CN1137387C - Method for testing abnormality of electronic element and device on printed circuit board and its testing instrument - Google Patents
Method for testing abnormality of electronic element and device on printed circuit board and its testing instrument Download PDFInfo
- Publication number
- CN1137387C CN1137387C CNB001024914A CN00102491A CN1137387C CN 1137387 C CN1137387 C CN 1137387C CN B001024914 A CNB001024914 A CN B001024914A CN 00102491 A CN00102491 A CN 00102491A CN 1137387 C CN1137387 C CN 1137387C
- Authority
- CN
- China
- Prior art keywords
- image
- printed
- computing machine
- circuit board
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention discloses a method for testing the abnormality of an electronic element on a printed circuit board and a tester thereof. An image shooting device is used for obtaining image information in a designated region on the surface of the printed-circuit board with an element, and the image information is sent into a computer for analyzing images which are compared with standard data stored in a data base to judge whether the electronic element on the printed-circuit board has abnormalities. The present invention can examine abnormal conditions of missing faults, erroneous insertion, erroneous welding, etc. on the circuit board, and has the advantages of high accuracy and automatic operation.
Description
Technical field:
The present invention relates to electronic devices and components abnormality test method and tester on a kind of printed-wiring board (PWB).
Background technology:
Along with the development of technology, printed-wiring board (PWB) has more and more microminiaturized trend, and the electronic devices and components above it are because too small overstocked, makes that to judge that with human eye components and parts unusual (comprising falling material omission, wrong plug, weldering mistake etc.) almost become impossible.Simultaneously, existing electrical detection instrument can't be applicable to surface mount elements.Therefore, check that how fast, easily and accurately components and parts become a problem that presses for solution unusually on these wiring boards.
Summary of the invention:
Purpose of the present invention is exactly to provide electronic devices and components abnormality test method and tester on a kind of printed-wiring board (PWB) in order to overcome the above problems, with fast, check out abnormal occurrencies such as falling to expect omission, wrong plug, weldering mistake on the wiring board easily and accurately.
The present invention realizes that the scheme of above-mentioned purpose is: the unusual method of electronic devices and components on a kind of testing PC board is characterized in that may further comprise the steps: it is fixing that printed-wiring board (PWB) is put into the locating rack that has image-pickup device; Obtain the image information of appointed area on the surface that components and parts are arranged on the printed-wiring board (PWB) with image-pickup device; Image information is sent into computing machine; Computing machine is analyzed image, and compares with the normal data stored in the database, to judge on the printed-wiring board (PWB) whether there being unusually electronic devices and components; Wherein computing machine method that image is analyzed may further comprise the steps: the difference according to each several part color in the image is divided into a plurality of color regions; Calculate each regional geometric properties; The standard value of storing in the feature calculated and the computing machine machine is compared; Described geometric properties comprises regional barycenter, region shape, symmetry.
Owing to adopted above scheme, with sending in the computing machine after the image absorption of image-pickup device with printed-wiring board (PWB), replace the human eye operation, accurately quick more, analysis to components and parts on the wiring board is undertaken by image, compare with the testing electrical property instrument, do not need contact electrode, thereby applicable surface mount elements is analyzed.
Description of drawings:
Fig. 1 is a tester general illustration of the present invention.
Embodiment:
Also the present invention is described in further detail in conjunction with the accompanying drawings below by specific embodiment.
Electronic devices and components abnormality test method on a kind of printed-wiring board (PWB) is characterized in that may further comprise the steps:
It is fixing that printed-wiring board (PWB) 5 is put into the locating rack 1 that has image-pickup device 2;
Obtain the image information of appointed area on the surface that components and parts are arranged on the printed-wiring board (PWB) 5 with image-pickup device 2;
Image information is sent into computing machine 3;
3 pairs of images of computing machine are analyzed, and compare with the normal data stored in the database, to judge on the printed-wiring board (PWB) 5 whether there being unusually electronic devices and components.
Wherein the method analyzed of 3 pairs of images of computing machine may further comprise the steps: the difference according to each several part color in the image is divided into a plurality of color regions, and electronic devices and components are extracted, and carries out color coding, with the printed circuit board (PCB) filtering background, gives black; Calculate each regional geometric properties (comprising regional barycenter, region shape, symmetry) then; The feature of calculating is compared with the standard value of storage in the computing machine machine 3.If error surpasses setting value, then judge unusual, otherwise assert qualified.
