CN113490086A

CN113490086A - Electronic device

Info

Publication number: CN113490086A
Application number: CN202110765966.4A
Authority: CN
Inventors: 董传宇; 蒋斌; 丁建; 伍伟竞; 贾晓飞
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-07-07
Filing date: 2021-07-07
Publication date: 2021-10-08
Also published as: WO2023280089A1

Abstract

The application discloses electronic equipment belongs to the technical field of communication. The electronic device includes: a frame; a speaker disposed at the frame; the main board is arranged on the frame, an avoiding hole is formed in the main board, a part of the loudspeaker is located in the avoiding hole, a first space is formed between the main board and the frame, the main board is provided with a first surface, a first component is arranged on the first surface, and the first component is located in the first space; the sealing support is connected with the mainboard and covers the loudspeaker, and a second space is formed between the sealing support and the loudspeaker; the first space is communicated with the second space through the avoiding hole to form a closed rear cavity. This technical scheme can solve the problem of speaker during operation back lid vibration.

Description

Electronic device

Technical Field

The application belongs to the technical field of communication, and particularly relates to an electronic device.

Background

In the existing electronic device, in order to meet the continuous rich audio-visual requirements of users, a plurality of speakers are usually configured.

Conventional speakers are generally classified into a closed type speaker, a semi-open type speaker, an open type speaker, and the like. In order to promote electronic equipment's inner space utilization, present electronic equipment adopts semi-open speaker or open speaker mostly, but when adopting this kind of design, because the back chamber of speaker extends to electronic equipment's back lid, therefore the speaker during operation, the air in the back chamber can promote the back lid, leads to the back lid vibration, causes user's use to experience the worsen.

Disclosure of Invention

The embodiment of the application aims to provide electronic equipment which can solve the problem that a rear cover vibrates when a loudspeaker works.

In order to solve the technical problem, the present application is implemented as follows:

an embodiment of the present application provides an electronic device, which includes:

a frame;

a speaker disposed at the frame;

the main board is arranged on the frame, an avoiding hole is formed in the main board, a part of the loudspeaker is located in the avoiding hole, a first space is formed between the main board and the frame, the main board is provided with a first surface, a first component is arranged on the first surface, and the first component is located in the first space;

the sealing support is connected with the mainboard and covers the loudspeaker, and a second space is formed between the sealing support and the loudspeaker;

the first space is communicated with the second space through the avoiding hole to form a closed rear cavity.

In the embodiment of the application, a first space is formed between the main board and the frame, a second space is formed between the sealing support and the loudspeaker, the first space is communicated with the second space through the avoiding hole of the main board to form a closed back cavity, and the first space between the main board and the frame can be used as a part of the closed back cavity of the loudspeaker, so that the scheme can form the closed back cavity which is large enough, and does not need to additionally reserve an overlarge space to form the closed back cavity, thereby improving the utilization rate of the internal space of the electronic equipment; meanwhile, the sealing support can separate the rear cover from the closed rear cavity, and when the loudspeaker works, the air in the closed rear cavity cannot push the rear cover, so that the rear cover cannot vibrate, and the use experience of a user is improved.

Drawings

Fig. 1 is an exploded view of a part of the structure of an electronic device disclosed in an embodiment of the present application;

fig. 2 is a sectional view of a partial structure of an electronic apparatus disclosed in an embodiment of the present application.

Description of reference numerals:

100-frame, 110-first projection, 111-third through hole, 120-second projection;

200-a loudspeaker;

300-main board, 301-avoidance hole, 310-first hole wall, 320-second hole wall, 302-first surface and 303-second surface;

400-sealing shelf, 401-first inner side wall, 402-second inner side wall;

500-a first component;

610-a first space, 620-a second space;

700-a first shield can;

800-speaker front cavity;

910-first foam, 920-double faced adhesive tape, 930-second foam.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The electronic device provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

Referring to fig. 1 to 2, an embodiment of the present application discloses an electronic device including a frame 100, a speaker 200, a main board 300, a sealing bracket 400, and a rear cover.

