CN113871864B - Liquid crystal antenna and manufacturing method thereof - Google Patents
Liquid crystal antenna and manufacturing method thereof Download PDFInfo
- Publication number
- CN113871864B CN113871864B CN202010621666.4A CN202010621666A CN113871864B CN 113871864 B CN113871864 B CN 113871864B CN 202010621666 A CN202010621666 A CN 202010621666A CN 113871864 B CN113871864 B CN 113871864B
- Authority
- CN
- China
- Prior art keywords
- liquid crystal
- substrate
- circuit board
- printed circuit
- flexible substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 224
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 219
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 37
- 239000004983 Polymer Dispersed Liquid Crystal Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 8
- 210000002858 crystal cell Anatomy 0.000 claims 3
- 230000005855 radiation Effects 0.000 claims 1
- 239000000523 sample Substances 0.000 claims 1
- 238000004891 communication Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 130
- 238000010586 diagram Methods 0.000 description 14
- 239000011521 glass Substances 0.000 description 8
- 238000007789 sealing Methods 0.000 description 5
- 230000008093 supporting effect Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
- H01Q3/2676—Optically controlled phased array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
Landscapes
- Details Of Aerials (AREA)
Abstract
The embodiment of the application provides a liquid crystal antenna and a manufacturing method thereof, relates to the technical field of communication, and can improve the performance of the antenna. The manufacturing method of the liquid crystal antenna comprises the following steps: forming a liquid crystal structure layer, wherein the liquid crystal structure layer comprises a liquid crystal layer and a first flexible substrate positioned at one side of the liquid crystal layer; providing a first printed circuit board; and pressing the first flexible substrate between one side far away from the liquid crystal layer and the first printed circuit board.
Description
Technical Field
The application relates to the technical field of communication, in particular to a liquid crystal antenna and a manufacturing method thereof.
Background
The liquid crystal antenna is used for adjusting the phase of electromagnetic waves and has wide application in the fields of radars, missile attitude control, accelerators, communication, instruments and meters, music and the like. Although microstrip antennas have the advantages of small volume, light weight, etc., the performance of the current liquid crystal antenna is limited due to the limitation of the manufacturing process of the liquid crystal antenna.
Disclosure of Invention
The embodiment of the application provides a liquid crystal antenna and a manufacturing method thereof, which can improve the performance of the antenna.
In one aspect, an embodiment of the present application provides a method for manufacturing a liquid crystal antenna, including:
Forming a liquid crystal structure layer, wherein the liquid crystal structure layer comprises a liquid crystal layer and a first flexible substrate positioned at one side of the liquid crystal layer;
Providing a first printed circuit board;
And pressing the first flexible substrate between one side far away from the liquid crystal layer and the first printed circuit board.
In a second aspect, an embodiment of the present application further provides a liquid crystal antenna, including:
the liquid crystal display comprises a liquid crystal structure layer and a first printed circuit board, wherein the liquid crystal structure layer comprises a liquid crystal layer and a first flexible substrate positioned on one side of the liquid crystal layer, and the first flexible substrate is positioned between the liquid crystal layer and the first printed circuit board.
According to the liquid crystal antenna and the manufacturing method thereof, the liquid crystal structure layer with the first flexible substrate and the liquid crystal layer is manufactured firstly to realize protection and sealing of the liquid crystal layer, then the first flexible substrate and the first printed circuit board are pressed together to realize combination of the liquid crystal layer and the first printed circuit board, the first printed circuit board is used for providing elements and circuits matched with the liquid crystal layer, compared with a traditional glass substrate, the printed circuit board can be provided with multiple layers of conducting layers on two sides or one side of a base material, thicker insulating layers can be arranged between adjacent conducting layers to meet radio frequency signal transmission requirements, and connection between the layers can be realized in a punching mode, so that a circuit structure with higher performance can be provided, antenna performance is improved, and a higher frequency range is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the related technical descriptions will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.
Fig. 1 is a schematic flow chart of a method for manufacturing a liquid crystal antenna according to an embodiment of the application;
Fig. 2 is a schematic structural diagram of a liquid crystal antenna according to an embodiment of the present application;
FIG. 3 is a flow chart of another method for fabricating a liquid crystal antenna according to an embodiment of the application;
fig. 4a is a schematic structural diagram of another liquid crystal antenna according to an embodiment of the present application;
FIG. 4b is an exploded view of the liquid crystal structure layer of FIG. 4a before and after irradiation;
FIG. 5a is a schematic diagram showing a partially exploded step in the manufacturing method of the liquid crystal antenna in FIG. 4;
FIG. 5b is a schematic diagram of another embodiment of a liquid crystal antenna;
FIG. 6 is a flow chart of another method for fabricating a liquid crystal antenna according to an embodiment of the application;
FIG. 7 is a schematic diagram showing a partially exploded step in the manufacturing method of the liquid crystal antenna of FIG. 6;
Fig. 8 is a schematic structural diagram of another liquid crystal antenna according to an embodiment of the application;
fig. 9 is a schematic structural diagram of a first printed circuit board according to an embodiment of the application;
FIG. 10 is a top view of a first printed circuit board according to an embodiment of the present application;
FIG. 11 is a schematic cross-sectional view of the AA' direction of FIG. 10;
FIG. 12 is a schematic view of another cross-sectional structure in the direction AA' of FIG. 10.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present application,
The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
As shown in fig. 1 and fig. 2, fig. 1 is a schematic flow chart of a method for manufacturing a liquid crystal antenna according to an embodiment of the present application, and fig. 2 is a schematic structural diagram of a liquid crystal antenna according to an embodiment of the present application, where the method for manufacturing a liquid crystal antenna according to an embodiment of the present application includes:
Step 101, forming a liquid crystal structure layer 10, wherein the liquid crystal structure layer 10 comprises a liquid crystal layer 1 and a first flexible substrate 21 positioned on one side of the liquid crystal layer 1;
Step 102, providing a first printed circuit board 31;
step 103, pressing the side of the first flexible substrate 21 away from the liquid crystal layer 1 with the first printed circuit board 31.