See Fig. 1, shown in be to realize electronic devices and components abnormality test instrument on a kind of printed-wiring board (PWB) of said method, comprise locating rack 1, computing machine 3, on the described locating rack 1 image recording device 2 is installed, image recording device 2 links to each other with computing machine 3 by signal wire; Electronic devices and components anomaly analysis program on the wiring board is arranged in computing machine 3.Described image recording device 2 can be color video camera, scanner etc.Also comprise printer 4 in the instrument, it links to each other with computing machine 3, so that the result is printed.6 is sliding bars among the figure, drive image recording device 2 and slide, and the 7th, head roll, moving printed-wiring board (PWB) 5 motions of driver card troughed belt.
Claims (1)
1, the unusual method of electronic devices and components on a kind of testing PC board is characterized in that may further comprise the steps:
It is fixing that printed-wiring board (PWB) (5) is put into the locating rack (1) that has image-pickup device (2);
Obtain the image information of appointed area on the surface that components and parts are arranged on the printed-wiring board (PWB) (5) with image-pickup device (2);
Image information is sent into computing machine (3);
Whether computing machine (3) is analyzed image, and compares with the normal data stored in the database, go up electronic devices and components and have unusually to judge printed-wiring board (PWB) (5);
Wherein computing machine (3) method that image is analyzed may further comprise the steps: the difference according to each several part color in the image is divided into a plurality of color regions; Calculate each regional geometric properties; The feature of calculating is compared with the standard value of storage in the computing machine machine (3);
Described geometric properties comprises regional barycenter, region shape, symmetry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001024914A CN1137387C (en) | 2000-03-14 | 2000-03-14 | Method for testing abnormality of electronic element and device on printed circuit board and its testing instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001024914A CN1137387C (en) | 2000-03-14 | 2000-03-14 | Method for testing abnormality of electronic element and device on printed circuit board and its testing instrument |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1263270A CN1263270A (en) | 2000-08-16 |
| CN1137387C true CN1137387C (en) | 2004-02-04 |
Family
ID=4576420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001024914A Expired - Fee Related CN1137387C (en) | 2000-03-14 | 2000-03-14 | Method for testing abnormality of electronic element and device on printed circuit board and its testing instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1137387C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104915635A (en) * | 2014-03-10 | 2015-09-16 | 波音公司 | Composite inspection and structural check of multiple layers |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3733094B2 (en) * | 2002-08-22 | 2006-01-11 | トヨタ自動車株式会社 | Pass / fail judgment device, pass / fail judgment program, and pass / fail judgment method |
| JP4228778B2 (en) * | 2003-05-21 | 2009-02-25 | ウシオ電機株式会社 | Pattern inspection device |
| CN101566460B (en) * | 2008-04-24 | 2012-07-18 | 鸿富锦精密工业（深圳）有限公司 | Substrate detection system for double-sided circuit board, detection method and detection carrier therefor |
| CN101308184B (en) * | 2008-06-13 | 2010-12-08 | 深圳创维－Rgb电子有限公司 | Method and system for analyzing and detecting inserting element using image |
| CN101603815B (en) * | 2008-06-13 | 2012-03-28 | 鸿富锦精密工业（深圳）有限公司 | System and method for checking small line segment figure |
| KR101231597B1 (en) | 2010-11-15 | 2013-02-08 | 주식회사 고영테크놀러지 | Inspection method |
| TWI467166B (en) * | 2011-09-21 | 2015-01-01 | Giga Byte Tech Co Ltd | Method and apparatus for inspecting pcb defects |
| CN102967820A (en) * | 2012-11-13 | 2013-03-13 | 东莞宇龙通信科技有限公司 | Mobile terminal and self-detection method thereof |
| CN104374420A (en) * | 2013-08-16 | 2015-02-25 | 镒生电线塑料(昆山)有限公司 | Image detection machine capable of preventing parts from being missed and detection method |