The frame 100 may serve as a base member of the electronic device, which may provide a mounting base for other components of the electronic device, and optionally, the frame 100 may be connected to a rear cover, and a display screen of the electronic device may be mounted on a side of the frame 100 facing away from the rear cover.

The speaker 200 is provided in the frame 100, and the speaker 200 generates sound by vibrating air around it.

The main board 300 is disposed on the frame 100, the main board 300 has an avoiding hole 301, and a portion of the speaker 200 is disposed in the avoiding hole 301, that is, the main board 300 is disposed around the speaker 200, and a gap a is formed between the main board 300 and the speaker 200. A first space 610 is formed between the main board 300 and the frame 100, the main board 300 has a first side 302, the first side 302 is provided with the first component 500, the first component 500 is located in the first space 610, in other words, at least one first component 500 can be provided on the side of the main board 300 facing away from the rear cover, and the first space 610 is used for accommodating the first component 500.

The sealing bracket 400 is connected to the main board 300, and the sealing bracket 400 covers the speaker 200, and a second space 620 is formed between the sealing bracket 400 and the speaker 200. The first space 610 may communicate with the second space 620 through the escape hole 301 to form a closed rear chamber. That is, the frame 100, the speaker 200, the main board 300, and the sealing bracket 400 form a closed rear cavity together by providing the sealing bracket 400 and forming the avoiding hole 301 in the main board 300.

In the embodiment of the present application, since the first space 610 between the main board 300 and the frame 100 can be used as a part of the closed rear cavity of the speaker 200, the solution can form a sufficiently large closed rear cavity, and an excessively large space does not need to be additionally reserved to form the closed rear cavity, so as to improve the utilization rate of the internal space of the electronic device; meanwhile, the sealing bracket 400 may separate the rear cover from the closed rear cavity, and when the speaker 200 operates, the air in the closed rear cavity may not push the rear cover, so the rear cover may not vibrate, thereby improving the user experience.

In order to realize the shielding of the first component 500, the electronic device further includes a first shielding case 700, the first shielding case 700 is disposed on the first side 302 of the motherboard 300, the first shielding case 700 covers at least one first component 500, and the first shielding case 700 is located in the first space 610, at this time, a space between the first shielding case 700 and the motherboard 300 is a first subspace, and a space between the first shielding case 700 and the frame 100 is a second subspace. In an alternative embodiment, in order to improve the shielding effect of the first component 500, the first shielding cover 700 is usually in a closed structure, so that the first subspace is separated from the second subspace, and further, in order to fully utilize the first subspace, the first shielding cover 700 may be provided with a first through hole through which the first subspace is communicated with the second subspace, and at this time, the first subspace and the second subspace are both part of the closed back cavity, so as to increase the closed back cavity, thereby improving the sound effect of the speaker 200.

The number of the first shielding cases 700 may be only one, and all the first components 500 may be covered by the first shielding cases 700, in another alternative embodiment, the electronic device further includes at least two first shielding cases 700, the first shielding cases 700 are disposed on the first face 302, and the first shielding cases 700 cover at least one of the first components 500, and a gap is formed between adjacent first shielding cases 700, and the gap is a part of the closed rear cavity. This embodiment increases the sound effect of the speaker 200 by increasing the number of the first shield cans 700 so that the space between the adjacent first shield cans 700 can be used as a part of the closed rear cavity, thereby increasing the closed rear cavity. Meanwhile, this embodiment does not require the first shield can 700 to have an opening, so that the shielding effect of the first shield can 700 on the first component 500 can be improved, and the structural strength of the first shield can 700 can be improved.

The main board 300 also has a second side 303 opposite the first side 302, which second side 303 may face the back cover. In a further embodiment, the second surface 303 is provided with a second component and a second shielding cover, the second shielding cover covers at least one second component, a third space is formed between the second shielding cover and the motherboard 300, in order to fully utilize the third space, the motherboard 300 may be provided with a second through hole, and the second space 620 between the motherboard 300 and the frame 100 may be communicated with the third space through the second through hole, so that the third space is a part of the closed rear cavity. At this time, the third space between the second shield case and the main board 300 may also be used as a part of the closed rear cavity, so as to further enlarge the closed rear cavity, thereby improving the sound effect of the speaker 200.