Specifically, the thickness of the liquid crystal layer 1 is in the micrometer level, and a high temperature process exists in the preparation process of the liquid crystal layer 1, so in the embodiment of the application, the liquid crystal structure layer 10 is firstly formed, the liquid crystal structure layer 10 is used for realizing the protection and the sealing of the liquid crystal layer 1, in addition, one side of the liquid crystal structure layer 10 is provided with the first flexible substrate 21, after the liquid crystal structure layer 10 is manufactured, the first flexible substrate 21 and the first printed circuit board 31 are pressed together, after the first flexible substrate 21 and the first printed circuit board 31 are pressed together, the first printed circuit board 31 can be used for providing elements and circuits required by the liquid crystal antenna, and the liquid crystal layer 1 is used for realizing the moving function of an antenna signal through the rotation of the liquid crystal. The first printed circuit board 31 may include a substrate layer and components located at both sides or one side of the substrate layer. In addition, a counter substrate 42 is disposed on a side of the liquid crystal layer 1 away from the first flexible substrate 21, an alignment layer 5 may be disposed between the counter substrate 42 and the liquid crystal layer 1, and a frame sealing adhesive 6 is further disposed between the counter substrate 42 and the first flexible substrate 21, for implementing packaging of liquid crystal.
According to the manufacturing method of the liquid crystal antenna, the liquid crystal structure layer with the first flexible substrate and the liquid crystal layer is manufactured firstly to realize protection and sealing of the liquid crystal layer, then the first flexible substrate and the first printed circuit board are pressed together to realize combination of the liquid crystal layer and the first printed circuit board, elements and circuits matched with the liquid crystal layer are provided through the first printed circuit board, compared with a traditional glass substrate, the printed circuit board can be provided with multiple layers of conducting layers on two sides or one side of a base material, thicker insulating layers can be arranged between adjacent conducting layers to meet radio frequency signal transmission requirements, and connection between the layers can be realized in a punching mode, so that a circuit structure with higher performance can be provided, antenna performance can be improved, and a higher frequency range can be achieved. The reason that printed circuit board is more suitable for the high frequency than glass substrate is that the manufacturing process of printed circuit board is limited less, can make multilayer conducting layer, realizes connecting through modes such as punching, buried line, hole filling etc. between multilayer conducting layer, and every conducting layer can all realize comparatively complicated circuit structure, and the complexity of circuit structure is higher, then realizes the drive to the high frequency signal more easily, consequently, through printed circuit board and the combination of liquid crystal structural layer, the liquid crystal antenna that forms can reach higher frequency. In addition, in the embodiment of the application, after the liquid crystal structure layer and the first printed circuit board are manufactured separately, the liquid crystal structure layer and the first printed circuit board are pressed together to form the liquid crystal antenna, if the printed circuit board is manufactured firstly, then the liquid crystal is manufactured or packaged on the printed circuit board, the printed circuit board is damaged due to a high-temperature process in the manufacturing process of the liquid crystal layer, and the air tightness of the printed circuit board is poor, so that the packaging of the liquid crystal cannot be realized.
Optionally, as shown in fig. 3, fig. 4a and fig. 4b, fig. 3 is a schematic flow chart of another method for manufacturing a liquid crystal antenna according to an embodiment of the present application, fig. 4a is a schematic structural diagram of another liquid crystal antenna according to an embodiment of the present application, fig. 4b is a schematic exploded view of the liquid crystal structure layer in fig. 4a before and after irradiation, and the liquid crystal layer 1 includes a polymer dispersed liquid crystal (polymer dispersed liquid crystal, PDLC); before the step 103 of pressing the side of the first flexible substrate 21 away from the liquid crystal layer 1 and the first printed circuit board 31, the method further includes: step 104, exposing the preset area 20 in the liquid crystal structure layer 10 through the mask plate to irradiate, so as to cure the polymer dispersed liquid crystal in the preset area 20.
