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CN204084030U - Led模组及显示器 - Google Patents

Led模组及显示器 Download PDF

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Publication number
CN204084030U
CN204084030U CN201420521162.5U CN201420521162U CN204084030U CN 204084030 U CN204084030 U CN 204084030U CN 201420521162 U CN201420521162 U CN 201420521162U CN 204084030 U CN204084030 U CN 204084030U
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Prior art keywords
pcb board
heat
led
pin
radiator
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CN201420521162.5U
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Inventor
林杰
强科文
钟燮和
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Shenzhen TCL New Technology Co Ltd
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Shenzhen TCL New Technology Co Ltd
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Priority to CN201420521162.5U priority Critical patent/CN204084030U/zh
Priority to EP14901725.3A priority patent/EP3193081A4/en
Priority to PCT/CN2014/093781 priority patent/WO2016037432A1/zh
Priority to US15/303,522 priority patent/US9829189B2/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10878—Means for retention of a lead in a hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本实用新型公开了一种LED模组，包括LED灯、散热器以及PCB板，该LED灯包括LED主体以及设于LED主体上的导热块和管脚，导热块设于LED主体的面向PCB板的底面上，管脚的自由端贯通该PCB板并与PCB板的焊盘电连接，散热器夹持于导热块与PCB板之间，导热块抵触在散热器上。本实用新型还公开了一种显示器。本实用新型所提供的LED模组通过将散热器夹持于LED灯的导热块与PCB板之间，使得导热块紧贴在散热器上，从而使LED灯在工作时其产生的热量能直接通过导热块传导到散热器上进行散热，进而提高LED灯的散热效果。

Description

LED模组及显示器
技术领域
本实用新型涉及光源领域，尤其涉及LED模组及使用该LED模组作为背光的显示器。
背景技术
目前市场上的液晶显示器越来越多的采用LED灯作为背光源，同时作为背光源的LED灯的功率也越来越大，LED灯的散热问题逐渐突出；目前通常先将LED灯焊接在PCB板上，再将PCB板通过导热胶固定到散热器上，但由于导热胶本身的导热系数较低，导致此散热固定结构中的LED灯的散热效果较差。
实用新型内容
本实用新型的主要目的在于提高LED灯的散热效果。
为实现上述目的，本实用新型提供一种LED模组，包括LED灯、散热器以及PCB板，所述LED灯包括LED主体以及设于所述LED主体上的导热块和管脚，所述导热块设于所述LED主体的面向所述PCB板的底面上，所述管脚的自由端贯通所述PCB板并与所述PCB板的焊盘电连接，所述散热器夹持于所述导热块与所述PCB板之间，所述导热块抵触在所述散热器上。
优选地，所述管脚的自由端设有卡扣部，所述PCB板包括一与所述LED主体的底面平行的PCB板本体，所述PCB板的焊盘设于所述PCB板本体的背离所述LED主体的一面上，所述卡扣部卡扣于所述PCB板的焊盘上以使所述管脚与所述PCB板电连接。
优选地，所述管脚的卡扣部到所述导热块的与所述散热器紧贴的一面的距离不大于所述散热器的厚度与所述PCB板本体的厚度之和。
优选地，所述管脚垂直设于所述LED主体的底面。
优选地，所述管脚为两个，所述导热块设于所述两个管脚之间，其中任意一管脚的卡扣部朝向背离另一管脚的方向延伸设置。
优选地，所述散热器设有供所述管脚穿过的第一通孔，所述PCB板在所述PCB板本体上正对所述第一通孔设有供所述管脚穿过的第二通孔，所述第二通孔设在所述PCB板的焊盘旁，所述管脚依次穿过所述第一通孔和所述第二通孔后与所述PCB板的焊盘电连接。
优选地，所述散热器为金属散热器，所述管脚在与所述第一通孔相对应的位置的外侧设有绝缘层。
优选地，所述第一通孔的内侧面设有绝缘层。
此外，为实现上述目的，本实用新型还提供一种显示器，包括所述的LED模组，该LED模组用于背光。
本实用新型所提供的LED模组通过将散热器夹持于LED灯的导热块与PCB板之间，使得导热块紧贴在散热器上，从而使LED灯在工作时其产生的热量能直接通过导热块传导到散热器上进行散热，相较于以往的热量散热途径热量无需经过PCB板和导热胶就能传导到散热器，从而提高LED灯的散热效果。
附图说明
图1为本实用新型LED模组一实施例的结构示意图；
图2为图1的前视图；
图3为图2中沿S-S线的部分截面示意图。
本实用新型目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。
本实用新型提供一种LED模组。
参照图1至图3，在一实施例中，该LED模组包括LED灯10、散热器20以及PCB板30，该LED灯10包括LED主体11以及设于该LED主体11上的导热块12和管脚13，导热块12设于LED主体11的面向PCB板30的底面111上，其中，管脚13的自由端贯通PCB板30，并与PCB板30的焊盘311电连接，散热器20夹持于导热块12与PCB板30之间，导热块12抵触在散热器20上。
在以往的LED灯的散热途径中，LED灯所产生的热量需要先后经过PCB板和导热胶才能传导到散热器上进行散热，由于导热胶的导热率远远低于散热器的导热率，故导热胶的存在会极大的降低LED灯所产生的热量的散发速率；而本实施例所提供的LED模组通过将散热器20夹持于LED灯10的导热块12与PCB板30之间，使得导热块12紧贴在散热器20上，从而使LED灯10在工作时其产生的热量能直接通过导热块12传导到散热器20上进行散热，相较于以往的热量散热途径热量无需经过PCB板和导热胶就能传导到散热器，从而提高LED灯10的散热效果。
具体地，在本实施例中，LED灯10的管脚13垂直设在LED主体11的底面111上，管脚13有两个，导热块12设在两个管脚13之间，LED灯10的管脚13的自由端设有卡扣部131，其中，任意一管脚13的卡扣部131朝向背离另一管脚13的方向延伸设置，PCB板30包括一与LED主体11的底面111平行的PCB板本体31，PCB板30的焊盘311设于PCB板本体31的背离LED主体11的一面上，卡扣部131卡扣于PCB板30的焊盘311上以使管脚13与PCB板30电连接，且管脚13的卡扣部131到导热块12的与散热器20紧贴的一面的距离不大于散热器20的厚度与PCB板本体31的厚度之和。
本实施例中，管脚13的卡扣部131到导热块12的垂直距离等于或略小于散热器20的厚度与PCB板本体31的厚度之和，如此，当卡扣部131卡扣于PCB板30的焊盘311上实现管脚13与PCB板30电连接固定之后，散热器20可以被牢牢的夹持在PCB板30和导热块12之间，确保导热块12紧贴散热器20，从而确保LED灯10所产生的热量能很好的通过导热块12直接传到到散热器20进行散热；另外，管脚13与PCB板30的焊盘311之间通过简单的卡扣方式实现电连接固定，可使得整个LED模组的安装更为方便。在本实施例中，导热块12的材料可以为金属、陶瓷等具有高导热率的导热材料。
进一步地，散热器20设有供管脚13穿过的第一通孔21，PCB板30在PCB板本体31上正对第一通孔21设有供管脚13穿过的第二通孔32，该第二通孔32设在PCB板30的焊盘311的旁边，管脚13依次穿过第一通孔21和第二通孔32后与PCB板30的焊盘311电连接。本实施例中，只需要将设有卡扣部131的管脚13依次穿过第一通孔21和第二通孔32后卡扣在PCB板30的焊盘311上，即可实现管脚13与PCB板30的焊盘311之间电连接固定，可进一步简化整个LED模组的安装过程。
在本实施例中，散热器20为金属散热器20，管脚13在与第一通孔21相对应的位置的外侧设有绝缘层40，以防止该LED灯在工作时由于两个管脚13同时接触到散热器20而出现短路的现象。
需要强调的是，本实施例中，在金属散热器20的第一通孔21的内侧面也设有绝缘层40，以进一步确保LED灯不会出现短路现象。
本实用新型还提供一种显示器。
在一实施例中，该显示器包括前述实施例的LED模组，该LED模组用于背光。
以上仅为本实用新型的优选实施例，并非因此限制本实用新型的专利范围，凡是利用本实用新型说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本实用新型的专利保护范围内。