Optionally, the connection position of the sealing bracket 400 and the motherboard 300 may be a hole wall of the avoiding hole 301, the first side 302 of the motherboard 300, or the second side 303 of the motherboard 300. In contrast, when the sealing bracket 400 is coupled to the second side 303 of the main board 300, the size of the escape hole 301 is not limited by the sealing bracket 400, thereby facilitating the structural design of the main board 300. Simultaneously, dodge hole 301 and can set up a bit less as far as possible under the prerequisite of dodging speaker 200 to alleviate and dodge the weakening of hole 301 to the structural strength of mainboard 300, make the structural strength of mainboard 300 higher, can also increase the face area of mainboard 300 simultaneously, so that set up more components and parts on mainboard 300. Optionally, the sealing bracket 400 may be connected to and sealingly engaged with the second side 303 of the main board 300 through the first foam 910, thereby improving the sealing performance of the closed back cavity.

The sealing bracket 400 has opposite first and second

inner side walls

401 and 402, the first and second

inner side walls

401 and 402 both facing the speaker 200, the first inner side wall 401 being located between the first component 500 and the second inner side wall 402, that is, the first inner side wall 401 is closer to the first component 500 than the second inner side wall 402, and the second inner side wall 402 is closer to the edge of the main board 300 than the first inner side wall 401. The avoiding hole 301 has a first hole wall 310 and a second hole wall 320 opposite to each other, the first hole wall 310 and the second hole wall 320 both face the speaker 200, the first hole wall 310 is located between the first component 500 and the second hole wall 320, that is, the first hole wall 310 is closer to the first component 500 than the second hole wall 320, and the second hole wall 320 is closer to the edge of the main board 300 than the first hole wall 310. The first inner side wall 401 may be at least partially aligned with the first hole wall 310, or the first hole wall 310 may extend in a direction close to the speaker 200 relative to the first inner side wall 401, and relatively speaking, the latter arrangement may result in an increase in size of the sealing bracket 400, thereby occupying too much board space of the motherboard 300, while the former arrangement may appropriately reduce the size of the sealing bracket 400, thereby alleviating the occupation of the board space of the motherboard 300 by the sealing bracket 400, and when the air in the closed rear cavity vibrates, the motherboard 300 may not generate resistance to the air due to the second hole wall 320 extending relative to the first inner side wall 401, and therefore, the structure may also improve the sound effect of the speaker 200.

The second aperture wall 320 may be aligned with the second interior sidewall 402 or the second aperture wall 320 may extend in a direction closer to the speaker 200 relative to the second interior sidewall 402. Considering that no component is disposed on the edge of the main board 300, in order to fully utilize the edge space of the main board 300, the second hole wall 320 may be protruded in a direction close to the speaker 200 relative to the second inner sidewall 402, so as to increase the size of the sealing bracket 400, and make the closed back cavity larger, thereby improving the sound effect of the speaker 200.

In an alternative embodiment, a side of the frame 100 facing the first component 500 is provided with the first protrusion 110, the speaker 200 is disposed on the first protrusion 110, and the speaker 200 is in sealing fit with the first protrusion 110, alternatively, the speaker 200 may be connected with the first protrusion 110 by the double-sided tape 920 and in sealing fit, so as to improve the sealing property of the closed rear cavity. Because at least a part of the speaker 200 needs to pass through the avoiding hole 301 of the main board 300 and be located in the sealing bracket 400, compared with a scheme that the speaker 200 is directly installed on one side of the frame 100 facing the first component 500, after the mode that the speaker 200 is installed through the first protrusion 110 is adopted, the distance between the frame 100 and the main board 300 can be increased, so that the main board 300 can be provided with more specifications of the first component 500, and the second space 620 can be increased, so that the sound effect of the speaker 200 is better.