Specifically, before the exposure to the liquid crystal layer 1, the polymer monomer 01 and the liquid crystal 02 in the polymer dispersed liquid crystal are dispersed in the liquid crystal layer 1, the mask 03 is used for exposing the preset area 20 in the liquid crystal structure layer 10 by ultraviolet irradiation, the mask 03 is transparent at the corresponding position of the preset area 20 and is opaque at other positions, therefore, the ultraviolet rays can only pass through partial areas to irradiate the preset area 20 of the liquid crystal structure layer 10, in the preset area 20 irradiated by the ultraviolet rays, the polymer monomer 01 is attracted to the preset area 20 to be combined and cured, the liquid crystal 02 can rotate normally outside the preset area 20, even if the polymer dispersed liquid crystal is cured to form a supporting structure, so that the supporting structure of the liquid crystal layer 1 is realized, the overall structural strength of the liquid crystal structure layer 10 is improved, the liquid crystal structure layer 10 and the first printed circuit board 31 are pressed in step 103 later, and the supporting structure formed by curing the polymer dispersed liquid crystal in the pressing process and after the pressing is improved. In the structure shown in fig. 4a, the upper substrate is a glass substrate, the lower substrate is a first printed circuit board 31, and on the basis of this structure, the following three specific structures may be further included: firstly, a fixed potential electrode plate and a radiator are arranged on a glass substrate, and a microstrip line and a power divider network are arranged on a first printed circuit board 31; secondly, a fixed potential electrode plate is arranged on the glass substrate, and a microstrip line, a power divider network and a radiator are arranged on the first printed circuit board 31; thirdly, a fixed potential electrode plate and a radiator are disposed on the glass substrate, a microstrip line is disposed on the first flexible substrate 21, and a power divider network is disposed on the first printed circuit board 31, and other related circuit components, such as a signal amplifier, may be disposed on the first printed circuit board, which is not limited thereto.
Optionally, before the pressing between the side of the first flexible substrate 21 away from the liquid crystal layer 1 and the first printed circuit board 31 in step 103, the method further includes: step 105, forming microstrip lines and a power divider network on the first printed circuit board 31. The microstrip line is used for transmitting radio frequency signals, and simultaneously, is used as one electrode for controlling liquid crystal deflection, and the power divider network is used for providing radio frequency signals for the microstrip line.
Optionally, as shown in fig. 3 and fig. 5a, fig. 5a is a schematic diagram illustrating a partially exploded step in the manufacturing method of the liquid crystal antenna in fig. 4, and step 101, forming a liquid crystal structure layer includes:
a step 1011 of forming a first flexible substrate 21 on the first rigid substrate 41;
step 1012, providing a counter substrate 42;
Step 1013, the first rigid substrate 41 and the opposite substrate 42 are aligned and attached, so that a liquid crystal layer is formed between the first flexible substrate 21 and the opposite substrate 42, and the first flexible substrate 21, the opposite substrate 42 and the liquid crystal layer form a liquid crystal structure layer 10;
step 103, the process of pressing the side surface of the first flexible substrate 21 away from the liquid crystal layer 1 and the first printed circuit board 31 includes:
Step 1031, peeling the first rigid substrate 41 from the first flexible substrate 21;
step 1032, the first printed circuit board 31 is pressed against the first flexible substrate 21 from which the first rigid substrate 41 is peeled.
Specifically, the liquid crystal structure layer 10 is first fabricated on the first rigid substrate 41 to ensure the sealability of the liquid crystal layer 1, and after the fabrication of the liquid crystal structure layer 10 is completed, the first rigid substrate 41 is peeled off and the first flexible substrate 21 and the first printed circuit board 31 are laminated to realize the bonding of the liquid crystal structure layer 10 and the first printed circuit board 31. For example, the microstrip line 06 is disposed on the first printed circuit board 31, after the first printed circuit board 31 and the first flexible substrate 21 are pressed together, the microstrip line 06 directly contacts the surface of the first flexible substrate 21, the fixed potential electrode plate is disposed on the opposite substrate 42, and an electric field can be generated by the voltage action between the microstrip line 06 and the fixed potential electrode plate, so as to control the deflection of the liquid crystal between the two, so that the phase is changed due to the deflection action of the liquid crystal in the transmission process of the radio frequency signal on the microstrip line.
Optionally, as shown in fig. 5b, fig. 5b is a schematic structural diagram of another liquid crystal antenna according to an embodiment of the present application, where the providing the opposite substrate 42 in step 1012 includes: a fixed potential electrode plate 04 is formed on a second rigid substrate, wherein the second rigid substrate is a counter substrate 42, and the fixed potential electrode plate may be grounded, for example, to provide another electrode plate for controlling the deflection of the liquid crystal in the liquid crystal layer 1, during the working process of the liquid crystal antenna, the radio frequency signal is transmitted through the microstrip line, meanwhile, the microstrip line and the fixed potential electrode plate 04 respectively provide two voltages, the liquid crystal in the liquid crystal layer 1 deflects under the control of the electric field generated by the two voltages, and the liquid crystal moves due to the deflection of the liquid crystal during the transmission process of the radio frequency signal, thereby realizing the function of moving the liquid crystal.