| CN105760424A (en) * | 2016-01-16 | 2016-07-13 | 唐山师范学院 | Database establishment method for storing key data of enterprise products |
| CN107432748B (en) * | 2016-05-27 | 2021-01-01 | 上海西门子医疗器械有限公司 | Flat panel detector testing system and flat panel detector testing method |
| CN108627088A (en) * | 2017-03-24 | 2018-10-09 | 汉达精密电子(昆山)有限公司 | Automatic measuring instrument and its method |
| CN107192310B (en) * | 2017-05-15 | 2020-03-24 | 格力电器（武汉）有限公司 | Method for inspecting circuit board welding jig |
| CN109142903A (en) * | 2017-06-27 | 2019-01-04 | 鸿富锦精密工业(武汉)有限公司 | The test macro and method of electronic equipment |
| CN111000357B (en) * | 2018-10-04 | 2023-01-03 | 卡西欧计算机株式会社 | Nail print apparatus, nail print method, and recording medium |
| TW202043786A (en) * | 2019-05-21 | 2020-12-01 | 仁寶電腦工業股份有限公司 | Testing method and testing system |
| CN111693778B (en) * | 2020-05-25 | 2021-07-20 | 珠海格力电器股份有限公司 | Patch resistor abnormality detection method, device, system, equipment and storage medium |
| JP7547980B2 (en) * | 2020-12-14 | 2024-09-10 | トヨタ自動車株式会社 | Abnormality diagnosis system, abnormality diagnosis method, and program |
| CN114089213A (en) * | 2021-12-03 | 2022-02-25 | 中科国微科技(深圳)有限公司 | All-digital control type high-power direct-current stabilized power supply detection method and system |
-
2000
- 2000-03-14 CN CNB001024914A patent/CN1137387C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104915635A (en) * | 2014-03-10 | 2015-09-16 | 波音公司 | Composite inspection and structural check of multiple layers |
| CN104915635B (en) * | 2014-03-10 | 2019-11-26 | 波音公司 | Check the method and computer system, computer-readable medium of composite article |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1263270A (en) | 2000-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1137387C (en) | Method for testing abnormality of electronic element and device on printed circuit board and its testing instrument | |
| JP6922168B2 (en) | Surface mount line quality control system and its control method | |
| US6701003B1 (en) | Component identification system for electronic board testers | |
| CN107015137B (en) | Circuit board detection device, system and method | |
| CN104730078A (en) | Thermal infrared imager-based AOI circuit board detection method | |
| KR102228957B1 (en) | Printed circuit board inspecting apparatus, method for determining fault type of screen printer and computer readable recording medium | |
| JP4667681B2 (en) | Mounting inspection system and mounting inspection method | |
| KR20080034560A (en) | Fpcb test unit for portable electronic equipment | |
| CN110132960B (en) | Detection method of circuit board assembly | |
| KR20100039816A (en) | Method of detecting mainboard mark, detecting apparatus, and method of placing mainboard | |
| CN210863584U (en) | Quality control detection device for identifying connecting terminal by two-dimensional image | |
| WO2007139716A2 (en) | Embedded inspection image archival for electronics assembly machines | |
| EP0940683A2 (en) | Printed circuit board testing system with page scanner | |
| CN118011190B (en) | Printed circuit board reliability analysis method, system and storage medium | |
| US7134599B2 (en) | Circuit board inspection apparatus | |
| US20060023934A1 (en) | Component edge detecting method, component edge detecting program and component inspection apparatus | |
| JP4161884B2 (en) | Solder inspection equipment | |
| JP4423130B2 (en) | Printed circuit board visual inspection method, printed circuit board visual inspection program, and printed circuit board visual inspection apparatus | |
| EP0898172B1 (en) | Testing printed circuit assemblies | |
| KR101664413B1 (en) | Method for detecting mount error of SMT machine | |
| CN110102492B (en) | Circuit board electrical property detects smelting tool | |
| KR101640936B1 (en) | Method of Analyzing Defect in Printing Process and Computer Readable Media Storing The Same | |
| JP2012038692A (en) | Connector defect inspection device | |
| JPH06207908A (en) | Inspection system of mounting unit of narrow and small component | |
| JP2008218737A (en) | Image processing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| C10 | Entry into substantive examination | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |