30 | A kind of high contrast integration packaging display module structure |
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| CN207637840U true CN207637840U (en) | 2018-07-20 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109243313A (en) * | 2018-10-13 | 2019-01-18 | 长春希达电子技术有限公司 | A kind of small spacing LED display panel of high contrast COB encapsulation |
| CN110534635A (en) * | 2019-08-23 | 2019-12-03 | 深圳市海讯高科技术有限公司 | COB display panel with high contrast and high light extraction rate |
| CN113782471A (en) * | 2021-09-14 | 2021-12-10 | 深圳市兆驰晶显技术有限公司 | LED screen packaging process based on LED flip chip packaging technology and LED screen |
-
2017
- 2017-10-30 CN CN201721409785.3U patent/CN207637840U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109243313A (en) * | 2018-10-13 | 2019-01-18 | 长春希达电子技术有限公司 | A kind of small spacing LED display panel of high contrast COB encapsulation |
| CN110534635A (en) * | 2019-08-23 | 2019-12-03 | 深圳市海讯高科技术有限公司 | COB display panel with high contrast and high light extraction rate |
| CN113782471A (en) * | 2021-09-14 | 2021-12-10 | 深圳市兆驰晶显技术有限公司 | LED screen packaging process based on LED flip chip packaging technology and LED screen |
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