Optionally, the method further comprises: a radiator 05 is formed on the opposite substrate 42 or the first printed circuit board 31, and the radiator 05 is used to radiate radio frequency signals. The location of the radiator 05 is not limited in this embodiment of the present application, for example, in the structure shown in fig. 5b, the radiator 05 may be disposed on the opposite substrate 42, the first flexible substrate 21, the first printed circuit board 31, and in the structure shown in fig. 7, the radiator may be disposed on the second printed circuit board 32. In the structure shown in fig. 5b, since the opposite substrate 42 is further provided with the fixed potential electrode plate 04, the fixed potential electrode plate 04 is located between the opposite substrate 42 and the liquid crystal layer 1, the fixed potential electrode plate 04 is located at a side of the opposite substrate 42 away from the liquid crystal layer 1, and the microstrip line is located on the first flexible substrate 21 or the first printed circuit board 31, in order to ensure the coupling effect between the microstrip line and the radiator 05, a hollowed-out area needs to be provided on the fixed potential electrode plate 04, and the radiator 05 is disposed at a position corresponding to the hollowed-out area, so that the radiator 05 can be coupled to the microstrip line through the hollowed-out area.
Optionally, in step 104, the preset area 20 in the liquid crystal structure layer 10 is irradiated and exposed through the mask plate, so that the polymer dispersed liquid crystal in the preset area 20 is cured in the following process: the preset area 20 in the liquid crystal structure layer 10 is irradiated and exposed from the first rigid substrate 41 to the opposite substrate 42 through the mask plate, so that the polymer dispersed liquid crystal in the preset area 20 is solidified.
Specifically, when the second rigid substrate, that is, the opposite substrate 42 is provided with the fixed-potential electrode plate, since the fixed-potential electrode plate occupies a larger space and is opaque, in order to ensure the curing effect of the polymer dispersed liquid crystal, the ultraviolet light irradiation direction during curing is set to be the direction from the first rigid substrate 41 to the opposite substrate 42, so as to avoid shielding of the fixed-potential electrode plate from the light irradiation during curing. At this time, the first printed circuit board 31 is provided with the microstrip line and the power divider network, so that when the polymer dispersed liquid crystal is cured by ultraviolet irradiation, the first printed circuit board 31 is not pressed together with the liquid crystal structure layer 10, and therefore shielding of the opaque structures of the microstrip line and the power divider network to ultraviolet light is avoided.
Alternatively, the first flexible substrate 21 sequentially includes a flexible substrate 211 and an alignment film 212 in a direction gradually away from the first rigid substrate 41, wherein the flexible substrate 211 serves as a base of the first flexible substrate 21, and the alignment film 212 serves to achieve initial alignment of liquid crystals in the liquid crystal layer 1.
Alternatively, the first flexible substrate 21 includes a flexible base material 211, a silicon nitride film 213, and an alignment film 212 in this order in a direction gradually away from the first rigid substrate 41.
Specifically, the first flexible substrate 21 may be manufactured by first coating a polyimide material film having a thickness of 5 μm to 200 μm on the first rigid substrate 41 as the flexible base material 211, the first rigid substrate 41 may be a glass substrate, a silicon substrate, a hard resin, a metal sheet, or the like, the silicon nitride film 213 may be a film layer having a thickness of 0.1 μm to 5 μm for achieving the buffering and planarization between the flexible base material 211 and the alignment film 212, and the alignment film 212 may be a polyimide material film as well.
Optionally, as shown in fig. 6 and fig. 7, fig. 6 is a schematic flow chart of another method for manufacturing a liquid crystal antenna according to an embodiment of the present application, and fig. 7 is a schematic partially exploded step diagram of the method for manufacturing a liquid crystal antenna in fig. 6, where the step 1012 of providing a counter substrate includes: forming a second flexible substrate 22 on the second rigid substrate 42', the second flexible substrate 22 serving as a counter substrate 42;
step 103, the process of pressing the side surface of the first flexible substrate 21 away from the liquid crystal layer 1 and the first printed circuit board 31 further includes:
step 1031, peeling the second rigid substrate 42' from the second flexible substrate 22;
Step 1032, pressing the second printed circuit board 32 with the second flexible substrate 22 after the second rigid substrate 42' is peeled off, where the second printed circuit board 32 is provided with a fixed potential electrode plate (not shown in the figure).
Specifically, the second flexible substrate 22 includes a flexible base 221, a silicon nitride film 223, and an alignment film 222 in this order in a direction gradually away from the second rigid substrate 42'. That is, the second flexible substrate 22 may be the same as the manufacturing process of the first flexible substrate 21, and the second flexible substrate 22 may be manufactured as a counter substrate, in addition to the above-described manner by directly manufacturing the fixed potential electrode on the second rigid substrate and then using the second rigid substrate as the counter substrate 42, and the second flexible substrate 22 may be peeled off the second rigid substrate 42' and then laminated with the second printed circuit board 32, and the opposite-side element and wiring including the fixed potential electrode plate, for example, may be provided by the second printed circuit board 32. In the final liquid crystal antenna structure shown in fig. 7, the lower substrate is a first printed circuit board 31, the upper substrate is a second printed circuit board 32, and on the basis of this structure, the following three specific structures can be further provided: first, a fixed potential electrode plate and a radiator are arranged on a second printed circuit board 32, and a microstrip line and a power divider network are arranged on a first printed circuit board 31; secondly, a fixed potential electrode plate is arranged on the second printed circuit board 32, and a microstrip line, a power divider network and a radiator are arranged on the first printed circuit board 31; third, a fixed potential electrode plate and a radiator are provided on the second printed circuit board 32, a microstrip line is provided on the first flexible substrate 21, and a power divider network is provided on the first printed circuit board 31.