Claims (9)

1.一种LED模组，其特征在于，所述LED模组包括LED灯、散热器以及PCB板，所述LED灯包括LED主体以及设于所述LED主体上的导热块和管脚，所述导热块设于所述LED主体的面向所述PCB板的底面上，所述管脚的自由端贯通所述PCB板并与所述PCB板的焊盘电连接，所述散热器夹持于所述导热块与所述PCB板之间，所述导热块抵触在所述散热器上。
2.如权利要求1所述的LED模组，其特征在于，所述管脚的自由端设有卡扣部，所述PCB板包括一与所述LED主体的底面平行的PCB板本体，所述PCB板的焊盘设于所述PCB板本体的背离所述LED主体的一面上，所述卡扣部卡扣于所述PCB板的焊盘上以使所述管脚与所述PCB板电连接。
3.如权利要求2所述的LED模组，其特征在于，所述管脚的卡扣部到所述导热块的与所述散热器紧贴的一面的距离不大于所述散热器的厚度与所述PCB板本体的厚度之和。
4.如权利要求2所述的LED模组，其特征在于，所述管脚垂直设于所述LED主体的底面。
5.如权利要求4所述的LED模组，其特征在于，所述管脚为两个，所述导热块设于所述两个管脚之间，其中任意一管脚的卡扣部朝向背离另一管脚的方向延伸设置。
6.如权利要求2所述的LED模组，其特征在于，所述散热器设有供所述管脚穿过的第一通孔，所述PCB板在所述PCB板本体上正对所述第一通孔设有供所述管脚穿过的第二通孔，所述第二通孔设在所述PCB板的焊盘旁，所述管脚依次穿过所述第一通孔和所述第二通孔后与所述PCB板的焊盘电连接。
7.如权利要求6所述的LED模组，其特征在于，所述散热器为金属散热器，所述管脚在与所述第一通孔相对应的位置的外侧设有绝缘层。
8.如权利要求6或7所述的LED模组，其特征在于，所述第一通孔的内侧面设有绝缘层。
9.一种显示器，其特征在于，所述显示器包括如权利要求1至8任意一项所述的LED模组，所述LED模组用于背光。
CN201420521162.5U 2014-09-11 2014-09-11 Led模组及显示器 Expired - Fee Related CN204084030U (zh)

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