In order to facilitate the installation of the main board 300, a second protrusion 120 is further disposed on a side of the frame 100 facing the first component 500, the main board 300 is disposed on the second protrusion 120, and the main board 300 is in sealing fit with the second protrusion 120, optionally, the main board 300 is in sealing fit with the second protrusion 120 through the second foam 930, so as to improve the sealing property of the closed rear cavity. The height of the second protrusion 120 may be equal to the height of the first protrusion 110, where the height is in a direction perpendicular to the main plate 300. At this time, the portion of the main board 300 provided with the avoiding hole 301 is closer to the first protruding portion 110, so that the gap between the portion of the main board 300 and the first protruding portion 110 is too small, which is not beneficial to the vibration of the air in the closed cavity. In order to solve this problem, the height of the second protrusion 120 may be greater than that of the first protrusion 110, so as to increase the distance between the portion of the main plate 300 where the avoiding hole 301 is opened and the first protrusion 110, thereby facilitating the vibration of air in the closed cavity. At the same time, the structure may also enlarge the second space 620, thereby further improving the sound effect of the speaker 200.

Further, when the frame 100 is provided with the first protrusion 110, the first protrusion 110 is provided with a third through hole 111, the speaker 200 is disposed toward the third through hole 111, the frame 100 and the speaker 200 together form a speaker front cavity 800, and the speaker front cavity 800 is located on a side of the speaker 200 away from the sealing bracket 400. When the speaker 200 vibrates, it may vibrate by driving air in the speaker front cavity 800, thereby generating sound waves, so that a user may hear sounds emitted from the electronic device. The third through hole 111 is formed in the first protrusion 110, and the speaker 200 is disposed toward the third through hole 111, so that the speaker front cavity 800 can be formed by the frame 100 and the speaker 200, the structure of the speaker front cavity 800 is simpler, the weight of the frame 100 can be reduced, and the electronic device can be lighter.

The electronic device disclosed in the embodiment of the present application may be an electronic device such as a smart phone, a tablet computer, an electronic book reader, a wearable device (e.g., a smart watch), and an electronic game machine, and the kind of the electronic device is not particularly limited in the embodiment of the present application.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An electronic device, comprising:

a frame;

a speaker disposed at the frame;

2. The electronic device of claim 1, further comprising a first shield disposed on the first face and covering at least one of the first components, the first shield being provided with a first via;

the space between the first shielding cover and the main board is a first subspace, the space between the first shielding cover and the frame is a second subspace, the first subspace is communicated with the second subspace through the first through hole, and the first subspace and the second subspace are parts of the closed rear cavity.

3. The electronic device of claim 1, further comprising at least two first shielding shells, wherein the first shielding shells are disposed on the first surface and cover at least one of the first components, and a gap is formed between adjacent first shielding shells, and the gap is a part of the closed back cavity.

4. The electronic device according to claim 1, wherein the main board further has a second surface opposite to the first surface, the second surface is provided with a second component and a second shielding cover, the second shielding cover covers at least one of the second components, the main board is provided with a second through hole, a third space is formed between the second shielding cover and the main board, the second space is communicated with the third space through the second through hole, and the third space is a part of the closed rear cavity.

5. The electronic device of claim 1, wherein the motherboard further has a second side opposite the first side, and wherein the seal holder is coupled to the second side.

6. The electronic device of claim 5, wherein the hermetic seal holder has first and second opposing inner sidewalls, the first and second inner sidewalls both facing the speaker, the first inner sidewall between the first component and the second inner sidewall, the avoidance hole having first and second opposing hole walls, the first and second hole walls both facing the speaker, the first hole wall between the first component and the second hole wall;

the first interior sidewall is at least partially aligned with the first aperture wall.

7. The electronic device of claim 6, wherein the second aperture wall protrudes in a direction proximal to the speaker relative to the second interior side wall.

8. The electronic device of claim 1, wherein a side of the frame facing the first component is provided with a first protrusion, the speaker is disposed on the first protrusion, and the speaker is in sealing engagement with the first protrusion.

9. The electronic device of claim 8, wherein a second protrusion is further disposed on a side of the frame facing the first component, the main board is disposed on the second protrusion, and the main board is in sealing engagement with the second protrusion, and a height of the second protrusion is greater than a height of the first protrusion.

10. The electronic device of claim 8, wherein the first protrusion is provided with a third through hole, the speaker is disposed toward the third through hole, and the frame and the speaker together form a speaker front cavity located on a side of the speaker facing away from the sealing bracket.