Optionally, as shown in fig. 3 and fig. 8, fig. 8 is a schematic structural diagram of another liquid crystal antenna according to an embodiment of the present application, where the step 101 of forming the liquid crystal structure layer includes:
step 1011, forming a first flexible substrate 21 on a first rigid substrate, wherein the first flexible substrate 21 sequentially comprises a flexible substrate 211, a microstrip line 214 and an alignment film 212 in a direction gradually far away from the first rigid substrate;
step 1013, aligning and bonding the first rigid substrate and the opposite substrate 42, so that a liquid crystal layer is formed between the first flexible substrate 21 and the opposite substrate 42, and the first flexible substrate 21, the opposite substrate 42 and the liquid crystal layer 1 form a liquid crystal structure layer 10; the first printed circuit board 31 includes a power divider network (not shown).
Specifically, in the structure shown in fig. 8, a part of the elements, for example, the microstrip line 214 is provided on the first flexible substrate 21, and another part of the elements, for example, the power divider network is provided on the first printed circuit board 31. With this structure, the microstrip line 214 is disposed at a corresponding position outside the preset region 20, so as to avoid degradation of the curing effect due to the shading effect of the microstrip line 214.
Alternatively, as shown in fig. 8, the first flexible substrate 21 includes a flexible base material 211, a silicon nitride film 213, a microstrip line 214, and an alignment film 212 in this order in a direction gradually away from the first rigid substrate.
Optionally, the mask plate has a grid-shaped light-transmitting region, that is, in step 104, the polymer dispersed liquid crystal in the liquid crystal layer is cured into a grid-shaped supporting structure by ultraviolet irradiation through the mask plate with the grid-shaped light-transmitting region, so as to provide a more stable supporting effect.
As shown in fig. 2, an embodiment of the present application further provides a liquid crystal antenna, including: the liquid crystal structure layer 10 and the first printed circuit board 31, wherein the liquid crystal structure layer 10 comprises a liquid crystal layer 1 and a first flexible substrate 21 positioned on one side of the liquid crystal layer 1, and the first flexible substrate 21 is positioned between the liquid crystal layer 1 and the first printed circuit board 31.
Specifically, the thickness of the liquid crystal layer 1 is in the micrometer level, and a high temperature process exists in the preparation process of the liquid crystal layer 1, so in the embodiment of the application, the liquid crystal structure layer 10 is firstly formed, the liquid crystal structure layer 10 is used for realizing the protection and the sealing of the liquid crystal layer 1, in addition, one side of the liquid crystal structure layer 10 is provided with the first flexible substrate 21, after the liquid crystal structure layer 10 is manufactured, the first flexible substrate 21 and the first printed circuit board 31 are pressed together, after the first flexible substrate 21 and the first printed circuit board 31 are pressed together, the first printed circuit board 31 can be used for providing elements and circuits required by the liquid crystal antenna, and the liquid crystal layer 1 is used for realizing the moving function of an antenna signal through the rotation of the liquid crystal.
According to the liquid crystal antenna provided by the embodiment of the application, the liquid crystal structure layer with the first flexible substrate and the liquid crystal layer is manufactured firstly to realize the protection and sealing of the liquid crystal layer, then the first flexible substrate and the first printed circuit board are pressed together to realize the combination of the liquid crystal layer and the first printed circuit board, and the first printed circuit board is used for providing elements and circuits matched with the liquid crystal layer.
Alternatively, as shown in fig. 4b, the liquid crystal layer 1 includes a polymer dispersed liquid crystal, which is cured in a partial region.
Optionally, as shown in fig. 9, fig. 9 is a schematic structural diagram of a first printed circuit board according to an embodiment of the present application, where the first printed circuit board 31 has a microstrip line 312 and a power divider network 313. For example, the first printed circuit board 31 may include a substrate layer 311, a microstrip line 312, a power divider network 313, an insulating layer 314, and a protective layer 315, where the microstrip line 312 and the power divider network 313 may be located on two sides of the substrate layer 311, or may be located on the same side of the substrate layer 311, and when located on the same side, the microstrip line 312 and the power divider network 313 may be disposed on the same layer, and where the microstrip line 312 and the power divider network 313 may be directly connected or coupled; when the microstrip line 312 and the power divider network 313 are respectively located at two sides of the substrate layer 311, the microstrip line 312 and the power divider network 313 are connected through the through holes on the substrate layer 311, so that the power divider network 313 can provide the microstrip line 312 with a required signal, and optionally, no through hole connection is provided on the substrate layer 311, and at this time, the signal on the power divider network 313 can be coupled to the microstrip line 312 by a coupling manner.
Optionally, as shown in fig. 9, the liquid crystal antenna further includes: the opposite side substrate 42 on the side of the liquid crystal layer 1 far from the first printed circuit board 31 is provided with a fixed potential electrode plate 420, and optionally, the fixed potential electrode plate 420 is grounded.
Alternatively, the counter substrate 42 includes a rigid substrate.
Optionally, the liquid crystal antenna further comprises: a radiator 05 located on the first printed circuit board 31 or the opposite substrate 42.
Alternatively, as shown in fig. 9, the first flexible substrate 21 includes a flexible base material 211 and an alignment film 212 in this order in a direction from the first printed circuit board 31 toward the liquid crystal layer 1.
Alternatively, as shown in fig. 9, the first flexible substrate 21 includes a flexible base material 211, a silicon nitride film 213, and an alignment film 212 in this order in a direction from the first printed circuit board 31 toward the liquid crystal layer 1.
Alternatively, as shown in fig. 7, the counter substrate includes a second flexible substrate 22 and a second printed circuit board 32, and the second flexible substrate 22 is located between the liquid crystal layer 1 and the second printed circuit board 32.
Optionally, as shown in fig. 8, the first flexible substrate 21 is provided with a microstrip line 214, and the first printed circuit board 31 is provided with an active splitter network (not shown in the figure).
Alternatively, the polymer dispersed liquid crystal is cured in the latticed regions.
In the following description of the structure of the first printed circuit board 31 according to the embodiment of the present application with reference to the drawings, as shown in fig. 10, 11 and 12, fig. 10 is a top view of one first printed circuit board according to the embodiment of the present application, fig. 11 is a schematic view of one cross-sectional structure of AA 'in fig. 10, fig. 12 is a schematic view of another cross-sectional structure of AA' in fig. 10, a liquid crystal antenna generally includes a plurality of liquid crystal phase shifter units, in the foregoing embodiment, only the structural features of one liquid crystal phase shifter unit are described, in fig. 10, each dashed box 200 represents a region corresponding to one liquid crystal phase shifter unit in the liquid crystal antenna, the first printed circuit board includes a substrate layer 311, a microstrip line 312 and a power divider network 313 are disposed on the substrate layer 311, wherein each liquid crystal phase shifter unit is correspondingly disposed with one microstrip line 312, the power divider network 313 is distributed in the entire first printed circuit board, and is connected to each microstrip line 312 for providing signals to each microstrip line 312 in each liquid crystal phase shifter unit, for example, the microstrip line 312 is provided with a microstrip signal for controlling a high frequency and a low frequency signal to each microstrip line 312 through the power divider network 313. In the structures shown in fig. 11 and 12, the power divider network 313 and the microstrip line 312 are located on the same layer, but the embodiment of the present application is not limited thereto, for example, in other possible implementations, the power divider network 313 and the microstrip line 312 may be located on different layers, where an insulating layer is disposed between the microstrip line and the power divider network when disposed on different layers, and the insulating layer may be perforated to implement direct connection between the microstrip line and the power divider network, or may be not perforated, where the microstrip line and the power divider network need to overlap, and signal coupling is implemented at the overlapping position; it should be noted that, in fig. 10, the microstrip line is only formed by bending a trace similar to a serpentine trace, and may be a circle, a ring, a quadrangle, a polygon, etc., which is not limited thereto; in fig. 10, the power divider network may multiplex the transmission of the radio frequency signal and the driving signal for driving the liquid crystal to rotate at the same time, or the driving signal for driving the liquid crystal to rotate may be connected between the driving circuit of the first printed circuit board and the microstrip line (not shown in the drawing) through a lead, so as to realize signal transmission, which is not limited herein; in the structure shown in fig. 11, the radiator is not provided on the first printed circuit board, whereas in the structure shown in fig. 12, the radiator 05 is further provided on the first printed circuit board, the radiator 05 is located on one side of the base material layer 311, and the microstrip line 312 and the power divider network 313 are located on the other side of the base material layer 311.
The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather to enable any modification, equivalent replacement, improvement or the like to be made within the spirit and principles of the application.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.
Claims (22)
1. A method for manufacturing a liquid crystal antenna, comprising:
Forming a liquid crystal structure layer, wherein the liquid crystal structure layer comprises a liquid crystal layer and a first flexible substrate positioned at one side of the liquid crystal layer;
Providing a first printed circuit board;
Pressing the side, far away from the liquid crystal layer, of the first flexible substrate with the first printed circuit board;
The liquid crystal layer comprises polymer dispersed liquid crystal;
The forming of the liquid crystal structure layer comprises providing a contralateral substrate, wherein the providing of the contralateral substrate comprises forming a fixed potential electrode plate on the contralateral substrate, and the fixed potential electrode plate is positioned on one side of the liquid crystal layer away from the first flexible substrate;
Before the first flexible substrate is pressed between the side far away from the liquid crystal layer and the first printed circuit board, the method further comprises the following steps:
and exposing a preset area in the liquid crystal structure layer in a radiation manner from the first flexible substrate to the liquid crystal layer through a mask plate, so that polymer dispersed liquid crystal in the preset area is solidified.
2. The method of claim 1, wherein the step of determining the position of the substrate comprises,
Before the first flexible substrate is pressed between the side far away from the liquid crystal layer and the first printed circuit board, the method further comprises the following steps:
and forming a microstrip line and a power divider network on the first printed circuit board.
3. The method of claim 2, wherein the step of determining the position of the substrate comprises,
The forming of the liquid crystal structure layer comprises:
forming the first flexible substrate on a first rigid substrate;
The first rigid substrate and the opposite side substrate are aligned and attached, a liquid crystal layer is formed between the first flexible substrate and the opposite side substrate, and the first flexible substrate, the opposite side substrate and the liquid crystal layer form the liquid crystal structure layer;
the process of pressing the first flexible substrate between the surface of one side far away from the liquid crystal layer and the first printed circuit board comprises the following steps:
peeling the first rigid substrate from the first flexible substrate;
And pressing the first printed circuit board and the first flexible substrate after the first rigid substrate is peeled off.
4. The method of claim 3, wherein the step of,
The providing a counter substrate includes: a fixed potential electrode plate is formed on the second rigid substrate.
5. The method as recited in claim 4, further comprising:
A radiator is formed on the opposite substrate or the first printed circuit board.
6. The method of claim 4, wherein the step of determining the position of the first electrode is performed,
The irradiation exposure is carried out on a preset area in the liquid crystal structure layer through a mask plate, so that the polymer dispersed liquid crystal in the preset area is solidified in the following steps:
and carrying out irradiation exposure on a preset area in the liquid crystal structure layer through a mask plate from the first rigid substrate to the opposite side substrate, so that polymer dispersed liquid crystal in the preset area is solidified.
7. The method of claim 4, wherein the step of determining the position of the first electrode is performed,
In the direction gradually far away from the first rigid substrate, the first flexible substrate sequentially comprises a flexible base material and an alignment film.
8. The method of claim 7, wherein the step of determining the position of the probe is performed,
The first flexible substrate includes a flexible base material, a silicon nitride film, and an alignment film in this order in a direction gradually away from the first rigid substrate.
9. The method of claim 3, wherein the step of,
The providing a counter substrate includes:
forming a second flexible substrate on a second rigid substrate;
The process of pressing the first flexible substrate between the first printed circuit board and the surface of the side far away from the liquid crystal layer further comprises the following steps:
peeling the second rigid substrate from the second flexible substrate;
and pressing the second printed circuit board with the second flexible substrate after the second rigid substrate is peeled off, wherein a fixed potential electrode plate is arranged on the second printed circuit board.
10. The method of claim 1, wherein the step of determining the position of the substrate comprises,
The forming of the liquid crystal structure layer comprises:
Forming a first flexible substrate on a first rigid substrate, wherein the first flexible substrate sequentially comprises a flexible substrate, a microstrip line and an alignment film in a direction gradually away from the first rigid substrate;
aligning and bonding the first rigid substrate and the opposite side substrate, so that a liquid crystal layer is formed between the first flexible substrate and the opposite side substrate, and the first flexible substrate, the opposite side substrate and the liquid crystal layer form the liquid crystal structure layer;
The first printed circuit board comprises a power divider network thereon.
11. The method of claim 10, wherein the step of determining the position of the first electrode is performed,
In the direction gradually far away from the first rigid substrate, the first flexible substrate sequentially comprises a flexible base material, a silicon nitride film, a microstrip line and an alignment film.
12. The method of claim 1, wherein the step of determining the position of the substrate comprises,
The mask plate is provided with a grid-shaped light-transmitting area.
13. A liquid crystal antenna prepared by the method of any one of claims 1-12, comprising:
The liquid crystal display comprises a liquid crystal structure layer and a first printed circuit board, wherein the liquid crystal structure layer comprises a liquid crystal layer and a first flexible substrate positioned at one side of the liquid crystal layer, and the first flexible substrate is positioned between the liquid crystal layer and the first printed circuit board;
the liquid crystal layer comprises polymer dispersed liquid crystal, and the polymer dispersed liquid crystal is solidified in a partial area before the side of the first flexible substrate far away from the liquid crystal layer is pressed between the first printed circuit board and the first flexible substrate.
14. The liquid crystal antenna of claim 13, wherein the liquid crystal antenna comprises a plurality of liquid crystal cells,
The first printed circuit board is provided with a microstrip line and a power divider network.
15. The liquid crystal antenna of claim 14, further comprising:
the opposite side substrate is positioned on one side of the liquid crystal layer far away from the first printed circuit board, and a fixed potential electrode plate is arranged on the opposite side substrate.
16. The liquid crystal antenna of claim 15, wherein,
The counter substrate includes a rigid substrate.
17. The liquid crystal antenna of claim 16, further comprising:
a radiator on the first printed circuit board or the opposite substrate.
18. The liquid crystal antenna of claim 16, wherein,
The first flexible substrate includes a flexible substrate and an alignment film in this order in a direction from the first printed circuit board toward the liquid crystal layer.
19. The liquid crystal antenna of claim 18, wherein,
The first flexible substrate includes a flexible substrate, a silicon nitride film, and an alignment film in this order in a direction from the first printed circuit board toward the liquid crystal layer.
20. The liquid crystal antenna of claim 15, wherein,
The opposite substrate includes a second flexible substrate and a second printed circuit board, and the second flexible substrate is positioned between the liquid crystal layer and the second printed circuit board.
21. The liquid crystal antenna of claim 13, wherein the liquid crystal antenna comprises a plurality of liquid crystal cells,
The first flexible substrate is provided with a microstrip line, and the first printed circuit board is provided with an active power divider network.
22. The liquid crystal antenna of claim 13, wherein the liquid crystal antenna comprises a plurality of liquid crystal cells,
The polymer dispersed liquid crystal is cured in the latticed regions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010621666.4A CN113871864B (en) | 2020-06-30 | 2020-06-30 | Liquid crystal antenna and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010621666.4A CN113871864B (en) | 2020-06-30 | 2020-06-30 | Liquid crystal antenna and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113871864A CN113871864A (en) | 2021-12-31 |
| CN113871864B true CN113871864B (en) | 2024-09-17 |
Family
ID=78982026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010621666.4A Active CN113871864B (en) | 2020-06-30 | 2020-06-30 | Liquid crystal antenna and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113871864B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070002187A (en) * | 2005-06-30 | 2007-01-05 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display device and method for manufacturing the same |
| CN108563050A (en) * | 2018-05-31 | 2018-09-21 | 成都天马微电子有限公司 | Liquid crystal phase shifter and antenna |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9780434B1 (en) * | 2014-04-18 | 2017-10-03 | University Of South Florida | Flexible antenna and method of manufacture |
| US9531077B1 (en) * | 2014-04-18 | 2016-12-27 | University Of South Florida | Flexible antenna and method of manufacture |
| CN105785658B (en) * | 2016-05-13 | 2018-03-30 | 深圳市华星光电技术有限公司 | Liquid crystal panel structure and preparation method |
| CN108761862A (en) * | 2018-05-23 | 2018-11-06 | 成都天马微电子有限公司 | A kind of liquid crystal phase-shifting unit and preparation method thereof, liquid crystal phase shifter, antenna |
| CN108957864B (en) * | 2018-08-01 | 2020-02-18 | 深圳市华星光电半导体显示技术有限公司 | Mask and preparation method of flexible liquid crystal display panel |
| CN110824734A (en) * | 2018-08-10 | 2020-02-21 | 北京京东方传感技术有限公司 | Liquid crystal phase shifter and liquid crystal antenna |
-
2020
- 2020-06-30 CN CN202010621666.4A patent/CN113871864B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070002187A (en) * | 2005-06-30 | 2007-01-05 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display device and method for manufacturing the same |
| CN108563050A (en) * | 2018-05-31 | 2018-09-21 | 成都天马微电子有限公司 | Liquid crystal phase shifter and antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113871864A (en) | 2021-12-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110034358B (en) | Liquid crystal phase shifter, liquid crystal antenna and manufacturing method of liquid crystal phase shifter | |
| CN114253015B (en) | Liquid crystal antenna, manufacturing method thereof and communication equipment | |
| CN107658547B (en) | Liquid crystal antenna device | |
| CN109782494B (en) | Liquid crystal phase shifter and manufacturing method thereof | |
| CN209544568U (en) | A kind of liquid crystal phase shifter and liquid crystal antenna | |
| CN112235449A (en) | Shell assembly, antenna assembly and electronic equipment | |
| JP2021517746A (en) | Flat LCD antenna and its manufacturing method | |
| US11799197B2 (en) | Liquid crystal antenna and preparation method thereof | |
| WO2021000733A1 (en) | Housing assembly, antenna assembly, and electronic device | |
| CN113871864B (en) | Liquid crystal antenna and manufacturing method thereof | |
| US11916297B2 (en) | Liquid crystal antena and fabrication thereof | |
| CN115000680B (en) | Antenna, phase shifter and communication equipment | |
| CN216145055U (en) | Laminated liquid crystal antenna | |
| CN113900310B (en) | Liquid crystal device and method for manufacturing the same | |
| Martynyuk et al. | 2-bit $ X $-band reflective waveguide phase shifter with BCB-based bias circuits | |
| US20240047882A1 (en) | Antenna device | |
| CN113437495B (en) | Antenna | |
| US12062852B2 (en) | Antenna and fabrication method | |
| CN116137754A (en) | Circuit board and manufacturing method thereof | |
| CN115441166A (en) | Electronic device | |
| JP2023156858A (en) | Wiring board, module and image display device | |
| CN117276865A (en) | Liquid crystal antenna and manufacturing method thereof | |
| CN118985071A (en) | Phase shifter, preparation method thereof and electronic equipment | |
| CN117638501A (en) | Antenna unit and electronic equipment | |
| CN115241636A (en) | Antenna module, manufacturing method thereof and terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |